JPH05198930A - Bonding apparatus - Google Patents

Abstract

PURPOSE:To remove a wire bonded to a pad by diffusion or soldering by, after moving down a bonding tip, rotating it through an angle of 90 degrees as required. CONSTITUTION:In case of the removal of a wire 3 bonded to a pad 2 by diffusion, a bonding tip 4 is positioned directly above the pad 2 and moved down, the end thereof pressing the wire 3. At the same time, oscillation is applied by an ultrasonic horn, and the bonding tip 4 is rotated by motor drive. In case of the removal of a wire 3 bonded to a pad 2 using solder 18, a bonding tip 6 is positioned directly above the pad 2 and moved down, the end thereof pressing the wire 3. At the same time, power is supplied by a power supply device 16, and the bonding tip 6 is rotated by the drive of a head rotating motor.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding apparatus having a bonding tip for bonding a wire to a predetermined pad by vibration and heating or heating.

In a printed circuit board used in electronic equipment, in addition to pattern wiring, discrete wiring using a wiring material is used for connection. Such discrete wiring is connected to a predetermined pad by diffusion bonding or solder bonding with a bonding device.

On the other hand, in the connection by the discrete wiring, the connection destination may be changed due to a design change or the like. Therefore, the connection with discrete wiring is
It is desired to be formed so that the connection can be easily changed if necessary.

[0004]

2. Description of the Related Art Conventionally, the structure is as shown in a conventional explanatory view (No. 1) of FIG. 6 and a conventional explanatory view (No. 2) of FIG. 6 (a) is a configuration diagram, (b) (c1) (c2) is an enlarged view of the tip of the bonding chip, FIG. 7 (a) is a configuration diagram, (b)
FIG. 4 is an enlarged view of a tip portion of a bonding chip.

As shown in FIG. 6 (a), a bonding chip 4 is fixed to the other end of an ultrasonic horn 15 whose one end is swingably held by a holding member 14 and which is sent out by an ultrasonic oscillator 13. Bonding tip 4 by ultrasonic
It is formed so that the vibration S is performed so that the vibration occurs via the ultrasonic horn 15.

Further, the printed circuit board 1 on which the pad 2 is arranged is placed on the table 10 so that the holding member 14 is moved up and down by the elevating mechanism 11 as indicated by the arrow Z, and is transferred by the table 10 in the XY directions. Is formed.

Such a bonding chip 4 is shown in FIG.
As shown in (b), a curved concave part 5 is formed at the tip, and it presses against the pad 2 so as to sandwich the wire 3 to be connected, and by the vibration of the bonding chip 4 and the irradiation of the laser beam L, etc. It was performed that the above-mentioned part is heated and the part shown in the D part is diffusion bonded.

Therefore, when performing such diffusion bonding, first, when the bonding chip 4 is raised,
The pad 2 to which the wire 3 is to be connected by the transfer of the table 10 is located directly below the bonding chip 4, and the wire 3 is positioned on the pad 2 to bond the bonding chip 4.
By lowering 4, the wire 5 is pressed against the pad 2 by the recess 5, and then the bonding tip 4 is vibrated by the vibration of the ultrasonic horn 15 and, at the same time, the laser beam L is irradiated so that the predetermined temperature T Heating is performed.

Further, in the case of FIG. 7A, a holding member held by the lifting mechanism 12 so as to move up and down in the direction of arrow Z.
Bonding tip 6 is fixed to 17
The power supply device 16 is configured to be supplied with a power supply V 6 having a predetermined current value.

A printed circuit board on which the pad 2 is arranged
1 is placed on table 10 and table 10 causes arrow XY
It is formed so as to be transferred in the direction. As shown in FIG. 7 (b), such a bonding chip 6 has a curved concave portion 7 formed at its tip end, presses the pad 2 so as to sandwich the wire 3 to be connected, and supplies the power V. A current flows from one side of the bonding chip 4 divided by the insulating layer 6A formed on the bonding chip 4 to the other as indicated by the arrow A, so that the tip of the bonding chip 4 is heated to a predetermined temperature and the solder 18 melts. By wire
Bonding of 3 to pad 2 was done.

Therefore, when performing such solder joining, first, when the bonding chip 6 is raised,
The pad 2 to which the wire 3 is to be connected by the transfer of the table 10 is positioned directly below the bonding chip 6, and the wire 3 is positioned on the pad 2 to form the bonding chip.
This is done by lowering 6 to press the wire 3 against the pad 2 by the recess 7 and then melting the solder 18 by supplying the power source V 1.

[0012]

However, when it is necessary to change the connection of the wire 3 joined by the diffusion joining and the solder joining as described above, in any case, as shown in (c1) of FIG. Then, the wire 3 is cut by the cutter 20, and the tip of the new wire 3-1 is overlapped with the tip 3A of the cut wire 3 as shown in (c2) of FIG. And soldering will be performed.

When the tips of the new wire 3-1 are overlapped and the diffusion bonding and the solder bonding are performed, there is a problem that the new wire 3-1 cannot be reliably bonded.

In this case, two wires are previously attached to the pad 2.
Although it is possible to form it so that the joining of 3 can be performed,
Therefore, the outer shape of the pad 2 becomes large, and the mounting efficiency on the printed board 1 becomes poor, which is not preferable.

Therefore, it is an object of the present invention to make it possible to easily remove a wire which is diffusion-bonded and solder-bonded to a predetermined pad.

[0016]

FIG. 1 is a diagram for explaining the principle of the first invention, and FIG. 2 is a diagram for explaining the principle of the second invention.
As shown in FIG. 1, pads arranged on the printed circuit board 1
Bonding tip 4 where ultrasonic vibration S and heating at a predetermined temperature T are performed so that wire 3 is diffusion bonded to 2
Is equipped with the bonding chip 4 and the wire is moved up and down.
When the wire 3 is pressed by the recess 5 at the tip formed so as to sandwich 3, the bonding chip 4 is rotated in the predetermined directions F1 and F2 with the center C1 of the bonding chip 4 as the rotation axis, if necessary. As shown in FIG. 2, the wires are attached to the pads 2 provided on the printed circuit board 1.
A soldering chip 6 is provided with a bonding chip 6 which is heated to a predetermined temperature by supplying a predetermined power source V, and the bonding chip 6 is moved up and down to form a concave portion 7 at a tip portion formed so as to sandwich the wire 3. When the wire 3 is pressed by the center of the bonding tip 6,
The bonding tip 6 moves in a predetermined direction F with C2 as the rotation axis.
Further, the bonding chips 4 and 6 are configured to be rotated by 1, F2, and the rotation angle for rotating the bonding chips 4 and 6 is formed within a range of approximately 90 °.

The above-mentioned problems can be solved by such a configuration.

[0018]

In other words, the bonding chip 4 for diffusion bonding and the bonding chip 6 for solder bonding are rotated about their own centers C1 and C2 as rotation axes.

Therefore, when it is desired to remove the wire 3 once diffusion-bonded or solder-bonded, the tip ends of the bonding chips 4 and 6 are lowered so as to abut the pad 2 as in the case of performing diffusion-bonding and solder-bonding. When the wire 3 is rotated, the wire 3 can be easily removed by rotating it.

Further, such rotation has a rotation angle of approximately
90 ° is enough to remove the wire 3 from the pad 2, and then reattach the wire 3 to the removed position.
Can be joined.

Therefore, as compared with the conventional joining by superposition, reliable joining can be performed and reliability can be improved.

[0022]

The present invention will be described in detail below with reference to FIGS. 3 is a configuration diagram of an embodiment according to the first invention, FIG. 4 is an explanatory diagram of an embodiment according to the second invention, (a) is a configuration diagram, (b) is a perspective view of a rotating mechanism, FIG. 5 is a rotation explanatory view of the bonding tip of the present invention. Throughout the drawings, the same reference numerals denote the same objects.

As shown in FIG. 3, a pulley 8A-2 of a rotor 8A having a shaft 8A-1 rotatably held by a bearing 8B, and a pulley 8A rotated by a motor 8E driven by a controller 8F. The rotation mechanism 8 is formed by stretching the belt 8C between the arm 8A and the arm 8A of the rotor 8A.
-3 is fixed to the elevating mechanism 11 so that the bonding chip 4 is rotated in the direction of arrow F1 or F2 by the rotation of the rotating body 8A.

Further, the center C of the shaft portion 8A-1 and the center C1 of the bonding tip 4 are formed so as to coincide with each other,
The elevating mechanism 11 is configured to drive the motor 11A under the control of the control unit 11B to elevate and lower the ultrasonic horn 15, the ultrasonic oscillator 13, and the bonding chip 4 as a whole through the holding member 14 in the vertical arrow Z direction. Has been done.

Therefore, a wire diffusion-bonded to the pad 2
If you want to remove 3, remove the bonding tip 4 by raising the bonding tip 4, positioning the bonding tip 4 so that it is directly above the prescribed pad 2 by moving the table 10 in the XY direction, and lowering the bonding tip 4. The wire 3 is pressed by the tip of 4 and vibration S by the ultrasonic horn 15 is performed at the same time,
This can be done by rotating the bonding chip 4 by driving 8E.

Therefore, according to this structure, both the wire 3 and the pad 2 can be diffusion-bonded and the diffusion-bonded wire 3 can be removed.
Further, in the case of FIG. 4A, the rotating mechanism 9 is provided by being connected to the lifting mechanism 12, and the rotating mechanism 9 is bonded to the bonding chip.
6 is mounted, and the bonding chip 6 is formed so as to be rotated in the arrow F1 or F2 direction by the rotating mechanism 9.

This rotating mechanism 9 drives a gear 9B by a head rotating motor 9A, as shown in FIG.
By driving the gear 9B, the gear 9C fixed to one end of the shaft 9E is rotated, and the shaft 9E is rotatably locked by interposing a bearing 9D in the lifting member 12C of the lifting mechanism 12.
Is rotated about the center C2 as the axis of rotation, and a spring 9F is provided in the hollow part of the shaft 9E.
It is formed so as to press the bonding chip 6 attached to the other end of 9E.

Further, the elevating mechanism 12 is formed so that the ball screw 12B is rotated by the vertical drive motor 12 so that the elevating member 12C is moved up and down in the vertical arrow Z direction by the guide of the guide rail 12D.

Therefore, when it is desired to remove the wire 3 soldered to the pad 2 by the solder 18, the bonding chip 6 is raised so that the bonding chip 6 is positioned directly above the predetermined pad 2. XY
Positioning and bonding chip 6 by directional transfer
This can be done by pressing the wire 3 by the tip of the bonding chip 6 due to the drop of the power source, simultaneously supplying the power V from the power supply device 16, and rotating the bonding chip 6 by driving the head rotation motor 9A.

Therefore, with this structure, both the solder bonding of the wire 3 to the pad 2 and the removal of the solder bonded wire 3 can be performed as described above.

In either of the diffusion bonding and the solder bonding, as shown in FIG. 5, by rotating the respective centers C1 and C2 of the bonding chips 4 and 6 in the range of 90 ° about the rotation axis, the wire Since 3 can be removed from pad 2, the rotation angle in rotation mechanisms 8 and 9 is 90
It is sufficient to consider so that it becomes °.

[0032]

As described above, according to the present invention,
When the bonding tip is lowered, if necessary, the bonding tip can be rotated by 90 ° to easily remove the diffusion-bonded or solder-bonded wire from the pad.

Therefore, unlike the prior art, the wire joining by superposition is not necessary, the wire joining is ensured, the reliability is improved, and both the wire diffusion joining or the solder joining and the removal thereof are performed. Since it can be performed by using the same device, work efficiency can be improved and the practical effect is great.

[Brief description of drawings]

FIG. 1 is an explanatory view of the principle of the first invention.

FIG. 2 is an explanatory view of the principle of the second invention.

FIG. 3 is a configuration diagram of an embodiment according to the first invention.

FIG. 4 is an explanatory diagram of an embodiment according to the second invention.

FIG. 5 is a rotation explanatory view of the bonding tip of the present invention.

FIG. 6 is a conventional explanatory view (No. 1)

FIG. 7 is an explanatory view of the related art (No. 2)

[Explanation of symbols]

1 Printed circuit board 2 Pad 3 Wire 4,6 Bonding chip 5,7 Recess

Claims (3)

[Claims] 1. A pad arranged on a printed circuit board (1)
Excitation with ultrasonic waves so that the wire (3) is diffusion-bonded to (2).
(S) and a bonding tip (4) that is heated to a predetermined temperature (T) are provided, and the bonding tip (4) is moved up and down in the vertical direction (Z) to sandwich the wire (3). When the wire (3) is pressed by the concave part (5) of the part,
If necessary, the center (C1) of the bonding tip (4) is used as a rotation axis so that the bonding tip (4) moves in a predetermined direction (F1,
Bonding device characterized by being rotated by F2). 2. A pad arranged on a printed circuit board (1)
(2) is equipped with a bonding chip (6) which is heated to a predetermined temperature by supplying a predetermined power (V) to solder-bond the wire (3), and the bonding chip (6) is arranged in the vertical direction.
(Z), when the wire (3) is pressed by the recess (7) at the tip formed so as to sandwich the wire (3), the center of the bonding tip (6) ( The bonding chip (6) is rotated in the predetermined direction (F1, F
2) A bonding device characterized by being rotated to. 3. A bonding apparatus, wherein a rotation angle for rotating the bonding tip (4, 6) according to claim 1 or 2 is formed in a range of about 90 °.