JPH05235217A - Material for heat transmission - Google Patents
Material for heat transmissionInfo
- Publication number
- JPH05235217A JPH05235217A JP3369692A JP3369692A JPH05235217A JP H05235217 A JPH05235217 A JP H05235217A JP 3369692 A JP3369692 A JP 3369692A JP 3369692 A JP3369692 A JP 3369692A JP H05235217 A JPH05235217 A JP H05235217A
- Authority
- JP
- Japan
- Prior art keywords
- carbon fiber
- synthetic resin
- heat
- resin
- heat transmission
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、例えば電子部品等の熱
を発生する部品の放熱や伝熱を行うのに用いられる伝熱
用材料に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat transfer material used for radiating or transferring heat from a heat generating component such as an electronic component.
【０００２】[0002]
【従来の技術】従来より、トランジスタやＩＣ等の電子
部品が電子機器に多く使用されているが、これらの電子
部品は、通常、使用すると発熱するものであり、特に大
きな電力を消費する電子部品を使用する場合には、発熱
量も多くなっていた。2. Description of the Related Art Conventionally, many electronic components such as transistors and ICs have been used in electronic equipment. However, these electronic components usually generate heat when used and consume a particularly large amount of power. When using, the calorific value was also increased.
【０００３】また、この様な電子部品には熱に弱いもの
が多く、あまりに熱くなると故障したり暴走することが
ある。従って、発熱の対策として、プリント基板に取り
付けられた電子部品の横に金属製の放熱板を立設し、こ
の放熱板に電子部品の筐体の側部を接続固定することが
あり、また近年では放熱性の高いセラミックスから作ら
れたプリント基板や放熱用のスペーサが提案されてい
る。Many of such electronic parts are vulnerable to heat, and if they become too hot, they may break down or run away. Therefore, as a measure against heat generation, a metal radiator plate may be installed upright next to the electronic component mounted on the printed circuit board, and the side portion of the housing of the electronic component may be connected and fixed to the radiator plate. Proposes a printed circuit board made of ceramics with high heat dissipation and a spacer for heat dissipation.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、上記の
金属製の放熱板やセラミックス製のものでは、各々一長
一短があり必ずしも好適ではなかった。例えば金属製の
放熱板は頑丈であるが、電気絶縁性が要求される場合に
は、使用することができないという問題があった。一
方、セラミックス製のプリント基板は放熱性に優れてい
るが、加工が難しいという問題があった。However, the above-mentioned metal radiator plate and ceramics plate are not necessarily suitable because they have advantages and disadvantages. For example, a metal heat sink is tough, but there is a problem that it cannot be used when electrical insulation is required. On the other hand, a ceramic printed circuit board is excellent in heat dissipation, but has a problem that it is difficult to process.
【０００５】本発明は、軽量で加工が容易であり、かつ
絶縁性を有し、しかも放熱性に優れた伝熱用材料を提供
することを目的とする。It is an object of the present invention to provide a heat transfer material which is lightweight, easy to process, has an insulating property, and has an excellent heat dissipation property.
【０００６】[0006]
【課題を解決するための手段】上記目的を達するため
に、請求項１に記載の発明は、電気絶縁性を有する被膜
で被覆された炭素繊維を、前記被膜に対する相溶性を有
する合成樹脂に均一分散したことを特徴とする伝熱用材
料を要旨とする。In order to achieve the above object, the invention according to claim 1 uniformly disperses carbon fibers coated with a coating having an electrically insulating property in a synthetic resin having compatibility with the coating. The main point is a heat transfer material characterized by being dispersed.
【０００７】ここで、上記合成樹脂としては、例えばポ
リアミド系樹脂，ポリエチレン，ポリプロピレン，ポリ
スチレン，ＡＢＳ樹脂，アクリル系樹脂，酢酸ビニル系
樹脂，含ハロゲン系樹脂，ポリエステル系樹脂，ポリエ
ーテル系樹脂，フェノール系樹脂，アミノ系樹脂，ポリ
ウレタン系樹脂，エポシキ樹脂，あるいはシリコーン樹
脂等を使用することができる。Examples of the synthetic resin include polyamide resin, polyethylene, polypropylene, polystyrene, ABS resin, acrylic resin, vinyl acetate resin, halogen-containing resin, polyester resin, polyether resin, phenol. A resin, an amino resin, a polyurethane resin, an epoxy resin, a silicone resin or the like can be used.
【０００８】上記合成樹脂に対する相溶性を有し、かつ
電気絶縁性を有する被膜で炭素繊維を被覆するために、
例えば合成樹脂として、ポリアミド系樹脂を用いる場合
は、水溶性ポリアミドを水に溶解したものを使用して、
炭素繊維を処理するのは好適な方法である。また、合成
樹脂として、シリコーン樹脂を用いる場合は、シリコー
ンの水乳化液あるいはシランカップリング剤を使用し
て、炭素繊維を処理することが望ましい。処理剤には種
々のものがあるが、母材の合成樹脂と同種の重合体でか
つ溶剤に易溶なものが望ましい。いずれの場合も、粘度
が高くなると被膜が厚くなり、熱伝導性が悪くなるか
ら、炭素繊維を処理する処理液の粘度が高くならないよ
うな溶剤の選択が必要である。In order to coat the carbon fiber with a coating having compatibility with the above synthetic resin and electrical insulation,
For example, when using a polyamide resin as the synthetic resin, use a water-soluble polyamide dissolved in water,
Treating carbon fibers is the preferred method. Further, when a silicone resin is used as the synthetic resin, it is desirable to treat the carbon fiber with an aqueous emulsion of silicone or a silane coupling agent. There are various kinds of treating agents, but it is desirable that the same kind of polymer as the synthetic resin of the base material and easily soluble in the solvent. In either case, as the viscosity increases, the coating becomes thicker and the thermal conductivity deteriorates. Therefore, it is necessary to select a solvent that does not increase the viscosity of the treatment liquid for treating the carbon fiber.
【０００９】そして、炭素繊維の加用量としては３０〜
６０重量％程度が望ましい。請求項２に記載の発明は、
前記炭素繊維として、炭化水素の熱分解による気相法に
よって生成され、かつ高融点金属及び／又は該金属の化
合物の超微細粉末を成長開始部として成長されたものを
用いることを特徴とする。The carbon fiber is added in an amount of 30 to
About 60% by weight is desirable. The invention according to claim 2 is
As the carbon fiber, one produced by a vapor phase method by thermal decomposition of hydrocarbon and grown by using an ultrafine powder of a refractory metal and / or a compound of the metal as a growth start portion is used.
【００１０】上記炭素繊維は、ポリアクリロニトリル系
炭素繊維又はピッチ系炭素繊維と異なり、微小直径のウ
ィスカ状のものとして生成されたものである。尚、本発
明に用いる高融点金属は、炭素水素の熱分解の温度であ
る９５０〜１３００℃において気化しない金属であっ
て、ＴｉやＺｒ等の周期律表の第４ａ族，ＶやＮｂ等の
第５ａ族，ＣｒやＭｏ等の第６ａ族，Ｍｎ等の第７ａ
族，ＦｅやＣｏ等の第８族の元素が適し、特に望ましい
のは、Ｆｅ，Ｃｏ，Ｎｉ，Ｖ，Ｎｂ，Ｔａ，Ｔｉ，Ｚｒ
である。そして、かかる金属の化合物には、その酸化
物，窒化物，その他の塩類がある。Unlike the polyacrylonitrile-based carbon fiber or the pitch-based carbon fiber, the above-mentioned carbon fiber is produced as a whisker having a minute diameter. The refractory metal used in the present invention is a metal that does not vaporize at a temperature of 950 to 1300 ° C., which is the temperature of pyrolysis of carbon hydrogen, and is a group 4a group of the periodic table such as Ti or Zr, or V or Nb. Group 5a, Group 6a such as Cr and Mo, Group 7a such as Mn
Group 8 elements such as Fe and Co are suitable, with Fe, Co, Ni, V, Nb, Ta, Ti and Zr being particularly desirable.
Is. And, such metal compounds include oxides, nitrides, and other salts thereof.
【００１１】[0011]
【作用】本発明の伝熱用材料は、例えばシート状に成形
したものを打ち抜いて、トランジスタやＩＣ等のスペー
サとして使用されるものであり、材料としては、合成樹
脂に、該合成樹脂に対して相溶性を有し、かつ電気絶縁
性を有する被膜で被覆された炭素繊維を混入したものが
使用される。The heat transfer material of the present invention is used, for example, as a spacer for transistors, ICs, etc. by punching out a sheet-shaped material. The carbon fiber mixed with the carbon fiber coated with a coating having compatibility with each other and electrical insulation is used.
【００１２】つまり、上記材料の母材となる合成樹脂の
中に、放熱性（熱伝導性）に優れた炭素繊維が含有され
ているので、放熱あるいは伝熱の特性が向上する。ま
た、炭素繊維は、母材となる合成樹脂に対する相溶性を
有する被膜で被覆されているので、母材のあらゆる部位
に行き渡り均一に分散する。更に、炭素繊維の被膜は、
電気絶縁性を有しているので、導電性の炭素繊維を含有
しているにも拘らず、混合物は良好な電気絶縁性を有す
る。That is, since the synthetic resin, which is the base material of the above material, contains the carbon fiber having excellent heat dissipation (heat conductivity), the heat dissipation or heat transfer characteristics are improved. Further, since the carbon fiber is coated with the coating film having compatibility with the synthetic resin as the base material, the carbon fiber is evenly distributed over all parts of the base material. Furthermore, the carbon fiber coating is
Having electrical insulation, the mixture has good electrical insulation despite containing electrically conductive carbon fibers.
【００１３】また、本発明の伝熱用材料は、加工し易い
ので、種々の形状のものを容易に形成することができ
る。更に、上記炭素繊維は、その規則正しい黒鉛結晶層
に基づき、炭素繊維固有の特性である引っ張り強度等の
機械的特性に優れているので、合成樹脂に添加すると強
度が向上する。Further, since the heat transfer material of the present invention is easy to process, it is possible to easily form various shapes. Further, the above-mentioned carbon fiber is excellent in mechanical properties such as tensile strength, which is a characteristic peculiar to the carbon fiber, based on its regular graphite crystal layer, and therefore the strength is improved when added to the synthetic resin.
【００１４】[0014]
【実施例】以下、本発明の一実施例を図面とともに説明
する。図１は、本発明の一実施例の伝熱用材料から作ら
れた放熱板が用いられた電子デバイスの断面図である。
図２は、該放熱板の製造に用いられる原料を示す説明図
である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a cross-sectional view of an electronic device using a heat dissipation plate made of a heat transfer material according to an embodiment of the present invention.
FIG. 2 is an explanatory view showing raw materials used for manufacturing the heat dissipation plate.
【００１５】図１において、基板１と電子部品２との間
には、本発明の一実施例の伝熱用材料で作られた放熱板
３が用いられている。放熱板３を構成する伝熱用材料の
合成樹脂として、例えばポリアミド系樹脂のような硬い
材料、あるいはシリコーンのような軟らかい材料で電気
絶縁性に優れた材料が使用される。In FIG. 1, a heat radiating plate 3 made of a heat transfer material according to an embodiment of the present invention is used between the substrate 1 and the electronic component 2. As the synthetic resin of the heat transfer material forming the heat dissipation plate 3, for example, a hard material such as polyamide resin or a soft material such as silicone having excellent electric insulation is used.
【００１６】図２に示すように、この合成樹脂４には、
該合成樹脂４に対する相溶性を有し、かつ電気絶縁性を
有する被膜５で被覆された非常に細い炭素繊維６が、後
述する所定の割合で混入されている。次に、本実施例の
放熱板３の製造方法について説明する。As shown in FIG. 2, the synthetic resin 4 contains
A very thin carbon fiber 6 coated with a coating 5 having compatibility with the synthetic resin 4 and electrical insulation is mixed at a predetermined ratio described later. Next, a method of manufacturing the heat dissipation plate 3 of this embodiment will be described.
【００１７】まず、９５０〜１３００℃の炉内で、ベン
ゼンを熱分解する気相法によって、粒径０.０２μｍ〜
０.０３μｍの鉄粉末を成長開始剤として、直径０.１μ
ｍ〜０.５μｍ，長さ０.１〜１mmの炭素繊維６を成長さ
せる。このようにして形成された炭素繊維６は、次の様
な物性を備えている。First, in a furnace at 950 to 1300 ° C., a particle size of 0.02 μm
Using iron powder of 0.03 μm as a growth initiator, diameter of 0.1 μm
A carbon fiber 6 having a length of m to 0.5 μm and a length of 0.1 to 1 mm is grown. The carbon fiber 6 thus formed has the following physical properties.
【００１８】 引張り強度：２００kg／mm2 弾性率：２０t／mm2 電気抵抗率：０.００１Ω・cm 熱伝導率：１.６×１０3w／m・k 次に、上記炭素繊維６をエマルジョンタイプのシリコー
ン（シリコーンを水に分散させたもので、シリコーンの
含有率が約２５重量％のもの）に含浸した後、取り出し
て余分のエマルジョンを除去した後、１８０℃で１５分
間加熱を行った。Tensile strength: 200 kg / mm 2 Elastic modulus: 20 t / mm 2 Electrical resistivity: 0.001 Ω · cm Thermal conductivity: 1.6 × 10 3 w / m · k Next, the carbon fiber 6 was emulsioned. Type silicone (a silicone dispersion in water with a silicone content of about 25% by weight) was impregnated, taken out to remove excess emulsion, and then heated at 180 ° C. for 15 minutes. ..
【００１９】これにより、炭素繊維６はシリコーンに対
する相溶性を有し、かつ電気絶縁性を有する被膜５で被
覆された。一方、上記のように被膜５で被覆された炭素
繊維６と合成樹脂４とからなる放熱板３の材料を下記の
ようにして製造する。As a result, the carbon fiber 6 was covered with the coating 5 having compatibility with silicone and electrical insulation. On the other hand, the material of the heat dissipation plate 3 composed of the carbon fiber 6 coated with the coating film 5 and the synthetic resin 4 as described above is manufactured as follows.
【００２０】まず、上記被覆処理後の炭素繊維６を、合
成樹脂（例えば熱伝導率０．２w／m・kのシリコーン樹
脂）４の材料中に、所定の割合（重量％）で、例えば合
成樹脂：被覆処理された炭素繊維＝（６０：４０）〜
（５０：５０）の範囲の割合で混入する。First, the carbon fiber 6 after the above-mentioned coating treatment is synthesized in a material of a synthetic resin (for example, a silicone resin having a thermal conductivity of 0.2 w / m · k) 4 at a predetermined ratio (% by weight). Resin: Coated carbon fiber = (60:40) ~
It is mixed in the ratio of (50:50).
【００２１】そして、上記の割合の合成樹脂４と被覆処
理後の炭素繊維６とを、ヘンシャルミキサーやスーパー
ミキサー等を使用してドライブレンドし、ドライブレン
ドによって形成された粉状物を、単軸又は二軸押出機で
混練し、その後、断面が丸か角のストランドとして押し
出し、次いで切断機で適当な長さに切断する。Then, the synthetic resin 4 in the above proportion and the carbon fiber 6 after the coating treatment are dry blended by using a Henshal mixer, a super mixer or the like, and the powdery substance formed by the dry blending is simply blended. It is kneaded in a twin-screw or twin-screw extruder, then extruded as strands of round or square cross section, and then cut into suitable lengths with a cutter.
【００２２】そして、上述した方法で製造した、かつ被
覆処理された炭素繊維６と合成樹脂４からなる材料を使
用して、周知のプレスや射出もしくは押出成形等によっ
て、所定の形状の放熱板３を形成する。シリコーンのよ
うに加硫を必要とするものでは、成形時に２００℃で加
硫する。Then, the heat radiation plate 3 having a predetermined shape is formed by a well-known press, injection, extrusion molding or the like using the material composed of the carbon fiber 6 and the synthetic resin 4 produced by the above-mentioned method and coated. To form. For silicones that require vulcanization, they are vulcanized at 200 ° C during molding.
【００２３】この様に製造された放熱板３は、上記割合
で炭素繊維と合成樹脂とが混合されているので、熱伝導
率が１２．１w／m・kとなる。上記の様にして形成された
放熱板３により、下記の効果を得ることができる。本実
施例の放熱板３は、合成樹脂４の母体に炭素繊維６が混
入されており、この炭素繊維６の熱伝導率が高いので、
電子部品２等から発生する熱を迅速に放熱することが可
能である。The heat dissipation plate 3 manufactured in this manner has a thermal conductivity of 12.1 w / m · k because the carbon fibers and the synthetic resin are mixed in the above proportion. The following effects can be obtained by the heat dissipation plate 3 formed as described above. In the heat dissipation plate 3 of this embodiment, the carbon fiber 6 is mixed in the matrix of the synthetic resin 4, and the thermal conductivity of the carbon fiber 6 is high.
It is possible to quickly dissipate the heat generated from the electronic component 2 and the like.
【００２４】また、放熱板３の材料は、合成樹脂４と被
覆処理された炭素繊維６とを素材とするものであるの
で、金属やセラミックスより製造が容易であり、特に複
雑な立体基板でも容易に製造することができる。更に、
炭素繊維６は、母材となる合成樹脂４に対する相溶性を
有する被膜５で被覆されているので、母材のあらゆる部
位に行き渡り均一に分散する。炭素繊維６の被膜５は、
電気絶縁性を有している。このため、炭素繊維を含有し
ているにも拘らず放熱板３は絶縁性を有すると共に、均
一性が非常に良好である。Further, since the material of the heat dissipation plate 3 is made of the synthetic resin 4 and the coated carbon fiber 6, it is easier to manufacture than the metal or the ceramics, and even a complicated three-dimensional substrate is easy. Can be manufactured. Furthermore,
Since the carbon fiber 6 is covered with the coating film 5 having compatibility with the synthetic resin 4 as the base material, the carbon fiber 6 is evenly distributed over all parts of the base material. The coating 5 of the carbon fiber 6 is
Has electrical insulation. For this reason, the heat dissipation plate 3 has an insulating property even though it contains carbon fibers, and the uniformity is very good.
【００２５】また、合成樹脂４に含まれている炭素繊維
６は、機械的強度が高いので、放熱板３を薄く形成した
場合でも十分な強度を確保できる。以上本発明の実施例
について説明したが、本発明はこのような実施例に何等
限定されるものではなく、本発明の要旨を逸脱しない範
囲内において種々なる態様で実施し得ることは勿論であ
る。Further, since the carbon fibers 6 contained in the synthetic resin 4 have high mechanical strength, sufficient strength can be secured even when the heat sink 3 is formed thin. Although the embodiments of the present invention have been described above, the present invention is not limited to such embodiments, and it goes without saying that the present invention can be implemented in various modes without departing from the scope of the present invention. .
【００２６】[0026]
【発明の効果】以上詳記したように、本発明の伝熱用材
料は、電気絶縁性を有する被膜で被覆された炭素繊維
を、上記被膜に対する相溶性を有する合成樹脂に均一分
散したものであるので、伝熱性および機械的強度が大き
く、かつ電気的絶縁性を有しているという特長がある。As described above in detail, the heat transfer material of the present invention is obtained by uniformly dispersing carbon fibers coated with an electrically insulating coating in a synthetic resin having compatibility with the coating. Therefore, it has a feature that it has high heat conductivity and mechanical strength, and has electrical insulation.
【００２７】従って、軽量で加工が容易であり、かつ絶
縁性を有し、しかも伝熱性に優れた伝熱用あるいは放熱
用の材料を提供することができる。Therefore, it is possible to provide a material for heat transfer or heat dissipation, which is lightweight, easy to process, has an insulating property, and is excellent in heat transfer property.
【図１】本発明の一実施例の伝熱用材料から作られた放
熱板が用いられた電子デバイスの断面図である。FIG. 1 is a sectional view of an electronic device using a heat dissipation plate made of a heat transfer material according to an embodiment of the present invention.
【図２】図１に示す放熱板の原料を示す説明図である。FIG. 2 is an explanatory view showing a raw material of the heat dissipation plate shown in FIG.
１…基板 ２…電子部品 ３…放熱板 ４…合成
樹脂 ５…被膜 ６…炭素繊維DESCRIPTION OF SYMBOLS 1 ... Substrate 2 ... Electronic component 3 ... Heat sink 4 ... Synthetic resin 5 ... Coating 6 ... Carbon fiber
Claims (2)
素繊維を、前記被膜に対して相溶性を有する合成樹脂に
均一分散したことを特徴とする伝熱用材料。1. A heat transfer material, characterized in that carbon fibers coated with an electrically insulating coating are uniformly dispersed in a synthetic resin compatible with the coating.
る気相法によって生成され、かつ高融点金属及び／又は
該金属の化合物の超微細粉末を成長開始部として成長さ
れることを特徴とする請求項１記載の伝熱用材料。2. The carbon fiber is produced by a vapor phase method by thermal decomposition of hydrocarbon, and is grown by using an ultrafine powder of a refractory metal and / or a compound of the metal as a growth start portion. The heat transfer material according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3369692A JP2695563B2 (en) | 1992-02-20 | 1992-02-20 | Heat transfer material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3369692A JP2695563B2 (en) | 1992-02-20 | 1992-02-20 | Heat transfer material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05235217A true JPH05235217A (en) | 1993-09-10 |
| JP2695563B2 JP2695563B2 (en) | 1997-12-24 |
Family
ID=12393584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3369692A Expired - Fee Related JP2695563B2 (en) | 1992-02-20 | 1992-02-20 | Heat transfer material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2695563B2 (en) |
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|---|---|---|---|---|
| JP2002326012A (en) * | 2001-05-07 | 2002-11-12 | Matsushita Seiko Co Ltd | Dehumidifier |
| JP2007128986A (en) * | 2005-11-01 | 2007-05-24 | Polymatech Co Ltd | Thermally conductive member and method of manufacturing same |
| JP2007291346A (en) * | 2006-03-31 | 2007-11-08 | Toyoda Gosei Co Ltd | Low electric conductivity high heat radiation polymer material and molded body |
| WO2011013840A1 (en) * | 2009-07-28 | 2011-02-03 | 帝人株式会社 | Insulated pitch-based graphitized short fibers |
| WO2016068157A1 (en) * | 2014-10-31 | 2016-05-06 | デクセリアルズ株式会社 | Heat conduction sheet, heat conduction sheet manufacture method, heat radiation member, and semiconductor device |
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| WO2017122817A1 (en) * | 2016-01-14 | 2017-07-20 | デクセリアルズ株式会社 | Thermal conducting sheet, method for manufacturing thermal conducting sheet, heat dissipation member, and semiconductor device |
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1992
- 1992-02-20 JP JP3369692A patent/JP2695563B2/en not_active Expired - Fee Related
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002326012A (en) * | 2001-05-07 | 2002-11-12 | Matsushita Seiko Co Ltd | Dehumidifier |
| JP2007128986A (en) * | 2005-11-01 | 2007-05-24 | Polymatech Co Ltd | Thermally conductive member and method of manufacturing same |
| JP2007291346A (en) * | 2006-03-31 | 2007-11-08 | Toyoda Gosei Co Ltd | Low electric conductivity high heat radiation polymer material and molded body |
| WO2011013840A1 (en) * | 2009-07-28 | 2011-02-03 | 帝人株式会社 | Insulated pitch-based graphitized short fibers |
| US9688897B2 (en) | 2011-10-05 | 2017-06-27 | National Institute Of Advanced Industrial Science And Technology | Carbon nanotube composite material and thermal conductor |
| WO2016068157A1 (en) * | 2014-10-31 | 2016-05-06 | デクセリアルズ株式会社 | Heat conduction sheet, heat conduction sheet manufacture method, heat radiation member, and semiconductor device |
| JP2016092407A (en) * | 2014-10-31 | 2016-05-23 | デクセリアルズ株式会社 | Thermally conductive sheet, method for manufacturing thermally conductive sheet, heat dissipation member and semiconductor device |
| JP2017038086A (en) * | 2014-10-31 | 2017-02-16 | デクセリアルズ株式会社 | Thermally conductive sheet, method for manufacturing thermally conductive sheet, heat dissipation member and semiconductor device |
| US9922901B2 (en) | 2014-10-31 | 2018-03-20 | Dexerials Corporation | Heat conduction sheet, heat conduction sheet manufacture method, heat radiation member, and semiconductor device |
| WO2017122817A1 (en) * | 2016-01-14 | 2017-07-20 | デクセリアルズ株式会社 | Thermal conducting sheet, method for manufacturing thermal conducting sheet, heat dissipation member, and semiconductor device |
| US11296007B2 (en) | 2016-01-14 | 2022-04-05 | Dexerials Corporation | Thermal conducting sheet, method for manufacturing thermal conducting sheet, heat dissipation member, and semiconductor device |
| JP2018098515A (en) * | 2016-01-26 | 2018-06-21 | デクセリアルズ株式会社 | Thermally conductive sheet, method for manufacturing thermally conductive sheet, heat dissipation member, and semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2695563B2 (en) | 1997-12-24 |
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