JPH0517853Y2 - - Google Patents

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Publication number
JPH0517853Y2
JPH0517853Y2 JP1326688U JP1326688U JPH0517853Y2 JP H0517853 Y2 JPH0517853 Y2 JP H0517853Y2 JP 1326688 U JP1326688 U JP 1326688U JP 1326688 U JP1326688 U JP 1326688U JP H0517853 Y2 JPH0517853 Y2 JP H0517853Y2
Authority
JP
Japan
Prior art keywords
low
temperature
temperature terminal
terminal portion
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1326688U
Other languages
Japanese (ja)
Other versions
JPH01118412U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1326688U priority Critical patent/JPH0517853Y2/ja
Publication of JPH01118412U publication Critical patent/JPH01118412U/ja
Application granted granted Critical
Publication of JPH0517853Y2 publication Critical patent/JPH0517853Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Containers, Films, And Cooling For Superconductive Devices (AREA)

Description

【考案の詳細な説明】 〔産業上の利用分野〕 この考案は超電導コイルを収納する低温容器の
外部から内部にある超電導コイルに電力を供給す
るリードの低温端子部の構造に関する。
[Detailed Description of the Invention] [Industrial Application Field] This invention relates to the structure of a low-temperature terminal portion of a lead that supplies power from the outside of a low-temperature vessel housing a superconducting coil to the superconducting coil located inside.

〔従来の技術〕[Conventional technology]

一般に超電導コイルは低温容器の内部に収納さ
れ、液体ヘリウム等の極低温冷媒によつて冷却さ
れ極低温に保持されるため、この液体ヘリウムの
消費量を少なくすることが要求される。したがつ
て電流リードにおける常温部から極低温に保持さ
れた超電導コイル部への熱侵入を小さくすること
が必要である。
Generally, superconducting coils are housed inside a low-temperature container and are cooled and maintained at a cryogenic temperature by a cryogenic refrigerant such as liquid helium, so it is required to reduce the amount of liquid helium consumed. Therefore, it is necessary to reduce heat intrusion from the normal temperature part of the current lead to the superconducting coil part kept at an extremely low temperature.

第4図は従来の超電導装置用電流リードを用い
た超電導装置の縦断面図、第5図は第4図のA−
A矢視横断面図、第6図は第4図における低温端
子部の縦断面図、第7図は第6図のP矢視下面図
で、これらの図面に基づいて構造を説明する。低
温容器1の内部に超電導コイル2を収納して開口
部を取付蓋3で閉塞し、内部に液体ヘリウムHを
入れて超電導コイル2を極低温に保持する。電流
リード4のリード本体5は取付蓋3を軸封貫通し
て設けられており、容器外部の一端には常温端子
部6が貫通孔8の上部位置で取付蓋3に取付けら
れ、容器内部の他端には低温端子部が取付けら
れている。容器内部の超電導コイル2は口出線9
を介して低温端子部のブスバー10に接続され
る。リード本体5の構成は第5図に示す横断面図
で明らかなように中空管11の内部に複数本の導
線12を挿入し、導線12の両端部はそれぞれ常
温端子部6、低温端子部に接続される。このリ
ード本体5では中空管11と導線12の間および
各導線12の間に形成されるすき間13にヘリウ
ムガスhを流通させ熱交換を良好にしている。す
なわち第4図において蒸発したヘリウムガスh
は、低温端子部内部→リード本体5内部→常温
端子部6内部を流通して中空管11内の複数本の
導線12の表面を冷却しながら常温端子部6のガ
ス出口管14より外部に放出される。このヘリウ
ムガスhは導線12に発生するジユール熱および
常温部からの伝導熱を除去する機能を有してい
る。この機能によつて導線12から極低温に保持
された超電導コイル2および液体ヘリウムHへの
侵入熱量を低減している。
Fig. 4 is a vertical cross-sectional view of a superconducting device using a conventional current lead for superconducting devices, and Fig. 5 is A--A in Fig. 4.
The structure will be explained based on a cross-sectional view taken in the direction of arrow A, FIG. 6 a longitudinal cross-sectional view of the low-temperature terminal portion in FIG. 4, and FIG. 7 a bottom view taken in the direction of arrow P in FIG. 6. A superconducting coil 2 is housed inside a low-temperature vessel 1, the opening is closed with a mounting lid 3, and liquid helium H is put inside to maintain the superconducting coil 2 at an extremely low temperature. The lead body 5 of the current lead 4 is provided by penetrating the mounting lid 3 with a shaft seal, and a room-temperature terminal portion 6 is attached to the mounting lid 3 at the upper position of the through hole 8 at one end of the outside of the container. A low temperature terminal section 7 is attached to the other end. The superconducting coil 2 inside the container has a lead wire 9
It is connected to the bus bar 10 of the low temperature terminal section 7 via. As is clear from the cross-sectional view shown in FIG. 5, the lead body 5 has a structure in which a plurality of conductive wires 12 are inserted into a hollow tube 11, and both ends of the conductive wire 12 are connected to a normal temperature terminal portion 6 and a low temperature terminal portion, respectively. Connected to 7 . In this lead body 5, helium gas h is passed through gaps 13 formed between the hollow tube 11 and the conducting wires 12 and between each conducting wire 12 to improve heat exchange. That is, in Fig. 4, the evaporated helium gas h
The gas flows inside the low-temperature terminal section 7 → inside the lead body 5 → inside the room-temperature terminal section 6, cooling the surface of the plurality of conductive wires 12 in the hollow tube 11, and then passing from the gas outlet pipe 14 of the room-temperature terminal section 6 to the outside. is released. This helium gas h has a function of removing Joule heat generated in the conductive wire 12 and conduction heat from the room temperature section. This function reduces the amount of heat that enters from the conducting wire 12 into the superconducting coil 2 and liquid helium H kept at an extremely low temperature.

電流リード4の低温端子部の構造は第6図の
縦断面図および第6図のP矢視下面図である第7
図で示される。この低温端子部は円筒体15の
開口両端面を複数個のヘリウムガス流入孔16お
よび複数個の導体接続孔17を有する導体板18
と、リード本体貫通孔19を有するリング板20
とでそれぞれ塞ぎヘリウムガスhを収容する容器
を形成している。さらに、前記導体板18にはブ
スバー10が設けられ、リード本体5の導体12
は、中空管11の端部より複数束に区分けされ放
射状に拡げられてそれぞれ導体接続孔17に挿入
され導体板18と電気的に接続される。
The structure of the low-temperature terminal portion 7 of the current lead 4 is shown in FIG. 6, which is a vertical cross-sectional view, and in FIG.
Illustrated in the figure. This low-temperature terminal part 7 is formed by forming a conductor plate 18 on both open end surfaces of a cylindrical body 15 having a plurality of helium gas inflow holes 16 and a plurality of conductor connection holes 17.
and a ring plate 20 having a lead body through hole 19.
and are respectively closed to form a container for accommodating helium gas h. Further, the conductor plate 18 is provided with a bus bar 10, and the conductor 12 of the lead body 5 is provided with a bus bar 10.
are divided into a plurality of bundles from the end of the hollow tube 11, expanded radially, and inserted into the conductor connection holes 17 to be electrically connected to the conductor plate 18.

〔考案が解決しようとする課題〕[The problem that the idea attempts to solve]

低温端子部の導体板には複数個の導体接続孔の
他に数多くのヘリウムガス孔が同一平面上に設け
られるため、導体板の面積が大となり円筒体の外
径も大きくなる。このため電流リードを低温容器
に取付け、取外しする際にくぐり抜ける取付蓋の
貫通孔の内径を大きくする必要がある。そのため
常温端子部のフランジ部分の面積が大となり、常
温部からの輻射熱が増大し、低温容器内の液体ヘ
リウムの消費量が増大するという問題があつた。
In addition to a plurality of conductor connection holes, a large number of helium gas holes are provided on the same plane in the conductor plate of the low-temperature terminal portion, so that the area of the conductor plate becomes large and the outer diameter of the cylindrical body also becomes large. For this reason, it is necessary to increase the inner diameter of the through hole in the mounting lid through which the current lead passes through when attaching and removing the current lead to the low temperature container. As a result, the area of the flange portion of the room-temperature terminal becomes large, radiant heat from the room-temperature section increases, and the consumption of liquid helium in the low-temperature container increases.

この考案は上述した問題点に鑑み、電流リード
の低温端子部を小形化し、とくに低温端子部の外
径寸法を極力小さくして取付蓋の貫通孔および常
温端子部を小さくし、常温部からの輻射熱を減少
できるように低温端子部の構造を改良することを
目的とする。
In view of the above-mentioned problems, this idea was developed by downsizing the low-temperature terminal part of the current lead, and in particular, by minimizing the outer diameter of the low-temperature terminal part and making the through-hole of the mounting lid and the normal-temperature terminal part smaller, it is possible to reduce the temperature of the current lead from the normal-temperature part. The purpose is to improve the structure of low-temperature terminals so as to reduce radiant heat.

〔課題を解決するための手段〕[Means to solve the problem]

この考案では上述した問題点を解決するため低
温端子部の構造を次のようにして外径寸法を小さ
くする。すなわち低温容器内にあるリード本体先
端の低温端子部を構成する円筒体の外周側壁面に
複数個ヘリウムガス流入孔を穿孔する。
In this invention, in order to solve the above-mentioned problems, the structure of the low-temperature terminal part is reduced in outer diameter as follows. That is, a plurality of helium gas inflow holes are bored in the outer peripheral side wall surface of the cylindrical body constituting the low temperature terminal portion at the tip of the lead body in the low temperature container.

〔作用〕[Effect]

複数個のヘリウムガス流入孔を円筒体に設け、
導体板には導体接続孔のみを穿孔するので導体板
の外径寸法を、したがつて円筒体の外径寸法も小
さくできる。
Multiple helium gas inflow holes are provided in the cylindrical body,
Since only the conductor connection holes are bored in the conductor plate, the outer diameter of the conductor plate and, therefore, the outer diameter of the cylindrical body can be reduced.

〔実施例〕 第1図はこの考案の一実施例である超電導装置
用電流リードの低温端子部の縦断面図、第2図は
第1図のQ矢視一部側面図、第3図は第1図のR
矢視下面図で、従来と同じ機能を有する部品につ
いては同一の符号を付し説明を省略する。
[Example] Fig. 1 is a vertical cross-sectional view of a low-temperature terminal portion of a current lead for a superconducting device that is an embodiment of this invention, Fig. 2 is a partial side view taken in the direction of the Q arrow in Fig. R in Figure 1
In the bottom view as viewed from the arrows, parts having the same functions as those of the prior art are designated by the same reference numerals and explanations thereof will be omitted.

この考案の実施例ではヘリウムガス流入孔16
を、導体板18とリング板20を連結してヘリウ
ムガス容器を形成する円筒体15の外周側壁面に
複数個設けたものである。これにより導体板18
に穿孔する孔は導体接続孔17のみでよく、ブス
バー10を設けたとしても導体板18の面積は従
来より小さくて済み、円筒体15の外径寸法を小
さくすることができる。このため取付蓋3の貫通
孔8(第4図参照)も小さくでき常温端子部6の
フランジ部分を小形化でき、常温部からの輻射熱
を低減できる。
In the embodiment of this invention, the helium gas inflow hole 16
A plurality of these are provided on the outer peripheral wall surface of the cylindrical body 15 that connects the conductor plate 18 and the ring plate 20 to form a helium gas container. As a result, the conductor plate 18
Only the conductor connection hole 17 needs to be drilled in the hole, and even if the bus bar 10 is provided, the area of the conductor plate 18 can be smaller than before, and the outer diameter of the cylindrical body 15 can be reduced. Therefore, the through hole 8 (see FIG. 4) of the mounting lid 3 can be made smaller, the flange portion of the room temperature terminal section 6 can be made smaller, and the radiant heat from the room temperature section can be reduced.

〔考案の効果〕[Effect of idea]

この考案によればヘリウムガス流入孔を低温端
子部の円筒体外周側壁面に設け、導体板の面積を
少くし、円筒体の外径寸法を小として低温端子部
および常温端子部を小形化できる。これに伴なつ
て常温部からの輻射熱を減少でき、高価な液体ヘ
リウムの消費量を低減できる。
According to this invention, the helium gas inflow hole is provided on the outer wall surface of the cylindrical body of the low-temperature terminal part, the area of the conductor plate is reduced, and the outer diameter of the cylindrical body is reduced, thereby making it possible to downsize the low-temperature terminal part and the room-temperature terminal part. . Along with this, radiant heat from the room temperature section can be reduced, and the amount of expensive liquid helium consumed can be reduced.

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの考案の一実施例である超電導装置
用電流リードの低温端子部の縦断面図、第2図は
第1図のQ矢視一部側面図、第3図は第1図のR
矢視下面図、第4図は従来の超電導装置用電流リ
ードを用いた超電導装置の縦断面図、第5図は第
4図のA−A矢視横断面図、第6図は第4図にお
ける低温端子部の縦断面図、第7図は第6図のP
矢視下面図である。 1……低温容器、2……超電導コイル、4……
電流リード、5……リード本体、6……常温端子
部、……低温端子部、15……円筒体、16…
…ヘリウムガス流入孔。
Fig. 1 is a vertical cross-sectional view of a low-temperature terminal portion of a current lead for a superconducting device that is an embodiment of this invention, Fig. 2 is a partial side view taken in the direction of the Q arrow in Fig. 1, and Fig. 3 is a partial side view of Fig. 1. R
4 is a vertical cross-sectional view of a superconducting device using a conventional current lead for a superconducting device, FIG. 5 is a cross-sectional view taken along the line A-A in FIG. 4, and FIG. 7 is a vertical cross-sectional view of the low-temperature terminal part in FIG.
FIG. 1... Low temperature container, 2... Superconducting coil, 4...
Current lead, 5... Lead body, 6... Room temperature terminal part, 7 ... Low temperature terminal part, 15... Cylindrical body, 16...
...Helium gas inflow hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 超電導コイルを収納する低温容器の外部から超
電導コイルに電力を供給するリード本体の、前記
低温容器の内部に設置される円筒体よりなる低温
端子部において、前記円筒体がその外周側壁面に
複数個のヘリウムガス流入孔を有することを特徴
とする超電導装置用電流リードの低温端子部。
In the low-temperature terminal portion of the lead body that supplies power to the superconducting coil from the outside of the low-temperature container housing the superconducting coil, the low-temperature terminal portion is made of a cylindrical body installed inside the low-temperature container, and a plurality of the cylindrical bodies are arranged on the outer peripheral side wall surface of the lead body. A low-temperature terminal portion of a current lead for a superconducting device, characterized by having a helium gas inflow hole.
JP1326688U 1988-02-03 1988-02-03 Expired - Lifetime JPH0517853Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1326688U JPH0517853Y2 (en) 1988-02-03 1988-02-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1326688U JPH0517853Y2 (en) 1988-02-03 1988-02-03

Publications (2)

Publication Number Publication Date
JPH01118412U JPH01118412U (en) 1989-08-10
JPH0517853Y2 true JPH0517853Y2 (en) 1993-05-13

Family

ID=31223426

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1326688U Expired - Lifetime JPH0517853Y2 (en) 1988-02-03 1988-02-03

Country Status (1)

Country Link
JP (1) JPH0517853Y2 (en)

Also Published As

Publication number Publication date
JPH01118412U (en) 1989-08-10

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