JPH05232878A - Base sheet providing with mount and cutting method of the same - Google Patents
Base sheet providing with mount and cutting method of the sameInfo
- Publication number
- JPH05232878A JPH05232878A JP6942692A JP6942692A JPH05232878A JP H05232878 A JPH05232878 A JP H05232878A JP 6942692 A JP6942692 A JP 6942692A JP 6942692 A JP6942692 A JP 6942692A JP H05232878 A JPH05232878 A JP H05232878A
- Authority
- JP
- Japan
- Prior art keywords
- mount
- sheet
- base
- base sheet
- cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Laser Beam Processing (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、ラベルや粘着材シー
トとして利用される台紙つき基材シートと、この台紙つ
き基材シートから基材シートのみを切断する切断方法に
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a base sheet with a mount used as a label or an adhesive sheet, and a cutting method for cutting only the base sheet from the base sheet with a mount.
【０００２】[0002]
【従来の技術】従来、台紙つき基材シートから基材シー
トのみをレーザ光線によりカットし、ラベル、粘着材シ
ートとして利用するものとして、特開昭５９−１４７３
８２号公報の技術が知られている。この従来技術によれ
ば、台紙としてアルミニウム等の金属板を用い、レーザ
光線を照射して台紙の切断を防止しつつ、基材シートの
みをレーザ切断するようにしている。2. Description of the Related Art Conventionally, only a base material sheet from a base material sheet with a mount is cut by a laser beam and used as a label or an adhesive material sheet.
The technique of Japanese Patent No. 82 is known. According to this conventional technique, a metal plate such as aluminum is used as a mount, and a laser beam is irradiated to prevent the mount from being cut, and only the base sheet is laser-cut.
【０００３】[0003]
【発明が解決しようとする課題】しかし、従来の技術で
は、基材シートのみを切断するためにレーザ出力の微妙
な制御が必要となり、又、基材シートが確実に切断され
ないと剥離性が悪くなり、更に、台紙にアルミニウム等
の金属を用いると、ロール状で材料を供給する場合に重
量が大きくなる等の課題があった。本発明は斯かる課題
を解決するためになされたもので、その目的とするとこ
ろは、台紙を残して基材シートのみをレーザにより切断
することができる台紙つき基材シートとその切断方法を
提供することにある。However, in the conventional technique, delicate control of the laser output is required in order to cut only the base sheet, and if the base sheet is not cut reliably, the releasability is poor. Furthermore, when a metal such as aluminum is used for the mount, there is a problem that the weight becomes large when the material is supplied in a roll shape. The present invention has been made to solve such a problem, and an object of the present invention is to provide a base material sheet with a mount and a method of cutting the base material sheet that can cut only the base material sheet with a laser while leaving the mount material. To do.
【０００４】[0004]
【課題を解決するための手段】前記目的を達成するため
に、本発明は、第１に、台紙とこの台紙に剥離自在な基
材シートとからなる台紙つき基材シートにおいて、この
台紙を透光材で構成したことを特徴とする。第２に、台
紙とこの台紙に剥離自在な基材シートとからなる台紙つ
き基材シートにおいて、この台紙と基材シートとの間に
低融点材を介在させたことを特徴とする。第３に、台紙
とこの台紙に剥離自在な基材シートとからなる台紙つき
基材シートにレーザ光を照射して基材シートを切断する
台紙つき基材シートの切断方法において、この台紙を透
光材で構成し、台紙にレーザ光を透過させて基材シート
を切断することを特徴とする。第４に、台紙とこの台紙
に剥離自在な基材シートとからなる台紙つき基材シート
にレーザ光を照射して基材シートを切断する台紙つき基
材シートの切断方法において、この台紙つき基材シート
を台紙と基材シートとの間に低融点材を介在させて構成
し、レーザ光の照射による低融点材の飛散エネルギーで
基材シートを切断することを特徴とする。第５に、台紙
とこの台紙に剥離自在な基材シートとからなる台紙つき
基材シートにレーザ光を照射して基材シートを切断する
台紙つき基材シートの切断方法において、この台紙つき
基材シートの台紙を透光材で構成し、かつ台紙と基材シ
ートとの間に低融点材を介在させ、台紙にレーザ光を透
過させると共に、レーザ光の照射による低融点材の飛散
エネルギーで基材シートを切断することを特徴とする。
第６に、台紙とこの台紙に剥離自在な基材シートとから
なる台紙つき基材シートにレーザ光を照射して基材シー
トを切断する台紙つき基材シートの切断方法において、
レーザ光の照射後、再度同一位置にレーザ光を照射する
ことを特徴とする。第７に、台紙とこの台紙に剥離自在
な基材シートとからなる台紙つき基材シートにレーザ光
を照射して基材シートを切断する台紙つき基材シートの
切断方法において、レーザ光の照射後、再度同一位置に
焦点をずらしてレーザ光を照射することを特徴とする。In order to achieve the above-mentioned object, the present invention is, firstly, a base sheet with a mount, which comprises a mount and a base sheet releasable from the mount, wherein the mount is transparent. It is characterized by being composed of a light material. Secondly, in a base material sheet with a mount, which comprises a mount material and a base material sheet which can be peeled off from the mount material, a low melting point material is interposed between the mount material and the base material sheet. Thirdly, in a method for cutting a base material sheet with a mount, which comprises cutting a base material sheet by irradiating a base material sheet with a mount material, which comprises a mount material and a base material sheet that can be peeled off from the mount material, with the base material sheet being transparent. It is characterized in that it is made of an optical material, and the base material sheet is cut by transmitting laser light to the mount. Fourthly, in a method of cutting a base sheet with a mount, which comprises cutting a base sheet by irradiating a base sheet with a mount, which comprises a mount and a base sheet which can be peeled off from the mount, with the base sheet with the mount. The material sheet is configured by interposing a low melting point material between the mount and the base material sheet, and the base material sheet is cut by the scattering energy of the low melting point material due to the irradiation of the laser beam. Fifthly, in a method for cutting a base sheet with a mount, which comprises cutting a base sheet by irradiating a base sheet with a mount, which comprises a mount and a base sheet that can be peeled off from the mount, with the base sheet with the mount. The mount of the material sheet is made of a translucent material, and the low melting point material is interposed between the mount and the base material sheet to allow the laser light to pass through the mount, and the scattering energy of the low melting point material due to the laser light irradiation. It is characterized in that the base material sheet is cut.
Sixth, in a method of cutting a base sheet with a mount, which comprises irradiating a base sheet with a mount made of a mount and a base sheet releasable on the mount with a laser beam to cut the base sheet,
It is characterized in that after the laser light irradiation, the same position is again irradiated with the laser light. Seventh, in a method of cutting a base material sheet with a mount, which comprises irradiating a base material sheet with a mount, which comprises a mount material and a base material sheet that can be peeled off from the mount material, with a laser beam, After that, the focus is shifted to the same position again and the laser light is emitted.
【０００５】[0005]
【作用】前記構成により、本発明によれば、 （１）台紙とこの台紙に剥離自在な基材シートとからな
る台紙つき基材シートにおける前記台紙を透光材で構成
したことにより、台紙に金属を使用していないため、台
紙つき基材シートが軽量となる。 （２）台紙と基材シートとの間に低融点材を介在させた
ことにより、台紙に金属を使用しなくて済むため、台紙
つき基材シートが軽量となる。 （３）台紙とこの台紙に剥離自在な基材シートとからな
る台紙つき基材シートにおける前記の台紙を、透光材で
構成したことにより、レーザ光を照射することによって
基材シートを台紙から切断する際、レーザ光が台紙を透
過するため、基材シートのみを切断することができ、
又、レーザ出力を微妙に制御しなくても基材シートの切
断が可能である。 （４）台紙と基材シートとの間に低融点材を介在させた
ことにより、レーザ光の照射により基材シートを台紙か
ら切断する際、低融点材が飛散し、そのエネルギーで基
材シートのみを切断することができ、又、基材シートの
剥離性も良い。 （５）台紙を透光材で構成すると共に、台紙と基材シー
トとの間に低融点材を介在させたことにより、レーザ光
の照射によって基材シートを台紙から切断する際、レー
ザ光は台紙を透過し、かつ低融点材の飛散エネルギーで
基材シートのみを切断することができるため、基材シー
トの剥離性が良い。 （６）レーザ光を照射して基材シートを切断した後、再
度同一位置にレーザ光を照射するため、切断部が熱処理
されて玉状になり、基材シートの剥離性が向上する。 （７）レーザ光を照射して基材シートを切断した後、再
度同一位置に焦点をずらしてレーザ光を照射することに
より、上記と同様に切断部が熱処理されて玉状になり、
基材シートの剥離性が向上する。With the above construction, according to the present invention, (1) the mount in the base sheet with a mount made of the mount and the base sheet that can be peeled off from the mount is made of a light-transmitting material. Since no metal is used, the base sheet with a mount becomes lightweight. (2) Since the low melting point material is interposed between the mount and the base sheet, it is not necessary to use a metal for the mount, so the base sheet with the mount becomes lightweight. (3) By forming the above-mentioned mount of the mount-equipped base sheet composed of the mount and the base sheet that can be peeled off from the mount by a light-transmitting material, the base sheet can be removed from the mount by irradiating laser light. When cutting, the laser light passes through the mount, so it is possible to cut only the base sheet,
Further, the base sheet can be cut without finely controlling the laser output. (4) By interposing the low melting point material between the mount and the base sheet, the low melting point material is scattered when the base sheet is cut from the mount by irradiation of laser light, and the energy causes the base material sheet to scatter. Only the base material sheet can be cut, and the peelability of the base sheet is good. (5) Since the mount is made of a translucent material and the low melting point material is interposed between the mount and the base sheet, when the base sheet is cut by the laser light irradiation, the laser light is Since it is possible to cut only the base sheet through the mount and with the energy of the low-melting-point material scattered, the releasability of the base sheet is good. (6) After cutting the base material sheet by irradiating it with laser light, the same position is again irradiated with laser light, so that the cut portion is heat-treated into a ball shape, and the releasability of the base material sheet is improved. (7) After irradiating with laser light to cut the base material sheet, the focal point is shifted to the same position again and irradiating with laser light, so that the cut portion is heat-treated into a bead shape in the same manner as above,
The releasability of the base sheet is improved.
【０００６】[0006]
【実施例】以下、図面に基づき本発明の好ましい実施例
を説明する。図１はロール状の台紙つき基材シートから
基材シートのみを切断する装置を示し、台紙つき基材シ
ート１０は供給ロール２０と巻取りロール３０間に張架
されている。これら二つのロール２０，３０の中途部に
レーザ切断装置４０を設け、レーザエネルギにより台紙
１から基材シート２のみを切断して剥離できるようにな
っている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described below with reference to the drawings. FIG. 1 shows an apparatus for cutting only a base material sheet from a roll-shaped base material sheet with a mount, and the base material sheet with a mount 10 is stretched between a supply roll 20 and a winding roll 30. A laser cutting device 40 is provided in the middle of these two rolls 20 and 30 so that only the base sheet 2 can be cut and peeled from the mount 1 by laser energy.
【０００７】〔実施例１〕この実施例では、台紙と基材
シートとからなる台紙つき基材シートにおいて、台紙を
透光材で構成したことを特徴とする。すなわち、図２
（ａ）のように、台紙つき基材シート１０を台紙１と基
材シート２ａ，２ｂで構成し、台紙１は透光性のナイロ
ン等から成っている。具体的には、例えば基材シート２
ａはラベルであり、基材シート２ｂは粘着シートであ
る。[Embodiment 1] This embodiment is characterized in that in a base sheet with a mount, which is composed of a mount and a base sheet, the mount is made of a translucent material. That is, FIG.
As shown in (a), the base sheet with a mount 10 is composed of the mount 1 and the base sheets 2a and 2b, and the mount 1 is made of translucent nylon or the like. Specifically, for example, the base sheet 2
a is a label, and the base material sheet 2b is an adhesive sheet.
【０００８】又、図２（ｂ）は、台紙つき基材シート１
０を台紙１と基材シート２ｂで構成したものであり、両
面接着テープとして利用される。この台紙つき基材シー
ト１０に対し、図３（ａ）（ｂ）のように、台紙１と反
対側からＹＡＧレーザを照射すれば、図４（ａ）（ｂ）
のように、基材シート２ａ，２ｂはレーザエネルギーに
より夫々切断されるが、レーザ光は台紙１を透過するた
め、基材シート２ａ，２ｂ、又は基材シート２ｂのみを
台紙１から剥離することができる。なお、図５のよう
に、台紙１側からＹＡＧレーザを照射しても良い。Further, FIG. 2B shows a base sheet 1 with a mount.
0 is composed of a mount 1 and a base sheet 2b, and is used as a double-sided adhesive tape. As shown in FIGS. 3 (a) and 3 (b), a YAG laser is radiated from the side opposite to the mount 1 with respect to the base sheet 10 with the mount, as shown in FIGS.
As described above, the base sheets 2a and 2b are respectively cut by the laser energy, but since the laser light passes through the mount 1, the base sheets 2a and 2b or only the base sheet 2b should be peeled from the mount 1. You can Incidentally, as shown in FIG. 5, the YAG laser may be emitted from the side of the mount 1.
【０００９】〔実施例２〕この実施例では、台紙と基材
シートとの間に低融点材を介在させたことを特徴とす
る。すなわち、図６（ａ）のように、台紙つき基材シー
ト１０は台紙１と低融点材３および基材シート２ａ，２
ｂ、又は図６（ｂ）のように、台紙１と低融点材３およ
び基材シート２ｂから構成され、具体的には基材シート
２ａはラベル、基材シート２ｂは粘着シートから成り、
台紙１は紙であるがこれに限定されるものではない。
又、低融点材３は例えばパラフィンから成っている。[Embodiment 2] This embodiment is characterized in that a low melting point material is interposed between the mount and the base sheet. That is, as shown in FIG. 6 (a), the base sheet with a mount 10 has a mount 1, a low melting point material 3 and base sheets 2 a and 2 a.
b, or as shown in FIG. 6B, it is composed of a mount 1, a low melting point material 3 and a base sheet 2b. Specifically, the base sheet 2a is a label and the base sheet 2b is an adhesive sheet.
The mount 1 is paper, but is not limited to this.
The low melting point material 3 is made of paraffin, for example.
【００１０】この台紙つき基材シート１０に対し、図７
（ａ）（ｂ）のように、台紙１と反対側からＹＡＧレー
ザを照射すれば、図８（ａ）（ｂ）のように、低融点材
３が飛散し、その飛散エネルギーで基材シート２ａ，２
ｂ、又は基材シート２ｂが切断される。このため、基材
シート２ａ，２ｂ、又は基材シート２ｂのみを台紙１か
ら剥離することができる。The base sheet 10 with the mount is shown in FIG.
When the YAG laser is irradiated from the side opposite to the mount 1 as in (a) and (b), the low melting point material 3 scatters as shown in FIGS. 2a, 2
b or the base material sheet 2b is cut. Therefore, the base material sheets 2a and 2b or only the base material sheet 2b can be peeled from the mount 1.
【００１１】〔実施例３〕この実施例では、台紙１を透
光材で構成し、かつ台紙１と基材シート２との間に低融
点材３を介在させ、台紙１にレーザ光を透過させると共
に、レーザ光の照射による低融点材３の飛散エネルギー
で基材シート２を切断する方法を特徴とするものであ
る。すなわち、台紙つき基材シート１０は、図９（ａ）
（ｂ）のように、台紙１を透光材で構成すると共に、台
紙１と基材シート２ａ，２ｂとの間、又は台紙１と基材
シート２ｂとの間に低融点材３を介在させている。[Embodiment 3] In this embodiment, the mount 1 is made of a translucent material, and the low melting point material 3 is interposed between the mount 1 and the base sheet 2 to transmit the laser light to the mount 1. In addition, the method is characterized in that the base sheet 2 is cut by the scattering energy of the low melting point material 3 by the irradiation of laser light. That is, the base sheet 10 with the mount is shown in FIG.
As shown in (b), the mount 1 is made of a translucent material, and the low melting point material 3 is interposed between the mount 1 and the base sheets 2a and 2b or between the mount 1 and the base sheet 2b. ing.
【００１２】この台紙つき基材シート１０に対し、ＹＡ
Ｇレーザを照射すれば、図１０（ａ）（ｂ）のように、
低融点材３の飛散エネルギーで基材シート２ａ，２ｂ、
又は基材シート２ｂが切断されると共に、図１１（ａ）
（ｂ）のように、レーザ光は台紙１を透過する。このよ
うにして、台紙１から基材シート２ａ，２ｂ、又は基材
シート２ｂのみを剥離することができる。For the base sheet 10 with the mount, YA
If G laser is radiated, as shown in FIGS.
The base sheet 2a, 2b, by the scattering energy of the low melting point material 3,
Alternatively, the base material sheet 2b is cut, and FIG.
As shown in (b), the laser light passes through the mount 1. In this way, the base sheets 2a and 2b or only the base sheet 2b can be peeled from the mount 1.
【００１３】〔実施例４〕この実施例では、台紙１を透
光材で構成し、レーザ光の照射後、再度同一位置にレー
ザ光を照射させるようにしたことを特徴とするものであ
る。すなわち、図１２（ａ）のように、台紙１をナイロ
ン等の透光材で構成し、台紙１と反対側からレーザ光を
照射させて基材シート２ｂを切断すると共に、図１２
（ｂ）のように、再度同一位置にレーザ光を照射させて
基材シート２ｂの切断部を熱処理して玉状にすることに
より、基材シート２ｂの剥離性をよくすることができ
る。[Embodiment 4] This embodiment is characterized in that the mount 1 is made of a translucent material, and after the laser light irradiation, the same position is irradiated with the laser light again. That is, as shown in FIG. 12A, the mount 1 is made of a translucent material such as nylon, and the base sheet 2b is cut by irradiating laser light from the side opposite to the mount 1 and
As in (b), the releasability of the base material sheet 2b can be improved by irradiating the same position with laser light again to heat the cut portion of the base material sheet 2b to form a ball shape.
【００１４】〔実施例５〕この実施例では、台紙１を透
光材で構成し、レーザ光の照射後、再度同一位置に焦点
をずらしてレーザ光を照射させるようにしたことを特徴
とする。すなわち、図１３（ａ）のように、台紙１をナ
イロン等の透光材で構成し、台紙１と反対側からレーザ
光を照射させて基材シート２を切断すると共に、図１３
（ｂ）のように、再度同一位置に焦点をずらしてレーザ
光を照射させて基材シート２ｂの切断部を熱処理して玉
状にすることにより、上記と同様に基材シート２ｂの剥
離性をよくすることができる。[Embodiment 5] This embodiment is characterized in that the mount 1 is made of a light-transmitting material, and after the laser light irradiation, the focus is shifted to the same position again and the laser light is irradiated. .. That is, as shown in FIG. 13A, the mount 1 is made of a translucent material such as nylon, and the base sheet 2 is cut by irradiating laser light from the side opposite to the mount 1 and
As in (b), the focal point is again shifted to the same position to irradiate the laser beam to heat the cut portion of the base material sheet 2b to form a ball shape, whereby the releasability of the base material sheet 2b is increased in the same manner as described above. Can be well.
【００１５】[0015]
【発明の効果】この発明は、以上説明した通り、 （１）台紙とこの台紙に剥離自在な基材シートとからな
る台紙つき基材シートにおいて、この台紙を透光材で構
成したことにより、台紙に金属を使用しないため、軽量
である。 （２）台紙とこの台紙に剥離自在な基材シートとからな
る台紙つき基材シートにおいて、この台紙と基材シート
との間に低融点材を介在させたことにより、台紙に金属
を使用しないため、軽量で済む。 （３）台紙とこの台紙に剥離自在な基材シートとからな
る台紙つき基材シートにレーザ光を照射して基材シート
を切断する台紙つき基材シートの切断方法において、こ
の台紙を透光材で構成し、台紙にレーザ光を透過させて
基材シートを切断することにより、レーザ出力を微妙に
制御しなくても基材の切断が可能である。 （４）台紙とこの台紙に剥離自在な基材シートとからな
る台紙つき基材シートにレーザ光を照射して基材シート
を切断する台紙つき基材シートの切断方法において、こ
の台紙つき基材シートを台紙と基材シートとの間に低融
点材を介在させて構成し、レーザ光の照射による低融点
材の飛散エネルギーで基材シートを切断することによ
り、レーザ出力を微妙に制御しなくても基材の切断が可
能であり、又、素材を飛散させるため、基材の剥離性が
よい。 （５）台紙とこの台紙に剥離自在な基材シートとからな
る台紙つき基材シートにレーザ光を照射して基材シート
を切断する台紙つき基材シートの切断方法において、こ
の台紙つき基材シートの台紙を透光材で構成し、かつ台
紙と基材シートとの間に低融点材を介在させ、台紙にレ
ーザ光を透過させると共に、レーザ光の照射による低融
点材の飛散エネルギーで基材シートを切断することによ
り、レーザ出力を微妙に制御しなくても基材の切断が可
能であり、又、素材を飛散させるため、基材の剥離性が
よい。 （６）台紙とこの台紙に剥離自在な基材シートとからな
る台紙つき基材シートにレーザ光を照射して基材シート
を切断する台紙つき基材シートの切断方法において、レ
ーザ光の照射後、再度同一位置にレーザ光を照射するこ
とにより、切断部を熱処理して玉状にすることにより、
基材の剥離性をよくすることができる。 （７）台紙とこの台紙に剥離自在な基材シートとからな
る台紙つき基材シートにレーザ光を照射して基材シート
を切断する台紙つき基材シートの切断方法において、レ
ーザ光の照射後、再度同一位置に焦点をずらしてレーザ
光を照射することにより、切断部を熱処理して玉状にす
ることにより、基材の剥離性をよくすることができる。As described above, according to the present invention, (1) a base sheet with a mount comprising a mount and a base sheet that can be peeled off from the mount, and the mount is made of a translucent material, It is lightweight because no metal is used for the mount. (2) In a base material sheet with a mount, which comprises a mount material and a base material sheet that can be peeled off from the mount material, a low melting point material is interposed between the mount material and the base material sheet, so that no metal is used for the mount material. Therefore, it is lightweight. (3) In a method of cutting a base sheet with a mount, the base sheet with a mount, which comprises a mount and a base sheet that can be peeled off from the mount, is irradiated with laser light to cut the base sheet. By using a material and cutting the base material sheet by transmitting the laser beam to the mount, the base material can be cut without finely controlling the laser output. (4) In a method for cutting a base material sheet with a mount, which comprises cutting a base material sheet by irradiating a base material sheet with a mount material, which comprises a mount material and a base material sheet that can be peeled off from the mount material, with the base material with the mount material. By constructing a sheet with a low melting point material interposed between the mount and the base material sheet, and cutting the base material sheet with the scattering energy of the low melting point material by the irradiation of laser light, the laser output is not delicately controlled. Even so, the base material can be cut, and since the material is scattered, the base material can be easily peeled off. (5) In a method of cutting a base material sheet with a mount, which comprises cutting a base material sheet by irradiating a base material sheet with a mount material, which comprises a mount material and a base material sheet that can be peeled off from the mount material, with the base material sheet having the mount material. The backing of the sheet is composed of a translucent material, and the low melting point material is interposed between the backing and the base sheet to allow the laser light to pass through the backing sheet, and at the same time, the energy of the low melting point is scattered by the irradiation of the laser light. By cutting the material sheet, the base material can be cut without finely controlling the laser output, and since the material is scattered, the base material can be easily peeled off. (6) In a method of cutting a base material sheet with a mount, which comprises cutting a base material sheet by irradiating a base material sheet with a mount material, which comprises a mount material and a base material sheet that can be peeled off from the mount material, with laser light , By irradiating the same position again with laser light, the cutting part is heat-treated into a ball shape,
The releasability of the base material can be improved. (7) In a method of cutting a base material sheet with a mount, which comprises cutting a base material sheet by irradiating a base material sheet with a mount material, which comprises a mount material and a base material sheet which can be peeled off from the mount material, with a laser beam. By peeling the focal point to the same position again and irradiating it with laser light, the cut portion is heat-treated to form a ball shape, whereby the releasability of the base material can be improved.
【図１】台紙つき基材シートの切断装置の外観を示す図
である。FIG. 1 is a diagram showing an appearance of a cutting device for a base sheet with a mount.
【図２】（ａ）（ｂ）は台紙を透光材で構成した台紙つ
き基材シートの断面図である。2A and 2B are cross-sectional views of a base sheet with a mount in which the mount is made of a translucent material.
【図３】（ａ）（ｂ）は台紙を透光材で構成した台紙つ
き基材シートにレーザ光を照射する状態を示す図であ
る。3 (a) and 3 (b) are diagrams showing a state in which a base material sheet with a mount having a mount made of a translucent material is irradiated with laser light.
【図４】（ａ）（ｂ）は台紙を透光材で構成した台紙つ
き基材シートにレーザ光を照射して基材シートを切断す
る状態を示す図である。FIGS. 4A and 4B are views showing a state in which a base sheet with a mount having a mount made of a translucent material is irradiated with laser light to cut the base sheet.
【図５】台紙を透光材で構成した台紙つき基材シートに
台紙側からレーザ光を照射する状態を示す図である。FIG. 5 is a diagram showing a state in which a base material sheet with a mount, the mount having a translucent material, is irradiated with laser light from the mount side.
【図６】（ａ）（ｂ）は台紙と基材シートとの間に低融
点材を介在させた台紙つき基材シートの断面図である。6A and 6B are cross-sectional views of a base sheet with a mount in which a low melting point material is interposed between the mount and the base sheet.
【図７】（ａ）（ｂ）は台紙と基材シートとの間に低融
点材を介在させた台紙つき基材シートにレーザ光を照射
する状態を示す図である。7 (a) and 7 (b) are diagrams showing a state in which a base material sheet with a mount having a low melting point material interposed between the mount material and the base material sheet is irradiated with laser light.
【図８】（ａ）（ｂ）は台紙と基材シートとの間に低融
点材を介在させた台紙つき基材シートにレーザ光を照射
して基材シートを切断する状態を示す図である。8A and 8B are views showing a state in which a base sheet with a mount having a low melting point material interposed between the mount and the base sheet is irradiated with laser light to cut the base sheet. is there.
【図９】（ａ）（ｂ）は台紙を透光材で構成すると共
に、台紙と基材シートとの間に低融点材を介在させた台
紙つき基材シートにレーザ光を照射する状態を示す図で
ある。9 (a) and 9 (b) show a state in which a mount is made of a translucent material, and a base sheet with a mount having a low melting point material interposed between the mount and the base sheet is irradiated with laser light. FIG.
【図１０】（ａ）（ｂ）は台紙を透光材で構成すると共
に、台紙と基材シートとの間に低融点材を介在させた台
紙つき基材シートにレーザ光を照射して基材シートを切
断する状態を示す図である。FIGS. 10 (a) and 10 (b) show a base sheet with a mount having a low melting point material interposed between the mount and a base sheet by irradiating the base sheet with laser light. It is a figure which shows the state which cut | disconnects a material sheet.
【図１１】（ａ）（ｂ）はレーザ光により基材シートを
切断した後、レーザ光が台紙を透過する状態を示す図で
ある。11A and 11B are diagrams showing a state in which the laser light is transmitted through the mount after the base sheet is cut by the laser light.
【図１２】（ａ）（ｂ）はレーザ光により基材シートを
切断した後、再び同じ位置にレーザ光を照射して熱処理
する状態を示す図である。12 (a) and 12 (b) are views showing a state in which the base material sheet is cut by laser light and then the same position is again irradiated with laser light to perform heat treatment.
【図１３】（ａ）（ｂ）はレーザ光により基材シートを
切断した後、再び同じ位置に焦点をずらしてレーザ光を
照射して熱処理する状態を示す図である。13 (a) and 13 (b) are views showing a state in which the base material sheet is cut by laser light, and then the focus is again shifted to the same position to irradiate laser light and heat treatment is performed.
【符号の説明】 １ 台紙 ２，２ａ，２ｂ 基材シート ３ 低融点材 １０ 台紙つき基材シート ２０ 供給ロール ３０ 巻取りロール ４０ レーザ切断装置[Explanation of Codes] 1 mount 2, 2a, 2b base sheet 3 low melting point material 10 base sheet with mount 20 supply roll 30 winding roll 40 laser cutting device
Claims (7)
とからなる台紙つき基材シートにおいて、この台紙を透
光材で構成したことを特徴とする台紙つき基材シート。1. A base sheet with a mount, which comprises a mount and a base sheet that can be peeled off from the mount, wherein the mount is made of a light-transmitting material.
とからなる台紙つき基材シートにおいて、この台紙と基
材シートとの間に低融点材を介在させたことを特徴とす
る台紙つき基材シート。2. A base sheet with a mount, which comprises a mount and a base sheet which can be peeled off from the mount, wherein a low melting point material is interposed between the mount and the base sheet. Base sheet.
とからなる台紙つき基材シートにレーザ光を照射して基
材シートを切断する台紙つき基材シートの切断方法にお
いて、この台紙を透光材で構成し、台紙にレーザ光を透
過させて基材シートを切断することを特徴とする台紙つ
き基材シートの切断方法。3. A method for cutting a base sheet with a mount, which comprises cutting a base sheet by irradiating a base sheet with a mount, which comprises a mount and a base sheet releasable on the mount, with a laser beam, to cut the base sheet. A method of cutting a base sheet with a mount, comprising a translucent material and cutting the base sheet by transmitting laser light to the mount.
とからなる台紙つき基材シートにレーザ光を照射して基
材シートを切断する台紙つき基材シートの切断方法にお
いて、この台紙つき基材シートを台紙と基材シートとの
間に低融点材を介在させて構成し、レーザ光の照射によ
る低融点材の飛散エネルギーで基材シートを切断するこ
とを特徴とする台紙つき基材シートの切断方法。4. A method of cutting a base sheet with a mount, which comprises cutting a base sheet by irradiating a base sheet with a mount, the base sheet having a mount and a base sheet releasable from the mount with the base sheet. A base material with a mount, characterized in that the base material sheet is formed by interposing a low melting point material between the mount material and the base material sheet, and the base material sheet is cut by the scattering energy of the low melting point material by the irradiation of laser light. How to cut the sheet.
とからなる台紙つき基材シートにレーザ光を照射して基
材シートを切断する台紙つき基材シートの切断方法にお
いて、この台紙つき基材シートの台紙を透光材で構成
し、かつ台紙と基材シートとの間に低融点材を介在さ
せ、台紙にレーザ光を透過させると共に、レーザ光の照
射による低融点材の飛散エネルギーで基材シートを切断
することを特徴とする台紙つき基材シートの切断方法。5. A method of cutting a base sheet with a mount, which comprises cutting a base sheet by irradiating a base sheet with a mount, which comprises a mount and a base sheet which can be peeled off from the mount, with the base sheet. The backing sheet of the base sheet is made of a translucent material, and the low melting point material is interposed between the backing sheet and the base sheet to allow laser light to pass through the backing sheet, and the scattering energy of the low melting point material due to laser light irradiation. A method for cutting a base material sheet with a mount, which comprises cutting the base material sheet with.
とからなる台紙つき基材シートにレーザ光を照射して基
材シートを切断する台紙つき基材シートの切断方法にお
いて、レーザ光の照射後、再度同一位置にレーザ光を照
射することを特徴とする台紙つき基材シートの切断方
法。6. A method of cutting a base sheet with a mount, comprising irradiating a base sheet with a mount, which comprises a mount and a base sheet releasable on the mount, with a laser beam to cut the base sheet. A method of cutting a base sheet with a mount, which comprises irradiating the same position with laser light again after irradiation.
とからなる台紙つき基材シートにレーザ光を照射して基
材シートを切断する台紙つき基材シートの切断方法にお
いて、レーザ光の照射後、再度同一位置に焦点をずらし
てレーザ光を照射することを特徴とする台紙つき基材シ
ートの切断方法。7. A method of cutting a base material sheet with a mount, comprising irradiating a base material sheet with a base material, which comprises a mount material and a base material sheet that can be peeled off from the mount material, with a laser beam to cut the base material sheet. After the irradiation, the laser beam is irradiated again with the focus shifted to the same position, and a method for cutting a base sheet with a mount.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6942692A JPH05232878A (en) | 1992-02-19 | 1992-02-19 | Base sheet providing with mount and cutting method of the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6942692A JPH05232878A (en) | 1992-02-19 | 1992-02-19 | Base sheet providing with mount and cutting method of the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05232878A true JPH05232878A (en) | 1993-09-10 |
Family
ID=13402286
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6942692A Pending JPH05232878A (en) | 1992-02-19 | 1992-02-19 | Base sheet providing with mount and cutting method of the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05232878A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005234380A (en) * | 2004-02-20 | 2005-09-02 | Malugo Label:Kk | Label and its manufacturing method |
| JP2016093141A (en) * | 2014-11-14 | 2016-05-26 | Jnc株式会社 | Apparatus, method, and program of microorganism inspection |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6161191A (en) * | 1984-09-01 | 1986-03-28 | 大阪シ−リング印刷株式会社 | Manufacture of label |
| JPS62259686A (en) * | 1986-05-02 | 1987-11-12 | Toshiba Corp | Macnining by laser light |
-
1992
- 1992-02-19 JP JP6942692A patent/JPH05232878A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6161191A (en) * | 1984-09-01 | 1986-03-28 | 大阪シ−リング印刷株式会社 | Manufacture of label |
| JPS62259686A (en) * | 1986-05-02 | 1987-11-12 | Toshiba Corp | Macnining by laser light |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005234380A (en) * | 2004-02-20 | 2005-09-02 | Malugo Label:Kk | Label and its manufacturing method |
| JP2016093141A (en) * | 2014-11-14 | 2016-05-26 | Jnc株式会社 | Apparatus, method, and program of microorganism inspection |
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