JPH05232696A - Positive resist composition - Google Patents

Abstract

PURPOSE:To improve the balance of various properties such as sensitivity and heat resistance by incorporating a specified phenol, alkali-soluble resin containing a resin obtd. by condensation of specified compd. and aldehydes, and quinonediazide compd. CONSTITUTION:The resist compsn. contains one or more kinds of phenols expressed by formula I, alkali-soluble resin and quinonediazide compd. containing a resin obtd. by condensation of aldehydes and one or more kinds of compds. expressed by formula II. In formula, R1, R2 and R3 are independently hydrogen atom or alkyl or alkoxy group of 1-4 carbon number, k is 1 or 2, Y1, Y2, Y3, Y4, Y5 and Y6 are independently hydrogen atom or alkyl or alkoxy group of 1-4 carbon number, Y7 is bivalent ethylene hydrocarbon residue having 3-10 carbon number which may be substd., and 1 and m are independently 1 or 2.

Description

Detailed Description of the Invention

[0001]

The present invention relates to ultraviolet rays (g rays, i rays),
The present invention relates to a positive resist composition suitable for a positive photoresist sensitive to radiation such as deep ultraviolet rays including excimer laser, electron rays, ion beams, X rays and the like.

[0002]

2. Description of the Related Art A composition containing a quinonediazide compound and an alkali-soluble resin utilizes the fact that the quinonediazide group is decomposed to produce a carboxyl group by irradiation with light having a wavelength of 500 nm or less, and as a result, the alkali-insoluble state becomes alkali-soluble. And is used as a positive photoresist. The resolution of this positive type photoresist is significantly superior to that of the negative type photoresist.
It is used in the fabrication of integrated circuits such as LSI.

In recent years, in integrated circuits, the width of wiring has become finer as the degree of integration has improved, and therefore dry etching has become the mainstream instead of conventional wet etching. In dry etching, the temperature of the substrate rises, and as a result, the resist pattern may be thermally deformed and the dimensional accuracy may deteriorate. Therefore, the heat resistance of the resist is required more than ever. In addition, when it is attempted to achieve both a good pattern profile of a developing solution and a high resolution, a marked decrease in sensitivity usually occurs. Looking at the positive photoresists currently used from this viewpoint, it cannot be said that the balance between sensitivity and various properties such as heat resistance is at a satisfactory level.

[0004]

The present invention provides a positive resist composition having an excellent balance of various properties such as sensitivity and heat resistance.

[0005]

The present invention has the following general formula (I):

[0006]

[Chemical 8]

(Wherein R ₁ , R ₂ and R ₃ each independently represent a hydrogen atom or an alkyl or alkoxy group having 1 to 4 carbon atoms, and k represents 1 or 2). Or one or more of the following general formula (I
I)

[0008]

[Chemical 9]

(Wherein Y ₁ , Y ₂ , Y ₃ , Y ₄ , Y ₅ and Y ₆
Each independently represent a hydrogen atom or an alkyl or alkoxy group having 1 to 4 carbon atoms, Y ₇ represents a divalent, optionally substituted ethylene hydrocarbon group having 3 to 10 carbon atoms, and l And m each independently represent 1 or 2. )
A positive resist composition comprising an alkali-soluble resin containing a resin (A) obtained by condensing one or more compounds represented by the above and an aldehyde, and a quinonediazide compound.

The phenols represented by the above general formula (I) include phenol, o-cresol, m-cresol, p-cresol, 3,5-xylenol and 2,5-.
Xylenol, 2,3-xylenol, 3,4-xylenol, 2,3,5-trimethylphenol, 4-tert
-Butylphenol, 2-tert-butylphenol, 3
-Tert-butylphenol, 2-tert-butyl-4-methylphenol, 2-tert-butyl-5-methylphenol, 6-tert-butyl-3-methylphenol, 2-
Methylresorcinol, 4-methylresorcinol, 5
-Methylresorcinol, 4-tert-butylcatechol, 4-methoxyphenol, 3-methoxyphenol, 2-methoxyphenol, 2-methoxycatechol, 2-methoxyresorcinol, 3-methoxyresorcinol, 2,3-dimethoxyphenol, 2, 5-dimethoxyphenol, 3,5-dimethoxyphenol,
3-ethylphenol, 2-ethylphenol, 4-ethylphenol, 2,3,5-triethylphenol,
Examples include 3,5-diethylphenol and 2,5-diethylphenol. Among them, m-cresol, p-cresol, 3,5-xylenol, 2,5-xylenol, 2,3,5-trimethylphenol, 2-tert-butyl-5-methylphenol and 6-tert-butyl-3.
-Methylphenol is preferred. The phenols may be used alone or in combination of two or more. As a specific example of mixing, m-cresol and p-cresol,
m-cresol and 3,5-xylenol, m-cresol and 2,3,5-trimethylphenol, m-cresol and 6-tert-butyl-3-methylphenol, m-cresol and p-cresol and 3,5- Xylenol, m
-Cresol and p-cresol and 2,3,5-trimethylphenol, m-cresol and p-cresol and 6-
tert-butyl-3-methylphenol and the like can be mentioned.
The ratio when two or more phenols are mixed can be appropriately selected.

In the above general formula (II), the alkyl or alkoxy group represented by Y _{1 to} Y ₆ includes straight or branched ones, preferably methyl, ethyl, methoxy and ethoxy groups. The substituent of the divalent ethylene-based hydrocarbon residue represented by Y ₇ is preferably an alkyl group having 1 to 4 carbon atoms such as methyl or ethyl group. Preferred compounds represented by the general formula (II) include

[0012]

[Chemical 10]

(In the formula, l and m have the same meanings as described above.) And the like. Above all,

[0014]

[Chemical 11]

Especially preferred are these, which may be mixtures. The compound represented by the general formula (II) is known. The preferred molar ratio of the phenol represented by the general formula (I) to the compound represented by the general formula (II) is 60:40.
~ 99.5: 0.5.

Examples of the aldehydes condensed with the phenols represented by the general formula (I) and the compound represented by the general formula (II) include formaldehyde, acetaldehyde, propionaldehyde, n-butyraldehyde, isobutyraldehyde and trimethylacetaldehyde. , N-hexylaldehyde, acrolein, crotonaldehyde, cyclohexanaldehyde, cyclopentanaldehyde, furfural, furylacrolein, benzaldehyde, o-tolualdehyde, p-tolualdehyde, m-tolualdehyde, p-ethylbenzaldehyde, 2,4-dimethyl Benzaldehyde, 2,5-dimethylbenzaldehyde, 3,4-dimethylbenzaldehyde, 3,5-dimethylbenzaldehyde, phenylacetaldehyde, - hydroxy benzaldehyde, p
-Hydroxybenzaldehyde, m-hydroxybenzaldehyde, cinnamic aldehyde, o-anisaldehyde, p-anisaldehyde, m-anisaldehyde, vanillin and the like can be mentioned. These aldehydes may be used alone or in combination of two or more. As the aldehyde, formaldehyde is preferable because it is industrially easily available. Preferable molar numbers of aldehydes are phenols represented by the general formula (I) and general formula (I).
It is 0.35 to 2 times the total number of moles of the compound represented by I).

The acid catalyst used in the condensation is hydrochloric acid,
Examples thereof include inorganic acids such as sulfuric acid, perchloric acid and phosphoric acid, organic acids such as formic acid, acetic acid, oxalic acid, trichloroacetic acid and p-toluenesulfonic acid, and divalent metal salts such as zinc acetate, zinc chloride and magnesium acetate. .. These acid catalysts may be used alone or in combination of two or more. The preferred number of moles of the acid catalyst used is 0.005 to 2 times the total number of moles of the phenols represented by the general formula (I) and the compound represented by the general formula (II).

The condensation conditions are usually 60 to 250 ° C. and 2 to 30 hours, and the phenols represented by the general formula (I), the compounds represented by the general formula (II), aldehydes, acid catalysts, etc. are charged at once. Alternatively, the reaction is carried out by separately charging.
Also, the condensation is carried out in bulk or in a solvent. Examples of the solvent include water, alcohols (methanol, ethanol, iso-propanol, n-butanol and iso-
Amyl alcohol, etc.), ketones (methyl isobutyl ketone, methyl ethyl ketone, cyclohexanone, etc.),
Hydrocarbons (hexane, heptane, cyclohexane, benzene, toluene, xylene, etc.) or methyl cellosolve, ethyl cellosolve, ethyl cellosolve acetate and the like can be mentioned. Usually, the amount of these solvents is 10 to 1000 parts by weight based on 100 parts by weight of the total amount of the phenols represented by the general formula (I) and the compound represented by the general formula (II).

As the resin (A), its GPC (UV-254n
Use m detector. The same below) The area ratio in the range of 1000 or less in terms of polystyrene equivalent in the pattern is preferably 30% or less with respect to the total pattern area excluding the pattern area of unreacted phenols, and the heat resistance is improved and the development residue is From the viewpoint of being less likely to occur, the area ratio in the range of 6000 or less in terms of polystyrene equivalent in the GPC pattern, which satisfies the above conditions, is 15% or more and 65% with respect to the total pattern area excluding the pattern area of unreacted phenols The following are more preferable. Such a resin can be easily obtained by adding an operation such as fractionation after the condensation reaction. Fractionation is performed by using a resin produced by condensation as a good solvent such as alcohol (methanol, ethanol, etc.),
Method of dissolving in ketones (acetone, methyl ethyl ketone, methyl isobutyl ketone, etc.), ethylene glycol and its ethers, ether esters (ethyl cellosolve acetate, etc.) or tetrahydrofuran, and then pouring into water to precipitate or pentane, hexane, heptane, It is carried out by a method of pouring into a solvent such as cyclohexane and separating. Further, as the resin (A), the polystyrene reduced weight average molecular weight in the GPC pattern is 2000 to
Those of 20000 are preferred.

Preferred alkali-soluble resins include those containing both the resin (A) and the low molecular weight novolak resin (B) having a polystyrene reduced weight average molecular weight of 200 to 2000 in the GPC pattern. As a more preferable alkali-soluble resin, the above conditions are satisfied, and
In terms of polystyrene-reduced molecular weight, the area ratio in the range of 1000 or less in the GPC pattern of the resin (A) is 30% or less with respect to the total pattern area excluding the pattern area of unreacted phenols. Furthermore, the area ratio of the resin (A) in the range of GPC pattern 6000 or less is 15% or more and 65% or less with respect to the total pattern area excluding the pattern area of unreacted phenols. Those are particularly preferable. The low molecular weight novolak resin (B) can be produced by reacting a phenol compound with an aldehyde such as formalin, paraformaldehyde, acetaldehyde or glyoxal in the presence of an acid catalyst. Examples of the phenol compound include phenol and o
-Cresol, m-cresol, p-cresol, 3,
Examples include 5-xylenol, 2,5-xylenol, 2,3-xylenol, 2,4-xylenol, 2,6-xylenol, 3,4-xylenol, 2,3,5-trimethylphenol and resorcinol. These phenol compounds may be used alone or as a mixture of two or more kinds in consideration of the solubility in an alkali developing solution. Among the above phenol compounds, o-cresol, m-cresol or p-cresol is preferable. As an acid catalyst,
The above-mentioned inorganic acid, organic acid, divalent metal salt and the like can be mentioned. The reaction temperature is 30 to 250 ° C., and the other reaction conditions are the same as in the above condensation.

The more preferable molecular weight of the low molecular weight novolak resin (B) (weight average in terms of polystyrene by GPC) is
200 to 1000. When the molecular weight exceeds 2000, the sensitivity of the positive photoresist is lowered, and when the molecular weight is less than 200, the adhesion to the substrate and the heat resistance are deteriorated. The molecular weight of the low molecular weight novolak resin (B) can be easily adjusted by adjusting the molar ratio of the aldehyde to the phenol compound. The low molecular weight novolac resin (B) having a molecular weight of 200 to 2000 can be produced, for example, in the case of m-cresol / formaldehyde resin, by reacting by setting the molar ratio of formaldehyde to m-cresol to 0.65 to 0.05. .. After the reaction, it is preferable to remove the residual monomer by distillation or the like. The content of the low molecular weight novolak resin (B) is preferably 4 to 50 parts by weight based on 100 parts by weight of the total alkali-soluble resin. If the content of the low molecular weight novolak resin (B) is less than 4 parts by weight, the solubility in the alkali developing solution will decrease, and if it exceeds 50 parts by weight, the part not exposed to radiation will be easily dissolved in the alkali developing solution. Patterning becomes difficult.

The preferred positive resist composition of the present invention comprises, in addition to the alkali-soluble resin containing the resin (A) and the quinonediazide compound, the following general formula (II)
I)

[0023]

[Chemical 12]

(In the formula, R ₄ , R ₅ , R ₆ , R ₇ , R ₈ and R ₉ each independently represent a hydrogen atom or an alkyl or alkoxy group having 1 to 4 carbon atoms, and R ₁₀ is a hydrogen atom. ,
Represents an alkyl or aryl group having 1 to 4 carbon atoms, p
, Q and r each independently represent 0, 1 or 2. ) Containing the compound shown by these. In the general formula (III), R ₄ , R ₅ , R ₆ , R ₇ , R ₈ and R ₉
The alkyl or alkoxy group represented by is a linear or branched group, and preferable alkyl or alkoxy groups include methyl, ethyl, methoxy and ethoxy groups. The aryl group represented by R ₁₀ includes substituted or unsubstituted ones, and preferable substituents include an alkyl group and a hydroxyl group. Preferred compounds represented by the general formula (III) include

[0025]

[Chemical 13]

And particularly preferred general formula (II
As the compound represented by I),

[0027]

[Chemical 14]

And the like. The compound represented by the general formula (III) can be produced, for example, by the same method as described in JP-A-2-275955. General formula (II
The content of the compound represented by I) is 4 to 40 parts by weight based on 100 parts by weight of the total amount of the alkali-soluble resin.

As long as the effects of the present invention are not impaired,
In addition to the resin (A) and the low molecular weight novolac resin (B), other alkali-soluble resin or compound may be added to the alkali-soluble resin. Examples of other resins include novolak resins other than the resin (A) and the low molecular weight novolac resin (B), polyvinylphenol, and the like. Examples of the novolac resin other than the resin (A) and the resin (B) include phenol, o-cresol, m-cresol, p
-Cresol, 2,5-xylenol, 3,4-xylenol, 2,3,5-trimethylphenol, 4-tert
-Butylphenol, 2-tert-butylphenol, 3
-Tert-butylphenol, 2-tert-butyl-5-methylphenol, 3-ethylphenol, 2-ethylphenol, 4-ethylphenol, 2-naphthol,
Examples of the resin include phenols such as 1,3-dihydroxynaphthalene, 1,5-dihydroxynaphthalene, and 1,7-dihydroxynaphthalene, which may be used alone or in combination of two or more and condensed with formalin by a conventional method.

The quinonediazide compound is not particularly limited, but for example, 1,2-benzoquinonediazide-4-
Sulfonate, 1,2-naphthoquinonediazide-
4-sulfonic acid ester, 1,2-naphthoquinonediazide-5-sulfonic acid ester and the like can be mentioned. These quinonediazide compounds can be produced, for example, by condensing benzoquinonediazidesulfonic acid or 1,2-naphthoquinonediazidesulfonic acid with a compound having a hydroxyl group in the presence of a weak alkali.

As the compound having a hydroxyl group,
Hydroquinone, resorcin, phloroglucin, 2,4
-Dihydroxybenzophenone, 2,3,4-trihydroxybenzophenone, 2,2 ', 3-trihydroxybenzophenone, 2,2', 4-trihydroxybenzophenone, 2,2 ', 5-trihydroxybenzophenone, 2,3 , 3'-trihydroxybenzophenone,
2,3,4'-trihydroxybenzophenone, 2,
3 ', 4-trihydroxybenzophenone, 2,3',
5-trihydroxybenzophenone, 2,4,4'-trihydroxybenzophenone, 2,4 ', 5-trihydroxybenzophenone, 2', 3,4-trihydroxybenzophenone, 3,3 ', 4-trihydroxybenzophenone, Trihydroxybenzophenones such as 3,4,4′-trihydroxybenzophenone, 2,3,3
3 ', 4-tetrahydroxybenzophenone, 2,3
4,4'-tetrahydroxybenzophenone, 2,
2 ', 4,4'-tetrahydroxybenzophenone,
2,2 ', 3,4-tetrahydroxybenzophenone,
2,2 ', 3,4'-tetrahydroxybenzophenone, 2,2', 5,5'-tetrahydroxybenzophenone, 2,3 ', 4', 5-tetrahydroxybenzophenone, 2,3 ', 5,5 '-Tetrahydroxybenzophenones such as tetrahydroxybenzophenone, 2,
2 ', 3,4,4'-pentahydroxybenzophenone, 2,2', 3,4,5'-pentahydroxybenzophenone, 2,2 ', 3,3', 4-pentahydroxybenzophenone, 2,3,3 Pentahydroxybenzophenones such as 3 ', 4,5'-pentahydroxybenzophenone, 2,3,3', 4,4 ', 5'-hexahydroxybenzophenone, 2,2', 3,3 ', 4,5 '-
Hexahydroxybenzophenones such as hexahydroxybenzophenone, gallic acid alkyl esters, oxyflavans described by the general formula (I) in JP-A-2-84650, and general formula (I) in JP-A-2-269351.
Phenolic compounds described in JP-A-3-49437
Compounds described by the general formula (I) in JP-A No. 1993-242, and the following general formula (IV)

[0032]

[Chemical 15]

(In the formula, R ₁₁ , R ₁₂ , R ₁₃ and R ₁₄ each independently represent a hydrogen atom, an alkyl, alkenyl, alkoxy or aryl group. S, t and u are 2 or more in their sum. 0, 1, 2, 3 or 4 with the condition
And x, y and z are 0, 1, 2, 3 or 4, respectively. ) The phenol compound shown by these is mentioned. As a particularly preferred quinonediazide compound, the above-mentioned JP-A-2
-84650, wherein the oxyflavans represented by the general formula (I) or the phenol compound represented by the general formula (IV) are condensed with 1,2-naphthoquinonediazide-5-sulfonic acid, In addition, the condensation product has an average of two or more ester groups.
The quinonediazide compound is used alone or in combination of two or more, and the amount thereof is the total weight of the alkali-soluble resin [when the compound represented by the general formula (III) is added as an additive, the compound and the alkali-soluble compound are mixed. The total weight with the resin] is usually 5 to 50%, preferably 10 to 40%.

The solvent used for preparing the positive photoresist solution is preferably one which has an appropriate drying rate and which evaporates the solvent to give a uniform and smooth coating film. Such solvents include ethyl cellosolve acetate, glycol ether esters such as propylene glycol monomethyl ether acetate, solvents described in JP-A-2-220056,
Ethyl pyruvate, n-amyl acetate, ethyl lactate, 2-
Examples include heptanone and γ-butyrolactone. These solvents may be used alone or in combination of two or more.
The amount of the solvent is not particularly limited as long as it can be applied on the wafer so as to form a coating film that is homogeneous and has no pinholes or uneven coating. However, the solid content, that is, the quinonediazide compound and the alkali-soluble resin is usually 3 to 50% by weight. The positive type photoresist solution is prepared so that the amount becomes 100%.

If necessary, for example, a sensitizer, another resin, a surfactant, a stabilizer, a dye or the like can be added to the positive photoresist solution.

[0036]

The positive resist composition of the present invention has sensitivity,
And excellent balance of various properties such as heat resistance.

[0037]

The present invention will be described in more detail with reference to the following examples, but the present invention is not limited to these examples.

Reference Example 1 The following formula (b)

[0039]

[Chemical 16]

25.6 g of the compound represented by: m-cresol
While stirring 103.0 g, p-cresol 103.0 g, methyl isobutyl ketone 200 g, 9.3% oxalic acid 42.7 g and 90% acetic acid 68 g, 37% formalin 131.1 at 90 ° C for 1 hour.
g was added dropwise. After the dropping was completed, the reaction was carried out at the same temperature for 25 hours. The reaction mixture was washed with water and dehydrated to obtain a methyl isobutyl ketone solution of novolak resin. The polystyrene reduced weight average molecular weight by GPC was 4,605. Methyl isobutyl ketone solution of the above novolak resin (novolak resin content 42.89%) 100 g, methyl isobutyl ketone 370.6 g
And 369.4 g of n-heptane were stirred at 60 ° C for 30 minutes, and then allowed to stand,
The layers were separated. To the lower layer, 62.5 g of 2-heptanone was added and concentrated with an evaporator to obtain a 2-heptanone solution of novolak resin. The polystyrene reduced weight average molecular weight by GPC is 9122, and the area ratio of the polystyrene reduced molecular weight of 6000 or less to the total pattern area excluding the pattern area of unreacted phenols in the GPC pattern is 41.4%, and the polystyrene reduced molecular weight of 1000 or less. Ratio is 15.0%
Met.

Reference Example 2 Without using the compound of the formula (b), m-cresol and p
-Cresol amount to 108 g each and 37% formalin amount
Reaction, washing with water and dehydration were carried out in the same manner as in Reference Example 1 except that the amount was changed to 64.3 g to obtain a methyl isobutyl ketone solution of the novolak resin. The polystyrene reduced weight average molecular weight by GPC was 4550. Methyl isobutyl ketone solution of the above novolak resin (novolak resin content 40%) 100 g, methyl isobutyl ketone 188.7 g and n-heptane 199.4
g was stirred at 60 ° C. for 30 minutes, allowed to stand and separated. To the lower layer, 120 g of 2-heptanone was added and concentrated with an evaporator to obtain a 2-heptanone solution of novolak resin. The polystyrene-equivalent weight average molecular weight by GPC is 9540, and the polystyrene-equivalent molecular weight is 6000 with respect to the total pattern area excluding the pattern area of unreacted phenols in the GPC pattern.
The area ratio below is 37.5%, which is the polystyrene-equivalent molecular weight.
The area ratio below 1000 was 18.1%.

Example 1 and Comparative Example 1 Each of the novolak resins obtained in Reference Examples 1 and 2, the following formula (a)

[0043]

[Chemical 17]

The compound represented by and the quinonediazide compound were dissolved in 2-heptanone and γ-butyrolactone in the composition shown in the table below (the amount of solvent was set to the film thickness under the coating conditions described below).
It was adjusted to 1.055 μm) and filtered through a 0.2 μm Teflon filter to prepare a resist solution. This was coated on a silicon wafer that had been washed by a conventional method at 4000 rpm with a spin coater. Then, the silicon wafer was baked on a vacuum adsorption type hot plate at 90 ° C. for 1 minute. After that, a reduction projection exposure apparatus (Nikon NSR1755i 7A) using an ultra-high pressure mercury lamp as a light source was used, and the exposure time was changed stepwise for each shot for exposure. Then developer SO
A positive pattern was obtained by developing with PD (Sumitomo Chemical Co., Ltd.). Then, a 0.4 μm line-and-space (L / S) cross section was observed with an SEM (scanning electron microscope), and the sensitivity was determined from the exposure time at which the line-and-space at best focus was 1: 1. The residual film rate was calculated from the residual film thickness of the unexposed portion. In addition, the silicon wafer with the resist pattern after development was left in an air atmosphere for 30 minutes in a clean oven set to various temperatures, and then the resist pattern was observed by SEM to evaluate heat resistance. The results are summarized in the table below. As is clear from this table, the positive resist composition of the present invention has excellent heat resistance and a good balance of various performances such as sensitivity.

[0045]

^{* 1 The} quinonediazide compound (c) is the following compound

[0047]

[Chemical 18]

And naphthoquinone- (1,2) -diazide-
(2) Condensation product with 5-sulfonic acid chloride (average
2.8 hydroxyl groups are esterified)

^{* 2} Value at which 0.4 μm L / S starts to break at 1: 1 ^{* 3} Temperature in the clean oven when the resist pattern begins to sag

Claims (16)

[Claims] 1. The following general formula (I): (In the formula, R ₁ , R ₂ and R ₃ each independently represent a hydrogen atom or an alkyl or alkoxy group having 1 to 4 carbon atoms, and k represents 1 or 2). Alternatively, two or more kinds of the following general formula (II): (In the formula, Y ₁ , Y ₂ , Y ₃ , Y ₄ , Y ₅ and Y ₆ each independently represent a hydrogen atom or an alkyl or alkoxy group having 1 to 4 carbon atoms, and Y ₇ is a divalent, substituted And 1 or 2 or more of the compound represented by the formula (1) or (2) each independently representing an ethylene-based hydrocarbon residue having 3 to 10 carbon atoms, and 1 and m each independently represent 1 or 2. A positive resist composition comprising an alkali-soluble resin containing a resin (A) obtained by condensation and a quinonediazide compound. 2. A compound represented by the general formula (II) is: (In the formula, l and m each independently represent 1 or 2.)
The positive resist composition according to claim 1, wherein 3. A compound represented by the general formula (II) is: The positive resist composition according to claim 2. 4. A phenol represented by the general formula (I) is m
With cresol, p-cresol, 3,5-xylenol, 2,5-xylenol, 2,3,5-trimethylphenol, 6-tert-butyl-3-methylphenol or 2-tert-butyl-5-methylphenol The positive resist composition according to claim 1. 5. A phenol represented by the general formula (I),
The positive resist composition according to claim 1, wherein the molar ratio in condensation with the compound represented by the general formula (II) is 60:40 to 99.5: 0.5. 6. The GPC pattern of the resin (A) has an area ratio in the range of 1000 or less in terms of polystyrene equivalent molecular weight of 30% or less with respect to the total pattern area excluding the pattern area of unreacted phenols. The positive resist composition as described above. 7. The area ratio in the range of 6000 or less in terms of polystyrene in the GPC pattern of the resin (A) is 15% or more and 65% or less with respect to the total pattern area excluding the pattern area of unreacted phenols. The positive resist composition according to claim 6. 8. The positive resist composition according to claim 1, wherein the GPC pattern of the resin (A) has a polystyrene reduced weight average molecular weight of 2000 to 20000. 9. GPC as the alkali-soluble resin
Polystyrene equivalent weight average molecular weight in the pattern is 20
The positive resist composition according to claim 1, which comprises a low molecular weight novolak resin (B) having a molecular weight of 0 to 2000. 10. The positive resist composition according to claim 9, wherein the low molecular weight novolac resin (B) is a cresol novolac resin. 11. The positive resist composition according to claim 9, wherein the low molecular weight novolak resin (B) has a polystyrene-reduced weight average molecular weight of 200 to 1,000 as measured by GPC. 12. The positive resist composition according to claim 9, wherein the content of the low molecular weight novolak resin (B) is 4 to 50 parts by weight based on 100 parts by weight of the total amount of the alkali-soluble resin. 13. The following general formula (III): (In the formula, R ₄ , R ₅ , R ₆ , R ₇ , R ₈ and R ₉ each independently represent a hydrogen atom or an alkyl or alkoxy group having 1 to 4 carbon atoms, and R ₁₀ is a hydrogen atom or a carbon number. 1-4
Represents an alkyl group or an aryl group, and p, q and r each independently represent 0, 1 or 2. The positive resist composition according to claim 1, which comprises a compound represented by the formula (1). 14. A compound represented by the general formula (III) is: The positive resist composition according to claim 13, wherein 15. A compound represented by the general formula (III) is: The positive resist composition according to claim 14, wherein 16. The content of the compound represented by the general formula (III) is 4 to 100 parts by weight of the total amount of the alkali-soluble resin.
The positive resist composition according to claim 13, which is 40 parts by weight.