JPH05206324A - Vertical electronic parts - Google Patents

Abstract

PURPOSE:To provide vertical electronic parts which eliminate the necessity of special working on a substrate. and are difficult to overturn on the substrate. CONSTITUTION:A vertical electronic parts are composed of a lead group 11 extending from one side B of main substance 10. and bonding portions 12 at both sides of the lead group 11. Therefore, even if external force such as wind is given during a process of soldering of the leads, the main substance 10 is difficult to overturn, and defective soldering can be avoided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vertical electronic component, and more particularly to a vertical electronic component in which adhesive margin portions are provided on both sides of a lead group to improve stability before completion of soldering.

[0002]

2. Description of the Related Art In recent years, in the field of electronic parts such as ICs and LSIs, it has been required to improve mounting efficiency on a substrate. Therefore, in order to meet this demand, by concentrating the leads on one side of the main body and extending from the one side, a vertical electronic component that can be vertically attached to the substrate has been manufactured. As described above, when the electronic component is attached to the substrate, the heat dissipation effect can be enhanced along with the improvement of the mounting efficiency.

FIG. 4A is a perspective view showing a first example of the prior art. 101 is a substrate, 102 is this substrate 10
1 is a land, 110 is a main body, 111 is a main body 1
10 is a lead extending from one side. Also, the main body 11
On both sides of 0, parallel to lead 111, and lead 11
A downwardly projecting projection 112 that is projected to be longer than 1 is provided, and a projecting insertion hole 103 is provided at a position of the substrate 101 that corresponds to this projecting 112. Then, by inserting the protrusion 112 into the protrusion insertion hole 103, the lead 111
Is brought into contact with the land 102, and the main body 110 is vertically supported by the substrate 101.

FIG. 4B is a perspective view showing a second example of the prior art. This one is on both sides of the lead 111,
A pair of L-shaped holding leads 113, 113 are provided back to back, and as shown in the side view of FIG.
It is to be supported by the pair of holding leads 113, 113 on the top. Incidentally, 102 'is a land for holding lead.

[0005]

The first example of the prior art described above has the following problems. First, the substrate 101
It is essential to open the projection insertion hole 103 in the. However, this cannot be applied to the case where wiring is provided inside the substrate such as a multilayer substrate. Therefore,
It may not be mounted depending on the substrate 101. In addition, the leads 111 have to be shorter than the projections 112, and after the main body 110 is mounted on the substrate 101, the projections 112 and the main body 1 are
Since the lead 10 covers the lead 111,
It becomes extremely difficult to perform a visual inspection as to whether the land 102 and the land 102 are in good contact with each other.

In the second example, the lands 102, 102 'are formed by the normal solder leveler method or the cream solder printing method.
Then, the lead 111 and the holding lead 113 are soldered to fix the main body 110 to the substrate 101. However, from the time the main body 110 is mounted on the board 101 until the soldering is completed, the main body 110 is
The lead 102 and the holding lead 113 are the land 102,
Since it is supported only by being placed on 102 ', it is extremely unstable and easily falls.
Here, in order to improve the stability of the main body 110 during this time, the span L in FIG. 4C (side view of FIG. 4B) must be increased. However, since it is premised that a large number of the vertical electronic components are arranged on the substrate 101 with a narrow space therebetween, the span L cannot be unnecessarily increased. Looking at the step of performing the soldering, for example, when the cream solder printing method is used, after the cream solder S is applied to the lands 102 and 102 ′, the hot air W is received in the furnace of the reflow device RF, As shown in FIG. 4D, the main body 110 is likely to fall. In particular, since the vertical electronic components are arranged in a row on the substrate 101 as described above, in the case of the second example, the main body 110 is overwhelmed by shogi, and soldering failure frequently occurs. There is a point. In FIG. 4D, RF1 is a fan and RF2 is a heating unit.

Therefore, an object of the present invention is to provide a vertical electronic component which does not require any special processing on a substrate and is hard to fall on the substrate.

[0008]

According to the present invention, a lead group is extended from one side of a main body, and adhesive margin portions are provided on both sides of the lead group to form a vertical electronic component.

[0009]

In the above structure, the substrate and the adhesive margin portion are adhered to each other with the adhesive, so that the main body is stably supported on the substrate. Further, for this support, it is not necessary to perforate the substrate, so that the substrate can be easily mounted on both front and back surfaces.

[0010]

Embodiments of the present invention will now be described with reference to the drawings.

FIG. 1 is a perspective view of a vertical electronic component of the present invention, FIG. 2 is a perspective view of the electronic component as viewed from the bottom side B, and FIG. 3 is a vertical sectional view showing a state in which the electronic component is mounted. ..

In FIG. 1, 1 is a substrate, 2 is a land formed in a row on the substrate 1 by etching or the like, and 3 is an adhesive agent applied to both sides of this group of lands 2 by a dispenser D or the like. As this adhesive, an ultraviolet curable resin, a thermosetting resin or the like is preferably used.

Reference numeral 10 denotes a main body of a vertical electronic component such as a DRAM, and leads 11 are extended from one side (bottom side) B of the thin plate-shaped main body 10. The tip of this lead 11 is
It is bent like a key and is formed so as to be easily connected to the land 2. Reference numeral 12 is an adhesive joint portion provided on both sides of the lead 11 group. In this embodiment, the main body 10 is expanded in the width direction from the lead 11 group, and the bonding margin portion 12 is formed so as to protrude downward from the bottom side B so as to be shorter than the tip portion of the lead 11. This adhesive margin part 1
2 can be easily formed at the same time as the main body 10 is formed by sealing the electronic circuit of the vertical electronic component with the mold body. Note that the adhesive margin portion 12 does not have to be projected from the bottom side B as described above, and the main body 10 is expanded in the width direction so as to be flush with the bottom side B, and the adhesive margin portion 12 is formed. Good. In short, with the lead 11 placed on the solder S (see FIG. 3) applied on the land 2,
It suffices that the adhesive margin portion 12 be in contact with the adhesive 3 applied to the substrate 1. In FIG. 3, H is a transfer head of the electronic component mounting apparatus (not shown), and N is a nozzle provided on the head H and sucking the main body 10.

This means is constructed as described above, and the mounting process on the substrate 1 will be described below. First, after applying the solder S to the land 2 formed on the substrate 1, the adhesive 3 is applied to both sides of the land 2 group. Next, the nozzle N of the transfer head H
After the upper surface of the main body 10 is adsorbed onto the main body 10 and the land 2 and the lead 11 are aligned with each other, the lead 11 is placed on the solder S on the land 2 and the adhesive margin portion 12 is brought into contact with the adhesive 3. In this state, when the adhesive 3 is an ultraviolet curable resin, ultraviolet rays are irradiated, and when it is a thermosetting resin, heat treatment is performed to cure the adhesive 3. By doing so, the main body 10 is temporarily fixed (fixed) to the substrate 1. Therefore, even if the hot air W (see also FIG. 4D) that carries the substrate 1 into the furnace of the reflow apparatus RF and flows to equalize the temperature distribution of the substrate hits the body 10, the body 10 may fall down. Absent. Therefore, the main body 10
It is possible to melt the solder S in the state of standing upright and then cool it to solidify the solder S, and complete the connection between the land 2 and the lead 11 while maintaining the standing upright state. In addition, the main body 10 and the bonding margin portion 12 are not connected
It is possible to easily perform a visual inspection of the quality of soldering without hiding the joint portion of No. 1.

[0015]

According to the present invention, the lead group is extended from one side of the main body and the adhesive margin portions are provided on both sides of the lead group to form the vertical electronic component. The adhesive margin part is adhered with an adhesive, the main body is stably supported on the substrate, and the main body can be prevented from tipping over even if an external force such as wind force is applied to the main body during the lead soldering process. As a result, defective soldering can be avoided.
Further, such support does not require special processing of the substrate, and mounting can be performed on both front and back surfaces of the substrate to improve mounting efficiency.

[Brief description of drawings]

FIG. 1 is a perspective view of a vertical electronic component of the present invention.

FIG. 2 is a perspective view of the same.

FIG. 3 is a vertical sectional view of the same.

FIG. 4 is an explanatory view of conventional means.

[Explanation of symbols]

 10 Main Body B One Side of Main Body 11 Lead 12 Adhesive Area

Claims (1)

[Claims] 1. A vertical electronic component, wherein a lead group is extended from one side of a main body, and adhesive margin portions are provided on both sides of the lead group.