JPH05221799A - Modification treatment of sic whisker - Google Patents

Modification treatment of sic whisker

Info

Publication number
JPH05221799A
JPH05221799A JP5902892A JP5902892A JPH05221799A JP H05221799 A JPH05221799 A JP H05221799A JP 5902892 A JP5902892 A JP 5902892A JP 5902892 A JP5902892 A JP 5902892A JP H05221799 A JPH05221799 A JP H05221799A
Authority
JP
Japan
Prior art keywords
diameter
sic
whiskers
sic whiskers
mixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5902892A
Other languages
Japanese (ja)
Inventor
Akira Yamakawa
昭 山川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokai Carbon Co Ltd
Original Assignee
Tokai Carbon Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokai Carbon Co Ltd filed Critical Tokai Carbon Co Ltd
Priority to JP5902892A priority Critical patent/JPH05221799A/en
Publication of JPH05221799A publication Critical patent/JPH05221799A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To provide a modification treatment method for efficiently increasing the diameter of SiC whiskers by sublimation recrystallization while inhibiting the formation of sintered grains as a by-product. CONSTITUTION:A blend of 100 pts.wt. SiC whiskers based on beta-crystals and having 0.3-1.5mum diameter and 10-100mum length with 1-50 pts.wt. short carbon fibers is well dispersed and mixed and this mixture is heated to 1,700-2,200 deg.C in an Ar atmosphere. The SiC whiskers preferably have <=0.14 deg. half-width of (111) diffraction line at <=20% alpha proportion.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、SiCウイスカーを加
熱処理して直径2μm 以上の径太性状に転化させるSi
Cウイスカーの改質処理方法に関する。
BACKGROUND OF THE INVENTION The present invention relates to a Si whisker which is heat-treated to convert it into a thick diameter having a diameter of 2 μm or more.
The present invention relates to a method for modifying C whiskers.

【0002】[0002]

【従来の技術】SiCの針状単結晶で構成されるウイス
カーは、比強度、比弾性率、耐熱性、化学的安定性等の
特性面で卓越した性能を示すことから、各種の金属、セ
ラミックス、プラスチックス材料の複合強化材として有
用されている。このうち、特に破壊靭性に乏しいセラミ
ックス材の複合強化は、近時の重要な開発課題とされて
おり、多様の研究提案がなされている。
2. Description of the Related Art Whiskers composed of SiC needle-like single crystals exhibit excellent properties such as specific strength, specific elastic modulus, heat resistance, and chemical stability. , Is used as a composite reinforcing material for plastics materials. Among these, composite strengthening of ceramic materials, which are particularly poor in fracture toughness, has recently been regarded as an important development issue, and various research proposals have been made.

【0003】セラミックスに対するウイスカーの複合化
は、組織内部に分散したウイスカーがセラミックス体に
発生するクラックの成長を停止または抑制し、クラック
の進行方向を屈曲(クラックディフレクション)させて
応力集中を緩和し、あるいはウイスカーの引き抜き作用
でクラック先端でのエネルギーを吸収する等の機構を介
して破壊靭性の向上を図るためにおこなわれる。この機
構によるセラミックス材の高靭化には、特に直径の大き
な径太ウイスカーで複合化すると効果的であることが解
明されている。
The compounding of whiskers with ceramics stops or suppresses the growth of cracks generated in the ceramic body by the whiskers dispersed inside the structure, and bends the direction of progress of the cracks (crack deflection) to relieve stress concentration. Alternatively, it is carried out in order to improve the fracture toughness through a mechanism of absorbing the energy at the crack tip by the action of pulling out the whiskers. It has been clarified that it is effective to increase the toughness of the ceramic material by this mechanism, especially by compounding with thick whiskers having a large diameter.

【0004】また、ウイスカーは微細な針状繊維形態を
呈しているため、人体の呼吸器系に吸入された場合には
肺の中に残留し易く、呼吸器障害を起こす危険性が指摘
されている。そして、この障害危険性はウイスカー径と
の関係が強く、とくに直径2μm 未満の性状において危
険性が大きいことが報告されている。
Further, since whiskers have a fine needle-like fiber form, when they are inhaled into the respiratory system of the human body, they are likely to remain in the lungs, causing a risk of respiratory disorders. There is. It has been reported that this hazard risk has a strong relationship with the diameter of the whiskers, and that the risk is particularly great when the diameter is less than 2 μm.

【0005】このような事態に対処するため、本出願人
は直径2μm を越える径太タイプのSiCウイスカーを
製造する技術を開発し、既に提案した(特開平3−3719
8 号公報、特開平3−141200号公報)。
In order to deal with such a situation, the present applicant has developed and has already proposed a technique for manufacturing a thick type SiC whisker having a diameter of more than 2 μm (Japanese Patent Laid-Open No. 3-3719).
No. 8, JP-A-3-141200).

【0006】[0006]

【発明が解決しようとする課題】上記の先行技術は、一
定条件下の加熱処理を施すことによりSiCウイスカー
が昇華再結晶を生じて径太化する改質機構を利用したも
ので、比較的簡単な加熱処理を介して効率よく直径2μ
m 以上の径太SiCウイスカーを得ることができる。し
かしながら、加熱過程において接触状態にあるSiCウ
イスカー同士が接触部位で焼結し、直径5μm 以上のS
iC粒子となって介在する現象が発生し易い。このよう
な焼結粒子がセラミックスとの複合組織中に存在する
と、破壊起点となって強度および破壊靭性を減退させる
原因となるため、煩雑な二次処理により分離除去する必
要があった。
The above-mentioned prior art utilizes a reforming mechanism in which SiC whiskers undergo sublimation recrystallization and become thicker by being subjected to heat treatment under a certain condition, which is relatively simple. 2μ diameter with efficient heat treatment
A thick SiC whisker having a diameter of m or more can be obtained. However, during the heating process, the SiC whiskers that are in contact with each other sinter at the contact site, and
The phenomenon of intervening as iC particles is likely to occur. If such sintered particles are present in the composite structure with ceramics, they act as fracture initiation points and reduce strength and fracture toughness. Therefore, it is necessary to separate and remove them by a complicated secondary treatment.

【0007】本発明は、前記の課題を解決するために先
行技術(特開平3−37198 号公報)に改良を加え、加熱
処理の段階でSiCウイスカーの焼結粒子化現象を抑制
するための技術を解明して開発に至ったものである。し
たがって、本発明の目的は、焼結粒子の副生を抑制しな
がらSiCウイスカーの昇華再結晶による径太化を効率
よくおこなうための改質処理方法を提供することにあ
る。
The present invention is a technique for improving the prior art (Japanese Patent Laid-Open No. 3-37198) in order to solve the above-mentioned problems and for suppressing the sintering particle formation phenomenon of SiC whiskers at the stage of heat treatment. It was the clarification of that that led to the development. Therefore, an object of the present invention is to provide a modification treatment method for efficiently increasing the diameter of SiC whiskers by sublimation recrystallization while suppressing by-production of sintered particles.

【0008】[0008]

【課題を解決するための手段】上記の目的を達成するた
めの本発明によるSiCウイスカーの改質処理方法は、
直径 0.3〜1.5 μm 、長さ10〜100 μm のアスペクト性
状を有するβ結晶型主体のSiCウイスカー100 重量部
に、カーボン繊維を1〜50重量部の割合で配合して十分
に分散混合し、該混合物を非酸化雰囲気中で1700〜2200
℃の温度に加熱処理することを構成上の特徴とする。
A method for modifying a SiC whisker according to the present invention to achieve the above object is as follows.
100 parts by weight of β crystal type SiC whiskers having an aspect property of 0.3 to 1.5 μm in diameter and 10 to 100 μm in length were mixed with carbon fibers at a ratio of 1 to 50 parts by weight and sufficiently dispersed and mixed. 1700-2200 in a non-oxidizing atmosphere
The constitutional feature is to perform heat treatment at a temperature of ° C.

【0009】本発明の処理原料となるSiCウイスカー
は、製造履歴に影響されることなくいずれの方法によっ
て製造されたものであってもよい。したがって、例えば
SiCl4 、SiHCl3 、(CH)3 Siのような分
解性珪素化合物をCH4 、CCl4 、C3 8 などの炭
材成分と気相反応させる方法、SiO2 を含む固形状の
珪素源原料とカーボン粉末を混合するか、籾殻炭のよう
に前記成分を複合的に含有する物質を加熱反応させる方
法等によって製造されるSiCウイスカーが使用対象と
なる。
The SiC whiskers used as the processing raw material of the present invention may be produced by any method without being affected by the production history. Therefore, for example, a method of reacting a decomposable silicon compound such as SiCl 4 , SiHCl 3 , (CH) 3 Si with a carbonaceous material component such as CH 4 , CCl 4 or C 3 H 8 in a gas phase reaction, a solid state containing SiO 2. The SiC whiskers produced by a method of mixing the silicon source raw material and the carbon powder, or a method of heating and reacting a substance containing the above components in a complex manner such as rice husk charcoal are used.

【0010】しかし、SiCウイスカーのアスペクト性
状として直径 0.3〜1.5 μm 、長さ10〜100 μm のもの
が原料対象として選択使用される。この理由は、前記範
囲のアスペクト性状を備えるSiCウイスカーが昇華再
結晶による径太効果が最も顕著に現出するからである。
また、SiCウイスカーの結晶系は、β結晶型主体のも
のを選定する必要があり、この要件を外れると目的とす
る直径2μm 以上の径太化改質ができなくなる。なお、
β結晶型主体のものとは、SiCウイスカーの結晶系が
全てβ型か、α/β混在型であってもβ型が支配的な形
態を意味するが、特に積層欠陥密度が低い高β比率のも
のほど少ない粒状物含有量で径太化が進行する。最も好
適なSiCウイスカーの結晶性状は、下式によるα度が
20以下で、(111) 回折線の半価幅が0.14deg 以下の場合
である。 α度 = (H1 ×2/H2)×100 但し、上式においてH1 は粉末X線回折法でCuKαを
線源とした際の2θ約33.5deg に出る回折強度、H2
2θ約35.6deg に出る回折強度である。
However, SiC whiskers having an aspect property of 0.3 to 1.5 μm in diameter and 10 to 100 μm in length are selected and used as raw materials. The reason for this is that the SiC whiskers having the aspect characteristics in the above range most significantly exhibit the diameter effect by sublimation recrystallization.
In addition, the crystal system of the SiC whiskers needs to be selected mainly from the β crystal type, and if this requirement is not satisfied, the desired diameter thickening modification of 2 μm or more cannot be performed. In addition,
Being mainly β-crystal type means that the crystal system of the SiC whiskers is all β-type or β-type is dominant even if α / β mixed type is used, but especially high β-ratio with low stacking fault density. The smaller the particle content, the larger the diameter. The most suitable crystal property of SiC whisker is that α degree according to the following formula is
In the case of 20 or less, the full width at half maximum of the (111) diffraction line is 0.14 deg or less. α degree = (H 1 × 2 / H 2 ) × 100 However, in the above formula, H 1 is the diffraction intensity at 2θ about 33.5 deg when CuKα is used as the radiation source in the powder X-ray diffraction method, and H 2 is about 2θ. This is the diffraction intensity appearing at 35.6 deg.

【0011】上記の処理対象となるSiCウイスカーに
混合するカーボン繊維は、種類や特性に限定されず、ポ
リアクリロニトリル系、レーヨン系、ピッチ系など各種
のものを用いることができる。しかし、SiCウイスカ
ーと均一混合させる目的から繊維形態として、繊維径が
細く、かつ短繊維状であることが好ましい。具体的に
は、直径20μm 以下のカーボン繊維トウを長さ5mm程度
に裁断したチョップ品の使用が好適である。
The carbon fibers to be mixed with the SiC whiskers to be treated are not limited in kind and characteristics, and various types such as polyacrylonitrile type, rayon type and pitch type can be used. However, for the purpose of uniformly mixing with the SiC whiskers, the fiber form is preferably a thin fiber diameter and a short fiber shape. Specifically, it is preferable to use a chopped product obtained by cutting a carbon fiber tow having a diameter of 20 μm or less into a length of about 5 mm.

【0012】カーボン繊維の配合量は、SiCウイスカ
ー 100重量部に対し1〜50重量部の割合となる範囲に設
定する。カーボン繊維の配合比率が1重量部を下廻ると
SiCウイスカーの焼結粒子化を抑制する効果が不十分
となり、他方、50重量部を越えると2000℃未満の加熱温
度ではSiCウイスカーが径太化せず、2000℃以上にな
ると粒状化が進行してアスペクト性状を留めなくなる。
SiCウイスカーとカーボン繊維の混合は、両成分が十
分に分散混合するように機械的手段を用いておこなう
が、混合過程でウイスカー性状を破壊するような混合手
段は避けねばならない。好ましい分散混合は、SiCウ
イスカーとカーボン短繊維を水または適宜な有機溶媒と
ともに機械的撹拌装置で湿式混合し、ついで超音波振動
などを用いて分散処理を施すことである。
The blending amount of carbon fiber is set within a range of 1 to 50 parts by weight with respect to 100 parts by weight of SiC whiskers. If the blending ratio of carbon fibers is less than 1 part by weight, the effect of suppressing the formation of sintered particles in the SiC whiskers becomes insufficient, while if it exceeds 50 parts by weight, the diameter of the SiC whiskers becomes thicker at a heating temperature of less than 2000 ° C. If the temperature is 2000 ° C or higher, the granulation progresses and the aspect properties cannot be retained.
The SiC whiskers and the carbon fibers are mixed by mechanical means so that both components are sufficiently dispersed and mixed, but mixing means that destroys the whisker properties in the mixing process must be avoided. A preferable dispersive mixing is to wet mix SiC whiskers and short carbon fibers with water or an appropriate organic solvent by a mechanical stirrer, and then subject them to dispersion treatment using ultrasonic vibration or the like.

【0013】SiCウイスカーとカーボン繊維の混合物
は、N2 ガス、Arガスあるいは真空のような非酸化性
雰囲気下で1700〜2200℃の温度域で加熱処理する。この
際の加熱温度が1700℃未満であるとSiCウイスカーを
直径2μm 以上に径太化するために長時間を要するよう
になり、また2200℃を越えるとSiCウイスカーが粒状
物に転化するうえ、SiCの気化が激しくなって重量減
少を招き収率が低下する。
The mixture of SiC whiskers and carbon fibers is heat-treated in the temperature range of 1700 to 2200 ° C. under a non-oxidizing atmosphere such as N 2 gas, Ar gas or vacuum. If the heating temperature at this time is less than 1700 ° C, it takes a long time to thicken the SiC whiskers to a diameter of 2 μm or more, and if the heating temperature exceeds 2200 ° C, the SiC whiskers are converted into granular substances and SiC. Vaporization becomes more intense, resulting in a decrease in weight and a decrease in yield.

【0014】[0014]

【作用】SiCウイスカーは、不活性雰囲気下で加熱す
ると昇華再結晶を経て直径が増大するが、この現象は主
に積層欠陥部分から優先して昇華が始まり、昇華した原
子は欠陥の少ないウイスカー表面部分に再結晶して径太
化が進行するものと推測されている。この段階で、Si
Cウイスカー同士が接触状態にあると接触部位でネック
形成−成長という過程を経て焼結現象が生じ、複数のウ
イスカーによる焼結粒子が混在するようになる。
When SiC whiskers are heated in an inert atmosphere, the diameter increases through sublimation and recrystallization, but this phenomenon mainly starts sublimation from stacking faults, and sublimated atoms are the surface of the whiskers with few defects. It is presumed that recrystallization occurs in the part to increase the diameter. At this stage, Si
When C whiskers are in contact with each other, a sintering phenomenon occurs at a contact site through a process of neck formation and growth, and sintered particles by a plurality of whiskers are mixed.

【0015】本発明によれば、処理対象がSiCウイス
カーとカーボン繊維が均質分散した混合物となってお
り、介在するカーボン繊維がSiCウイスカー相互の接
触度合を少なくし、同時にカーボン繊維の絡み合いによ
り混合組織にSiCウイスカーの径太化に有効となる適
度の空隙を形成する。これらの作用が対象SiCウイス
カーの性状選定、特定されたカーボン繊維の配合割合お
よび加熱処理条件と相俟って、焼結粒子の生成を効果的
に抑制しながらSiCウイスカーの円滑な径太化を現出
するために有効機能する。
According to the present invention, the object to be treated is a mixture of SiC whiskers and carbon fibers homogeneously dispersed, the intervening carbon fibers reduce the degree of contact between the SiC whiskers, and at the same time the carbon fibers are entangled to form a mixed structure. In addition, an appropriate void that is effective for increasing the diameter of the SiC whiskers is formed. These effects, in combination with the selection of the properties of the target SiC whisker, the blending ratio of the specified carbon fiber and the heat treatment condition, effectively suppress the generation of sintered particles and increase the diameter of the SiC whisker smoothly. It works effectively to reveal.

【0016】[0016]

【実施例】以下、本発明の実施例を比較例と対比して説
明する。
EXAMPLES Examples of the present invention will be described below in comparison with comparative examples.

【0017】実施例1〜3、比較例1〜2 直径 1.0μm 、長さ50μのアスペクト性状を有し、α度
が0.5 で(111) 回折線の半価幅が0.1375deg のβ結晶型
主体のSiCウイスカー〔東海バーボン(株)製、“ト
ーカウイスカーTWS-400 ”〕を処理対象とし、この 100
重量部に対し平均径13μm 、平均長3mmのピッチ系カー
ボン繊維チョップ〔大日本インキ化学工業(株)製、
“ドナカーボS-231 ”〕を 0.5〜60重量部の範囲で配合
した。
Examples 1 to 3 and Comparative Examples 1 to 2 have a diameter of 1.0 μm, a length of 50 μ and an aspect ratio of 0.5, and a (111) diffraction line having a half-value width of 0.1375 deg. This SiC whisker [Tokai Bourbon Co., Ltd., "Tokai Whisker TWS-400"]
Pitch-based carbon fiber chops having an average diameter of 13 μm and an average length of 3 mm relative to parts by weight [manufactured by Dainippon Ink and Chemicals, Inc.,
"Donacarb S-231"] was compounded in the range of 0.5 to 60 parts by weight.

【0018】配合物をエタノールとともにジューサーミ
キサーに入れ、2分間撹拌混合処理したのち、さらに超
音波振動処理を施して十分に分散させた。ついで、濾
過、乾燥して得た混合物を黒鉛ルツボに詰め、Arガス
雰囲気に保持された電気炉中で1900℃の温度で加熱処理
した。加熱処理後のSiCウイスカーの平均直径と副生
混在しているSiC焼結粒子(直径5mm以上) の含有率
を測定し、その結果をカーボン繊維の配合量と対比させ
て表1に示した。
The mixture was placed in a juicer mixer together with ethanol, stirred and mixed for 2 minutes, and further ultrasonically vibrated to sufficiently disperse the mixture. Then, the mixture obtained by filtration and drying was filled in a graphite crucible and heat-treated at a temperature of 1900 ° C. in an electric furnace maintained in an Ar gas atmosphere. The average diameter of the SiC whiskers after the heat treatment and the content of the SiC sintered particles (diameter 5 mm or more) mixed as a by-product were measured, and the results are shown in Table 1 in comparison with the blending amount of carbon fiber.

【0019】[0019]

【表1】 [Table 1]

【0020】表1の結果から、本発明の実施例によれば
SiCウイスカーがいずれも2μm以上に径太化されて
おり、しかも焼結粒子の含有量が効果的に抑制されてい
ることが認められる。これに対し、カーボン繊維配合量
が1重量部を下廻る比較例1では径太効果は高いものの
焼結粒子の含有率も増大しており、またカーボン繊維配
合量が50重量部を越える比較例2では焼結粒子は副生し
ないが径太化は期待できないことが判る。
From the results shown in Table 1, it was confirmed that according to the examples of the present invention, the diameter of each SiC whisker was increased to 2 μm or more, and the content of the sintered particles was effectively suppressed. Be done. On the other hand, in Comparative Example 1 in which the carbon fiber content is less than 1 part by weight, the diameter effect is high, but the content of the sintered particles is also increased, and the carbon fiber content in the comparative example exceeds 50 parts by weight. It can be seen that in No. 2, sintered particles are not produced as a by-product, but the diameter cannot be expected to increase.

【0021】実施例4〜5、比較例3〜4 実施例3と同一組成のSiCウイスカーとカーボン繊維
の混合物を黒鉛ルツボに詰めてArガス雰囲気に保持し
た電気炉に入れ、1600〜2300℃の範囲で加熱温度を変え
て加熱処理を施した。各温度段階で加熱処理したSiC
ウイスカーの平均直径と形状変化の状況を測定観察し、
その結果を適用加熱温度と対比させて表2に示した。
Examples 4 to 5 and Comparative Examples 3 to 4 A mixture of SiC whiskers and carbon fibers having the same composition as in Example 3 was packed in a graphite crucible and placed in an electric furnace maintained in an Ar gas atmosphere, and the mixture was heated at 1600 to 2300 ° C. The heating temperature was changed within the range to perform the heat treatment. SiC heat treated at each temperature stage
Measure and observe the average diameter of whiskers and the situation of shape change,
The results are shown in Table 2 in comparison with the applied heating temperature.

【0022】[0022]

【表2】 [Table 2]

【0023】表2の結果から、加熱温度が1700〜2200℃
の範囲にある実施例では正常なSiCウイスカーの径太
効果が得られるが、1600℃ではSiCウイスカーが径太
化せず、2300℃になるとSiCウイスカーの粒状化が進
行してアスペクト性状を留めなくなる。
From the results shown in Table 2, the heating temperature was 1700 to 2200 ° C.
In the examples within the range of 1, the diameter effect of normal SiC whiskers can be obtained, but at 1600 ° C., the diameter of the SiC whiskers does not increase, and at 2300 ° C., the granularity of the SiC whiskers progresses and the aspect properties do not remain. ..

【0024】[0024]

【発明の効果】以上のとおり、本発明の方法に従えば処
理対象となるSiCウイスカーに所定量のカーボン繊維
を均一混合した状態で簡単な加熱処理工程を施すことに
より、焼結粒子の副生を抑制しながら直径2μm 以上の
径太サイズに改質することができる。したがって、各種
セラミックス材の靭性改善を目的とする複合強化材用の
SiCウイスカーを得るための手段として極めて有用で
ある。
As described above, according to the method of the present invention, by subjecting the SiC whisker to be treated to a simple heat treatment step in which a predetermined amount of carbon fibers are uniformly mixed, a by-product of sintered particles is produced. The diameter can be modified to a diameter of 2 μm or more while suppressing the above. Therefore, it is extremely useful as a means for obtaining SiC whiskers for a composite reinforcing material for the purpose of improving the toughness of various ceramic materials.

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 直径 0.3〜1.5 μm 、長さ10〜100 μm
のアスペクト性状を有するβ結晶型主体のSiCウイス
カー100 重量部に、カーボン繊維を1〜50重量部の割合
で配合して十分に分散混合し、該混合物を非酸化雰囲気
中で1700〜2200℃の温度に加熱処理することを特徴とす
るSiCウイスカーの改質処理方法。
1. Diameter 0.3 to 1.5 μm, length 10 to 100 μm
100 parts by weight of the β crystal type SiC whiskers having an aspect property of 1 to 50 parts by weight of carbon fibers were mixed and sufficiently dispersed and mixed, and the mixture was heated at 1700 to 2200 ° C. in a non-oxidizing atmosphere. A method for modifying a SiC whisker, which comprises performing a heat treatment at a temperature.
【請求項2】 β結晶型主体のSiCウイスカーが、α
度20以下で、(111)回折線の半価幅が0.14deg 以下であ
る請求項1記載のSiCウイスカーの改質処理方法。
2. A SiC whisker mainly composed of β crystal is formed by α
The method for modifying a SiC whisker according to claim 1, wherein the half width of the (111) diffraction line is 0.14 deg or less at a temperature of 20 or less.
JP5902892A 1992-02-10 1992-02-10 Modification treatment of sic whisker Pending JPH05221799A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5902892A JPH05221799A (en) 1992-02-10 1992-02-10 Modification treatment of sic whisker

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5902892A JPH05221799A (en) 1992-02-10 1992-02-10 Modification treatment of sic whisker

Publications (1)

Publication Number Publication Date
JPH05221799A true JPH05221799A (en) 1993-08-31

Family

ID=13101429

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5902892A Pending JPH05221799A (en) 1992-02-10 1992-02-10 Modification treatment of sic whisker

Country Status (1)

Country Link
JP (1) JPH05221799A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5997832A (en) * 1997-03-07 1999-12-07 President And Fellows Of Harvard College Preparation of carbide nanorods
US6190634B1 (en) 1995-06-07 2001-02-20 President And Fellows Of Harvard College Carbide nanomaterials
US20190249059A1 (en) * 2016-06-13 2019-08-15 Teijin Limited Silicon carbide production method and silicon carbide composite material

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6190634B1 (en) 1995-06-07 2001-02-20 President And Fellows Of Harvard College Carbide nanomaterials
US5997832A (en) * 1997-03-07 1999-12-07 President And Fellows Of Harvard College Preparation of carbide nanorods
US20190249059A1 (en) * 2016-06-13 2019-08-15 Teijin Limited Silicon carbide production method and silicon carbide composite material

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