JPH0516535A - Thermal transfer recording medium and recording method - Google Patents

Abstract

PURPOSE:To realize high speed printing of image with high resolution and low energy by bringing the surface of thermal adhesive in a thermal transfer recording medium into tight contact with the surface of a light transmissive material to be transferred and then irradiating the surface of the thermal adhesive with laser beam from the rear of the material to be transferred thereby forming an image on the material to be transferred. CONSTITUTION:The thermal transfer recording medium 1 comprises an exfoliation layer 3, a thermal transfer coloring layer 4 and a thermal adhesive layer 5 laminated sequentially on a support 2, wherein at least one of the thermal transfer coloring layer 4 and the thermal adhesive layer 5 contains a near infrared ray absorbing substance. The thermal adhesive layer 5 in the thermal transfer recording medium 1 is brought into tight contact with a light transmissive material 6 to be transferred, and then the thermal adhesive layer 5 is irradiated with laser beam R from the rear of the material 6 to be transferred thus forming an image on the material 6 to be transferred.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat-sensitive transfer recording medium and a heat-sensitive transfer recording method, and more particularly to a heat-sensitive transfer recording medium and a heat-sensitive transfer recording capable of high-speed printing and capable of obtaining a printed image with high resolution. Regarding the method.

[0002]

2. Description of the Related Art Conventionally, as a method for obtaining a color hard copy, a color recording technology such as ink jet, electrophotography, thermal transfer recording and the like has been studied. Of these, the thermal transfer recording method is particularly not limited to the case of color recording, and has advantages such as easy operation and maintenance, downsizing of the apparatus, and cost reduction. This thermal transfer recording system includes a thermal fusion transfer system as well as a thermal diffusion transfer system. The heat-melt transfer method is a method in which a heat-meltable ink sheet having a coloring material is imagewise heated by a heat-sensitive head to melt-transfer the heat-meltable ink layer onto a heat-sensitive transfer recording image-receiving sheet.

However, it is difficult to obtain a clear printed image with high resolution in the conventional thermal fusion transfer method using a thermal head. Furthermore, conventionally, a method has also been proposed in which a heat-meltable ink sheet having a coloring material is imagewise heated by a semiconductor laser to melt-transfer the heat-meltable ink layer onto a heat-sensitive transfer recording image-receiving sheet (special feature: (See Japanese Laid-Open Patent Publication No. 59-143657).

However, the thermal energy application method using a semiconductor laser has a disadvantage that the printer inevitably becomes large in size because a high output semiconductor laser must be used in order to form an image at high speed. The present invention has been made to improve the above circumstances. That is, an object of the present invention is to provide a heat-sensitive transfer recording medium and a heat-sensitive transfer recording method capable of printing a high-resolution clear printed image with low energy at high speed.

[0005]

The heat-sensitive transfer recording medium of the present invention for achieving the above object comprises a support, a release layer, and a heat-sensitive transfer coloring material layer containing a coloring material and a heat-meltable substance. , A heat-sensitive adhesive layer is laminated in this order, and at least one of the heat-sensitive transfer color material layer and the heat-sensitive adhesive layer contains a near-infrared absorbing substance, which is a heat-sensitive transfer recording medium. The heat-sensitive transfer recording method of the invention comprises bringing the surface of the heat-sensitive adhesive layer of the heat-sensitive transfer recording medium into close contact with the surface of the light-transmitting transfer target, and transferring the back surface of the transfer target to the heat-sensitive adhesive layer surface. It is a heat-sensitive transfer recording method which comprises irradiating a laser beam to form an image on the transfer-receiving member.

The present invention will be described in detail below. (1) Heat-sensitive transfer recording medium The heat-sensitive transfer recording medium of the present invention basically comprises a release layer, a heat-sensitive transfer color material layer and a heat-sensitive adhesive layer laminated in this order on a support.

-Support-As the above support, any support may be used as long as it has good dimensional stability and withstands heat during recording by a thermal head, but thin paper such as condenser paper or glassine paper, polyethylene terephthalate. A heat resistant plastic film such as polyethylene naphthalate, polyamide, polyimide, polycarbonate, polysulfone, polyvinyl alcohol cellophane, or polystyrene can be used.

The thickness of the support is preferably 2 to 10 μm. The shape of the support is not particularly limited, and may be any shape such as a wide sheet or film, a narrow tape or a card.

-Release Layer- The release layer is provided on the support. That is,
The main purpose of this peeling layer is to peel and transfer the heat-sensitive transfer color material layer provided on at least the peeling layer sufficiently quickly when heated by a laser beam during image formation as described later. It is provided as. The release layer may be composed of the heat-melting compound itself, but is usually preferably composed of the heat-melting compound and / or a binder resin such as a thermoplastic resin.

As the heat-fusible compound, various compounds such as known compounds may be appropriately selected and used. Specific examples thereof include, for example, JP-A-63-193886, page 4, upper left column. The exemplified substances can be used from the 8th line to the 12th line in the upper right column of the same page. The heat-fusible compound is
Among those exemplified above, microcrystalline wax, paraffin wax, carnauba wax and the like having a melting point or a softening point in the range of 50 to 100 ° C. are preferable. If the melting point or softening point is too high, sufficient releasability may not be obtained, and in particular, characteristics such as desired releasability in high-speed printing may not be sufficiently exhibited.
On the other hand, if it is too low, it may cause problems such as peeling in a normal state.

These heat-fusible compounds may be used alone or in combination of two or more. The binder resin of the release layer or the thermoplastic resin used as a component thereof is not particularly limited, and various types such as those used in the release layer of the known heat-melt type thermal transfer recording ink sheet are appropriately used. You can select and use it.

Specific examples of the thermoplastic resin include ethylene-based copolymers such as ethylene-vinyl acetate-based resin, polyamide-based resin, polyester-based resin, polyurethane-based resin, polyolefin-based resin, acrylic resin and cellulose. Examples thereof include resin. In addition, for example, vinyl chloride resin, rosin resin,
Resins such as petroleum-based resins and ionomer resins, elastomers such as natural rubber, styrene-butadiene rubber, isoprene rubber and chloroprene rubber, ester gum,
Rosin maleic acid resin, rosin phenol resin, rosin derivative such as hydrogenated rosin, and phenol resin,
A terpene resin, a cyclopentadiene resin, an aromatic resin, etc. can be used depending on the case.

Among these, ethylene-based copolymers such as ethylene-vinyl acetate copolymers and ethylene-vinyl acetate-based copolymers and cellulose resins are preferable, and ethylene-vinyl acetate copolymers and cellulose-based resins are particularly preferable. Resins are preferred. These various thermoplastic resins, if used, may be used alone,
Alternatively, two or more kinds may be used in combination.

In the present invention, the thermoplastic resin used as a component of the release layer usually has a melting point or softening point of 50 among the various thermoplastic resins exemplified above.
What is in the range of to 150 ° C., especially 60 to 120 ° C., or those which fall within the range by mixing two or more kinds are preferably used. In the release layer, in addition to the above components,
If necessary, other components may be appropriately contained within a range that does not impair the object of the present invention. Examples of the other components include higher fatty acids, higher alcohols, higher fatty acid esters, amides, and higher amines. If these are used,
They may be used alone or in combination of two or more.

Further, in order to enhance the releasability of the release layer from the support, it is also preferable to incorporate a compound or substance conventionally called a release agent into the release layer. Such release agents include silicone oils (including those called silicone resins); solid waxes such as polyethylene wax, amide wax, and Teflon powder;
Examples thereof include fluorine-based and phosphoric acid ester-based surfactants, and among them, silicone oil is preferable. This silicone oil is classified into a type that is simply added (simple addition type) and a type that is cured or reacted (curing reaction type). In the case of the simple addition type, it is preferable to use a modified silicone oil (for example, polyester modified silicone resin, urethane modified silicone resin, acrylic modified silicone resin, etc.) in order to improve the compatibility with the resin. The addition amount of these simple addition type silicone oils cannot be uniformly determined because it may vary depending on the type, but generally speaking, it is generally 0. 1 to 50% by weight, preferably 0.5
Is about 20% by weight.

As the curing reaction type silicone oil,
Examples thereof include a reaction curable type (for example, one obtained by reacting and curing an amino-modified silicone oil and an epoxy-modified silicone oil), a photocurable type, a catalyst curable type, and the like. The addition amount of these curable silicone oils is preferably 0.5 to 30% by weight based on the binder resin.

The release layer may contain, in addition to the above components, a surfactant for controlling the release property.
Examples of typical surfactants used in the present invention include polyoxyethylene chain-containing compounds. Furthermore, inorganic or organic fine particles (metal powder, silica gel, etc.) or oils (linseed oil, mineral oil, etc.) can be added.

This release layer may contain the same color material as that which is blended in the heat-sensitive transfer color material layer described later. The types of coloring materials that may be contained in the release layer will be clarified by referring to the description of the thermal transfer coloring material layer below. The melting point or softening point of the entire release layer is usually 50 to 150 ° C, and particularly preferably 60 to 120 ° C. The layer thickness of the release layer is usually 0.
A range of 2 to 4 μm, preferably 0.5 to 2.5 μm is suitable.

-Heat-sensitive transfer color material layer-In the present invention, the heat-transfer color material layer is laminated on the release layer. The heat-sensitive transfer coloring material layer contains a coloring material and a binder as essential components. However, in order to enhance the high speed response to the application of heat energy by the semiconductor laser, it is also preferable to contain a near infrared absorbing substance.

1. Coloring Material As the coloring material, those which are usually used in the heat-melting ink layer of the heat-melting type thermal transfer recording ink sheet can be used without limitation. For example, JP-A-63-193.
Inorganic pigments, organic pigments, and other pigments and dyes such as organic dyes described in JP-A-886, page 5, upper right column, lines 3 to 15 can be mentioned. Examples of the inorganic pigment include
Titanium dioxide, carbon black, zinc oxide, Prussian blue, cadmium sulfide, iron oxide and lead, zinc,
Examples include barium and calcium chromates. Examples of the organic pigments include azo-based, thioindigo-based, anthraquinone-based, anthanthrone-based, triphendioxazine-based pigments, vat dye pigments, phthalocyanine pigments such as copper phthalocyanine and its derivatives, and quinacridone pigments.

Examples of organic dyes include acid dyes, direct dyes, disperse dyes, oil-soluble dyes and metal-containing oil-soluble dyes. These coloring materials may be used alone or in combination of two or more as needed. The amount of the coloring material used is usually 0.1 to 1 m ^{2 of} the support.
20 g, preferably 0.2-5 g.

2. Binder As the binder, a heat-meltable substance, a thermoplastic resin, or the like is used.

As the heat-melting substance, any of those usually used for the heat-melting ink layer of the heat-melting ink sheet can be arbitrarily used. Specifically, for example,
Low molecular weight thermoplastic resin such as polystyrene resin, acrylic resin, styrene-acrylic resin, polyester resin, polyurethane resin, etc., JP-A-63-193886, page 4, upper left column, line 8 to same page, upper right column, 12 Examples of substances that can be mentioned up to the line include rosin, hydrogenated rosin, polymerized rosin, rosin-modified glycerin, rosin-modified maleic acid resin, rosin-modified polyester resin, rosin-modified phenolic resin and ester gum. Examples of the rosin derivative include a phenol resin, a terpene resin, a ketone resin, a cyclopentadiene resin, and an aromatic hydrocarbon resin.

It is preferable that these heat-melting substances have a molecular weight of usually 10,000 or less, particularly 5,000 or less, and a melting point or softening point in the range of 50 to 150 ° C. The heat fusible substances may be used alone or in combination of two or more. As the thermoplastic resin, various resins such as those used in the heat-meltable ink layer of the heat-melting type thermal transfer recording ink sheet can be used.
Japanese Patent No. 193886, page 4, upper right column, page 5, upper left column, 18th
The exemplified substances can be listed in the row.

3. Near-infrared absorbing substance This thermal transfer coloring material layer may contain a near-infrared absorbing substance. However, this near infrared absorbing material is
The heat-sensitive transfer coloring material layer and the heat-sensitive adhesive layer can be contained in either one layer or both layers. Whichever layer contains the near-infrared absorbing substance, the near-infrared absorbing substance self-heats due to the heat energy of the semiconductor laser, and assists the melt transfer of the heat-sensitive transfer color material layer. In particular, the thermal transfer coloring material layer can absorb the laser efficiently by mixing the near-infrared absorbing material and convert it into heat energy, and the heat generated in the heat-sensitive adhesive layer is transmitted to the peeling layer, so that the laser irradiation can be performed. The peelability of the peeling layer of the part can be improved.

As the near-infrared ray absorbing substance, any of the conventionally known substances can be used.
A near infrared absorbing substance having an absorption maximum in the wavelength band of m is more preferable. Examples of the near-infrared absorbing substance include carbon black, polymethine-based, azurenium-based, squarylium-based, thiopyrylium-based, anthraquinone-based organic compounds, phthalocyanine-based, azo-based, thioamide-based organic metal complexes, and the like.

These can be used alone or in combination of two or more. In the present invention, the amount of the near infrared absorbing substance contained in the heat-sensitive transfer coloring material layer is usually 0.01 to 10% by weight. The amount of the near-infrared absorbing substance used in the present invention is usually 0.01 in the total material including the heat-sensitive transfer coloring material layer and the heat-sensitive adhesive layer.
-40% by weight, preferably 0.1-30% by weight.
However, if the near-infrared absorbing substance is also contained in the heat-sensitive adhesive layer, the amount of the near-infrared absorbing substance to be contained is within the above range, and the amount of the whole heat-sensitive transfer coloring material layer is 0.01 ˜50% by weight, and the heat-sensitive adhesive layer preferably contains 0.01 to 30% by weight of the total amount of the heat-sensitive adhesive layer.

4. Other Optional Components To the thermal transfer color material layer, if necessary, other additive components other than those described above can be appropriately added within a range that does not impair the object of the present invention. For example, when the heat-sensitive transfer color material layer contains a fluorine-based surfactant, the blocking phenomenon can be prevented. Further, a near-infrared absorbing agent described later may be added to this heat-sensitive transfer color material layer.

—Heat-Sensitive Adhesive Layer— This heat-sensitive adhesive layer is provided on the heat-sensitive transfer color material layer, and when irradiated with laser light during image formation, heat is generated to adhere to the transfer target material. It contains an infrared absorbing substance and a heat-sensitive adhesive.

1. Near-infrared absorbing substance As the near-infrared absorbing substance, the same substance as described in the section "Heat-sensitive transfer coloring material layer" can be blended in this heat-sensitive adhesive layer.

The amount of the near infrared absorbing substance contained in the heat-sensitive adhesive layer is usually 0.01 to 10% by weight. By blending the near-infrared absorbing substance, the heat-sensitive adhesive layer can efficiently absorb the laser and convert it into heat energy. Also, the heat generated in the heat-sensitive adhesive layer is transferred to the release layer,
The peelability of the peeling layer in the laser irradiation part can be improved.

2. Thermosensitive Adhesive The thermosensitive adhesive contained in the thermosensitive adhesive layer may include a heat-meltable compound and a thermoplastic resin. Examples of the heat-meltable compound include low molecular weight thermoplastic resins such as polystyrene resin, acrylic resin, styrene-acrylic resin, polyester resin, and polyurethane resin, carnauba wax, wood wax, candelin wax, rice wax, and Plant waxes such as auricurie wax; animal waxes such as beeswax, insect wax, shellac, and whale wax; paraffin wax, microcrystalline wax, polyethylene wax, fisher-Tropsch wax, ester wax, and oxidation wax And various waxes such as petroleum waxes such as montan wax, mineral waxes such as montan wax, ozokerite and ceresin wax, and other waxes, rosin, hydrogenated rosin, Rosin derivatives such as synthetic rosin, rosin-modified glycerin, rosin-modified maleic acid resin, rosin-modified polyester resin, rosin-modified phenolic resin and ester gum, and phenolic resin, terpene resin, ketone resin, cyclopentadiene resin, aromatic hydrocarbon resin , Aliphatic hydrocarbon resins, alicyclic hydrocarbon resins, and the like.

It is preferable that these heat-fusible compounds have a molecular weight of usually 10,000 or less, particularly 5,000 or less and a melting point or softening point in the range of 50 to 150 ° C. These heat fusible compounds may be used alone or in combination of two or more. As the thermoplastic resin, for example, ethylene-based copolymer, polyamide resin, polyester resin, polyurethane resin, polyolefin-based resin, acrylic resin,
And cellulose resins and the like. Among these, ethylene-based copolymers are particularly preferably used.

Examples of the ethylene-based copolymer include ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate resin, ethylene-vinyl acetate-maleic anhydride resin, ethylene-acrylic acid resin, ethylene-methacrylic acid resin, Examples thereof include ethylene-α-olefin copolymers. Among these various ethylene-based copolymers, ethylene-vinyl acetate copolymer, ethylene-
Ethyl acrylate resin, ethylene-ethyl acrylate-maleic anhydride resin and other ethylene-vinyl acetate copolymers or ethylene-vinyl acetate copolymers and ethylene-ethyl acrylate resins or ethylene-ethyl acrylate resins are preferable, and particularly ethylene. -Vinyl acetate copolymer and the like are preferable.

Further, these various ethylene-based copolymers have a comonomer unit content other than ethylene units of 28% or less.
It is preferably at least 35% by weight, particularly preferably at least 35% by weight. With such a specific composition, the ethylene-vinyl acetate copolymer such as the ethylene-vinyl acetate copolymer and / or the ethylene-ethyl acrylate resin such as the ethylene-ethyl acrylate resin is the thermoplastic resin or the thermoplastic resin thereof. By using it as a main component, it is possible to further improve the adhesive force even for a transfer target having a low surface smoothness, and it is possible to realize remarkably high fixing property of a printed image after printing.

The thermoplastic resin preferably has a melt index (MI value) of usually 2 to 1,500, and more preferably 20 to 500. This is because when a thermoplastic resin having an MI value in the above range is used, the adhesive force of the heat-sensitive adhesive layer to the transferred material can be further increased. In addition, the said thermoplastic resin may be used individually by 1 type, and may use 2 or more types together.

The proportion of the heat-meltable compound in the heat-sensitive adhesive layer is usually 20 to 80% by weight, preferably 30 to 70% by weight. If the content of the heat-melting compound is too small, fine characters and the like may not be printed, while if it is too large, adverse effects such as scumming may occur. The proportion of the thermoplastic resin in the heat-sensitive adhesive layer is usually 5 to 40% by weight, preferably 10 to 30% by weight. If the content ratio of this thermoplastic resin is too low, it may not be possible to print on low-smooth paper cleanly, while if it is too high, it may cause blocking such as blocking at high temperature.

Further, the heat-sensitive adhesive layer may optionally contain other additive components other than those described above, as long as the object of the present invention is not impaired. The thickness of the heat-sensitive adhesive layer is usually 0.2 to 5.0 μm, and particularly preferably 0.5 to 4.0 μm. Further, the heat-sensitive adhesive layer is required to be provided in at least one layer, for example, two layers different in the type and content of the coloring material, or the blending ratio of the thermoplastic resin and the heat-meltable substance. You may comprise by the above.

-Other Layers- The heat-sensitive transfer recording medium is not limited to a four-layer structure comprising a support, a peeling layer, a heat-sensitive transfer coloring material layer and a heat-sensitive adhesive layer,
Other layers may be formed. For example, on the back surface of the support (on the side opposite to the thermal transfer coloring material layer), running stability,
A backing layer may be provided for the purpose of heat resistance and antistatic property. The thickness of this backing layer is usually 0.1-1 μm.
Is.

(2) Production of heat-sensitive transfer recording medium In the heat-sensitive transfer recording medium, first, a release layer is formed on a support, then a heat-sensitive transfer color material layer is formed on this release layer, and further this heat-transfer color material is formed. It can be manufactured by forming a heat-sensitive adhesive layer on the layer. The release layer and the heat-sensitive adhesive layer are formed by dispersing or dissolving each forming component in an organic solvent and applying it (organic solvent method), or by heating each component in a softened or molten state to apply (hot melt coating). Method) and other known methods.

The heat-sensitive transfer coloring material layer may be applied by adopting the above-mentioned organic solvent method or hot-melt coating method, but using an emulsion or a solution in which the forming components are dispersed or dissolved in a solvent. It is preferably applied. The heat-sensitive transfer color material layer is usually preferably formed to a film thickness of 0.6 to 5.0 μm, and particularly preferably 1.0 to 4.0 μm.

The total content of the layer-forming components in the coating liquid used for coating the heat-sensitive transfer color material layer is usually set within the range of 5 to 50% by weight.

The binder may be used by dissolving one or two or more in a solvent or dispersing it in a latex form. As the solvent, water, ethanol, tetrahydrofuran, methyl ethyl ketone, toluene, xylene,
Examples thereof include chloroform, dioxane, acetone, cyclohexane, and normal butyl acetate.

For the coating, conventionally known surface-sequential separate coating method using a gravure roll, extrusion coating method, wire bar coating method, roll coating method and the like can be adopted. The thermal transfer recording medium can be conveniently used by forming a perforation or providing a detection mark or the like for detecting the position of an area having a different hue.

(3) Transferred Material As the transferred material which is the object of image formation, a film (also referred to as a sheet) of a known material having a light transmitting property can be used. Examples thereof include polystyrene film, polycarbonate film, polyethylene terephthalate film, stretched polypropylene film, polyester film, non-plasticized vinyl chloride resin film, cellulose triacetate film, and cellulose diacetate film. The thickness of the transferred material is usually 20 to 1000 μm, preferably 50 to 800.
μm. (4) Image Formation (Thermal Transfer Recording) In order to form an image, as shown in FIG. 1, the heat-sensitive adhesive layer 5 of the heat-sensitive transfer recording medium 1 (laminated on the support 2 via the release layer 3). It is laminated on the heat-sensitive transfer color material layer 4.)
And the transfer target 6 are brought into close contact with each other, and the surface of the heat-sensitive adhesive layer 5 is irradiated with a low-power laser beam R such as a semiconductor laser beam from the back side of the transfer target 6 to give imagewise thermal energy. .

The heat-sensitive adhesive layer 5 in the portion thus irradiated is quickly heated to soften or melt when it contains a near-infrared absorber, and this heat is transferred to the heat-sensitive transfer color material layer 4 and the peeling layer 3. It is transmitted to each and softens each. In this state, when the transferred body 6 is peeled off from the thermal transfer recording medium 1,
Since the release layer 3 is released from the support 2, the heat-sensitive transfer coloring material layer 4 is transferred to the transfer target 6 together with the release layer 3 and the heat-sensitive adhesive layer 5.
As a result of shifting to the side and being fixed, an image is formed on the transfer target body 6.

Even when the near-infrared absorbing substance is contained in the heat-sensitive adhesive layer, the peeling layer is easily peeled off by the application of heat energy by the semiconductor laser in the same manner as described above, and an image is formed on the transferred material. It is formed. As described above, according to the present invention, the image can be transferred only by intensively heating the heat-sensitive adhesive layer and / or the heat-sensitive adhesive layer.
High-speed printing can be achieved with low energy laser light. Not only that, unlike the conventional method using a thermal head or the like, a clear printed image with high resolution can be obtained.

In the present invention, the thermal energy applied can be changed by changing the amount of laser light or the irradiation area. In the present invention, the irradiation of laser light is performed from the back surface side of the transfer target. If the laser beam is irradiated from the back side of the thermal transfer recording medium, the effect of the present invention cannot be obtained.

The transparent transfer material to which the image is transferred in this manner can be used as it is in the field of medical images, the field of using a transparent image such as OHP, and the transparent material of the present invention. The image formed on the transfer target can be retransferred to plain paper or the like. The method of retransfer is to overlay the image formed on the transparent transfer material with plain paper and pinch it with a heat roller, or to irradiate the entire surface with infrared rays from the back side of the transparent transfer material by overlapping it with plain paper. You can do it.

[0050]

EXAMPLES Next, the present invention will be described more specifically with reference to Examples and Comparative Examples. In the following, "part" means "part by weight". (Example 1) -Production of thermal transfer recording medium-The following composition for release layer formation was mixed and dispersed in a sand mill to prepare a coating solution, which was coated on a polyethylene terephthalate film having a thickness of 6 µm with a wire bar. It was applied and dried to form a release layer.

[0051]   <Release layer forming composition>   Paraffin wax ・ ・ ・ ・ ・ ・ 9.5 parts   [HNP-11, manufactured by Nippon Seiro Co., Ltd.]   Ethylene-vinyl acetate copolymer: 0.5 part   [Eva Flex EV210, manufactured by Mitsui Deupon Polychemical Co., Ltd.]   Isopropyl alcohol: 85.0 parts.

Next, the following composition for forming a heat-sensitive transfer coloring material layer was mixed and dispersed in a sand mill to prepare a coating solution, which was coated on the above-mentioned release layer with a wire bar and dried to give a thickness of 1 A heat-sensitive transfer coloring material layer having a thickness of 0.5 μm was formed. <The composition for forming the heat-sensitive transfer color material layer> Paraffin wax ... 3.0 parts [Nippon Seiro Co., Ltd., HNP-11] Carnauba wax: 2.0 parts Ethylene-vinyl acetate copolymer: 1 0.0 parts [Evaflex EV40Y manufactured by Mitsui-DeuPont Polychemical Co., Ltd.] Carbon black ・ ・ ・ ・ ・ ・ ・ ・ 3.0 parts Methyl ethyl ketone ・ ・ ・90.0 parts Cyclohexanone: 10.0 parts.

Next, the following composition for heat-sensitive adhesive layer was mixed and dispersed in a sand mill to prepare a coating solution, which was coated on the heat-sensitive transfer color material layer using a wire bar and dried to give a coating solution having a thickness of 1 μm. A heat sensitive adhesive layer was formed. <Composition for heat-sensitive adhesive layer> Ethylene-vinyl acetate copolymer: 2.0 parts [Evaflex EV210 manufactured by Mitsui / DuPont Polychemical Co., Ltd.] Rosin-modified resin ... 4.0 parts [Hariester DS90 manufactured by Harima Kasei Co., Ltd.] Near infrared absorbing material ...・ ・ ・ 1.5 parts [Mitsui Toatsu Dyestuff Co., Ltd., SIR-128] Carbon black ・ ・ ・ ・ ・ ・ ・ ・..... 4.0 parts Methyl ethyl ketone ..... 45.0 parts Toluene .....・ ・ ・ ・ ・ ・ ・ ・ ・ ・ 45.0 copies.

Subsequently, a silicone-modified urethane resin [SP-2105, manufactured by Dainichiseika Co., Ltd.] is provided on the back surface of the polyethylene terephthalate film (on the side opposite to the release layer).
Was applied and dried to form a backing layer. —Transfer Material— A polyethylene terephthalate film having a thickness of 100 μm was prepared as a transfer material.

-Image formation-The transferred material is brought into close contact with the surface of the heat-sensitive adhesive layer of the thermal transfer recording medium, and in this state, the semiconductor laser-LT090MD / MF [wavelength 830 nm, maximum light Laser light of output 100 mW, manufactured by Sharp Co., Ltd.] is focused so that the beam diameter on the surface of the heat-sensitive adhesive layer is 20 μm, and exposure is performed under two conditions of irradiation time of 2 μs and 10 μs to record an image. Got the body

—Evaluation— The transfer medium was peeled off from the image recording medium, and the state of the image transferred on the transfer medium was observed with a microscope based on the following criteria. The results are shown in Table 1. A: A clear image was obtained. ◯: An image was obtained, but there was a partially unclear image. Δ: An image was obtained, but it was unclear. X: No image was obtained.

Example 2 Instead of the composition for forming a heat-sensitive transfer color material layer and the composition for forming a heat-sensitive adhesive layer of Example 1, the following composition for forming a heat-transfer color material layer and a heat-sensitive adhesive layer were used. Example 1 except that each of the forming compositions was used.
An image recording material was manufactured and evaluated in the same manner as in. The results are shown in Table 1. <Thermal transfer colorant layer forming composition> Paraffin wax ... 4.0 parts [NIPPON SEIWA CO., LTD., HNP-11] Carnauba wax: 2.0 parts Microcrystalline wax: 1.0 parts [ Hi-Mic 1080 manufactured by Nippon Seiro Co., Ltd. Ethylene-vinyl acetate copolymer 1.0 part [Mitsui Deupon Polychemical Co., Ltd. Eva Flex EV210] Organic pigment: 2.0 parts [Nippon Kayaku Co., Ltd., Kayaset Blue FR] Methyl ethyl ketone ..... 90.0 parts cyclohexanone ... 10.0 parts.

<Composition for forming heat-sensitive adhesive layer>   Paraffin wax ... 1.0 part   [NIPPON SEIWA CO., LTD., HNP-3]   Ethylene-vinyl acetate copolymer: 3.0 parts   [Eva Flex EV210, manufactured by Mitsui Deupon Polychemical Co., Ltd.]   Phenolic resin: 3.0 parts   [Tamanor 100S manufactured by Arakawa Chemical Co., Ltd.]   Near-infrared absorbing material: 3.0 parts   [ICI product, NARROW BAND INFRARED ABSORBE RS 101756]   Dispersant: 0.5 part   Methyl ethyl ketone ... 45.0 parts   Toluene: 45.0 parts.

Example 3 Instead of the composition for forming a release layer, the composition for forming a heat-sensitive transfer coloring material layer and the composition for forming a heat-sensitive adhesive layer in Example 1, the following composition for forming a release layer was prepared. An image recording material was produced and evaluated in the same manner as in Example 1 except that the composition for forming a heat-sensitive transfer coloring material layer and the composition for forming a heat-sensitive adhesive layer were used. The results are shown in Table 1.

[0060]   <Release layer forming composition>   Micro-Crystalline Wax 9.0 parts   [Ni Mitsuwa Co., Ltd., Hi Mic 1080]   Ethylene-vinyl acetate copolymer: 0.5 part   [Eva Flex EV210, manufactured by Mitsui Deupon Polychemical Co., Ltd.]   Isopropyl alcohol: 85.0 parts.

[0061]   <Composition for forming thermal transfer colorant layer>   Paraffin wax ... 1.0 part   [HNP-11, manufactured by Nippon Seiro Co., Ltd.]   Ethylene-vinyl acetate copolymer: 1.0 part   [Evaflex EV40Y manufactured by Mitsui / DeuPont Polychemical Co., Ltd.]   Phenolic resin: 5.0 parts   [Tamanor 100S manufactured by Arakawa Chemical Co., Ltd.]   Carbon black: 2.0 parts   Methyl ethyl ketone: 90.0 parts   Cyclohexanone ... 10.0 parts.

[0062]   <Composition for forming heat-sensitive adhesive layer>   Ethylene-vinyl acetate copolymer: 2.0 parts   [Eva Flex EV210, manufactured by Mitsui Deupon Polychemical Co., Ltd.]   Polyester resin ... 3.0 parts   [Byron 200]   Phenolic resin: 3.0 parts   [Tamanor 100S manufactured by Arakawa Chemical Co., Ltd.]   Near-infrared absorbing material: 2.0 parts   [Mitsui Toatsu Dyestuff Co., Ltd., SIR-159]   Carbon black: 2.0 parts   Methyl ethyl ketone ... 45.0 parts   Toluene: 45.0 parts.

Example 4 Instead of the composition for forming a release layer, the composition for forming a heat-sensitive transfer coloring material layer and the composition for forming a heat-sensitive adhesive layer of Example 1, the following composition for forming a release layer was prepared. An image recording material was produced and evaluated in the same manner as in Example 1 except that the composition for forming a heat-sensitive transfer coloring material layer and the composition for forming a heat-sensitive adhesive layer were used. The results are shown in Table 1. <Composition for forming peeling layer> Paraffin wax ········ 7.0 parts [HNP-11, manufactured by Nippon Seiro Co., Ltd.] Carnauba wax・ ・ ・ ・ ・ ・ 1.0 part Ethylene-vinyl acetate copolymer ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ 1.0 part [Eva Flex EV40Y manufactured by Mitsui / DeuPont Polychemical Co., Ltd.] Carbon black 1.0 part Methyl ethyl ketone・ ・ ・ ・ ・ ・ ・ ・ ・ ・ ・ 90.0 copies.

[0064]   <Composition for forming thermal transfer colorant layer>   Paraffin wax ... 4.0 parts   [HNP-11, manufactured by Nippon Seiro Co., Ltd.]   Carnauba wax ... 1.0 parts   Ethylene-vinyl acetate copolymer: 2.0 parts   [Evaflex EV40Y manufactured by Mitsui / DeuPont Polychemical Co., Ltd.]   Organic pigment: 2.0 parts   [Kayaset Blue FR manufactured by Nippon Kayaku Co., Ltd.]   Near-infrared absorbing material: 2.0 parts   [Mitsui Toatsu Dyestuff Co., Ltd., SIR-103]   Methyl ethyl ketone: 90.0 parts   Cyclohexanone ... 10.0 parts.

[0065]   <Composition for forming heat-sensitive adhesive layer>   Paraffin wax ... 1.0 part   Ethylene-vinyl acetate copolymer: 2.0 parts   [Eva Flex EV210, manufactured by Mitsui Deupon Polychemical Co., Ltd.]   Near-infrared absorbing material: 3.0 parts   [Mitsui Toatsu Dyestuff Co., Ltd., SIR-103]   Methyl ethyl ketone ... 45.0 parts   Toluene: 45.0 parts.

(Comparative Example 1) An image recording material was produced and evaluated in the same manner as in Example 2 except that the near-infrared absorbing material was removed from the adhesive layer composition in Example 2. The results are shown in Table 1. (Comparative Example 2) An image recording material was produced in the same manner as in Example 1 except that the heat-sensitive adhesive layer was not provided in Example 1.
The evaluation was performed. The results are shown in Table 1. (Comparative Example 3) An image recording material was produced and evaluated in the same manner as in Example 3 except that the release layer was not provided. The results are shown in Table 1. (Comparative Example 4) In Example 1, the transfer target is brought into close contact with the surface of the heat-sensitive adhesive layer of the heat-sensitive transfer recording medium, and in this state, the semiconductor laser-LT is applied from the back side of the heat-sensitive transfer recording medium.
090 MD / MF laser-except for irradiating light
An image recording material was manufactured in the same manner as in Example 1 and evaluated. The results are shown in Table 1.

(Comparative Example 5) In Example 2, the material to be transferred was brought into close contact with the surface of the heat-sensitive adhesive layer of the heat-sensitive transfer recording medium, and in this state, the semiconductor laser-LT090MD / MF was applied from the back side of the heat-sensitive transfer recording medium. An image recording material was manufactured and evaluated in the same manner as in Example 2 except that the laser beam was irradiated. The results are shown in Table 1. (Comparative Example 6) In Example 3, the transferred material was brought into close contact with the surface of the heat-sensitive adhesive layer of the heat-sensitive transfer recording medium, and in this state, the semiconductor laser-LT was applied from the back side of the heat-sensitive transfer recording medium.
090 MD / MF laser-except for irradiating light
An image recording material was manufactured and evaluated in the same manner as in Example 3. The results are shown in Table 1.

(Comparative Example 7) In Example 4, the surface of the heat-sensitive adhesive layer of the heat-sensitive transfer recording medium was brought into close contact with the material to be transferred, and in this state, the semiconductor laser-LT090MD / MF was applied from the back side of the heat-sensitive transfer recording medium. An image recording material was manufactured and evaluated in the same manner as in Example 4 except that the laser beam was irradiated. The results are shown in Table 1. (Comparative Example 8) In Comparative Example 1, the transferred material is brought into close contact with the surface of the heat-sensitive adhesive layer of the heat-sensitive transfer recording medium, and in this state, the semiconductor laser-LT is applied from the back side of the heat-sensitive transfer recording medium.
090 MD / MF laser-except for irradiating light
An image recording material was manufactured in the same manner as in Comparative Example 1 and evaluated. The results are shown in Table 1.

(Comparative Example 9) In Comparative Example 2, the material to be transferred is brought into close contact with the surface of the heat-sensitive adhesive layer of the heat-sensitive transfer recording medium, and in this state, the semiconductor laser-LT090MD / MF is applied from the back side of the heat-sensitive transfer recording medium. An image recording material was manufactured and evaluated in the same manner as in Comparative Example 2 except that the laser beam was irradiated. The results are shown in Table 1. (Comparative Example 10) In Comparative Example 3, the transferred material was brought into close contact with the surface of the heat-sensitive adhesive layer of the heat-sensitive transfer recording medium, and in this state, the semiconductor laser-L was applied from the back side of the heat-sensitive transfer recording medium.
An image recording material was manufactured and evaluated in the same manner as in Comparative Example 3 except that the laser beam of T090MD / MF was irradiated. The results are shown in Table 1.

[0070]

[Table 1]

(Example 5) -Production of heat-sensitive transfer recording medium-The following composition for forming a heat-sensitive transfer colorant layer was mixed and dispersed in a sand mill to prepare a coating solution, which was then applied on a polyethylene terephthalate film having a thickness of 6 μm. Was coated with a wire bar and dried to form a heat-sensitive transfer coloring material layer having a thickness of 1.5 μm. <The composition for forming the heat-sensitive transfer color material layer> Paraffin wax ... 3.0 parts [Nippon Seiro Co., Ltd., HNP-11] Carnauba wax: 2.0 parts Ethylene-vinyl acetate copolymer: 1 0.0 parts [Evaflex EV40Y manufactured by Mitsui-DeuPont Polychemical Co., Ltd.] Carbon black ・ ・ ・ ・ ・ ・ ・ ・ 3.0 parts Methyl ethyl ketone ・ ・ ・90.0 parts Cyclohexanone: 10.0 parts.

Next, the following composition for heat-sensitive adhesive layer was mixed and dispersed in a sand mill to prepare a coating solution, which was coated on the heat-sensitive transfer coloring material layer using a wire bar and dried to obtain a coating solution having a thickness of 1 μm. A heat sensitive adhesive layer was formed. <Composition for heat-sensitive adhesive layer> Ethylene-vinyl acetate copolymer: 2.0 parts [Evaflex EV210 manufactured by Mitsui / DuPont Polychemical Co., Ltd.] Rosin-modified resin ... 4.0 parts [Hariesta DS90 manufactured by Harima Kasei Co., Ltd.] Near infrared absorbing material ... Part [Mitsui Toatsu Dye Co., Ltd., SIR-103] Carbon Black ... ... 4.0 parts Methyl ethyl ketone ... 45.0 parts Toluene ... ..... 45.0 parts Cyclohexanone ..... 10.0 parts.

Then, on the back surface of the polyethylene terephthalate film (on the side opposite to the release layer), a silicone-modified urethane resin [SP-2105 manufactured by Dainichiseika Co., Ltd.].
Was applied and dried to form a backing layer. —Transfer Material— A polyethylene terephthalate film having a thickness of 100 μm was prepared as a transfer material.

-Image formation-The transfer target is brought into close contact with the surface of the heat-sensitive adhesive layer of the heat transfer recording medium, and in this state, the semiconductor laser LT090MD / MF [wavelength 830 nm, maximum light output] is applied from the back side of the transfer target. A laser beam of 100 mW, manufactured by Sharp Co., Ltd.] was condensed so that the beam diameter on the surface of the heat-sensitive adhesive layer would be 20 μm, and exposure was performed under two conditions of irradiation time of 2 μs and 10 μs. Obtained. —Evaluation— The transferred material was peeled off from the image recording material, and the state of the image transferred on the transferred material was observed with a microscope based on the same criteria as in Example 1 above. The results are shown in Table 2. (Example 6) Instead of the composition for forming a heat-sensitive transfer coloring material layer and the composition for forming a heat-sensitive adhesive layer of Example 5, the following composition for forming a heat-sensitive transfer coloring material layer and a composition for forming a heat-sensitive adhesive layer are described. An image recording material was manufactured and evaluated in the same manner as in Example 5 except that the respective materials were used. The results are shown in Table 2.

[0075]   <Composition for forming thermal transfer colorant layer>   Paraffin wax ... 4.0 parts   [HNP-11, manufactured by Nippon Seiro Co., Ltd.]   Carnauba wax: 2.0 parts   Microcrystalline wax ・ ・ ・ ・ ・ ・ ・ ・ 1.0   [Ni Mitsuwa Co., Ltd., Hi Mic 1080]   Ethylene-vinyl acetate copolymer: 1.0 part   [Eva Flex EV210, manufactured by Mitsui Deupon Polychemical Co., Ltd.]   Organic pigment: 2.0 parts   [Kayaset Blue FR manufactured by Nippon Kayaku Co., Ltd.]   Methyl ethyl ketone: 90.0 parts   Cyclohexanone ... 10.0 parts.

[0076]   <Composition for forming heat-sensitive adhesive layer>   Paraffin wax ... 1.0 part   [NIPPON SEIWA CO., LTD., HNP-3]   Ethylene-vinyl acetate copolymer: 3.0 parts   [Eva Flex EV210, manufactured by Mitsui Deupon Polychemical Co., Ltd.]   Phenolic resin: 3.0 parts   [Tamanor 100S manufactured by Arakawa Chemical Co., Ltd.]   Near-infrared absorbing material: 3.0 parts   [ICI product, NARROW BAND INFRARED ABSORBE RS 101756]   Dispersant: 0.5 part   Methyl ethyl ketone ... 45.0 parts   Toluene: 45.0 parts   Cyclohexanone ... 10.0 parts.

Example 7 Instead of the composition for forming a heat-sensitive transfer coloring material layer and the composition for forming a heat-sensitive adhesive layer of Example 5, the following composition for forming a heat-sensitive transfer coloring material layer and heat-sensitive adhesive were respectively prepared. An image recording material was produced and evaluated in the same manner as in Example 5 except that the layer composition was used. The results are shown in Table 2. <Composition for forming heat-sensitive transfer color material layer> Paraffin wax ... 1.0 part [NNP-11, manufactured by Nippon Seiro Co., Ltd.] Ethylene-vinyl acetate copolymer: 1.0 part [Evaflex EV40Y manufactured by Mitsui-Dyupon Polychemical Co., Ltd.] Phenol resin: 5.0 parts [Tamanor 100S manufactured by Arakawa Chemical Co., Ltd.] Carbon black ... ... 2.0 parts Methyl ethyl ketone ... 90.0 parts Cyclohexanone ... ... 10.0 copies.

[0078]   <Composition for forming heat-sensitive adhesive layer>   Ethylene-vinyl acetate copolymer: 2.0 parts   [Eva Flex EV210, manufactured by Mitsui Deupon Polychemical Co., Ltd.]   Polyester resin ... 3.0 parts   [Byron 200]   Phenolic resin: 3.0 parts   [Tamanor 100S manufactured by Arakawa Chemical Co., Ltd.]   Near-infrared absorbing material: 2.0 parts   [Mitsui Toatsu Dyestuff Co., Ltd., SIR-159]   Carbon black: 2.0 parts   Methyl ethyl ketone ... 45.0 parts   Toluene: 45.0 parts   Cyclohexanone ... 10.0 parts.

Example 8 Instead of the composition for forming a heat-sensitive transfer coloring material layer and the composition for forming a heat-sensitive adhesive layer of Example 5, the following composition for forming a heat-sensitive transfer coloring material layer and heat-sensitive adhesive were respectively prepared. An image recording material was produced and evaluated in the same manner as in Example 5 except that the layer composition was used. The results are shown in Table 2. <Thermal transfer colorant layer forming composition> Paraffin wax ... 4.0 parts [NIPPON SEIWA CO., LTD., HNP-11] Carnauba wax ... 1.0 part Ethylene-vinyl acetate copolymer ... 2 0.0 parts [Eva Flex EV40Y, manufactured by Mitsui Deupon Polychemical Co., Ltd.] Organic pigment: 2.0 parts [Kayaset Blue FR manufactured by Nippon Kayaku Co., Ltd.] Near infrared absorbing material: 2.0 parts [Mitsui Toatsu Dyestuffs Co., Ltd. ), SIR-103] Methyl ethyl ketone ... 90.0 parts Cyclohexanone ... ... 10.0 parts.

[0080]   <Composition for forming heat-sensitive adhesive layer>   Paraffin wax ... 1.0 part   Ethylene-vinyl acetate copolymer: 2.0 parts   [Eva Flex EV210, manufactured by Mitsui Deupon Polychemical Co., Ltd.]   Near-infrared absorbing material: 3.0 parts   [Mitsui Toatsu Dyestuff Co., Ltd., SIR-103]   Methyl ethyl ketone ... 45.0 parts   Toluene: 45.0 parts   Cyclohexanone ... 10.0 parts.

(Comparative Example 11) An image recording material was produced and evaluated in the same manner as in Example 6 except that the near infrared absorbing substance was omitted from the adhesive layer composition in Example 6. The results are shown in Table 2. (Comparative Example 12) An image recording material was manufactured and evaluated in the same manner as in Example 5 except that the heat-sensitive adhesive layer was not provided. The results are shown in Table 2.

(Comparative Example 13) In Example 5, the transferred material was brought into close contact with the surface of the heat-sensitive adhesive layer of the heat-sensitive transfer recording medium, and in this state, the semiconductor laser LT090MD / MF was applied from the back side of the heat-sensitive transfer recording medium. An image recording material was produced and evaluated in the same manner as in Example 5 except that the laser beam was applied. The results are shown in Table 2. (Comparative Example 14) In Example 6, the transfer target is brought into close contact with the surface of the heat-sensitive adhesive layer of the heat-sensitive transfer recording medium, and in this state, the semiconductor laser L is applied from the back side of the heat-sensitive transfer recording medium.
An image recording medium was manufactured and evaluated in the same manner as in Example 6 except that the laser beam of T090MD / MF was irradiated. The results are shown in Table 2.

(Comparative Example 15) In Example 7, the material to be transferred was brought into close contact with the surface of the heat-sensitive adhesive layer of the heat-sensitive transfer recording medium, and in this state, the semiconductor laser LT090MD / MF was applied from the back side of the heat-sensitive transfer recording medium. An image recording medium was manufactured and evaluated in the same manner as in Example 7 except that the laser beam was applied. The results are shown in Table 2. (Comparative Example 16) In Example 8, the transfer target was brought into close contact with the surface of the heat-sensitive adhesive layer of the heat-sensitive transfer recording medium, and in this state, the semiconductor laser L was applied from the back side of the heat-sensitive transfer recording medium.
An image recording medium was manufactured and evaluated in the same manner as in Example 8 except that the laser beam of T090MD / MF was irradiated. The results are shown in Table 2.

(Comparative Example 17) In Comparative Example 11, the transferred material was brought into close contact with the surface of the heat-sensitive adhesive layer of the heat-sensitive transfer recording medium, and in this state, the semiconductor laser LT090MD / MF was applied from the back side of the heat-sensitive transfer recording medium. An image recording material was manufactured and evaluated in the same manner as in Comparative Example 11 except that the laser beam was irradiated. The results are shown in Table 2. (Comparative Example 18) In Comparative Example 12, the transferred material is brought into close contact with the surface of the heat-sensitive adhesive layer of the heat-sensitive transfer recording medium, and in this state, laser light of the semiconductor laser LT090MD / MF is emitted from the back surface side of the heat-sensitive transfer recording medium. An image recording material was manufactured and evaluated in the same manner as in Comparative Example 12 except that irradiation was performed. The results are shown in Table 2.

[0085]

[Table 2]

[0086]

According to the heat-sensitive transfer recording material and the heat-sensitive transfer recording method of the present invention, a clear image with low energy and high resolution can be printed at high speed.

[Brief description of drawings]

FIG. 1 is a sectional view schematically showing a thermal transfer recording method of the present invention.

[Explanation of sign]

1 Thermal transfer recording medium 2 support 3 Release layer 4 Thermal transfer color material layer 5 Thermosensitive adhesive layer 6 Transferee

Claims (2)

[Claims] 1. A support, a release layer, a heat-sensitive transfer coloring material layer containing a coloring material and a heat-melting substance, and a heat-sensitive adhesive layer are laminated in this order, and the heat-sensitive transfer coloring material layer and the heat-sensitive A thermal transfer recording medium, wherein at least one of the adhesive layers contains a near-infrared absorbing substance. 2. The surface of the heat-sensitive adhesive layer of the heat-sensitive transfer recording medium according to claim 1 and the surface of the light-transmitting transfer target are brought into close contact with each other, and the heat-sensitive adhesive layer is applied from the back side of the transfer target. A heat-sensitive transfer recording method, which comprises irradiating a surface with laser light to form an image on the transfer-receiving member.