JPH05245671A - Laser beam machining method and machining head device - Google Patents

Abstract

PURPOSE:To provide a laser beam machining method to maintain a state that a cut piece is continued to be stuck on a work in a laser beam machining time for cutting off and separating the cut piece from a plate like work and a machining head device used for the machining method. CONSTITUTION:When a laser beam machining head 3 is moved relatively to the work W to cut and separate the cut piece WP off the work W through laser beam machining, a machining method that the cut piece WP is cut and separated off the work W as adhesive 7 is supplied suitably onto a cutting line 5 by laser beam machining is used. Further, the laser beam machining head device provides an adhesive supply part 9 to supply the adhesive 7 onto the cutting line 5 on which laser beam machining has been performed to cut and separate the cut piece WP from the work W on the laser beam machining head 3 relatively movable to the work W.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser processing method for cutting and separating a cut piece of an appropriate size from a plate-like work, and a laser processing head device used in the laser processing method.

[0002]

2. Description of the Related Art Conventionally, as a type of a laser processing machine for cutting and separating a cut piece of an appropriate size from a plate-shaped work, a laser processing head for a work fixed on a work table has two axes of X and Y. Direction, the work table moves in one of the X and Y axis directions, and the laser processing head moves in the other one axis direction. For the laser processing head fixed above the work table. On the other hand, a type in which the work tail moves in the X and Y axis directions, a fixed laser processing head is used, and the work table is
There are various types of laser processing machines such as a type that moves a workpiece in the X and Y axis directions.

By the way, in the case where a cutting piece is cut and separated from a plate-like work by laser processing, in a configuration in which the work is placed on a large number of swords erected on a work table and the cutting pieces are dropped from between the swords. However, there is a problem that it is difficult to drop a relatively large cut piece.

In addition, there is a similar problem in a structure in which a work shooter that can be opened and closed is provided on a table, and sometimes a cutting piece may overlap the work.

Therefore, when cutting large and small cut pieces from a work, the work and the cut pieces are connected to one part of the cutting line without completely cutting and separating the cut pieces from the work. The connection part (sometimes referred to as a micro joint or a wire joint) is left, and hitting with a hammer or the like is performed in a subsequent step to break the connection of the connection part.

[0006]

As described above, in the processing for leaving a fine connecting portion in one part of the cutting line obtained by cutting the work and the cutting piece, as described above, it is hit with a hammer or the like in the subsequent step. Since it is necessary to rupture the connecting portion by means of this, there is a problem to be solved such as a trace of being hit on the portion hit by a hammer or the like.

[0007]

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and its processing method is to laser-cut a cut piece from a work by moving a laser-processing head relative to the work. When cutting and separating by, an adhesive or a pressure-sensitive adhesive is appropriately supplied on a cutting line by laser processing to cut and separate a cut piece from a work.

Further, the laser processing head device supplies an adhesive or a pressure-sensitive adhesive to a laser processing head movable relative to a work on a cutting line which is laser-processed to cut and separate a cut piece from the work. It is provided with an adhesive supply section.

[0009]

In the above structure, the laser processing is performed to separate the cut pieces from the plate-like work, and the adhesive or the adhesive is supplied on the cutting line formed by the laser processing.
The work and the cut pieces are integrated with each other by the adhesive or the pressure-sensitive adhesive.

Therefore, it is not necessary to leave a fine connecting portion on the cutting line, the processing accuracy is further improved, and in the subsequent step, the adhesive or the adhesive may be appropriately removed. It does not give deformation to the like.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In FIG. 1, a plate-shaped work W is movably mounted on a work table (not shown) in a laser processing machine, and this work W is a known work moving equipment provided in the laser processing machine. The positioning device 1 moves and positions in the X-axis and Y-axis directions.

A laser processing head 3 for performing laser processing on the work W is provided above the work table. The laser processing head 3 irradiates the work W with laser light to perform cutting processing. An appropriate number of adhesive supply parts 9 for supplying an appropriate pressure sensitive adhesive or adhesive 7 are attached to the portion of the cutting line 5 which has been subjected to the step by the attachment 10. This adhesive agent supply unit 9 is exemplified by a nozzle in this embodiment, and this nozzle is
It is connected to an adhesive supply source 13, such as a pump.

The adhesive supply source 13 is controlled and driven under the control of an NC device for controlling the laser processing machine to supply the adhesive 7, and is continuous with the cutting line 5 of the work W. It is also possible to supply to. However, the adhesive 7 may be supplied to such an extent that the cut piece WP can be integrally held on the work W when the cut piece WP is cut and separated from the work W. It is sufficient to supply an adhesive or a pressure sensitive adhesive.

In the above structure, the work piece W is moved relative to the laser processing head 3 to perform cutting work, so that the cut piece WP can be cut and separated from the work piece W. When performing such cutting processing,
By appropriately driving the adhesive supply source 13 and supplying the adhesive 7 to the portion of the cutting line 5 by laser processing, the cutting piece WP is cut and separated in a state where the cutting piece WP is integrally held on the work W. Processing can be performed.

Therefore, a plurality of cutting pieces W are cut from the work W.
After the processing of cutting and separating P is completed, the adhesive 7 is appropriately removed from the work W (for example, a solvent is used), whereby the cut piece WP can be separated from the work W.

Although FIG. 1 exemplifies a configuration in which the adhesive agent supply portion 9 is attached to the laser processing head 3 by a mounting tool 10 afterwards, the laser processing head 3 is provided with the adhesive supply portion 9 as shown in FIG. It is also possible to provide the nozzle 15 with an adhesive supply section.

By the way, in the above-mentioned embodiment, it has been described that the nozzle 9 is located at a fixed position to eject the adhesive or the adhesive 7. However, when the assist gas is ejected from the laser processing head 3 violently. It is desirable that the nozzle 9 be moved up and down so that the nozzle 9 is brought into direct contact with the cutting line 5 to supply the adhesive or the adhesive.

In the embodiment shown in FIG. 2, a plurality of (four in this embodiment) adhesive supply ports 19A to 19D are provided around the opening 17 provided in the nozzle 15.
Each of the adhesive supply ports 19A to 19D is appropriately connected to the adhesive supply source 13 via the communication hole 21.
A valve device 25 is arranged in each of the communication holes 21 so that the communication holes 21 can be blocked.

In this embodiment, each valve device 25
By appropriately controlling the opening / closing of each of the adhesive supply ports 19
The supply of the adhesive or the adhesive from A to 19D can be controlled. That is, according to this embodiment, the adhesive or the pressure-sensitive adhesive can be supplied only to the adhesive supply port located on the rear side in the traveling direction of the cutting process of the work W, and the adhesive on the cutting line of the work W can be supplied. Can be surely supplied.

Based on the embodiment shown in FIG. 1 and the embodiment shown in FIG. 2, a plurality of adhesive supply parts (nozzles) 9 are arranged around the laser processing head 3 so that only the necessary nozzles 9 are provided. It is also possible to adopt a configuration in which the adhesive is supplied.

Further, as shown in FIG. 2, the adhesive supply source 1
In the configuration including the valve device 25 capable of opening and closing the communication hole 21 between the adhesive 3 and the adhesive supply port 19, it is not necessary to configure the adhesive supply source 13 as a pump, and for example, a container containing the adhesive may be used. It is also possible to adopt a configuration in which pressure is appropriately applied and the adhesive is discharged by this pressure.

The supply of the adhesive or the adhesive to the part of the cutting line 5 of the work W is not limited to the upper side, but the work supporting portion which faces the laser processing head 3 supports the work W and the lower surface of the work. It is a good thing to do. Also,
Instead of the adhesive or the adhesive, a magnet is used as the cutting line 5 of the work W.
It is also possible to provide the above structure.

[0023]

As will be understood from the above description of the embodiments, according to the present invention, when the cutting piece P is cut and separated from the plate-like work W, the adhesive or the adhesive is applied onto the cutting line 5. The cutting piece WP can be integrally held on the work W by supplying 7. Then, the cutting piece WP can be easily separated from the work W by appropriately removing the adhesive or the adhesive 7 after the cutting and separating processing of the cutting piece WP from the work W, so that the cutting piece WP is not deformed. There is no need to add it, and the stability of quality and accuracy is further improved.

[Brief description of drawings]

FIG. 1 is an explanatory diagram of a first embodiment according to the present invention.

FIG. 2 is an explanatory view of a second embodiment according to the present invention, showing a partial cross section.

FIG. 3 is an end view of a portion indicated by an arrow III in FIG.

[Explanation of symbols]

 3 Laser Processing Head 5 Cutting Line 7 Adhesive 9 Adhesive Supply Section (Nozzle) 13 Adhesive Supply Source W Work WP Cut Piece

Claims (2)

[Claims] 1. When a laser processing head is moved relative to a work to cut and separate a cut piece from the work by laser processing, an adhesive or a pressure-sensitive adhesive is appropriately supplied on a cutting line by the laser processing. A laser processing method characterized by cutting and separating a cut piece from a work. 2. A laser processing head movable relative to a work, and an adhesive supply section for supplying an adhesive or a pressure-sensitive adhesive onto a cutting line laser-processed to cut and separate a cut piece from the work. A laser processing head device characterized by being provided.