JPH0522528U - Injection molding powder metallurgy mold - Google Patents

Injection molding powder metallurgy mold

Info

Publication number
JPH0522528U
JPH0522528U JP8140491U JP8140491U JPH0522528U JP H0522528 U JPH0522528 U JP H0522528U JP 8140491 U JP8140491 U JP 8140491U JP 8140491 U JP8140491 U JP 8140491U JP H0522528 U JPH0522528 U JP H0522528U
Authority
JP
Japan
Prior art keywords
mold
tape
injection molding
injection
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8140491U
Other languages
Japanese (ja)
Inventor
良雄 木嶋
俊人 岸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Metal Mining Co Ltd
Original Assignee
Sumitomo Metal Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co Ltd filed Critical Sumitomo Metal Mining Co Ltd
Priority to JP8140491U priority Critical patent/JPH0522528U/en
Publication of JPH0522528U publication Critical patent/JPH0522528U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】 【目的】 射出成形粉末冶金法に使用され、各種の模様
あるいはマークをつけた製品を精度よく製造し得、容易
に、かつ、安価に製造し得る金型を提供することを目的
とする。 【構成】 樹脂テープを加熱保持して、所定模様のゴム
型にプレスで加圧して所定模様4の凹凸部5を有するテ
ープ部3を形成する。このテープ部3を金型部1のキャ
ビティ2のキャビティ面に接着剤により接着して金型を
形成する。 【効果】 多種の表面模様あるいはマークを精度よく形
成し得る金型が得られ、しかも、容易に、かつ、安価に
製造し得る。
(57) [Abstract] [Purpose] To provide a mold which is used for injection molding powder metallurgy and can accurately manufacture products with various patterns or marks and which can be manufactured easily and at low cost. With the goal. [Structure] A resin tape is heated and held, and a rubber mold having a predetermined pattern is pressed by a press to form a tape portion 3 having an uneven portion 5 having a predetermined pattern 4. The tape portion 3 is adhered to the cavity surface of the cavity 2 of the die portion 1 with an adhesive to form a die. [Effect] A mold capable of accurately forming various surface patterns or marks can be obtained, and can be manufactured easily and at low cost.

Description

【考案の詳細な説明】[Detailed description of the device]

【0001】[0001]

【産業上の利用分野】[Industrial applications]

本考案は、射出成形粉末冶金法によって表面に模様あるいはマークの付いた製 品を製造するための射出成形粉末冶金用金型に関するものである。 The present invention relates to an injection molding powder metallurgy mold for producing a product having a pattern or a mark on the surface by the injection molding powder metallurgy method.

【0002】[0002]

【従来の技術】[Prior Art]

機械部品、電気部品、及び、表面精度の良好さが要求される装飾用製品などの ように、三次元的な複雑な形状を有する金属製品を製造する方法として、従来か ら、原料粉末とバインダーとを混練して得た混練物をバインダーの軟化温度以上 の温度において射出成形し、この射出成形物を脱バインダーした後に、焼結する 射出成形粉末冶金法が知られている。又、この方法において、使用するバインダ ーが、ワックス、ポリエチレンなどの有機物であることや金属粉末とバインダー 相互間の濡れ性を向上させるために濡れ剤を含有していることも知られており、 さらに、脱バインダー処理に際して、焼結工程への搬送のために便利なように射 出成形物をセラミックセッター上に載置することも知られている。 As a method for producing metal products having a three-dimensionally complicated shape such as mechanical parts, electrical parts, and decorative products requiring good surface accuracy, raw material powders and binders have been conventionally used. There is known an injection molding powder metallurgy method in which a kneaded product obtained by kneading and is subjected to injection molding at a temperature equal to or higher than the softening temperature of the binder, and the injection molded product is debindered and then sintered. In this method, it is also known that the binder used is an organic substance such as wax and polyethylene, and that it contains a wetting agent to improve the wettability between the metal powder and the binder. Furthermore, it is also known to place the injection molded product on a ceramic setter for the convenience of transportation to the sintering step during the debinding process.

【0003】 しかして、この方法によって製造される製品に、表面に各種の模様やマークが 付けられている。したがって、射出成形には、当該模様やマークを形成し得るよ うに製作した金型を使用する必要がある。However, various patterns and marks are provided on the surface of the product manufactured by this method. Therefore, in the injection molding, it is necessary to use a mold manufactured so that the pattern or mark can be formed.

【0004】[0004]

【考案が解決しようとする課題】[Problems to be solved by the device]

このためには、金型の必要箇所に放電加工などによって当該模様やマークを形 成する必要があるが、射出成形品が複雑形成となるほどそれに用いる金型の加工 は困難となり、その表面に微細な模様や付けることは、金型の製作費用がきわめ て高価なものになるという問題があり、とくに、装飾用製品は、多品種少量生産 であるために高価な金型を使用することは困難であり、精度よく、しかも安価に 製造し得る金型が望まれているという問題がある。 For this purpose, it is necessary to form the pattern or mark on the required place of the mold by electrical discharge machining, etc. However, the more complicated the injection molded product is, the more difficult it is to process the mold used for it. However, it is difficult to use expensive dies for decoration products because it is a high-mix, low-volume production of decorative products. Therefore, there is a problem that a mold that can be manufactured with high accuracy and at low cost is desired.

【0005】 本考案は、射出成形粉末冶金製品の製造に用いられ、製品を精度よく製造し得 、容易に、かつ、安価に製造し得る金型を提供することを目的とするものである 。An object of the present invention is to provide a mold used for manufacturing an injection-molded powder metallurgy product, capable of manufacturing the product with high accuracy, and easily and inexpensively.

【0006】[0006]

【課題を解決するための手段】[Means for Solving the Problems]

本考案者等は、前記問題を解決し、前記目的を達成するために工夫を重ねた結 果、金型部のキャビティのキャビティ面に模様やマークを凹あるいは凸に型どっ たテープを接着した金型とすることによって目的を達し得ることを認めて本考案 を完成するに至った。 The inventors of the present invention have made efforts to solve the above-mentioned problems and achieve the above-mentioned object, and as a result, a tape having concave or convex patterns or marks is adhered to the cavity surface of the mold cavity. We have completed the present invention by recognizing that the purpose can be achieved by using a mold.

【0007】 すなわち、本考案は、粉末と有機物を含有するバインダーとからなる混練物を 射出成形し、この射出成形物を脱バインダーした後に焼結処理を行ない表面に模 様あるいはマークの付いた粉末冶金製品を得るための金型において、金型部のキ ャビティのキャビティ面の所要箇所に前記模様あるいはマークを凹あるいは凸の 凹凸部に型どったテープを接着してなる射出成形粉末冶金用金型である。That is, according to the present invention, a kneaded product comprising powder and a binder containing an organic substance is injection-molded, and the injection-molded product is debindered and then subjected to a sintering treatment to obtain a powder with a pattern or mark on the surface. In a metal mold for obtaining metallurgical products, an injection molding powder metallurgical metal which is obtained by adhering a tape having a concave or convex portion with the above-mentioned pattern or mark to a required portion of the cavity surface of the cavity of the die portion. It is a type.

【0008】 本考案金型を使用して射出成形する原料粉末は、金属粉末、合金粉末、及び、 これらとセラミック粉末との混合物などが使用できる。The raw material powder to be injection molded using the mold of the present invention may be metal powder, alloy powder, a mixture of these and ceramic powder, or the like.

【0009】 バインダーとしては、パラフィンワックス、ポリエチレンなどの有機物に、原 料粉末とバインダーとの濡れ性を改良するために添加する界面活性剤のような濡 れ剤とからなる混合物が用いられる。As the binder, a mixture of an organic substance such as paraffin wax and polyethylene with a wetting agent such as a surfactant added to improve the wettability of the raw material powder and the binder is used.

【0010】 模様あるいはマークを凹あるいは凸に型どるテープとしては、射出成形が80 ℃以上の温度で行なわれるので、耐熱温度200℃以上の熱硬化性プラスチック を厚さ0.05〜1mm程度のテープとして、たとえば、加温下でゴム型にプレ スで加圧することによって型づけする。凹凸の深さ又は高さは0.5mm以下程 度として使用することが望ましい。As a tape having a concave or convex pattern or pattern, since injection molding is performed at a temperature of 80 ° C. or higher, a thermosetting plastic having a heat resistance temperature of 200 ° C. or higher with a thickness of about 0.05 to 1 mm is used. As a tape, for example, a rubber mold is pressed with a press under heating and is shaped. The depth or height of the irregularities is preferably 0.5 mm or less.

【0011】 又、前記テープを金型のキャビティ面に接着するためには、ケイ酸ナトリウム あるいはケイ酸カリウムの3〜10重量%溶液が使用し得、同様の耐熱性をもつ 材料であれば支障ない。Further, in order to bond the tape to the cavity surface of the mold, a 3 to 10 wt% solution of sodium silicate or potassium silicate can be used, and any material having the same heat resistance will not be a problem. Absent.

【0012】 適用される金型部は、通常の方法によって製作されたものでよい。The applied mold part may be manufactured by a usual method.

【0013】[0013]

【作用】[Action]

この金型を使用して常法にしたがって射出成形し、脱バインダー処理、焼結処 理を行なって射出成形製品を得ることができるのであって、安価に製造し得る型 どりした耐熱性テープだけを交換することによって、形状は同じでも表面模様あ るいはマークが異なる射出成形製品を高価な金型をその都度使用することなく、 形状の精度がよく、容易に、かつ、安価に製作し得るものである。 It is possible to obtain injection-molded products by injection-molding using this mold in accordance with the usual method, debinding and sintering, and only modeled heat-resistant tape that can be manufactured at low cost. By exchanging, it is possible to manufacture injection-molded products with the same shape but different surface patterns or marks with good shape accuracy, easily and at low cost without using expensive dies each time. It is a thing.

【0014】[0014]

【実施例】【Example】

次に、添付の図面に基づいて本考案の実施例を述べる。 Next, an embodiment of the present invention will be described with reference to the accompanying drawings.

【0015】 図1は、本考案金型を形成するテープの一実施例を示す側面図、図2は、本考 案金型のテープを接着する金型部の一実施例を示す側断面図、図3は、本考案金 型で製造した製品形状例を示す平面図、図4は、図3に示す製品例の側面図であ る。FIG. 1 is a side view showing an embodiment of a tape forming a mold of the present invention, and FIG. 2 is a side sectional view showing an embodiment of a die portion to which the tape of the present invention die is adhered. 3 is a plan view showing an example of the shape of a product manufactured by the mold of the present invention, and FIG. 4 is a side view of the example of the product shown in FIG.

【0016】 1は、金型部であって、通常の方法によって製作され、目的製品形状を形成す るに応じた形状のキャビティ2が設けられている。3は、テープ部であって、た とえば、厚さ1mmのフェノール樹脂テープを200℃に加熱保持した状態で、 目的とする製品の表面模様に相応する模様4を、該模様4と同形に形成したゴム 型にプレスで加圧して凹凸部5として型どってある。Reference numeral 1 denotes a mold part, which is manufactured by a usual method and is provided with a cavity 2 having a shape corresponding to a shape of a target product. 3 is a tape portion, for example, a 1 mm-thick phenol resin tape is heated and held at 200 ° C., and a pattern 4 corresponding to the target product surface pattern is formed into the same shape as the pattern 4. The formed rubber mold is pressed by a press and shaped as an uneven portion 5.

【0017】 本考案金型を、図2中矢印で示すように金型部1のキャビティ2のキャビティ 面に、図1に示すような本考案テープ3をケイ酸ナトリウム5重量%水溶液を接 着剤として接着して形成した。The mold of the present invention is attached to the cavity surface of the cavity 2 of the mold part 1 as shown by the arrow in FIG. 2 with the tape 3 of the present invention as shown in FIG. 1 and a 5 wt% aqueous solution of sodium silicate. It was formed by adhesion as an agent.

【0018】 これを通常のように射出成形機に取付けて、平均粒径14μmのガスアトマイ ズSUS316粉末に、60重量%のポリスチレン、30重量%の酢酸ビニル共 重合体、10重量%のステアリン酸からなる有機物バインダー7重量%を加えて 混練し、得られた混練物を成形温度80℃、金型温度30℃において射出成形を 行ない、縦9mm、横18mm、高さ3mmで平面部面積0.6cmの図3に 示す複雑形状装飾用部品を500個成形した。その後、脱バインダー炉を用いて 20℃/hの昇温速度で300℃まで窒素ガス中で加熱した後に冷却する脱バイ ンダー処理を行なった。得られた脱バインダー体を1300℃に1時間焼結処理 を行なって製品とした。This was mounted in an injection molding machine as usual, and gas atomized SUS316 powder having an average particle size of 14 μm was mixed with 60% by weight of polystyrene, 30% by weight of vinyl acetate copolymer and 10% by weight of stearic acid. 7% by weight of an organic binder is added and kneaded, and the resulting kneaded product is injection-molded at a molding temperature of 80 ° C. and a mold temperature of 30 ° C., and has a length of 9 mm, a width of 18 mm, a height of 3 mm, and a flat surface area of 0.6 cm. 2. 500 pieces of the ornamental parts having complicated shapes shown in FIG. Then, a binder removal process was performed in a debinding furnace in which the temperature was raised to 300 ° C. in nitrogen gas at a heating rate of 20 ° C./h and then cooled. The obtained binder-removed body was sintered at 1300 ° C. for 1 hour to obtain a product.

【0019】 焼結体の平面部の形状を調査した結果、500個のすべての焼結体に、深さ0 .5mm以上の模様が正確に形成されているのが認められた。As a result of investigating the shape of the flat surface portion of the sintered body, a depth of 0. It was confirmed that the pattern of 5 mm or more was accurately formed.

【0020】 なお、連続した500個の成形中にテープの損傷や剥れなどはおきなかった。The tape was not damaged or peeled during the continuous molding of 500 tapes.

【0021】[0021]

【考案の効果】[Effect of the device]

本考案は、模様あるいはマークを所定凹凸に型どったテープをキャビティ面に 接着した金型であるから、多品種少量の製品製造にも容易に適用し得、多種類の 表面模様あるいはマークを精度よく形成された製品を射出成形粉末冶金法によっ て容易にかつ安価に製造できるものであって、きわめて大きな効果が認められる 。 Since the present invention is a mold in which a tape having a pattern or mark shaped in a predetermined irregularity is adhered to the cavity surface, it can be easily applied to the production of a wide variety of small quantity products, and various types of surface patterns or marks can be accurately manufactured. A well-formed product can be manufactured easily and inexpensively by injection molding powder metallurgy, and a very large effect is recognized.

【図面の簡単な説明】[Brief description of drawings]

【図1】本考案金型を形成するテープの一実施例を示す
側面図である。
FIG. 1 is a side view showing an embodiment of a tape forming a mold of the present invention.

【図2】本考案金型のテープを接着する金型部の一実施
例を示す側断面図である。
FIG. 2 is a side sectional view showing an embodiment of a die unit for adhering a tape of the inventive die.

【図3】本考案金型で製品した製品形状例を示す平面図
である。
FIG. 3 is a plan view showing an example of a product shape produced by the mold of the present invention.

【図4】図3に示す製品例の側面図である。FIG. 4 is a side view of the example product shown in FIG.

【符号の説明】[Explanation of symbols]

1 金型部 2 キャビティ 3 テープ部 4 模様(又はマーク) 5 凹凸部 1 Mold part 2 Cavity 3 Tape part 4 Pattern (or mark) 5 Concavo-convex part

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】 粉末と有機物を含有するバインダーとか
らなる混練物を射出成形し、この射出成形物を脱バイン
ダーした後に焼結処理を行ない表面に模様あるいはマー
クの付いた粉末冶金製品を得るための金型において、金
型部(1) のキャビティ(2) のキャビティ面の所望箇所に
前記模様あるいはマーク(4) を凹あるいは凸の凹凸部
(5) に型どったテープ(3) を接着してなる射出成形粉末
冶金用金型。
1. A powder metallurgical product having a pattern or a mark on the surface thereof, which is obtained by injection-molding a kneaded material comprising a powder and a binder containing an organic substance, debinding the injection-molded article, and then performing sintering treatment. In the mold, the pattern or mark (4) is concave or convex at the desired location on the cavity surface of the cavity (2) of the mold (1).
An injection-molding powder metallurgical mold comprising a tape (3) bonded to the (5).
JP8140491U 1991-09-11 1991-09-11 Injection molding powder metallurgy mold Pending JPH0522528U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8140491U JPH0522528U (en) 1991-09-11 1991-09-11 Injection molding powder metallurgy mold

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8140491U JPH0522528U (en) 1991-09-11 1991-09-11 Injection molding powder metallurgy mold

Publications (1)

Publication Number Publication Date
JPH0522528U true JPH0522528U (en) 1993-03-23

Family

ID=13745387

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8140491U Pending JPH0522528U (en) 1991-09-11 1991-09-11 Injection molding powder metallurgy mold

Country Status (1)

Country Link
JP (1) JPH0522528U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101476887B1 (en) * 2012-09-14 2014-12-26 주식회사 쎄타텍 A method for powder injection molding and powder injection molded part

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101476887B1 (en) * 2012-09-14 2014-12-26 주식회사 쎄타텍 A method for powder injection molding and powder injection molded part

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