JPH0521150B2 - - Google Patents
Info
- Publication number
- JPH0521150B2 JPH0521150B2 JP18643384A JP18643384A JPH0521150B2 JP H0521150 B2 JPH0521150 B2 JP H0521150B2 JP 18643384 A JP18643384 A JP 18643384A JP 18643384 A JP18643384 A JP 18643384A JP H0521150 B2 JPH0521150 B2 JP H0521150B2
- Authority
- JP
- Japan
- Prior art keywords
- acid
- carbon atoms
- polyether ester
- parts
- glycol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 34
- 229920006146 polyetheresteramide block copolymer Polymers 0.000 claims description 25
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 17
- 239000004952 Polyamide Substances 0.000 claims description 15
- 125000004432 carbon atom Chemical group C* 0.000 claims description 15
- 229920002647 polyamide Polymers 0.000 claims description 15
- 150000003951 lactams Chemical class 0.000 claims description 12
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical compound NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 claims description 8
- 239000011342 resin composition Substances 0.000 claims description 8
- 150000001991 dicarboxylic acids Chemical class 0.000 claims description 7
- 229920000233 poly(alkylene oxides) Polymers 0.000 claims description 7
- 150000004985 diamines Chemical class 0.000 claims description 6
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 4
- 150000003839 salts Chemical class 0.000 claims description 4
- -1 enantlactam Chemical compound 0.000 description 26
- 238000002844 melting Methods 0.000 description 13
- 230000008018 melting Effects 0.000 description 13
- 229920000642 polymer Polymers 0.000 description 13
- 238000006116 polymerization reaction Methods 0.000 description 11
- PBLZLIFKVPJDCO-UHFFFAOYSA-N 12-aminododecanoic acid Chemical compound NCCCCCCCCCCCC(O)=O PBLZLIFKVPJDCO-UHFFFAOYSA-N 0.000 description 10
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 10
- 238000000465 moulding Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 6
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- TVIDDXQYHWJXFK-UHFFFAOYSA-N dodecanedioic acid Chemical class OC(=O)CCCCCCCCCCC(O)=O TVIDDXQYHWJXFK-UHFFFAOYSA-N 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 229920002302 Nylon 6,6 Polymers 0.000 description 4
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 238000011084 recovery Methods 0.000 description 4
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 4
- 239000004677 Nylon Substances 0.000 description 3
- 229920002292 Nylon 6 Polymers 0.000 description 3
- 229920000577 Nylon 6/66 Polymers 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 3
- TZYHIGCKINZLPD-UHFFFAOYSA-N azepan-2-one;hexane-1,6-diamine;hexanedioic acid Chemical compound NCCCCCCN.O=C1CCCCCN1.OC(=O)CCCCC(O)=O TZYHIGCKINZLPD-UHFFFAOYSA-N 0.000 description 3
- WIHMDCQAEONXND-UHFFFAOYSA-M butyl-hydroxy-oxotin Chemical compound CCCC[Sn](O)=O WIHMDCQAEONXND-UHFFFAOYSA-M 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000007334 copolymerization reaction Methods 0.000 description 3
- 229920001778 nylon Polymers 0.000 description 3
- 229920006111 poly(hexamethylene terephthalamide) Polymers 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- PXGZQGDTEZPERC-UHFFFAOYSA-N 1,4-cyclohexanedicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 description 2
- GUOSQNAUYHMCRU-UHFFFAOYSA-N 11-Aminoundecanoic acid Chemical compound NCCCCCCCCCCC(O)=O GUOSQNAUYHMCRU-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 2
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 2
- 229920003189 Nylon 4,6 Polymers 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 229920001400 block copolymer Polymers 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000004040 coloring Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 239000002667 nucleating agent Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 229920005604 random copolymer Polymers 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- ISPYQTSUDJAMAB-UHFFFAOYSA-N 2-chlorophenol Chemical compound OC1=CC=CC=C1Cl ISPYQTSUDJAMAB-UHFFFAOYSA-N 0.000 description 1
- XCSGHNKDXGYELG-UHFFFAOYSA-N 2-phenoxyethoxybenzene Chemical compound C=1C=CC=CC=1OCCOC1=CC=CC=C1 XCSGHNKDXGYELG-UHFFFAOYSA-N 0.000 description 1
- DZIHTWJGPDVSGE-UHFFFAOYSA-N 4-[(4-aminocyclohexyl)methyl]cyclohexan-1-amine Chemical compound C1CC(N)CCC1CC1CCC(N)CC1 DZIHTWJGPDVSGE-UHFFFAOYSA-N 0.000 description 1
- SLXKOJJOQWFEFD-UHFFFAOYSA-N 6-aminohexanoic acid Chemical compound NCCCCCC(O)=O SLXKOJJOQWFEFD-UHFFFAOYSA-N 0.000 description 1
- UFFRSDWQMJYQNE-UHFFFAOYSA-N 6-azaniumylhexylazanium;hexanedioate Chemical compound [NH3+]CCCCCC[NH3+].[O-]C(=O)CCCCC([O-])=O UFFRSDWQMJYQNE-UHFFFAOYSA-N 0.000 description 1
- UQXNEWQGGVUVQA-UHFFFAOYSA-N 8-aminooctanoic acid Chemical compound NCCCCCCCC(O)=O UQXNEWQGGVUVQA-UHFFFAOYSA-N 0.000 description 1
- WXIOPKYMMKAUEP-UHFFFAOYSA-N C(CCCCCCCCC)(C(=O)O)C(=O)O.C(CCCCCCCCCCC(=O)O)(=O)O Chemical compound C(CCCCCCCCC)(C(=O)O)C(=O)O.C(CCCCCCCCCCC(=O)O)(=O)O WXIOPKYMMKAUEP-UHFFFAOYSA-N 0.000 description 1
- 229920000571 Nylon 11 Polymers 0.000 description 1
- 229920000299 Nylon 12 Polymers 0.000 description 1
- 229920000393 Nylon 6/6T Polymers 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- YDLSUFFXJYEVHW-UHFFFAOYSA-N azonan-2-one Chemical compound O=C1CCCCCCCN1 YDLSUFFXJYEVHW-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 125000002843 carboxylic acid group Chemical group 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000006258 conductive agent Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- YWJUZWOHLHBWQY-UHFFFAOYSA-N decanedioic acid;hexane-1,6-diamine Chemical compound NCCCCCCN.OC(=O)CCCCCCCCC(O)=O YWJUZWOHLHBWQY-UHFFFAOYSA-N 0.000 description 1
- LHLUQDDQLCJCFU-UHFFFAOYSA-L disodium;1-sulfocyclohexa-3,5-diene-1,3-dicarboxylate Chemical compound [Na+].[Na+].OS(=O)(=O)C1(C([O-])=O)CC(C([O-])=O)=CC=C1 LHLUQDDQLCJCFU-UHFFFAOYSA-L 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000010101 extrusion blow moulding Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 229920006017 homo-polyamide Polymers 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- WPUMVKJOWWJPRK-UHFFFAOYSA-N naphthalene-2,7-dicarboxylic acid Chemical compound C1=CC(C(O)=O)=CC2=CC(C(=O)O)=CC=C21 WPUMVKJOWWJPRK-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920006139 poly(hexamethylene adipamide-co-hexamethylene terephthalamide) Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920006123 polyhexamethylene isophthalamide Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Description
〈産業上の利用分野〉
本発明は、結晶性、溶融粘性が高く、成形性、
機械的性質のすぐれたポリエーテルエステルアミ
ド樹脂組成物に関するものである。
〈従来の技術〉
ポリマー主鎖中にポリアミド繰返し単位、ポリ
エーテル繰返し単位およびエステル結合を有する
ポリエーテルエステルアミドは公知である(米国
特許第3044987号明細書)。
〈発明が解決しようとする問題点〉
ポリエーテルエステルアミドは軽量性、弾性回
復性、透明性、低温耐衝撃性にすぐれ、また成形
時にバリ、ヒケ等が生じにくいため各種成形用途
に有用されているが、結晶化速度、到達結晶化度
が小さいため溶融成形の場合、冷却時間を比較的
長く必要とし生産性が低下するという問題があつ
た。
また、チユーブ、蛇腹等を押出成形やブロー成
形により製造するには高粘度が必要であるが、高
粘度を得るために重合時間を延長すると着色がひ
どくなる傾向があつた。またポリエーテルエステ
ルアミドは比較的融点が低く、固相重合が困難で
あるため液相重合にならざるを得ず、着色を増進
させるという問題があつた。
本発明は上述の問題を解消し、結晶性、溶融粘
性が高く、成形性、機械的性質のすぐれた樹脂組
成物の提供を目的になされた。
〈問題点を解決するための手段〉
その結果、本発明の上記の目的は炭素原子数6
以上のアミノカルボン酸またはラクタム、もしく
は炭素数6以上のジアミンとジカルボン酸の塩
(a)、数平均分子量300〜6000のポリ(アルキレン
オキシド)グリコール(b)、および炭素原子数4〜
20のジカルボン酸(c)から構成されるポリエーテル
エステルアミド(A)50〜99重量部に炭素原子数4〜
9のアミノカルボン酸またはラクタム(d)および/
または炭素数4〜9のジアミンとジカルボン酸の
塩(e)から構成されるポリアミド(B)50〜1重量部の
割合、混合してなるポリエーテルエステルアミド
組成物とすることによつて達成されることがわか
つた。以下本発明の構成、実施例及び効果を述べ
る。
本発明のポリエーテルエステルアミド(A)におけ
る炭素数が6以上のアミノカルボン酸またはラク
タムもしくは炭素数6以上のジアミンとジカルボ
ン酸の塩(a)としては、ω−アミノカプロン酸、ω
−アミノエナント酸、ω−アミノカプリル酸、ω
−アミノペラルゴン酸、ω−アミノカプリン酸、
11−アミノウンデカン酸、12−アミノドデカン酸
等のアミノカルボン酸あるいはカプロラクタム、
エナントラクタム、カプリルラクタム、ラウロラ
クタム等のラクタムおよびヘキサメチレンジアミ
ン−アジピン酸塩、ヘキサメチレンジアミン−セ
バシン酸塩、ヘキサメチレンジアミン−イソフタ
ル酸塩、ウンデカメチレンジアミン−アジピン酸
塩、4,4′−ジアミノジシクロヘキシルメタン−
ドデカンジ酸塩などのジアミン−ジカルボン酸の
塩があるが、特に11−アミノウンデカン酸、12−
アミノドデカン酸が好ましく、目的と用途に応じ
てはこれらを併用して用いることもできる。
またポリエーテルエステルアミドの融点を下げ
たり、接着性を高めるなどの目的でその他のアミ
ド形成性成分を共重合成分として用いることも小
量範囲なら許容される。
本発明のポリエーテルエステルアミド(A)におけ
る数平均分子量が300〜6000のポリ(アルキレン
オキシド)グリコール(b)としては、ポリエチレン
グリコール、ポリ(1,2−および1,3−プロ
ピレンオキシド)グリコール、ポリ(テトラメチ
レンオキシドグリコール)、ポリ(ヘキサメチレ
ンオキシド)グリコール、エチレンオキシドとプ
ロピレンオキシドのブロツク又はランダム共重合
体、エチレンオキシドとテトラヒドロフランのブ
ロツク又はランダム共重合体などが挙げられ、就
中耐熱性、耐水性、機械的強度、弾性回復性な
ど、すぐれたポリエーテルエステルアミドの物理
的性質からポリ(テトラメチレンオキシド)グリ
コールが好ましく用いられる。ポリ(アルキレン
オキシド)グリコールの数平均分子量は300〜
6000の範囲で用いうるが、重合時に粗大な相分離
を起こさず、低温特性や機械的性質がすぐれる分
子量領域が選択され、この最適分子量領域はポリ
(アルキレンオキシド)グリコールの種類によつ
て異なる。
例えばポリエチレングリコールの場合300〜
6000、特に好ましくは1000〜4000が、ポリ(プロ
ピレンオキシド)グリコールの場合300〜5000、
特に好ましくは500〜3000が、またポリ(テトラ
メチレンオキシド)グリコールの場合500〜3000、
特に好ましくは500〜2500の分子量領域のものが
好ましく用いられる。
本発明のポリエーテルエステルアミド(A)におけ
る炭素数4〜20のジカルボン酸(c)としてはテレフ
タル酸、イソフタル酸、ナフタレン2,6−ジカ
ルボン酸、ナフタレン−2,7−ジカルボン酸、
ジフエニル−4,4′−ジカルボン酸、ジフエノキ
シエタンジカルボン酸、3−スルホイソフタル酸
ナトリウムのごとき芳香族ジカルボン酸、1,4
−シクロヘキサンジカルボン酸、1,2−シクロ
ヘキサンジカルボン酸、ジシクロヘキシル−4,
4′−ジカルボン酸のごとき脂環族ジカルボン酸、
およびコハク酸、シユウ酸、アジピン酸、セバシ
ン酸、ドデカンジ酸(デカンジカルボン酸)のご
とき脂肪族ジカルボン酸を挙げることができる。
特にテレフタル酸、イソフタル酸、1,4−シク
ロヘキサンジカルボン酸、セバシン酸、ドデカン
ジ酸のようなジカルボン酸が重合性、色調および
ポリマの物理的性質の点から好ましく用いられ
る。
本発明の効果が就中最も顕著に示されるために
は、ポリエーテルエステルアミド(A)中のポリ(ア
ルキレンオキシド)グリコール(b)の共重合量とし
て5〜90重量%が好ましい。共重合量が5重量%
以下では柔軟性、弾性回復性が失われ、逆に90重
量%以上では高温特性、機械的性質が十分でな
い。
ポリエーテルエステルアミド(A)の重合方法は特
に限定されず公知の方法を利用することができ
る。たとえば、アミノカルボン酸またはラクタム
(a)とジカルボン酸(c)を反応させて両末端がカルボ
ン酸基のポリアミドプレポリマをつくりこれにポ
リ(アルキレンオキシド)グリコール(b)を真空下
に反応させる方法、あるいは上記(a),(b),(c)の化
合物を反応槽に仕込み、水の存在下または不存在
下に高温で加熱反応させることによりカルボン酸
末端のポリアミドプレポリマを生成させ、その
後、常圧または減圧下で重合を進める方法が知ら
れている。また、上記(a),(b),(c)の化合物を同時
に反応槽に仕込み、溶融重合したのち、高真空下
で一挙に重合をすすめる方法もあり、むしろこの
方法がポリマの着色も少なく好ましい。
本発明の炭素原子数4〜9のアミノカルボン酸
またはラクタム(d)および/または炭素数4〜9の
ジアミンとジカルボン酸の塩(e)から構成されるポ
リアミド(B)としては、ナイロン6、ナイロン46、
ナイロン49、ナイロン66、ナイロン69、ナイロン
6I(ポリヘキサメチレンイソフタルアミド)、ナイ
ロン6T(ポリヘキサメチレンテレフタルアミド)
等のホモポリアミドあるいはナイロン6/66、ナ
イロン46/66、ナイロン6/6T、ナイロン6/
6I、ナイロン66/6T、ナイロン66/6I、ナイロ
ン6/66/6T、ナイロン6/66/6I(前記におい
てスラツシユは共重合体を意味する)等のコポリ
アミドおよびそれらの混合物が挙げられるが、特
にナイロン6、ナイロン66が好ましく用いられ
る。本発明の特徴はポリアミド(B)として比較的高
融点のものを用いるところにある。さらに詳しく
述べると、ポリエーテルエステルアミド(A)の融点
以上でしかもポリアミド(B)の融点以下の温度で本
発明の樹脂組成物を成形することにより、ポリア
ミド(B)が高分子核剤として機能し、本発明の目的
とする結晶性、成形性、溶融粘性を付与すること
が可能となる。
これらの効果はナイロン11、ナイロン12等の比
較的低融点のポリアミドを用いた場合には得られ
ない。
本発明においてポリエーテルエステルアミド(A)
とポリアミド(B)との混合比は(A)が50〜99重量部に
(B)が50〜1重量部の割合となるようにする必要が
ある。(B)が1重量部未満では本発明の高融点化、
高温特性の改良効果が小さく、また50重量部越え
るとポリエーテルエステルアミドの柔軟性、弾性
回復性を損なうので好ましくない。
本発明の樹脂組成物は溶融混練することが好ま
しく、溶融混練の方法は公知の方法を用いること
ができる。例えばバンハリーミキサー、ゴムロー
ル機、一軸もしくは二軸の押出機などを用い、通
常100〜300℃の温度で溶融混練して樹脂組成物と
することができる。
また、本発明の樹脂組成物には公知の酸化防止
剤、熱分解防止剤、紫外線吸収剤、耐加水分解改
良剤、着色剤(顔料、染料)、帯電防止剤、導電
剤、難燃剤、補強剤、充填剤、滑剤、核剤、離型
剤、可塑剤、接着助剤、粘着剤などを任意に含有
せしめることができる。
〈実施例〉
実施例中特にことわらない限り、部数は重量部
を意味する。
参考例
ポリマー(A−1)の重合
ω−アミノドデカン酸81.9部、ドデカンジ酸
6.8部、及び数平均分子量650のポリ(テトラメチ
レンオキシド)グリコール19.3部を“イルガノツ
クス”1098 0.5部(酸化防止剤)とともにヘリカ
ルリボン撹拌翼を備えた反応容器に仕込み、窒素
パージして260℃で1時間加熱撹拌して均質透明
溶液とした後、三酸化アンチモン触媒0.015部、
モノブチルモノヒドロキシ錫オキシド触媒0.015
部、りん酸0.005部(着色防止剤)を添加し、減
圧プログラムに従つて1時間で1mmHg以下の重
合条件にもたらした。この条件にて2.5時間反応
せしめると粘稠な無色透明の溶融ポリマーが得ら
れ、このポリマーをガツトとして水中に吐出する
と結晶化して白化した。得られたポリエーテルエ
ステルアミド(A−1)は、オルトクロロフエノ
ール中25℃、0.5%濃度で測定した相対粘度(ηr)
が1.81であり、DSCによる結晶融点は167℃であ
つた。
ポリマー(A−2)の重合
ω−アミノドデカン酸49.1部、テレフタル酸
7.9部、数平均分子量が1020のポリ(テトラメチ
レンオキシド)グリコール48.8部、“イルガノツ
クス”1098 0.5部、三酸化アンチモン0.015部、
モノブチルモノヒドロキシ錫オキシド0.015部、
及びリン酸0.005部からポリマー(A−1)と同
様の条件で重合し、相対粘度1.93、融点154℃の
ポリエーテルエステルアミド(A−2)を得た。
ポリマー(A−3)の重合
ω−アミノドデカン酸27.3部、テレフタル酸
5.7部、数平均分子量が2060ポリ(テトラメチレ
ンオキシド)グリコール70.5部、“イルガノツク
ス”1098 0.5部、三酸化アンチモン0.015部、モ
ノブチルモノヒドロキシ錫オキシド0.015部、及
びリン酸0.005部からポリマー(A−1)と同様
の条件で重合し、相対粘度1.92、融点145℃のポ
リエーテルエステルアミド(A−3)を得た。
ポリマー(A−4)の重合
ウンデカメチレンジアミン−アジピン酸塩44.9
部、テレフタル酸12.8部、数平均分子量が650の
ポリ(テトラメチレンオキシド)グリコール50.0
部、“イルガノツクス”1098 0.5部、三酸化アン
チモン0.015部、モノブチルモノヒドロキシ錫オ
キシド0.015部、及びリン酸0.005部からポリマー
(A−1)と同様の条件で重合し、相対粘度1.80、
融点209℃のポリエーテルエステルアミド(A−
4)を得た。
ポリアミド
実施例及び比較例に用いたポリアミド(B)の略号
と内容は次のとおりである。
<Industrial Application Field> The present invention has high crystallinity, high melt viscosity, moldability,
This invention relates to a polyetheresteramide resin composition with excellent mechanical properties. <Prior Art> Polyetheresteramides having polyamide repeating units, polyether repeating units and ester bonds in the polymer main chain are known (US Pat. No. 3,044,987). <Problems to be solved by the invention> Polyether ester amide is useful for various molding applications because it is lightweight, has excellent elastic recovery properties, transparency, and low-temperature impact resistance, and is less likely to cause burrs, sink marks, etc. during molding. However, since the crystallization rate and the achieved crystallinity are low, in the case of melt molding, a relatively long cooling time is required, resulting in a decrease in productivity. In addition, high viscosity is necessary for manufacturing tubes, bellows, etc. by extrusion molding or blow molding, but if the polymerization time is extended to obtain high viscosity, coloring tends to become severe. In addition, polyether ester amide has a relatively low melting point and is difficult to perform solid phase polymerization, so liquid phase polymerization has to be performed, which has the problem of increasing coloration. The present invention has been made to solve the above-mentioned problems and to provide a resin composition that has high crystallinity, high melt viscosity, and excellent moldability and mechanical properties. <Means for Solving the Problems> As a result, the above object of the present invention is achieved when the number of carbon atoms is 6.
The above aminocarboxylic acids or lactams, or salts of diamines and dicarboxylic acids having 6 or more carbon atoms
(a), poly(alkylene oxide) glycol (b) having a number average molecular weight of 300 to 6000, and a number of carbon atoms of 4 to
Polyether ester amide (A) composed of 20 dicarboxylic acids (c) with 4 to 99 parts by weight of carbon atoms
9 aminocarboxylic acid or lactam (d) and/or
Or, it can be achieved by mixing 50 to 1 part by weight of a polyamide (B) composed of a diamine having 4 to 9 carbon atoms and a dicarboxylic acid salt (e) to form a polyether ester amide composition. I found out that. The structure, embodiments, and effects of the present invention will be described below. Examples of the aminocarboxylic acid or lactam having 6 or more carbon atoms or the diamine and dicarboxylic acid salt (a) having 6 or more carbon atoms in the polyether ester amide (A) of the present invention include ω-aminocaproic acid, ω
-aminoenanthic acid, ω-aminocaprylic acid, ω
-aminopelargonic acid, ω-aminocapric acid,
Aminocarboxylic acids such as 11-aminoundecanoic acid and 12-aminododecanoic acid or caprolactam,
Lactams such as enantlactam, capryllactam, laurolactam and hexamethylenediamine-adipate, hexamethylenediamine-sebacate, hexamethylenediamine-isophthalate, undecamethylenediamine-adipate, 4,4'- Diaminodicyclohexylmethane
There are salts of diamine-dicarboxylic acids such as dodecanedioic acid salts, especially 11-aminoundecanoic acid, 12-
Aminododecanoic acid is preferred, and these may be used in combination depending on the purpose and use. It is also permissible to use other amide-forming components as copolymerization components in small amounts for the purpose of lowering the melting point of polyether ester amide or increasing adhesiveness. Examples of the poly(alkylene oxide) glycol (b) having a number average molecular weight of 300 to 6,000 in the polyether ester amide (A) of the present invention include polyethylene glycol, poly(1,2- and 1,3-propylene oxide) glycol, Poly(tetramethylene oxide) glycol, poly(hexamethylene oxide) glycol, block or random copolymers of ethylene oxide and propylene oxide, block or random copolymers of ethylene oxide and tetrahydrofuran, etc., among others, have excellent heat resistance and water resistance. Poly(tetramethylene oxide) glycol is preferably used because of the excellent physical properties of polyether ester amide, such as mechanical strength, elastic recovery, etc. The number average molecular weight of poly(alkylene oxide) glycol is 300~
6000, but a molecular weight range that does not cause coarse phase separation during polymerization and has excellent low-temperature properties and mechanical properties is selected, and this optimum molecular weight range varies depending on the type of poly(alkylene oxide) glycol. . For example, in the case of polyethylene glycol, it is 300~
6000, particularly preferably 1000-4000, 300-5000 in the case of poly(propylene oxide) glycol,
Particularly preferably 500 to 3000, and in the case of poly(tetramethylene oxide) glycol, 500 to 3000;
Particularly preferably, those in the molecular weight range of 500 to 2,500 are preferably used. Examples of the dicarboxylic acid (c) having 4 to 20 carbon atoms in the polyether ester amide (A) of the present invention include terephthalic acid, isophthalic acid, naphthalene-2,6-dicarboxylic acid, naphthalene-2,7-dicarboxylic acid,
Aromatic dicarboxylic acids such as diphenyl-4,4'-dicarboxylic acid, diphenoxyethane dicarboxylic acid, sodium 3-sulfoisophthalate, 1,4
-cyclohexanedicarboxylic acid, 1,2-cyclohexanedicarboxylic acid, dicyclohexyl-4,
Alicyclic dicarboxylic acids such as 4'-dicarboxylic acids,
and aliphatic dicarboxylic acids such as succinic acid, oxalic acid, adipic acid, sebacic acid, dodecanedioic acid (decanedicarboxylic acid).
In particular, dicarboxylic acids such as terephthalic acid, isophthalic acid, 1,4-cyclohexanedicarboxylic acid, sebacic acid, and dodecanedioic acid are preferably used from the viewpoint of polymerizability, color tone, and physical properties of the polymer. In order for the effects of the present invention to be exhibited most significantly, the copolymerization amount of poly(alkylene oxide) glycol (b) in polyether ester amide (A) is preferably 5 to 90% by weight. Copolymerization amount is 5% by weight
If it is less than 90% by weight, flexibility and elastic recovery properties will be lost, and if it is more than 90% by weight, high temperature properties and mechanical properties will not be sufficient. The method for polymerizing polyether ester amide (A) is not particularly limited, and any known method can be used. For example, aminocarboxylic acids or lactams
A method of reacting (a) with dicarboxylic acid (c) to create a polyamide prepolymer having carboxylic acid groups at both ends, and reacting this with poly(alkylene oxide) glycol (b) under vacuum, or (a) above, The compounds (b) and (c) are charged into a reaction tank and reacted by heating at high temperature in the presence or absence of water to produce a carboxylic acid-terminated polyamide prepolymer, and then heated under normal pressure or reduced pressure. Methods of advancing polymerization are known. There is also a method in which the compounds (a), (b), and (c) above are charged into a reaction tank at the same time, melt-polymerized, and then polymerized all at once under high vacuum; this method actually causes less coloring of the polymer. preferable. The polyamide (B) composed of an aminocarboxylic acid or lactam having 4 to 9 carbon atoms or a lactam (d) and/or a salt of a diamine and dicarboxylic acid having 4 to 9 carbon atoms (e) of the present invention includes nylon 6, nylon 46,
nylon 49, nylon 66, nylon 69, nylon
6I (polyhexamethylene isophthalamide), nylon 6T (polyhexamethylene terephthalamide)
Homopolyamides such as nylon 6/66, nylon 46/66, nylon 6/6T, nylon 6/
Copolyamides such as 6I, nylon 66/6T, nylon 66/6I, nylon 6/66/6T, nylon 6/66/6I (slush means copolymer in the above) and mixtures thereof, In particular, nylon 6 and nylon 66 are preferably used. A feature of the present invention is that a polyamide (B) having a relatively high melting point is used. More specifically, by molding the resin composition of the present invention at a temperature higher than the melting point of polyetheresteramide (A) and lower than the melting point of polyamide (B), polyamide (B) functions as a polymer nucleating agent. However, it becomes possible to impart the crystallinity, moldability, and melt viscosity that are the objectives of the present invention. These effects cannot be obtained when polyamides with relatively low melting points, such as nylon 11 and nylon 12, are used. In the present invention, polyether ester amide (A)
The mixing ratio of (A) and polyamide (B) is 50 to 99 parts by weight.
It is necessary to adjust the proportion of (B) to 50 to 1 part by weight. When (B) is less than 1 part by weight, the melting point of the present invention is increased;
The effect of improving high temperature properties is small, and if it exceeds 50 parts by weight, it impairs the flexibility and elastic recovery of the polyether ester amide, which is not preferred. The resin composition of the present invention is preferably melt-kneaded, and known methods can be used for melt-kneading. For example, the resin composition can be prepared by melt-kneading using a Banharry mixer, a rubber roll machine, a single-screw or twin-screw extruder, etc., usually at a temperature of 100 to 300°C. The resin composition of the present invention also includes known antioxidants, thermal decomposition inhibitors, ultraviolet absorbers, hydrolysis resistance improvers, colorants (pigments, dyes), antistatic agents, conductive agents, flame retardants, and reinforcing agents. Agents, fillers, lubricants, nucleating agents, mold release agents, plasticizers, adhesion aids, adhesives, etc. can be optionally contained. <Examples> Unless otherwise specified in the examples, parts mean parts by weight. Reference Example Polymerization of polymer (A-1) ω-aminododecanoic acid 81.9 parts, dodecanedioic acid
6.8 parts of poly(tetramethylene oxide) glycol and 19.3 parts of poly(tetramethylene oxide) glycol with a number average molecular weight of 650 were charged together with 0.5 parts of "Irganox" 1098 (antioxidant) into a reaction vessel equipped with a helical ribbon stirring blade, and the mixture was purged with nitrogen and heated at 260°C. After heating and stirring for 1 hour to obtain a homogeneous transparent solution, 0.015 parts of antimony trioxide catalyst,
Monobutyl monohydroxytin oxide catalyst 0.015
and 0.005 parts of phosphoric acid (anticoloring agent) were added, and the polymerization conditions were brought to below 1 mmHg in 1 hour according to a vacuum program. When reacted under these conditions for 2.5 hours, a viscous, colorless and transparent molten polymer was obtained, and when this polymer was discharged into water as a gut, it crystallized and turned white. The obtained polyether ester amide (A-1) has a relative viscosity (ηr) measured in orthochlorophenol at 25°C and a concentration of 0.5%.
was 1.81, and the crystal melting point by DSC was 167°C. Polymerization of polymer (A-2) 49.1 parts of ω-aminododecanoic acid, terephthalic acid
7.9 parts, 48.8 parts of poly(tetramethylene oxide) glycol with a number average molecular weight of 1020, 0.5 parts of "Irganox" 1098, 0.015 parts of antimony trioxide,
0.015 parts of monobutyl monohydroxytin oxide,
and 0.005 part of phosphoric acid under the same conditions as Polymer (A-1) to obtain polyetheresteramide (A-2) having a relative viscosity of 1.93 and a melting point of 154°C. Polymerization of polymer (A-3) 27.3 parts of ω-aminododecanoic acid, terephthalic acid
Polymer (A- Polymerization was carried out under the same conditions as in 1) to obtain polyether ester amide (A-3) having a relative viscosity of 1.92 and a melting point of 145°C. Polymerization of polymer (A-4) Undecamethylenediamine-adipate 44.9
12.8 parts of terephthalic acid, 50.0 parts of poly(tetramethylene oxide) glycol with a number average molecular weight of 650.
part, "Irganox" 1098 0.5 part, antimony trioxide 0.015 part, monobutyl monohydroxytin oxide 0.015 part, and phosphoric acid 0.005 part under the same conditions as Polymer (A-1), and the relative viscosity was 1.80.
Polyether ester amide (A-
4) was obtained. Polyamide The abbreviations and contents of polyamide (B) used in Examples and Comparative Examples are as follows.
【表】
実施例1〜7、比較例3、4(比較例1、2、
5、6は後述)
ポリエーテルエステルアミドブロツク共重合体
(A−1)、(A−2)、(A−3)および(A−4)
に表に示すポリアミドを混合し、用いたポリアミ
ドにより(B−1)、(B−2)および(B−3)
についてそれぞれ250℃、280℃、210℃に加熱さ
れた30mmφの押出機で溶融混練した後ペレツト化
した。得られたペレツトを5ozの射出能力を有す
る射出成形機を使用して表に示す成形温度で、ま
た金型温度は40℃でJIS2号引張試験片を成形し
た。
引張特性はASTM D−638に、また硬度は
ASTM D−2240、溶融指数はASTM D−1238
に従い測定した。成形サイクルは良好な成形品を
得るための保圧時間+冷却時間とした。その結果
を表に示す。
比較例1、2、5、6
ポリエーテルエステルアミド(A−1)、(A−
2)、(A−3)および(A−4)について実施例
1〜7、比較例3、4と同様にJIS2号引張試験片
を成形し、引張特性、硬度、溶融指数、成形サイ
クルを求めた。その結果を表に示す。[Table] Examples 1 to 7, Comparative Examples 3 and 4 (Comparative Examples 1, 2,
5 and 6 will be described later) Polyether ester amide block copolymers (A-1), (A-2), (A-3) and (A-4)
By mixing the polyamides shown in the table, (B-1), (B-2) and (B-3) were obtained depending on the polyamide used.
The mixtures were melt-kneaded in a 30 mmφ extruder heated to 250°C, 280°C, and 210°C, respectively, and then pelletized. The obtained pellets were molded into JIS No. 2 tensile test pieces using an injection molding machine with a 5 oz injection capacity at the molding temperature shown in the table and at a mold temperature of 40°C. Tensile properties meet ASTM D-638, and hardness meets ASTM D-638.
ASTM D-2240, melting index ASTM D-1238
Measured according to the following. The molding cycle was a holding time + cooling time to obtain a good molded product. The results are shown in the table. Comparative Examples 1, 2, 5, 6 Polyether ester amide (A-1), (A-
2) For (A-3) and (A-4), JIS No. 2 tensile test pieces were molded in the same manner as Examples 1 to 7 and Comparative Examples 3 and 4, and the tensile properties, hardness, melting index, and molding cycle were determined. Ta. The results are shown in the table.
【表】【table】
【表】
〈発明の効果〉
実施例1〜7にみられるように本発明の樹脂組
成物はポリエーテルエステルアミドの柔軟性とす
ぐれた機械的性質を保持したまま、溶融指数、成
形サイクルが減少し、溶融粘性が高く、結晶性、
成形性がすぐれていることがわかる。[Table] <Effects of the invention> As seen in Examples 1 to 7, the resin composition of the present invention reduced the melting index and molding cycle while retaining the flexibility and excellent mechanical properties of polyetheresteramide. has high melt viscosity, crystallinity,
It can be seen that the moldability is excellent.
Claims (1)
ラクタム、もしくは炭素数6以上のジアミンとジ
カルボン酸の塩(a)、数平均分子量300〜6000のポ
リ(アルキレンオキシド)グリコール(b)、および
炭素原子数4〜20のジカルボン酸(c)から構成され
るポリエーテルエステルアミド(A)50〜99重量部
に、炭素原子数4〜9のアミノカルボン酸または
ラクタム(d)および/または炭素数4〜9のジアミ
ンとジカルボン酸の塩(e)から構成されるポリアミ
ド(B)を50〜1重量部の割合混合してなるポリエー
テルエステルアミド樹脂組成物。1 Aminocarboxylic acid or lactam having 6 or more carbon atoms, or salt of diamine and dicarboxylic acid having 6 or more carbon atoms (a), poly(alkylene oxide) glycol (b) having a number average molecular weight of 300 to 6000, and number of carbon atoms Aminocarboxylic acid or lactam (d) having 4 to 9 carbon atoms and/or 4 to 9 carbon atoms to 50 to 99 parts by weight of polyether ester amide (A) composed of 4 to 20 dicarboxylic acids (c). A polyether ester amide resin composition prepared by mixing 50 to 1 part by weight of a polyamide (B) composed of a diamine and a dicarboxylic acid salt (e).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18643384A JPS6164752A (en) | 1984-09-07 | 1984-09-07 | Polyether ester amide resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18643384A JPS6164752A (en) | 1984-09-07 | 1984-09-07 | Polyether ester amide resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6164752A JPS6164752A (en) | 1986-04-03 |
JPH0521150B2 true JPH0521150B2 (en) | 1993-03-23 |
Family
ID=16188350
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18643384A Granted JPS6164752A (en) | 1984-09-07 | 1984-09-07 | Polyether ester amide resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6164752A (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6389568A (en) * | 1986-10-03 | 1988-04-20 | Daiseru Hiyurusu Kk | Flame-retardant polyamide resin composition |
CN1078221C (en) * | 1998-04-24 | 2002-01-23 | 聚隆纤维股份有限公司 | Production process for polyether ester acetate-amine elastic body and elastic fiber |
-
1984
- 1984-09-07 JP JP18643384A patent/JPS6164752A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6164752A (en) | 1986-04-03 |
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