JPH05229290A - Semiconductor device and production thereof - Google Patents

Abstract

PURPOSE:To efficiently produce a card strong against the stress in a process for producing the functional part of a thin semiconductor device such as an IC card and use environment. CONSTITUTION:A resin receiver 8a discharging excessive foamable resin 9 is provided to the outer skin container 7 forming the outer shape of a thin semiconductor device such as an IC card and, after a printed circuit board 2 and functional parts are received in the container, the outer skin container 7 is filled with the foamable resin 9 to perfectly embed the functional parts in the resin and the excessive resin is discharged to the resin receiver 8a through a passage 8.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure and manufacturing method of a thin semiconductor device such as an IC card.

[0002]

2. Description of the Related Art Conventionally, a thin semiconductor device such as an IC card (hereinafter referred to as an IC card) has an IC as shown in FIG.
Functional parts of the card 1, for example, IC package (hereinafter referred to as IC
It is made by accommodating the circuit board 2 on which the 3) is mounted in the case 11 made of plastic. Figure 6
Is a so-called non-contact type I with no external connection terminal
This shows the configuration of a C card, in which functional parts such as IC3, batteries as a power source, and other parts (not shown) such as resistors and capacitors are mounted on a circuit board 2 such as a glass epoxy printed circuit board, and parts and circuits are provided. Wiring circuit 2a on substrate 2
And a pair of dish-shaped cases 11a and 11b electrically connected to
It is housed in and is joined to the case to form an IC card.

[0003]

Since the conventional IC card is constructed as described above, when a space is created between the case and the functional parts and the circuit board and an external force is applied to the surface of the card, the card is There were problems such as the surface being partially distorted and holes being formed, making the case thicker than necessary. For this reason, the overall thickness of the card becomes thicker, moisture easily enters from the joint part of the case, environment resistance is deteriorated, and more time is required for assembly, and reliability of the joint part of the case, etc. There were many problems.

The present invention has been made in order to solve the above problems, and efficiently embeds functional parts of an IC card in a card substrate to provide a compact, thin and highly reliable thin semiconductor device. The purpose is to get.

[0005]

In a semiconductor device according to the present invention, a circuit board on which functional parts are mounted is housed in an outer cover container having an outer shape of a card, and the outer cover container and the circuit board on which the functional parts are mounted are mounted. In order to fill the voids with a foaming resin and completely embed the functional component in the resin, a resin container is provided in the outer container.

[0006]

Since the circuit board on which the functional component according to the present invention is mounted is embedded in the foaming resin in the exterior material of the card, it is tough against various external stresses and is environmentally resistant. It becomes an excellent IC card, and the foaming resin of the card can be filled in a simple process, and the inside of the exterior material can be filled by expansion caused by foaming of the resin, so that the function of the IC card is improved and the assembly process is simplified.

[0007]

【Example】

Example 1. An embodiment of the present invention will be described below with reference to FIGS. 1, 2 and 3. In FIG. 1, a is a plan view and b is a side view, showing the outer shape of a card after being filled with a foaming resin and cured. FIG. 2 is an enlarged view of an essential part showing a cross section taken along the line AA of FIG. 1. A circuit board 2 having an IC 3, a coil 6, and other components 5 mounted therein is housed in an outer cover container 7 forming the outer shape of a card. The periphery of the functional component in the outer container 7 is filled with the cured foaming resin 9. Skin container 7
As shown in FIGS. 1 and 2, the main body portion 7a and the lid portion 7b are
The two are fitted in a spigot shape. The lid 7b is integrally provided with a resin receiving portion 8a at its apex via a resin passage 8 penetrating the lid.

FIG. 3 is a sectional view showing a procedure for making the IC card shown in FIG. 1. FIG. 3A shows the IC 3, the battery 4, the coil 6,
FIG. 2 shows a circuit board 2 on which other components 5 are mounted, and FIG. B shows an outer cover container 7 forming the outer shape of a card, which is composed of a main body portion 7a and a lid portion 7b.
The foamable resin 9 is injected into a in a non-foamed state such that the inside of the outer container 7 is sufficiently filled after foaming and hardening, and the circuit board 2 is inserted. This state is shown in FIG. Then, as shown in FIG. D, the lid 7b of the outer container 7 is attached to the main body 7a.
And the foamable resin 9 is foamed. As the foamable resin 9, a three-liquid type medium temperature curing epoxy resin is used, which is set at room temperature and then foamed and cured at 50 ° C. The foamable resin 9 expands in the foaming process to fill the inside of the outer container 7, and then overflows to the resin receiver 8a through the resin passage 8 of the lid 7b of the outer container 7 to complete the foaming. Harden. Of course, the amount of resin is adjusted so that the resin discharged to the resin receiving portion 8a does not overflow from the resin receiving portion 8a. The card thus foamed and cured is cut at the base of the card body shown by the chain line C in FIGS. 1b and 2 to complete the IC card.

Example 2. FIG. 4 is an enlarged sectional view of an essential part of another embodiment of the present invention. In the figure, a lid 7b of the outer container 7 is provided with a hollow balloon-shaped resin receiving portion 8a via a resin passage 8. A small hole 8b for venting air is provided at the apex of the resin receiving portion 8a. In this embodiment, as in the first embodiment, the foamable resin 9 and the circuit board 2 on which the functional components of the card are mounted are enclosed in the outer container 7, and then the foamable resin 9 is foamed. Then, the foamable resin 9 foams and expands its volume to fill the inside of the outer casing 7, and the excess resin is discharged to the resin receiving portion 8 a through the resin passage 8. The air in the outer casing 7 is pushed by the expansion of the resin and is discharged from the small hole 8b for venting the air through the resin passage 8. Then, the foamable resin 9 discharged to the resin receiving portion 8a has almost completed the foaming at this point and the viscosity has started to rise and harden. There is no going out. Therefore, the balloon-shaped resin receiving portion 8a
In the case of, the resin is not accidentally spilled and the card is not contaminated. When the foam hardening is completed, the resin receiving portion 8a is cut at the position indicated by the alternate long and short dash line C in the figure to complete the IC card.

FIG. 5 shows an example in which two resin passages 8 and resin receiving portions 8a in the above-described first embodiment are provided at the positions which are the vertices at the time of foaming. Instead, it is discharged and filled with the foamable resin. By providing a plurality of resin passages 8 as described above, there is an advantage that the resin can be more completely filled.

As described above with reference to the embodiments, according to the present invention, the functional parts of the IC card are housed in the outer casing having the outer shape of the IC card, and the gap between the functional component and the outer casing is filled with the foaming resin. However, since the functional component is completely embedded in the resin, the functional component of the IC card can be protected from the usage environment of the IC card. Further, since the outer casing of the IC card has a simple shape and its thickness does not require precision, various molding methods can be adopted. In addition, various thermoplastic resins can be selected according to the use environment and purpose of use of the IC card. As the IC card, the inside of the outer container is completely filled. To be kept. Therefore, the outer container can be molded by blow molding or injection molding depending on the size and shape of the card. Further, since the resin container is continuously provided in the outer container, the inside of the outer container is sufficiently filled and the excess resin is discharged to a specific location. Therefore, the surface of the IC card body is contaminated with the filled resin. Of course, the card is completed simply by cutting the card with the card root after foaming and hardening the foamed resin.

Also in the manufacture of IC cards, as shown in the above embodiment, the functional parts are housed in the outer container, the inside of the container is filled by the expansion of the resin itself, and after curing, cut at the root of the resin receiving portion. Since the card is completed only by itself, it is a simple manufacturing process, which does not require complicated processes, shapes with storage parts, alignment, etc. as in the conventional case.

Further, since the functional parts are covered with the foamed resin around them, the internal stress due to curing shrinkage or heat shrinkage of the resin, such as when embedded in a sealing resin, is greatly reduced, and in addition to the card. You can get cards that are strong against external force, especially mechanical shock. Further, by adjusting the foamed resin density, elastic modulus, etc. of the foamable resin, it becomes possible to manufacture a card suitable for a wider range of purposes.

In the above-mentioned embodiment, the outer container made of polyester resin is used, but other resins such as polycarbonate and polypropylene resin are also effective, as a matter of course.
Due to the heat resistance of the functional parts of the C card, it is possible to apply high temperature foaming resin, and the range of resin application will be further expanded. It is also possible to add a design to the card surface according to each resin.

[0015]

As described above, according to the present invention, a circuit board, a functional component, etc. are embedded in a foamed resin and an IC is formed.
Since it is formed integrally with the outer skin of the card on the card, it is strong and has excellent environmental resistance, and effectively protects functional parts from external forces, thus improving reliability. Also in the production of cards, the simple process of storing functional parts in the outer container that forms the outer shape of the card, foaming the foamable resin and discharging the excess resin into the resin receiver, does not pollute the card itself. Since it does not exist, it has the effect of improving cleanliness and productivity.

[Brief description of drawings]

FIG. 1 is a diagram showing an embodiment of the present invention, in which a is a plan view and b is a side view.

FIG. 2 is a diagram showing an embodiment of the present invention, which is A- in FIG.
It is a partial expanded sectional view of the A line.

FIG. 3 is a cross-sectional view showing the manufacturing procedure of the embodiment of the present invention.

FIG. 4 is an enlarged sectional view of an essential part showing another embodiment of the present invention.

FIG. 5 is an enlarged plan view of an essential part showing another embodiment of the present invention.

FIG. 6 is a view showing a conventional device, in which a is a plan view and b is a cross-sectional view.

[Explanation of symbols]

 1 IC Card 2 Circuit Board 3 IC 4 Battery 5 Parts 6 Coil 7 Skin Container 7a Main Body 7b Lid 8 Resin Passage 8a Resin Receptor 8b Small Hole 9 Foaming Resin C Cut

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Claims (5)

[Claims] 1. An outer skin container comprises a main body and a lid which is connected to one end of the main body and has a resin receiving portion through a resin passage. The outer skin container contains electronic parts therein. A semiconductor device, wherein a foamed resin is filled in a gap between the outer container and an electronic component incorporated therein. 2. The semiconductor device according to claim 1, wherein the resin receiving portion has a hollow balloon shape and a small hole is provided at one end thereof. 3. The semiconductor device according to claim 1, wherein a plurality of resin receiving portions communicating with the main body of the outer container are arranged on both sides of the container. 4. The semiconductor device according to claim 1, wherein the foamable resin is injected into the outer container to foam the foamable resin in the container and the excess resin is received through the resin passage. A method for manufacturing a semiconductor device, characterized in that a gap between the outer container and the electronic component is filled while being discharged to a portion. 5. The method of manufacturing a semiconductor device according to claim 1, wherein the foaming resin is foamed and hardened, and then cut at the root of the outer container on the main body side.