JPH05235221A - Semiconductor stack - Google Patents

Abstract

PURPOSE:To contrive miniaturization and simplification of repair works by a method wherein an inlet and an outlet of a waterway for each water-cooled fin are applied to a grooved side edge part to communicate both of the inlet and outlet of each waterway with a fixed communicating member, so that a communicating waterway for successively passing cooled water through each waterway is formed. CONSTITUTION:A plurality of flat semiconductor elements are arranged at a predetermined interval by making a flat plate in the longitudinal direction and interposed between water-cooled fins 20 from front and back. Inside the water-cooled fin, an U-shaped waterway comprising 2 parallel waterway parts 21 and a vertical waterway part 22 is grooved. Also, a start terminal of the parallel waterway parts 21 extends to a side edge part of the water-cooled fin 20 to form an inlet and outlet 23 for the waterway. A fixed communicating member 50 is applied to the side edge part of each water-cooled fin 20 and communicated with both of the inlet and outlet 23 of the waterways 21, 22 of each cooling fin 20 to form a communicating waterway 55 for successively passing cooled water through each of the waterways 21, 22. Thus a device can be miniaturized, and as a rubber hose, etc., for circulating the cooled water is unnecessary, repair works become simple.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention has a plurality of flat semiconductor elements arranged with a flat surface in front and back at a predetermined interval, and a water channel is formed inside a water cooling fin for cooling the semiconductor element. The present invention relates to a semiconductor stack in which each semiconductor element is sandwiched between the water-cooled fins from the front and back.

[0002]

2. Description of the Related Art Conventional semiconductor stacks include those shown in FIGS. 8 and 9, for example.

That is, in a structure in which a plurality of flat semiconductor elements 1 are pressed and sandwiched between water cooling fins 2, the water cooling fins 2 are cooled with water to efficiently cool the heat generated from the semiconductor elements 1. In FIG. 8, two semiconductor elements 1 are pressure-contacted with three water-cooled fins 2. Holes are provided at the four corners of the water-cooled fin 2, and the pressure bolt 3 having the surface covered with an insulating tube is inserted into the hole, and the pressure plates 6 are arranged on both sides via the insulating spacer 4 and the disc spring 5 as shown in the figure. To do. Due to the elasticity of the disc spring 5, the semiconductor element 1 is pressed and sandwiched between the water cooling fins 2. By forming a water channel inside the water cooling fin 2 and attaching hose joints 7 to both openings of the water channel, and connecting the water channels of each water cooling fin 2 with rubber hoses 8, the water flowing from one hose joint 7 is After passing through the water-cooled fin 2, the second water-cooled fin 2 is passed through the rubber hose 8. Hereinafter, the water that has passed through the second rubber hose 8 is discharged from the other hose joint 7 after passing through the third water cooling fin 2. Since the water-cooled fins 2 have higher cooling efficiency than the air-cooled fins, this type of semiconductor stack can be downsized.

[0004]

The rubber hose 8 connecting the water channels of the respective water cooling fins 2 is inserted into the hose joint 7 and has an appropriate radius R so that it will not bend when the hose is bent. As a result, as shown in FIG. 9, the dimension H protruding from the side surface of the water-cooled fin 2 becomes large, and even if the water-cooled fin 2 is downsized, the rubber hose 8 cannot be downsized as a whole. In addition, when the rubber hose 8 is used for a long time while being bent, cracks may occur on the surface of the rubber hose 8, causing water leakage.
There is a problem in that the work of replacing with a new rubber hose 8 is troublesome.

The present invention has been made in view of the above conventional problems, and an object of the present invention is to provide a semiconductor stack which is small in size and has a simple repairing work by eliminating the replacement work of a rubber hose.

[0006]

The gist of the present invention for achieving the above object is that a plurality of flat semiconductor elements (10) are arranged at predetermined intervals with the flat surface in front and back. In a semiconductor stack in which a water channel is formed inside a water cooling fin (20) for cooling the semiconductor element (10), and each semiconductor element (10) is sandwiched by the water cooling fin (20) from the front and rear, Inlet / outlet (2) of the water channels (21, 22) of the water cooling fins (20)
3) The connecting member (50) is fixed to the side edge portion where 3) is perforated so that the connecting member (50) can be connected to the water channels (21, 22) of each cooling fin (20). Doorway (2
3) Communicate with each other and transfer cooling water to each water cooling fin (2
0) The water passages (21, 22) are connected to each other to form a connecting water passage (55).

[0007]

The cooling water enters the first water cooling fin (20), returns to the connecting member (50) through the water channels (21, 22), the water channel inlet (23).

The cooling water returned to the connecting member (50) passes through the connecting water channel (55) and then enters the second water cooling fin (20) through the water inlet / outlet port (23). Second water cooling fin (2
The cooling water that has entered 0) passes through the water channels (21, 22) in the water cooling fins (20) and then returns to the communication member (50) through the water channel inlet / outlet port (23).

That is, the cooling water is sequentially passed through the connecting water passages (55) of the connecting member (50) to the respective cooling fins (20).
Pass through the waterways (21, 22).

The connecting member (50) only protrudes laterally of the cooling fin (20), and the entire device is not bulky laterally.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings. 1 to 7 show an embodiment of the present invention.
As shown in FIGS. 1 to 3, two flat semiconductor devices 1 are provided.
Zeros are arranged at a predetermined interval with the flat surface as the front and back.
Each semiconductor element 10 is sandwiched between water cooling fins 20 from the front and back. In FIG. 2, the semiconductor element 10 is conceptually shown.

A pressure plate 36 faces the front water cooling fin 20 from the front via an insulating spacer 32 and a disc spring 34. Similarly, a pressure plate 36 faces the rear water cooling fin 20 via the spacer 32. 36 is facing from the rear.

Bolts 42 for pressing are provided on both pressing plates 36.
A nut 44 that is erected and is screwed into the bolt 42 for pressurization.
By tightening against the restoring force of the disc spring 34,
The semiconductor element 10 is sandwiched under pressure by the water-cooled fins 20 from the front and back. The pressurizing bolt 42 is covered with an insulating chave.

As shown in FIGS. 6 to 7, the water cooling fins 20 are provided.
A U-shaped water channel, which is composed of two upper and lower horizontal water channel portions 21 and a vertical water channel portion 22 that connects the terminal ends of the horizontal water channel portions 21 to each other, is bored inside. The vertical water channel portion 22 is vertically drilled from below, and a sealing screw is screwed into the lower end opening of the vertical water channel portion 22. A screw hole 27 for screwing an external terminal is screwed on the upper edge of the water cooling fin 20.

The water cooling fins 20 are provided at the starting ends of the horizontal water passage portions 21.
And extends to a side edge portion thereof to form a waterway entrance / exit 23. At the four corners of the water cooling fin 20, bolts 4 for pressurization are provided.
Two holes 24 for insertion are formed. Water cooling fins 20
At the vertical center of the side edge of the
Is screwed.

As shown in FIGS. 4 and 5, a connecting member 50 made of an insulating material is provided at the side edge of the water cooling fin 20.
Has been assigned. Each water cooling fin 2 is used for the connecting member 50.
The through hole 51 is formed corresponding to the mounting screw hole 25 of 0, and the connecting member 50 is fixed by the bolt inserted through the through hole 51 and screwed into the mounting screw hole 25 of each water cooling fin 20. Has been done.

In the connecting member 50, three connecting ports 53 are provided in the upper and lower portions, corresponding to the inlets / outlets 23 for the water channels of each water cooling fin 20. A spot facing 23a is provided on the periphery of the communication port 23.
Is provided, and an O-ring 57 is housed in the spot facing 23a to ensure watertightness.

Regarding the upper communication port 53, a hose joint 61 is screwed to the front communication port 53, and the intermediate communication port 53 and the rear communication port 53 are connected by a communication water passage 55. The connecting water channel 55 is formed from the front to the rear, and the front end opening of the connecting water channel 55 is sealed with a screw.

Similarly, regarding the lower communication port 53, the front communication port 53 and the intermediate communication port 53 are connected by a communication water passage 55, and the hose joint 61 is screwed into the rear communication port 53. It is worn.

Next, the operation will be described. Hose joint 6
The cooling water flowing in from 1 enters the first water cooling fin 20 through the communication port 53 and the waterway port 23. The cooling water that has entered the first water cooling fins 20 passes through the upper horizontal water channel portion 21 to the vertical water channel portion 22 to the lower horizontal water channel portion 21 in the water cooling fin 20, and then to the lower water channel inlet / outlet port 23. And returns to the communication member 50 through the communication port 53.

The cooling water returned to the connecting member 50 is used as the connecting water channel 55 to the connecting port 53 at the lower middle portion and the water inlet / outlet port 23.
Through and into the second water cooled fin 20. The cooling water that has entered the second water cooling fins 20 has a lower horizontal water channel portion 21 to a vertical water channel portion 22 to an upper horizontal water channel portion 2 in the water cooling fin 20.
1 to return to the communication member 50 again through the upper waterway entrance 23 and the communication opening 53.

The cooling water returned to the connecting member 50 is used as the connecting water channel 55 to the connecting port 53 on the upper rear side and the inlet / outlet port 23 for the water channel.
Through the third water-cooled fin 20. The cooling water that has entered the third water cooling fins 20 has an upper horizontal water channel portion 21 to a vertical water channel portion 22 to a lower horizontal water channel portion 2 in the water cooling fin 20.
1 through the inlet / outlet port 23 and the communication port 53 for the water channel on the lower side to flow out from the hose joint 61 to the outside.

In this way, the cooling water that has passed through the water channels of each water cooling fin 20 absorbs heat from the semiconductor element 10 sandwiched between the water cooling fins 20 and then flows out.

As shown in FIGS. 2 and 3, the entire semiconductor stack is small in size, with only the thickness of the connecting member 50 protruding from the water-cooled fin 20 and not being bulky in both directions.

In the above embodiment, the connecting member 50 is applied to one side edge of the cooling fin 20. However, in the case where the inlet / outlet port 23 of the water channel is formed on both side edges, both sides are provided. The connecting member may be applied to the edge.

Further, in the embodiment, the number of the water cooling fins 20 is three, but the number of the water cooling fins may be four or more, and the flow path of the cooling water does not have to be in order from the end.

[0027]

According to the semiconductor stack of the present invention, the cooling water is sequentially passed through the water passages of the cooling fins through the communication water passages of the communication members by applying the connection members to the side edges of the water cooling fins. As a result, the entire device is not bulky to the side, and the entire device can be downsized, and since it is not necessary to use a rubber hose for circulating cooling water, replacement work due to deterioration of the rubber hose is eliminated, Repair work can be simplified.

[Brief description of drawings]

FIG. 1 is a perspective view of a semiconductor stack showing an embodiment of the present invention.

FIG. 2 is a plan view of a semiconductor stack showing an embodiment of the present invention.

FIG. 3 is a front view of a semiconductor stack showing an embodiment of the present invention.

FIG. 4 is a side view of a connecting member showing an embodiment of the present invention.

5 is a sectional view taken along line VV of FIG.

FIG. 6 is a cross-sectional view of essential parts of a water-cooled fin showing an embodiment of the present invention.

FIG. 7 is a front view of a water-cooled fin showing an embodiment of the present invention.

FIG. 8 is a plan view of a semiconductor stack showing a conventional example.

FIG. 9 is a front view of a semiconductor stack showing a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Semiconductor element 20 ... Water cooling fin 21 ... Horizontal water channel part 22 ... Vertical water channel part 23 ... Channel entrance / exit 50 ... Communication member 53 ... Communication port 55 ... Communication water channel

Claims (1)

[Claims] 1. A plurality of flat semiconductor elements are arranged with a flat surface in front and back at predetermined intervals, and water channels are formed inside a water cooling fin for cooling the semiconductor elements. In the semiconductor stack so as to be sandwiched by the water-cooled fins from the front and back, the side edge portion where the inlet / outlet of the water channel of each of the water-cooled fins is bored is fixed by applying a connecting member, A semiconductor stack comprising: connecting the inlets and outlets of the water channels of the respective cooling fins, and forming a connecting water channel for sequentially passing cooling water to the water channels of the respective water cooling fins.