JPH05188247A - Method for packaging optical module - Google Patents

Abstract

PURPOSE:To provide the method for packaging an optical module to be used in an optical communication system. CONSTITUTION:A molded package 13 having a holder 12 communicating with a light emitting element or light receiving element is produced by molding the holder 12 integrally with a chip. The molded package 13 is automatically packaged on a substrate 14 and thereafter an adapter 16 provided at one end of an optical fiber pigtail 15 is inserted into the holder 12 and the optical fiber pigtail 15 is mounted by self-alignment into the light emitting element or light receiving element, by that, the optical module for optical communication is packaged.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of mounting an optical module used in an optical communication system.

[0002]

2. Description of the Related Art In manufacturing an optical module for optical communication, it is desirable to manufacture it by using an optical fiber pigtail without problems such as near-end reflection as compared with the case of using a connector or the like. It is said that.

However, the module with an optical fiber pigtail has a problem that it cannot be automatically mounted on a substrate because the pigtail cannot be removed.

In view of the above problems, it is an object of the present invention to provide a novel optical module mounting method.

[0005]

An optical module mounting method according to the present invention, which achieves the above object, comprises mounting a mold package, which is obtained by integrally molding a holder communicating with a light emitting element or a light receiving element, on a substrate. It is characterized in that an adapter provided at one end of an optical fiber pigtail is inserted into the holder of the mold package to perform centering attachment.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A preferred embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a schematic manufacturing process diagram of an assembling method of an optical module with a pigtail according to this embodiment. As shown in the figure, when a light emitting element or a light receiving element is molded together with a chip, a holder 12 communicating with the light emitting element or the light receiving element is provided on one end surface of the package body 11, and a mold package 13 with a holder is formed by applying high temperature. After the integrated manufacturing, the mold package 13 is automatically mounted on the surface of the substrate 14 using an automatic mounting machine or the like (see FIG. 1).

On the other hand, an adapter 16 such as a ferrule which can be inserted into the holder 12 is attached to one end of the optical fiber pigtail 15. Then, after the adapter 16 is attached to the holder 12 of the molded package 13 after the above-mentioned molding, alignment is performed while adjusting the coupling loss so as to obtain a desired power level using, for example, a power meter or the like, and then, for example, resin or the like is used. An optical module with a pigtail is assembled by fixing it (see FIG. 2).

As described above, according to this method, first, the mold package 13 having the holder 12 is manufactured, and after being automatically mounted on the substrate 14, the adapter 16 fitted to the holder 12 is manufactured.
Since the optical fiber pigtail 15 is attached by using, it is possible to automatically mount the optical module with an optical fiber pigtail, which was not removable in the past, on the substrate 14, and can be applied when manufacturing a substrate for mounting and using the optical module for optical communication. ,It is valid.

[0010]

As described above with reference to the embodiments, according to the method of assembling the optical module with a pigtail according to the present invention, the optical fiber pigtail is mounted after the mold package is mounted on the substrate. It is effective to apply it when manufacturing a board to be mounted and used.

[Brief description of drawings]

FIG. 1 is an assembly process diagram of an optical module with a pigtail according to the present embodiment.

FIG. 2 is an assembly process diagram of an optical module with a pigtail according to the present embodiment.

[Explanation of symbols]

 11 Package Main Body 12 Holder 13 Mold Package 14 Substrate 15 Optical Fiber Pigtail 16 Adapter

Claims (1)

[Claims] 1. After mounting a mold package formed by integrally molding a holder communicating with a light emitting element or a light receiving element on a substrate, an adapter provided at one end of an optical fiber pigtail is inserted into the holder of the mold package, An optical module mounting method, which is characterized by centering and mounting.