JPH051961A - Atomospheric pressure sensor - Google Patents

Abstract

PURPOSE:To provide a small atmospheric pressure-sensor easy to adjust and having excellent reliability and good temperature characteristic. CONSTITUTION:A pressure-sensitive element for detecting the atmospheric pressure, an amplifier IC 12 having a pressure-sensitive element installation area for installing the pressure-sensitive element 13 on the surface major section and arranged with input/output electrodes on the surface periphery section, and a hybrid IC board 11 having an amplifying element installation area for installing the amplifier IC 12 on part of the surface are provided. The back face of the amplifier IC 12 is fixed to the amplifying element installation area of the hybrid IC board 11, and the input/output electrodes of the amplifier IC 12 and the wiring pattern on the surface of the hybrid IC board 11 are connected with bonding wires 14. The back face of the pressure-sensitive element 13 is fixed to the pressure-sensitive element installation area of the amplifier IC 12, and the operating electrode on the surface of the pressure-sensitive element 13 and the input/output electrodes of the amplifier IC 12 are connected with the bonding wires 14.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a barometric pressure sensor, and more particularly to an absolute pressure type barometric pressure sensor configured to measure atmospheric pressure and the like by utilizing the piezoresistive effect of a resistor region formed of a semiconductor. Related to.

[0002]

2. Description of the Related Art Generally, in the case of obtaining an absolute pressure type atmospheric pressure sensor for measuring atmospheric pressure by a pressure sensitive element having a semiconductor body having a resistive region and a film-like diaphragm including the resistive region, it is easy to configure the absolute pressure type atmospheric pressure sensor. Performance and convenience during actual use, an amplification element that amplifies the output of the pressure-sensitive element, a trimming resistor for sensitivity adjustment, etc. are mounted together with the pressure-sensitive element on a single circuit board, making the whole hybrid. IC
As a form of (hybrid integrated circuit), a method for achieving its integration is adopted.

FIGS. 4A and 4B show a hybrid I
It is a figure which shows the internal structure of the conventional atmospheric pressure sensor which takes the form of C by the top surface form and the side surface form. As shown in the figure, first, on the surface of a hybrid IC substrate 1 having a size of about 10 × 25 mm, which constitutes a circuit board, a pressure-sensitive element 2 having a size of about 2 × 3 mm for detecting atmospheric pressure and an amplifying element are provided. An amplifier IC 3 having a size of about 5 mm square and a plurality of thick film printed resistors 4 as trimming resistors are installed. A predetermined wiring pattern (not shown) is selectively arranged on the surface of the hybrid IC substrate 1, and this wiring pattern and an actuation electrode (described later) arranged on the surface of the pressure sensitive element 2 are provided. And the input / output electrodes (not shown) arranged on the surface of the amplifier IC 3 are connected by a plurality of bonding wires 5, respectively, and the edge of the hybrid IC substrate 1 is connected to each other. , A plurality of input / output pins (including dummy) 6 are arranged while making electrical connection with the wiring pattern in that region.

Here, the specific installation state of the pressure sensitive element 2 on the hybrid IC substrate 1 is as follows. FIG. 5 is a view showing a state in which the pressure sensitive element 2 is installed on the hybrid IC substrate 1 shown in FIG.

As shown in the figure, the pressure sensitive element 2 used here has a thickness of about 0.3 to 0.5 mm, and the above-mentioned working electrode 7 is provided on the peripheral portion of the surface thereof. Further, a diaphragm (not shown) including a resistor region (not shown) having a thickness of about 5 to several tens of μm is formed in the central portion of the surface. In addition, on the back surface of the pressure-sensitive element 2 formed in this way, 0.5 to several mm
A pedestal 8 having a certain thickness is joined, and the pedestal 8 gives strength necessary for always maintaining the entire pressure-sensitive element 2 in a stable state, and at the bottom of the membrane diaphragm. The internal pressure of the located air chamber (not shown) is kept constant. The pressure-sensitive element 1 to which the pedestal 8 is joined is fixed to a predetermined area on the front surface of the hybrid IC substrate 1 with an adhesive 9 on the back surface of the pedestal 8, and will be described below. As described above, the working electrode 7 of the pressure sensitive element 2 and the wiring pattern of the hybrid IC substrate 1 in this state are connected by the bonding wires 5, respectively.

[0006]

By the way, as shown in FIG. 4, in the above-described conventional atmospheric pressure sensor, the pressure sensitive element 2 and the amplifier I are arranged on the surface of the hybrid IC substrate 1.
Since the necessary circuit elements such as C3 and the thick film printed resistor 4 are mounted side by side, the size in the lateral direction naturally becomes large. Further, adjustment of the sensitivity, offset, etc. of the pressure sensitive element 2 by the thick film printed resistor 4 inevitably mounts all circuit elements on the hybrid IC substrate 1,
Further, it is very troublesome since it needs to be performed after all the connections by the bonding wires are completed.

On the other hand, as shown in FIG.
The hybrid IC substrate 1 with the pedestal 8 on its back surface
Since it is installed on the surface of the pressure sensitive element 2, there is a significant difference in height between the surface of the pressure sensitive element 2 and the surface of the hybrid IC substrate 1.
In some cases, it may be difficult to connect the wiring pattern to the wiring pattern on the hybrid IC substrate 1 with a bonding wire, and the reliability may not be sufficiently secured. Further, the coefficient of thermal expansion of the hybrid IC substrate 1 is significantly different from that of the pressure sensitive element 2, so that the difference in the coefficient of thermal expansion causes the hybrid IC substrate 1 to expand or contract in accordance with fluctuations in ambient temperature. The strain when contracted is transmitted to the pressure sensitive element 2 via the adhesive 9 and the pedestal 8, and the diaphragm of the pressure sensitive element 2 reacts to the transmitted strain and an appropriate atmospheric pressure cannot be detected. .

The present invention has been made in view of these various circumstances, and a first object thereof is to provide a barometric pressure sensor which is small in size and easy to adjust, and a second object thereof. An object is to provide a barometric pressure sensor having excellent reliability and excellent temperature characteristics.

[0009]

Means for solving the problems Means of the present invention are as follows. First, the invention according to claim 1 has a pressure-sensitive element for pressure detection and a pressure-sensitive element installation region for installing the pressure-sensitive element in the main surface portion, and the input / output electrodes are arranged in the peripheral portion of the surface. And a circuit board having an amplification element installation area for installing the amplification element on a part of the front surface thereof. The pressure-sensitive element is installed on the back surface of the pressure-sensitive element in the amplification element installation area. And connecting the working electrode arranged on the surface of the pressure sensitive element and the input / output electrode of the amplifying element with a bonding wire, and fixing the amplifying element with its back surface to the amplifying element installation region on the circuit board, It is characterized in that the input / output electrodes of the amplification element and the wiring pattern arranged on the surface of the circuit board are connected by bonding wires.

According to a second aspect of the present invention, a pressure-sensitive element for detecting atmospheric pressure and a pressure-sensitive element installation region for installing the pressure-sensitive element are provided on the main surface portion, and the input / output electrodes are provided on the main surface portion and the surface. It has an amplifying element arranged on the periphery and a circuit board having an amplifying element installation region for installing the amplifying element on a part of the surface, and the pressure sensitive element is placed on the lower surface. Place it in the pressure sensitive element installation area of the amplification element while
The actuating electrodes arranged on the surface of the pressure sensitive element and the input / output electrodes on the main surface of the amplifying element are joined by bumps, and the amplifying element is fixed to the amplifying element installation area on the circuit board with the back surface of the amplifying element. And a wiring pattern arranged on the surface of the circuit board is connected by a bonding wire.

The invention according to claim 3 is the same as claim 1
Alternatively, a trimming resistor is further installed on the peripheral portion of the surface of the amplifying element described in 2. Furthermore, the invention according to claim 4 is a pressure-sensitive element for detecting atmospheric pressure,
An intermediate substrate of a predetermined material, which has a pressure sensitive element installation region for installing a pressure sensitive element on the main surface portion and continuously disposes land electrodes between the main surface portion and the peripheral edge portion of the surface, and an intermediate substrate. A circuit board having an intermediate board installation area for setting a board on a part of its surface, and mounting the pressure sensitive element on the pressure sensitive element installation area of the intermediate board with its surface facing down. Then, the working electrode arranged on the surface of the pressure-sensitive element and the land electrode on the main surface of the intermediate substrate are joined by bumps, and the intermediate substrate is fixed to the intermediate substrate installation area of the circuit substrate with the back surface of the intermediate substrate. It is characterized in that the land electrode on the peripheral portion of the surface of the substrate and the wiring pattern arranged on the surface of the circuit board are connected by bonding wires.

Further, the invention according to claim 5 is characterized in that the coefficient of thermal expansion of the material forming the intermediate substrate according to claim 4 is equal to the coefficient of thermal expansion of the material forming the pressure sensitive element. is there.

[0013]

The function of the present invention is as follows. First, in the invention according to claim 1, an amplifying element having a pressure sensitive element installation region for installing a pressure sensitive element in a main surface portion and input / output electrodes arranged in a peripheral edge portion of the surface is prepared. After fixing the pressure element to the pressure sensitive element installation region of the amplification element with its back surface, the working electrode and the input / output electrode of the amplification element are connected with a bonding wire, and the amplification element Is fixed to the amplification element installation area of the circuit board with its back surface, and then the input / output electrodes of the amplification element and the wiring pattern arranged on the front surface of the circuit board are connected by bonding wires, thereby making Since it is not necessary to directly install the pressure sensitive element on the section, the size in the lateral direction is reduced.

Further, in the invention of claim 2, the pressure sensitive element installation region for installing the pressure sensitive element is provided in the main surface portion, and the input / output electrodes are arranged in the main surface portion and the peripheral portion of the surface. In the main part of the surface of the amplifying element and the working electrode arranged on the surface of the pressure sensitive element Wiring arranged on the front surface of the circuit board after connecting the input / output electrodes with bumps and fixing the amplifier element to the amplifier element installation area on the circuit board with its back surface By connecting the pattern to the bonding wire with a bonding wire, it is not necessary to directly install the pressure sensitive element on a part of the surface of the circuit board, and the size in the horizontal direction is reduced, and at the same time, the vertical direction. Size against is also reduced.

According to the invention of claim 3,
By further installing the trimming resistor on the peripheral portion of the surface of the amplifying element according to claim 1 or 2, it is not necessary to install the trimming resistor on a part of the surface of the circuit board, and the size in the lateral direction is further reduced. At the same time, the sensitivity and offset of the pressure sensitive element can be adjusted by the trimming resistor before the amplification element is installed on a part of the surface of the circuit board.

Further, in the invention according to claim 4,
An intermediate substrate of a predetermined material is prepared, which has a pressure sensitive element installation area for installing a pressure sensitive element on the main surface portion and continuously disposes land electrodes between the main surface portion and the peripheral edge portion of the surface. , The bump is used to place the pressure sensitive element on the surface of the intermediate substrate after placing the pressure sensitive element on the pressure sensitive element installation region of the intermediate substrate and the land electrode on the main part of the surface of the intermediate substrate. After bonding and fixing the intermediate substrate with the back surface thereof to the intermediate substrate installation area of the circuit substrate, the land electrode on the peripheral portion of the surface of the intermediate substrate and the wiring pattern arranged on the surface of the circuit substrate are connected by a bonding wire. By doing so, it is not necessary to directly connect the working electrode on the surface of the pressure sensitive element and the wiring pattern on the circuit board with a bonding wire.

Further, in the invention according to claim 5, since the coefficient of thermal expansion of the material forming the intermediate substrate according to claim 4 is equal to the coefficient of thermal expansion of the material forming the pressure-sensitive element,
Even if the ambient temperature fluctuates, the pressure-sensitive element and the intermediate board expand or contract at the same rate, and the strain caused by the expansion or contraction of the circuit board when the ambient temperature fluctuates can affect the pressure-sensitive element. Will be suppressed.

[0018]

Embodiments of the present invention will now be described in detail with reference to the drawings. In addition, in this embodiment, the first embodiment corresponding to claim 1 or 3, the second embodiment corresponding to claim 2 or 3, and the third embodiment corresponding to claim 4 or 5. Examples and will be explained in order.

First, FIGS. 1A and 1B are views showing the internal structure of a barometric pressure sensor according to a first embodiment of the present invention in terms of its top face shape and side face shape. As shown in the figure, a predetermined area (amplification element installation area) for installing the amplifier IC 12 as an amplification element is secured in a part of the surface of the hybrid IC board 11 as a circuit board. An amplifier IC 12 in a bare chip state of about 5 mm square formed from a silicon wafer is fixed to a predetermined area on its back surface via an adhesive (not shown) made of a material such as synthetic resin. ing. However, the amplifier IC 12 used here has a predetermined area (pressure-sensitive element installation area) for installing the pressure-sensitive element 13 in the main part of the surface thereof, and is located at the peripheral portion of the surface. An output electrode (not shown) is arranged. Also,
A predetermined wiring pattern (not shown) is selectively arranged on the surface of the hybrid IC substrate 11, and this wiring pattern and the input / output electrodes on the surface of the amplifier IC 12 are electrically connected to each other. For the purpose of illustration, they are connected by bonding wires 14 made of a material such as gold or aluminum. Furthermore, the hybrid IC substrate 1
A plurality of input / output pins 15 are arranged at the edge portion of 1 for electrical connection with the wiring pattern in the area. The hybrid IC board 11 is the amplifier IC1.
Any material may be used as long as it has an insulating property so that 2 can be surely installed with an adhesive.

Then, in a predetermined area for installing the pressure sensitive element 13 in the main part of the surface of the amplifier IC 12,
2 x 3m for pressure detection made from silicon wafer
A pressure-sensitive element 13 having a size of about m is fixed to the back surface of the pressure-sensitive element 13 with an adhesive (not shown) made of a material such as insulating synthetic resin. However, this pressure-sensitive element 13 has a structure exactly the same as the conventional one, and an operating electrode (not shown) arranged on a part of its surface and an input / output electrode on the surface of the amplifier IC 12 are both In order to establish an electrical connection between
The wires are connected by bonding wires 14 made of a material such as gold or aluminum.

Here, this atmospheric pressure sensor is an amplifier IC1.
A trimming resistor (not shown) made of a thin film or a thick film is further installed on the peripheral portion of the surface of 2. The amplifier IC 12 is used to adjust the sensitivity and offset of the pressure sensitive element 13 by the trimming resistor. Hybrid IC board 1
It is possible to do this before the actual installation on part of the surface of 1. That is, since the sensitivity, the offset, and the like can be adjusted when the amplifier IC 12 and the pressure-sensitive element 13 are electrically connected to each other, when the pressure sensor is constructed, the adjustment is not yet made. After the pressure sensitive element 13 is individually installed to the amplifier IC 12 in the wafer state, the amplifier IC 12 and the pressure sensitive element 13 are respectively connected by the bonding wires 14, and in this state, the pressure sensitive element 13 is adjusted by the trimming resistor. After performing the process, the wafer-state amplifier IC 12 is divided by dicing, and finally,
The divided amplifier IC 12 after the pressure sensitive element 13 has been installed and adjusted may be installed on a part of the surface of the hybrid IC substrate 11.

As described above, according to the structure of the atmospheric pressure sensor according to the first embodiment, it is not necessary to directly install the pressure sensitive element 13 on a part of the surface of the hybrid IC substrate 11, and the surface of the hybrid IC substrate 11 is removed. Since it is not necessary to install a trimming resistor in a part of the hybrid IC substrate 11, for example, the size of the hybrid IC substrate 11 in the lateral direction is
It is possible to reduce the size to about 15 mm and to reduce the overall size. Further, since the sensitivity, offset, etc. of the pressure sensitive element 13 can be adjusted by the trimming resistor before the amplifier IC 12 is installed on a part of the surface of the hybrid IC substrate 11, the adjustment form is extremely easy and It will be efficient.

Next, FIGS. 2 (a) and 2 (b) are views showing the internal structure of the atmospheric pressure sensor according to the second embodiment of the present invention in terms of its top and side forms. As shown in the figure, in a part of the surface of the hybrid IC substrate 21 as a circuit substrate, a predetermined area (amplification) for installing the amplifier IC 22 as an amplification element is provided as in the first embodiment. A device mounting area) is secured, and a bare chip-shaped amplifier IC 22 formed of a silicon wafer and having a size of about 5 mm square is bonded to the predetermined area on the back surface with a material such as synthetic resin. It is fixed via an agent (not shown). However, the amplifier IC used here
22 has a predetermined area (pressure-sensitive element installation area) for installing the pressure-sensitive element 23 on the main part of its surface, and the input / output electrodes ( (Not shown) are arranged. Further, a predetermined wiring pattern (not shown) is selectively arranged on the surface of the hybrid IC substrate 21, and the wiring pattern and the input / output electrodes on the surface of the amplifier IC 22 are
In order to establish an electrical connection between the two, they are respectively connected by a bonding wire 24 made of a material such as gold or aluminum. Further, at the edge of the hybrid IC substrate 21, a plurality of input / output pins 25 are arranged for electrical connection with the wiring pattern in that region.
The hybrid IC substrate 21 may be made of any material as long as it has an insulating property so that the amplifier IC 22 can be surely installed with an adhesive.

Then, in a predetermined area for installing the pressure sensitive element 23 in the main part of the surface of the amplifier IC 22,
2 x 3m for pressure detection made from silicon wafer
A pressure-sensitive element 23 having a size of about m is placed with its surface facing down. The pressure-sensitive element 23 has a structure exactly the same as that of the first embodiment, and here, an operating electrode (not shown) and an amplifier arranged on a part of the surface thereof are provided. The input / output electrodes on the surface of the IC 22 are joined together by bumps 26 made of a material such as solder (flip chip bonding) in order to establish electrical connection between them.

Here, this atmospheric pressure sensor is also constructed by further installing a trimming resistor (not shown) made of a thin film or a thick film on the peripheral portion of the surface of the amplifier IC 22 as in the first embodiment. Therefore, it is possible to adjust the sensitivity and offset of the pressure sensitive element 23 by the trimming resistor before actually installing the amplifier IC 22 on a part of the surface of the hybrid IC substrate 21. That is, when constructing this atmospheric pressure sensor, first, the pressure sensitive element 23 is added to the amplifier IC 22 which is still in the wafer state.
, The amplifier IC 22 and the pressure-sensitive element 23 are bonded to each other by the bumps 26, and in this state, the pressure-sensitive element 23 is adjusted by the trimming resistance, and then the amplifier IC 22 in the wafer state is divided by dicing, Finally, the divided amplifier IC 22 after the pressure sensitive element 23 has been installed and adjusted may be installed on a part of the surface of the hybrid IC substrate 21.

As described above, according to the structure of the atmospheric pressure sensor of the second embodiment, in addition to the effect of the first embodiment, the connection by the bonding wire as in the first embodiment is necessary. Therefore, it is possible to reduce the size in the vertical direction and reduce the size of the entire device. Further, for the same reason, since the input / output electrodes at the peripheral portion of the surface of the amplifier IC 22 for bonding with the pressure sensitive element 23 are unnecessary, it is possible to reduce the size of the surface of the amplifier IC 22 slightly. As a result, the size of the hybrid IC substrate 21 in the lateral direction can be further reduced, and the overall size can be further reduced.

Next, FIG. 3 is a view showing the internal structure of a barometric pressure sensor according to a third embodiment of the present invention in a side view. As shown in the figure, a predetermined area (intermediate board installation area) for installing the intermediate board 32 is secured in a part of the surface of the hybrid IC board 31 as a circuit board. On the other hand, the intermediate substrate 32 having a thickness of about 0.5 mm is fixed to the back surface of the intermediate substrate 32 with an adhesive 33 made of a material such as synthetic resin. However, the intermediate substrate 32 used here has a predetermined area (pressure-sensitive element installation area) for installing the pressure-sensitive element 34 on the main part of its surface, and the main part on the surface is A land electrode (not shown) is continuously arranged between the peripheral portion and the peripheral portion. Further, a predetermined wiring pattern (not shown) is selectively arranged on the surface of the hybrid IC substrate 31, and the wiring pattern and the land electrode on the peripheral portion of the surface of the intermediate substrate 32 are provided between the two. In order to achieve electrical connection, they are respectively connected by bonding wires 35 made of a material such as gold or aluminum. Further, at the edge of the hybrid IC substrate 31, a plurality of input / output pins 36 are arranged for electrical connection with the wiring pattern in that region.

A predetermined area for installing the pressure sensitive element 34 on the main part of the surface of the intermediate substrate 32 has a 0.3 mm pressure detecting area formed from a silicon wafer.
A pressure-sensitive element 34 having a certain thickness is placed with its surface facing downward, and further, an operating electrode (not shown) arranged on a part of the surface of this pressure-sensitive element 34 and the intermediate substrate 32. The land electrode on the main part of the surface is the bump 3 made of a material such as solder in order to establish an electrical connection between them.
They are bonded together at 7 (flip chip bonding).

The material used for the intermediate substrate 32 is the same as the material of the pressure sensitive element 34, or the material of the pedestal 38 joined to the back surface of the pressure sensitive element 34. A predetermined glass having a coefficient of thermal expansion substantially equal to that of the pressure element 34 is suitable. That is, the thermal expansion coefficient of the intermediate substrate 32 is necessarily equal to that of the pressure sensitive element 34 by forming the intermediate substrate 32, and the intermediate substrate 32 is formed of glass used as the material of the pedestal 38. The coefficient of thermal expansion 34 is the pressure sensitive element 34.
The coefficient of thermal expansion is almost the same. Then, when the land electrode is formed on the surface of the intermediate substrate 32 made of silicon or glass, a metal such as aluminum may be selectively installed by using a thin film technique or a thick film technique. Electrical connection is made between the bump 37 bonded to the actuation electrode on the surface of the piezoelectric element 34 and the bonding wire 35 connected to the wiring pattern on the surface of the hybrid IC substrate 31. become.

As described above, according to the structure of the atmospheric pressure sensor of the third embodiment, the working electrode on the surface of the pressure sensitive element 34 and the land electrode on the main part of the surface of the intermediate substrate 32 are joined by the bumps 37, Further, since the land electrode on the peripheral portion of the surface of the intermediate electrode 32 having a small height difference and the wiring pattern on the surface of the hybrid IC substrate 31 are connected by the bonding wire 35, the reliability of the connection of the bonding wire 35 is improved. It will be fully secured. In addition, since the coefficient of thermal expansion of the material forming the intermediate substrate 32 is equal to the coefficient of thermal expansion of the material forming the pressure sensitive element 34, the intermediate substrate 32 and the pressure sensitive element 34 are equal even when the ambient temperature changes. The temperature characteristics are dramatically improved by expanding or contracting at a rate, and suppressing the influence of the strain caused by the expansion or contraction of the hybrid IC substrate 31 when the ambient temperature fluctuates on the pressure sensitive element as much as possible. become.

[0031]

As described above in detail, according to the first, second or third aspect of the present invention, it is possible to reduce the size of the circuit board in the lateral direction and to reduce the overall size. In addition, it is possible to reduce the size in the vertical direction a little and to downsize the whole.
The adjustment of the pressure sensitive element by the trimming resistor is also extremely easy and efficient.

Further, according to the invention of claim 4 or 5, the reliability regarding the connection of the bonding wire can be sufficiently ensured, and further, by the expansion or contraction of the circuit board when the ambient temperature changes. The influence of the generated strain on the pressure sensitive element is suppressed as much as possible, and the temperature characteristic thereof is dramatically improved.

[Brief description of drawings]

FIG. 1 is a diagram showing an internal structure of a barometric pressure sensor according to a first embodiment of the present invention by its top surface form and side surface form.

FIG. 2 is a diagram showing an internal structure of a barometric pressure sensor according to a second embodiment of the present invention in terms of its top surface form and side face form.

FIG. 3 is a diagram showing an internal structure of a barometric pressure sensor according to a third embodiment of the present invention in a side view thereof.

FIG. 4 is a diagram showing an internal structure of a conventional barometric pressure sensor in the form of a hybrid IC by its top surface form and side face form.

FIG. 5 is a view showing a state in which a pressure sensitive element is installed on the hybrid IC substrate shown in FIG. 4 in a side view thereof.

[Explanation of symbols]

11 Hybrid IC board 12 amplifier IC 13 Pressure-sensitive element 14 Bonding wire 21 Hybrid IC substrate 22 Amplifier IC 23 Pressure-sensitive element 24 Bonding wire 26 bumps 31 Hybrid IC substrate 32 Intermediate substrate 34 Pressure-sensitive element 35 Bonding wire 37 bumps

Claims (5)

[Claims] 1. A pressure-sensitive element for detecting atmospheric pressure, and an amplification element having a pressure-sensitive element installation region for installing the pressure-sensitive element in a main surface portion and input / output electrodes arranged in a peripheral edge portion of the surface. A circuit board having an amplification element installation area for installing the amplification element on a part of a front surface thereof, the pressure sensitive element having a back surface thereof in a pressure sensitive element installation area of the amplification element. While fixing, the working electrode arranged on the surface of the pressure sensitive element and the input / output electrode of the amplifying element are connected by a bonding wire, and the amplifying element is arranged on the rear surface of the amplifying element in the amplifying element installation region of the circuit board. An atmospheric pressure sensor, which is fixed and is formed by connecting an input / output electrode of the amplifying element and a wiring pattern arranged on the surface of the circuit board with a bonding wire. 2. A pressure-sensitive element for detecting atmospheric pressure and a pressure-sensitive element installation area for installing the pressure-sensitive element are provided on the main surface portion, and input / output electrodes are arranged on the main surface portion and the peripheral portion of the surface. And a circuit board having an amplification element installation region for installing the amplification element on a part of the surface thereof, and the amplification is performed with the pressure sensitive element facing down. The amplification element is mounted on the pressure sensitive element installation region of the element, and the working electrode arranged on the surface of the pressure sensitive element and the input / output electrode on the main surface portion of the amplification element are joined by bumps. The back surface is fixed to the amplification element installation region of the circuit board, and the input / output electrodes on the peripheral portion of the front surface of the amplification element and the wiring pattern arranged on the front surface of the circuit board are connected by bonding wires. Features and Barometric pressure sensor. 3. The barometric pressure sensor according to claim 1, further comprising a trimming resistor installed on a peripheral portion of a surface of the amplifying element. 4. A pressure-sensitive element for detecting atmospheric pressure, and a pressure-sensitive element installation region for installing the pressure-sensitive element in a main surface portion, and a land electrode is continuously provided between the main surface portion and the peripheral portion of the surface. And a circuit board having an intermediate substrate installation region for installing the intermediate substrate on a part of the surface thereof. While being mounted on the pressure sensitive element installation region of the intermediate substrate, the working electrode arranged on the surface of the pressure sensitive element and the land electrode on the main surface portion of the intermediate substrate are bonded by bumps, and the intermediate The substrate is fixed to the intermediate substrate installation region of the circuit substrate with the back surface thereof, and the land electrode in the peripheral portion of the surface of the intermediate substrate and the wiring pattern arranged on the surface of the circuit substrate are bonded.
An atmospheric pressure sensor characterized by being connected by a wire. 5. The barometric sensor according to claim 4, wherein the coefficient of thermal expansion of the material forming the intermediate substrate is equal to the coefficient of thermal expansion of the material forming the pressure sensitive element.