JPH0523710B2 - - Google Patents
Info
- Publication number
- JPH0523710B2 JPH0523710B2 JP61189582A JP18958286A JPH0523710B2 JP H0523710 B2 JPH0523710 B2 JP H0523710B2 JP 61189582 A JP61189582 A JP 61189582A JP 18958286 A JP18958286 A JP 18958286A JP H0523710 B2 JPH0523710 B2 JP H0523710B2
- Authority
- JP
- Japan
- Prior art keywords
- sensor
- heater
- temperature sensor
- heat
- container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 33
- 229910052751 metal Inorganic materials 0.000 claims abstract description 13
- 239000002184 metal Substances 0.000 claims abstract description 13
- 239000004033 plastic Substances 0.000 claims abstract description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 229910052697 platinum Inorganic materials 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 229920006015 heat resistant resin Polymers 0.000 claims description 2
- 238000001514 detection method Methods 0.000 abstract description 10
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract description 6
- 239000000463 material Substances 0.000 abstract description 6
- 230000035945 sensitivity Effects 0.000 abstract description 2
- 238000007599 discharging Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 238000005259 measurement Methods 0.000 description 23
- 238000010586 diagram Methods 0.000 description 10
- 239000004020 conductor Substances 0.000 description 6
- 239000011490 mineral wool Substances 0.000 description 6
- 239000002689 soil Substances 0.000 description 6
- 238000000605 extraction Methods 0.000 description 3
- 239000002470 thermal conductor Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 238000003898 horticulture Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910001006 Constantan Inorganic materials 0.000 description 1
- 229920005177 Duracon® POM Polymers 0.000 description 1
- 239000011358 absorbing material Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 230000000875 corresponding effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229910001120 nichrome Inorganic materials 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00013—Fully indexed content
Landscapes
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18958286A JPS6347644A (ja) | 1986-08-14 | 1986-08-14 | 水分センサー |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18958286A JPS6347644A (ja) | 1986-08-14 | 1986-08-14 | 水分センサー |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6347644A JPS6347644A (ja) | 1988-02-29 |
JPH0523710B2 true JPH0523710B2 (zh) | 1993-04-05 |
Family
ID=16243738
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18958286A Granted JPS6347644A (ja) | 1986-08-14 | 1986-08-14 | 水分センサー |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6347644A (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11304739A (ja) * | 1998-04-16 | 1999-11-05 | Kasen Joho Center | 湿潤度分布測定方法 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0544772Y2 (zh) * | 1988-03-25 | 1993-11-15 | ||
JPH0214060U (zh) * | 1988-07-13 | 1990-01-29 | ||
JPH0650764Y2 (ja) * | 1989-10-25 | 1994-12-21 | 矢崎総業株式会社 | 比熱式水分センサ |
US7465087B2 (en) * | 2005-12-02 | 2008-12-16 | Mamac Systems, Inc. | Armoured flexible averaging temperature sensor |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5017419U (zh) * | 1973-06-15 | 1975-02-25 |
-
1986
- 1986-08-14 JP JP18958286A patent/JPS6347644A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5017419U (zh) * | 1973-06-15 | 1975-02-25 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11304739A (ja) * | 1998-04-16 | 1999-11-05 | Kasen Joho Center | 湿潤度分布測定方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS6347644A (ja) | 1988-02-29 |
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