JPH05183015A - Film carrier - Google Patents

Abstract

PURPOSE:To avoid any insufficient strength and breakage of the wiring connection after connected, and at the same time, to provide a film carrier which is easily mountable. CONSTITUTION:A semiconductor element 2 is arranged on a flexible tape 1 by a patting part 3. At the same time, a connection window 4 is formed in an open state. On one side of the semiconductor element 2, an electric lead 5a and dummy inner lead 5b are formed. On one side of the tape 1, an outer lead 6a and dummy outer lead 65 are formed to stride over the connection window 4. Between the electric inner lead 5a and electric outer lead 6a, a wiring 7a is formed to electrically connect these electric inner lead 5a and electric outer lead 6a. The dummy inner leads 5b on both ends are connected to the electric inner lead 5a, dummy outer lead 6b, and electric outer lead 6a by the wiring 7b which is trapezoid having a width greater than that of the wiring 7a.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a film carrier which can be easily mounted without breaking the connecting portions of inner leads and outer leads.

[0002]

2. Description of the Related Art Conventionally, as shown in FIG. 3, a film carrier for mounting a semiconductor element is used to mount a semiconductor element in a thin area in a small area on a light, thin, short and small product such as a liquid crystal module. It is very effective and popular.

In the film carrier shown in FIG. 3, a semiconductor element 2 is arranged by a potting portion 3 on a flexible tape 1 punched from a film carrier tape with a die. Also, in the vicinity of one side edge of the tape 1,
The connection window 4 is formed with an opening.

A plurality of inner leads 5 are formed on one side of the semiconductor element 2, and a connection window 4 is formed on one side of the tape 1.
A plurality of outer leads 6 for input having a width of about several hundreds of μm are formed so as to straddle the inner leads 5 and the outer leads 6 and a thickness for electrically connecting the inner leads 5 and the outer leads 6 to each other. The wiring 7 is formed by etching a copper foil having a width of 35 μm and a width of several 10 μm.

Further, a plurality of output outer leads 8 are formed on the other side of the tape 1.

Further, the mounting of the printed circuit board 9 using the outer leads 8 of the film carrier shown in FIG. 2 is performed by soldering by anisotropic conductive material or thermocompression bonding, which is a special mounting method.

As shown in FIG. 4, it is also possible to use the flexibility of the tape 1 and bend the tape 1 for connection with another circuit.

[0008]

As described above, in the conventional film carrier shown in FIG. 2, when the outer leads 6 and the wirings 7 have a fine pitch, the cross-sectional area is very small and the mechanical strength is low. Since it cannot be obtained sufficiently, it is difficult to obtain high connection reliability when the tape 1 itself is bent and used as shown in FIG.

Further, when manually reflowing, the tape 1
The work is very difficult because of the warp of the wire, and the wiring 7 of the conductor circuit is broken during the work.

Further, as shown in FIG. 5, when the input side outer lead 6 is automatically reflowed by the mounting device, the input side outer lead 6 is pulled by the metal tool 10 for soldering in the direction of arrow f, The stress concentrates on the connection portion between the outer lead 6 on the side and the wiring 7 of the conductor circuit, and fracture occurs during reflow.

That is, as shown in FIG. 3, there is a problem that the strength after connection and the breakage of the connection portion of the wiring occur and the mounting work becomes difficult.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a film carrier which prevents insufficient strength after connection and breakage of a connection portion of wiring and facilitates mounting work. ..

[0013]

According to a first aspect of the present invention, there is provided a film carrier for use in a tape carrier mounting method, wherein the electric inner lead having an electric function is formed on the tape, and is formed on the tape. Formed on the tape; an outer lead for electricity electrically connected to the inner lead for electricity; wiring for connecting between the inner lead for electricity and the outer lead for electricity formed on the tape; A dummy inner lead having no electrical function and a dummy outer lead having no electrical function formed on the tape, the dummy inner lead being adjacent to the dummy inner lead. Between the electrical inner lead, the dummy outer lead, and the electrical outer lead that match. Bonded via serial lines, the wiring is at least one or more of, from the wiring connecting only the other of the electrical inner leads and the electrical for outer lead is obtained by widening the line width.

According to a second aspect of the present invention, in the film carrier according to the first aspect, the wiring between the dummy inner lead and the dummy outer lead is connected by the wiring between the electric inner lead and the electric outer lead. It is a thing.

[0015]

According to the film carrier of the present invention, the wiring of the dummy inner lead having no electric function, the electric inner lead having an electric function, the dummy outer lead and the dummy outer lead is provided. The wiring width between the dummy inner leads, the electrical inner leads, the dummy outer leads, and the dummy outer leads is made wider than the wiring width only between the electrical outer leads and the electrical inner leads, and at least 1 By providing more than this, it is possible to increase the joining force and improve the reliability, to prevent breakage of the connection portion of the outer lead for electric use and the wiring, and to improve the mounting workability.

According to a second aspect of the present invention, in the film carrier according to the first aspect, the wiring between the dummy inner lead and the dummy outer lead is connected by the wiring between the electric inner lead and the electric outer lead. It can be easily configured.

[0017]

An embodiment of the film carrier of the present invention will be described below with reference to the drawings.

The parts corresponding to those of the conventional example shown in FIGS. 3 to 5 will be described with the same reference numerals.

In the film carrier shown in FIG. 1, a semiconductor element 2 is arranged by a potting portion 3 on a flexible tape 1 punched from a film carrier tape with a die. A connection window 4 is formed near the one side edge of the tape 1.

A plurality of inner leads 5 are formed on one side of the semiconductor element 2. Among these inner leads 5, an intermediate portion is an electric inner lead 5a having an electric function, and these electric inner leads 5a. Both sides are dummy inner leads 5b having no electrical function. Further, a plurality of outer leads 6 for input having a width of several hundreds of μm are formed on one side of the tape 1 so as to straddle the connection window 4, and these outer leads 6 also serve as inner leads 5.
Similarly, the middle portion is an outer electrical lead 6a having an electrical function, and both ends of the electrical outer lead 6a are dummy outer leads 6b having no electrical function. Then, between the electric inner lead 5a and the electric outer lead 6a, a copper foil having a thickness of about 35 μm and a width of 10 μm for electrically connecting the electric inner lead 5a and the electric outer lead 6a is etched. The wiring 7a is formed.

Also, dummy inner leads 5b at both ends
Is connected to the dummy outer leads 6b at both ends and the adjacent electrical outer leads 6a together with the adjacent electric inner leads 5a by a trapezoidal wiring 7b wider than the wiring 7a.

Further, a plurality of output outer leads 8 are formed on the other side of the tape 1.

The mounting of the printed circuit board 9 using the outer leads 8 of the film carrier is performed by soldering by anisotropic conductive material or thermocompression bonding. And
The flexibility of the tape 1 can be used, and the tape 1 can be folded and used for connection with other circuits.

According to the above embodiment, when the film carrier is bent and used, stress concentration is applied to the connection portion of the outer lead 6a for electricity, the outer lead 6b for dummy, and the wirings 7a and 7b. By providing
The joining force can be increased to improve reliability, and furthermore, breakage of the connection portion of the outer lead 6a for electricity, the outer lead 6b for dummy, and the wirings 7a, 7b can be eliminated, and mounting workability can be improved.

Further, as shown in FIG. 2, one dummy inner lead 5b, two adjacent electric inner leads 5a, dummy outer leads 6b at both ends and adjacent electric outer leads 6a are wired 7a. Connection may be made with a wider trapezoidal wiring 7b, and the same effect can be obtained in this case as well.

[0026]

According to the film carrier of claim 1, a dummy inner lead having no electric function, an electric inner lead having an electric function, a dummy outer lead and a dummy outer are provided. Connect the lead wires so that the wiring width between the dummy inner lead, electrical inner lead, dummy outer lead, and dummy outer lead is wider than that between the electrical outer lead and electrical inner lead only. Then, by providing at least one or more of them, it is possible to increase the joining force and improve the reliability, and it is possible to prevent breakage of the connection portion of the electrical outer lead and the wiring, and to improve the mounting workability.

According to the film carrier of claim 2, in addition to the film carrier of claim 1, the wiring between the dummy inner lead and the dummy outer lead is connected to the electrical inner lead and the electrical outer lead. It can be easily configured by connecting by connecting.

[Brief description of drawings]

FIG. 1 is a plan view showing an embodiment of a film carrier of the present invention.

FIG. 2 is an enlarged view showing a film carrier of another embodiment of the same as above.

FIG. 3 is a plan view showing a conventional film carrier.

FIG. 4 is a cross-sectional view when a conventional film carrier is folded and used.

FIG. 5 is a cross-sectional view showing reflow of the outer lead with a metal tool.

[Explanation of symbols]

 1 Tape 5a Electrical inner lead 5b Dummy inner lead 6a Electrical outer lead 6b Dummy outer lead 7a, 7b Wiring

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[Procedure amendment]

[Submission date] January 18, 1993

[Procedure Amendment 1]

[Document name to be corrected] Drawing

[Name of item to be corrected] Fig. 4

[Correction method] Change

[Correction content]

[Figure 4]

[Procedure Amendment 2]

[Document name to be corrected] Drawing

[Name of item to be corrected] Figure 5

[Correction method] Change

[Correction content]

[Figure 5]

Claims (2)

[Claims] 1. A film carrier used in a tape carrier mounting method, comprising: an electrical inner lead formed on a tape and having an electrical function; and electrically connected to the electrical inner lead formed on the tape. Electrical outer lead, wiring for connecting between the electrical inner lead and the electrical outer lead formed on the tape, and a dummy inner lead formed on the tape having no electrical function And a dummy outer lead having no electrical function formed on the tape, the dummy inner lead, the electrical inner lead adjacent to the dummy inner lead, the dummy outer lead, and The electric outer leads are connected by the wiring, and at least one of the wirings is connected. The above is a film carrier characterized in that the wiring width is made wider than the wiring for connecting only the other electrical inner lead and the electrical outer lead. 2. The film carrier according to claim 1, wherein the wiring between the dummy inner lead and the dummy outer lead is connected by the wiring between the electrical inner lead and the electrical outer lead.