JPH05162164A - Apparatus for molding resin sealing part for electronic part - Google Patents

Abstract

PURPOSE:To confirm automatically existence of missing of a diode on a loading frame used for transfer molding. CONSTITUTION:A photoelectric switch 81 is moved along the arrangement of a diode against a loading frame 36. The photoelectric switch 81 is linearly moved by means of a motor 79 through a ball screw 76 and a nut 77. A magnet 87 is fixed on a supporting shaft 83 interlocking with a ball screw 76 through pulleys 84 and 85 and a belt 86 and a magnetic sensor 88 is provided to this magnet 87. When a laser beam from the photographic switch 81 hits a wire 2 of the diode, a pulse is output from the photoelectric switch 81. On every movement of the photoelectric switch 81 by a pitch distance of a wire-fitting groove 39 of the loading frame 36, a pulse is output from a magnet-type sensor 88. Existence and the position of missing of the diode on the loading frame 36 can be detected thereby. It is possible to detect accurately the position of missing.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin molding portion molding apparatus for electronic parts such as diodes.

[0002]

2. Description of the Related Art In an electronic component in which wires are coaxially projected in opposite directions from an element body, for example, an axial type diode 1 as shown in FIG. 16, the element body is resin-sealed with a thermosetting resin. It Note that FIG.
In FIG. 6, 2 is a wire and 3 is a resin sealing part. Transfer molding is performed at the time of the resin encapsulation.
An upper mold 11 and a lower mold 12 which can be opened and closed vertically as shown in FIG. Between these two molds 11 and 12, one or both of these parting line surfaces 11a,
Due to the recess formed in 12a, a shot cavity (not shown), a runner 13 communicating with this shot cavity, and a gate for the runner 13 are respectively provided at the time of mold clamping.
A plurality of mold cavities 15 communicating with each other via 14 are formed. The mold cavity 15 has the shape of the resin sealing portion 3. Further, the diode 1 is provided on the parting line surfaces 11a and 12a of the two molds 11 and 12, respectively.
Wire fitting grooves 16 and 17 into which the wire 2 is fitted. The wire fitting groove 16 of the upper mold 11 and the wire fitting groove 17 of the lower mold 17 are for fitting the upper half and the lower half of the wire 2 whose axial direction is horizontal, respectively. .. Along with this, a loading frame 21 as shown in FIG. 19 is used. This loading frame
The reference numeral 21 holds the diode 1 and is attached to the lower mold 12. That is, the loading frame 21 has a substantially H-shaped opening 22 into which the mold block on the lower mold 12 is inserted, and a large number of V-shaped openings are provided above each edge of the opening 22. A wire holding groove 23 is formed. These wire holding grooves 23 are formed in a pair of wires adjacent to each other with the opening 22 sandwiched therebetween.
Is to be retained. Further, a pair of handles 24 are provided on one outer surface of the loading frame 21 so as to project. Then, before molding the resin-sealed portion 3, the diode 1 before resin-sealed is mounted on the loading frame 21 manually by using a jig or the like. Then, with the upper die 11 and the lower die 12 opened, the loading frame 21 is mounted on the lower die 12 by hand or the like. Along with that, the diode 1 mounted on the loading frame 21 is mounted on the lower mold 12. That is, the wire 2 of the diode 1 is fitted into the wire fitting groove 17 of the lower mold 12, and the diode 1 is mounted on the lower mold 12. Next, after the lower die 12 is raised and clamped, the molten thermosetting resin is transferred from the shot cavity to the die cavity 15 via the runner 13 and the gate 14 and filled.
After that, the mold is opened and the diode 1 having the resin sealing portion 3 molded therein is taken out.

By the way, when the diode 1 is mounted on the loading frame 21, the mounting of the diode 1 may be missing. Also, loading frame 21
The diode 1 may fall off from the loading frame 21 when the sheet is transported. When the loading frame 21 in which the mounting of the diode 1 is missing is mounted on the lower mold 12 as it is, the mounting of the diode 1 in the lower mold 12 is naturally defective. That is, some of the wire fitting grooves 16 and 17 of the molds 11 and 12 that are not blocked by the wire 2 of the diode 1 are generated. However, if the resin is filled into the mold cavity as it is, it will be blocked. There is a problem that the resin enters into the wire fitting grooves 16 and 17 that are not provided, and eventually the resin leaks out of the molds 11 and 12 through the wire fitting grooves 16 and 17. In order to prevent such a problem, conventionally, before mounting the loading frame 21 to the lower mold 12, etc., by visual inspection,
Check whether the diode 1 is missing in the loading frame 21. If there is a missing diode, the diode 1 is almost the same length as the diode 1 and has the same diameter as the wire 2 at the position where the diode 1 is missing in the loading frame 21. I was supplementing dummy pins.

[0004]

As described above, conventionally, since the presence or absence of the diode 1 is visually confirmed, there is a problem that the operation takes time and the certainty of confirmation is poor. In particular, if the number of molded products to be taken in the molds 11 and 12 is as large as several hundreds, it is difficult to confirm reliably. Further, when trying to automate the resin encapsulation process of the diode 1, it is troublesome if it is necessary to visually confirm.

The present invention is intended to solve such a problem, and it is possible to automatically and surely and efficiently confirm the presence or absence of a missing electronic component in the loading frame while specifying the position thereof. An object of the present invention is to provide an apparatus for molding a resin-sealed portion of an electronic component, which is compatible with automation of a resin-sealed step.

[0006]

In order to achieve the above-mentioned object, the invention of claim 1 is a resin-sealed portion of an electronic component, wherein the element-body portion of the electronic component having a wire protruding from the element-body portion is resin-sealed. In the molding device, a loading frame on which a large number of electronic components are mounted side by side, and a molding machine on which the loading frame is mounted and which molds a resin sealing portion of the electronic component,
An electronic component missing detection mechanism is provided, and the electronic component missing detection mechanism includes an optical sensor for optically detecting the presence or absence of an object at a predetermined position, and an electronic sensor arranged along the arrangement of the electronic components mounted on the loading frame. A moving unit that moves the loading frame relative to the optical sensor so that the component passes through the predetermined position, and a relative position of the optical sensor with respect to the loading frame is detected in association with the moving unit. And a position detecting sensor.

Further, in a second aspect of the present invention, in the apparatus for molding a resin-sealed portion of a plurality of electronic components mounted on a loading frame in a straight line and at a constant pitch, the moving means includes a power source. And a power transmission means for converting the rotation of the drive shaft into a linear motion to linearly move the optical sensor and the loading frame with respect to each other. The amount of rotation of the drive shaft is detected.

[0008]

In the apparatus for molding the resin-sealed portion of the electronic component according to the first aspect of the present invention, when the element body of the electronic component is resin-sealed, first, a large number of electronic components before resin sealing are arranged on the loading frame. Put. Then, the electronic component missing detection mechanism detects whether or not the electronic component is missing in the loading frame. The electronic component missing detection mechanism has an optical sensor that optically detects the presence or absence of an object at a predetermined position.
The loading frame moves relative to the optical sensor along the arrangement of the electronic components mounted on the loading frame and so that the electronic components pass through the predetermined position. This allows the optical sensor to detect the presence or absence of electronic components in the loading frame,
Along with this, the position detecting sensor detects the relative position of the optical sensor with respect to the loading frame in conjunction with the moving means. Therefore, by collating the detection by the optical sensor and the detection by the position detection sensor, when the electronic component is missing, the missing position can be specified. When the electronic component is missing in the loading frame, for example, a dummy having a wire similar to that of the electronic component is attached to the position where the electronic component is missing in the loading frame. After that, the loading frame on which the electronic components and the dummy thereof are mounted is mounted on the molding machine to mold the resin sealing portion.

Further, in the apparatus for molding a resin-sealed portion of an electronic component according to a second aspect of the present invention, a large number of electronic components are mounted on the loading frame in a straight line and at a constant pitch. The drive shaft is rotationally driven by the power source, and the rotation of the drive shaft is converted into a linear motion by the power transmission means to linearly move the optical sensor and the loading frame. Along with this, the position detection sensor detects the rotation amount of the drive shaft, and the loading frame is detected from the detected rotation amount of the drive shaft in consideration of the relationship between the rotation amount of the drive shaft and the arrangement pitch of the electronic components. The missing position of the electronic component in can be specified.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the apparatus for molding a resin-sealed portion of an electronic component according to the present invention will be described below with reference to FIGS. In this embodiment, the resin-sealed electronic component is the axial type diode 1 as shown in FIG. 16 described above. Note that FIG. 2, FIG. 10, and FIG.
Reference numeral 4 shown in FIG. FIG. 7 shows a magazine 31 used when the diode 1 before resin sealing is carried into the main molding apparatus from the previous step and when the diode 1 after resin sealing is carried out from the main molding apparatus to the next step. ing. This magazine 31 is an elongated one in which a pair of side plate portions 32 facing each other in parallel are integrally connected by connecting portions 33 on both upper ends of the side plate portions 32. A large number of V-shaped wire holding grooves 34 are formed side by side on the upper side of the side plate portions 32. These wire holding grooves 34 are formed in a pair of opposing side plate portions 32 on both sides of each wire 2 of each diode 1.
Is to be retained. Thus, magazine 31
A large number of diodes 1 are arranged side by side on the top. Also shown in FIG. 8 is a loading frame 36, which has an opening 37, which is substantially H-shaped so that the magazine 31 It has four elongated opening grooves 38 having a size that allows passage. A large number of V-shaped wire holding grooves 39 are formed on the upper side of each edge portion along the longitudinal direction of the opening groove portions 38. These wire holding grooves 39 are for holding both wires 2 of each diode 1 in a pair of adjacent ones with the opening groove 38 interposed therebetween. In this way, a large number of diodes 1 are arranged on the loading frame 36 in two rows in the left-right direction, linearly and at a constant pitch p. The pitch p of the wire holding grooves 34 and 39 of the magazine 31 and the loading frame 36 is equal, and the number of wire holding grooves 39 along each opening groove 38 and the wire holding grooves 34 of the magazine 31 are equal. It is equal to the number.

FIG. 6 schematically shows the planar arrangement of each mechanism in the entire molding apparatus. In the figure,
41 is an electronic component supply mechanism, 42 is an electronic component missing detection mechanism, 43
Is a transfer molding machine, 44 is a resin supply mechanism, 45 is a gate break mechanism, 46 is a runner storage space, and 47 is an electronic component storage mechanism. Although not shown in FIG. 6, the present molding apparatus includes the loading frame 36, the electronic component supply mechanism 41, the electronic component missing detection mechanism 42, the transfer molding machine 43, the gate break mechanism 45, and the electronic component storage mechanism. It also has a loading frame transport mechanism that transports it to and from 47. That is, in FIG. 6, solid arrows indicate the transport path of the loading frame 36, and the loading frame 36 is circulated and transported in the molding apparatus. In addition, the dashed arrow indicates the transport path of the diode 1 from before resin sealing to after resin sealing. Furthermore, the dotted arrow indicates the flow of the thermosetting resin. The electronic component supply mechanism 41 transfers the diode 1 mounted in the magazine 31 before resin sealing to the loading frame 36. The electronic component missing detection mechanism 42 detects whether or not the diode 1 is mounted on the loading frame 36.
The transfer molding machine 43 includes a loading frame.
36 is mounted and the resin sealing portion 3 of the electronic component 1 is molded. The resin supply mechanism 44 is a transfer molding machine.
It supplies a thermosetting resin tablet to 43.
The gate break mechanism 45 separates the molded diode 1 of the resin encapsulation part 3 from the resin of the runner and cull part connected to the resin encapsulation part 3, and loads the resin of the runner and cull part into a loading frame. 36
It is removed from the container and put in the runner yard 46. The electronic component storage mechanism 47 transfers the diode 1 having the resin sealing portion 3 molded therein from the loading frame 36 to the magazine 31.

Next, the structure of the electronic component supply mechanism 41 will be described in more detail with reference to FIG. Posts on base 51
52 are erected, and the magazine set section is attached to the upper ends of these columns 52.
53 is provided and this magazine set section 53
A magazine relay section 54 is provided below the. The magazine setting section 53 and the magazine relay section 54 respectively include openable and closable magazine supports 55 and 56 that support the magazine 31 in a detachable manner from below. Also, the base 51
A lifter table 57 is provided above. The lifter table 57 is driven in the front-rear direction (direction orthogonal to the paper surface). A column 58 is erected on the lifter table 57, and a loading frame receiving lifter 59 is supported by the column 58. The loading frame receiving lifter 59 is driven in the vertical direction, and has a pair of loading frame receiving portions 60 at the top. A magazine receiving lifter is provided above the loading frame receiving lifter 59.
61 is provided. This magazine receiving lifter 61
Is vertically driven independently of the loading frame receiving lifter 59, and has four pairs of magazine receiving portions 62 on the upper portion. Further, 63 is a conveying plate, which is driven in the front-rear direction and moves in and out of the lifters 59 and 61.

Next, the structure of the electronic component missing detection mechanism 42 will be described in more detail with reference to FIGS. 1 to 3. A table 72 driven in the front-rear direction is supported on a base 71 driven in the up-down direction. The table 72 has the loading frame 36 mounted thereon. Further, a support top plate 73 is provided above the table 72,
The moving means 74 is provided below the supporting top plate 73. In this moving means 74, a ball screw 76 as a drive shaft is axially supported by a pair of left and right bearings 75 vertically extending from the support top plate 73 with the left-right direction as the axial direction, and at the lower side of the support top plate 73. The nut 77 is supported so as to be movable in the left-right direction and is prevented from rotating, and the ball screw 76 is screwed into the nut 77 in a penetrating state. A rotation output shaft 80 of a motor 79 as a power source fixed to the lower side of the support top plate 73 via a support 78 is coaxially connected to the ball screw 76. In this way, the rotation of the ball screw 76 rotationally driven by the motor 79 is converted into linear motion by the ball screw 76 itself which is a power transmission means and the nut 77, and the nut 77 moves linearly in the left-right direction. is there. A laser photoelectric switch 81, which is an optical sensor, is fixed to the lower side of the nut 77,
The photoelectric switch 81 moves in the left-right direction, which is the direction in which the diodes 1 are arranged with respect to the loading frame 36. The photoelectric switch 81 is for receiving the reflected light of the laser light emitted downward from the light emitting portion by the light receiving portion, and can detect the presence or absence of an object at a predetermined position from the presence or absence of the reflected light to the light receiving portion. However, when moving by the moving means 74,
The wire 2 of the diode 1 mounted on 36 passes through the predetermined position. Further, a support shaft 82 is fixed to a lower portion of the support top plate 73, and a support shaft 83 is provided with the left-right direction as an axial direction.
Is rotatably supported, and a timing belt 86 is stretched between a gear-shaped pulley 84 fixed to the support shaft 83 and a gear-shaped pulley 85 positioned above and fixed to the ball screw 76. ing. The gear ratio of the pulleys 84 and 85 is such that the pulley 81 is moved while the photoelectric switch 81 moves by the arrangement pitch p of the diodes 1 in the loading frame.
The 84 and the spindle 83 are set to rotate once. A magnet 87 is fixed to the outer peripheral surface of the support shaft 83, and a magnetic sensor 88 as a position detecting sensor is fixed to the bracket 82 below the magnet 87. The magnetic sensor 88 outputs a pulse signal when the magnet 87 comes under the support shaft 83 and approaches it. Therefore, this magnetic sensor 88
Thus, the rotation amount of the ball screw 76 can be detected, and from this, the lateral position of the photoelectric switch 81 with respect to the loading frame 36 can be detected. And FIG.
As shown in, photoelectric switch 81 and magnetic sensor 88
The output from is input to the computer 91. The computer 91 has counting means 92 and display control means 93 as software functions. The counting means 92 counts the pulses from the magnetic sensor 88. Further, the display control means 93 refers to the counting by the counting means 92, and when it is determined based on the output of the photoelectric switch 81 that the diode 1 is missing in the loading frame 36, the display means 94 causes the diode 1 to be missing. In addition to notifying that there is an error, the missing position in the loading frame 36 is displayed.

FIG. 11 shows a loading frame transfer mechanism 101 for transferring the loading frame 36 from the transfer plate 63 to the electronic component missing detection mechanism 42. In this loading frame transfer mechanism 101, a pair of upper and lower guide rods 104 extending in the front-rear direction are fixed to a pair of front and rear supporting side plates 103 vertically provided on a supporting top plate 102. A pair of front and rear sliders 105 are supported on the guide rods 104 so as to be movable in the front and rear directions. The transport plate 106 is fixed to the lower ends of the front and rear sliders 105. Chucks 108 which are located on both front and rear sides of the lower surface of the transport plate 106 and which are opened and closed by driving the air cylinder device 107 are provided. Also, the supporting side plate 10
The drive mechanism base 109 fixed to the lower end of 3 has a drive pulley 11 driven by a motor (not shown).
0 is attached to the front end and the driven pulley 111
Is pivoted on the rear end. And these pulleys 110
, 111 is stretched around a belt 112, and the conveyor plate 106 is coupled to this belt 112 via a coupling 113. As a result, as the belt 112 rotates, the transport plate 106 moves in the front-rear direction.

Next, the structure of the transfer molding machine 43 will be described in more detail with reference to FIGS. 12 and 13. The transfer molding machine 43 includes a mold clamping mechanism 121 and a transfer mechanism 122. Here, first, the structure of the mold clamping mechanism 121 will be described. Reference numeral 123 is a base, and 124 is an upper platen located above the base 123. The base 123 and the upper platen 124 are connected and fixed by four rods 125. Also these rods 1
The lower platen 126 is supported by the base 25 so as to be located between the base 123 and the upper platen 124 so as to be vertically movable. On the lower surface of this lower platen 126, there is an annular rotary disk.
127 is rotatably supported horizontally. This turntable 127
Is driven to rotate by a predetermined angle by an air cylinder device (not shown). Further, on the lower surface of the rotary disc 127, six cylindrical upper supports 128 are vertically provided so as to be located on the circumference around the rotation axis of the rotary disc 127. On the other hand, on the base 123, six hydraulic cylinder devices 129 which are located on a cylindrical surface passing through the upper support 128 and respectively correspond to the upper supports 128 are attached. Then, lower supports 130 are provided upright on the piston rods of these hydraulic cylinder devices 129 that move up and down. A stator of an electric direct drive motor 131 is fixed on the base 123. Although not shown, a ball screw fixed to the lower platen 126 is screwed into a nut fixed to a horizontally rotating rotor of the direct drive motor 131. With such a configuration, the lower platen 126 moves up and down as the rotor of the direct drive motor 131 horizontally rotates. The transfer mechanism 122 is provided on the upper platen 124 and has a plunger 134 which is vertically driven by a motor 132 via a nut (not shown) and a ball screw 133.

On the lower surface side of the upper platen 124, an upper mold 14
1 is installed, and the lower mold 14
2 is installed. These upper mold 141 and lower mold 142
As shown in FIGS. 12 and 13, the mold blocks 145, 146, and 146 are formed on the facing surfaces of the mold plates 143, 144, respectively.
The mold plates 143, 1 are fixed together with 147, 148 fixed.
44 are spacer blocks 149 and 150 and mounting plates 151 and 1
It is attached to the platens 124 and 126 via 52 and the lower mold 142 is moved vertically with the lower platen 126 by the driving of the mold clamping mechanism 121 to clamp and open the mold. Further, between the clamped molds 141 and 142, the lower surface forming the parting line surface of the mold blocks 145 and 147 of the upper mold 141 and the parting line surface of the mold blocks 146 and 148 of the lower mold 142. The claw 153, the runner 154 communicating with the cull 153, and the gate to the runner 154 are formed by the recesses formed in one or both of
A plurality of mold cavities 156 are formed to communicate with each other via 155. These mold cavities 156 are
Many are located side by side in multiple rows. Although not shown, the upper mold 141 is opposed to the cull 153 on the lower mold 142 side.
On the side, the plunger 13 of the transfer mechanism 122 is
There is a pot into which 4 can be slidably inserted. Furthermore, on the parting line surface of both molds 141 and 142,
Wire-fitting grooves 157 and 158, into which the wire 2 of the diode 1 is fitted, are formed in each case.

Next, the operation of the above configuration will be described. When the element body 3 of the diode 1 is sealed with resin, first, the electronic component supply mechanism 41 is used to set the magazine.
The diode 1 before resin sealing placed on 31 is transferred to the loading frame 36. This transfer is basically performed by referring to FIG.
By passing the magazine 31 on which the diode 1 is mounted through the opening groove 38 of the loading frame 36 from the top to the bottom as shown in FIG. As a result, both wires 2 of the diode 1 move from the wire holding groove 34 of the magazine 31 to the wire holding groove 39 of the loading frame 36, and the diode 1 is placed on the loading frame 36. Next, the transfer of the diode 1 will be described in more detail. From the previous step, a magazine cassette 31A packed with a magazine 31 on which the diode 1 before resin sealing is placed is sent, and this is placed on the magazine setting section 53. And
Magazine cassette 31A with magazine support 55 closed
After pulling out the bottom plate of the, the magazine receiving lifter 61 is raised, and the magazine receiving section 62
Receive magazine 31 at 53. Then, magazine support 55
After opening, the magazine receiving lifter 61 that has received the magazine 31 is slightly lowered. And magazine support 55, 56
Is closed and the magazine 31 received by the magazine receiving lifter 61 is held in the magazine relay section 54. After that, the magazine receiving lifter 61 is lowered to the origin position shown in the figure. In addition, the carrier plate 63 on which the loading frame 36 is mounted
Moves forward and is positioned above the loading frame receiving lifter 59. Here, the loading frame receiving lifter 59 is slightly raised to receive the loading frame 36 from the transport plate 63. Then, the carrier plate 63 moves backward. Then, the receiving lifters 59 and 61 are raised, and the magazine receiving lifter 61 is moved to the magazine 31 in the magazine relay section 54.
To receive. Then, after opening the magazine support 56, the magazine receiving lifter 61 first descends. As a result, the diode 1 mounted on the magazine 31 received by the magazine receiving lifter 61 is transferred to the loading frame 36. Then, after the loading frame receiving lifter 59 is slightly lowered, the transport plate 63 is moved forward. Then, the magazine receiving lifter 61 is further lowered, and the empty magazine 31 on this magazine receiving lifter 61 is transferred onto the transport plate 63. The carrier plate 63 moves backward with the empty magazine 31 still loaded. After that, these empty magazines 31 are transferred to the electronic component storage mechanism 47 by an empty magazine transfer mechanism (not shown).

By the way, there is a possibility that the diode 1 is missing in the loading frame 36 in the state where the diode 1 before resin sealing is mounted on the loading frame 36 as described above. That is, the diode 1 may already be missing in the magazine 31 itself sent from the previous process, or the diode 1 may be removed when the diode 1 is transferred to the loading frame 36 or during the transfer process of the loading frame 36. There is a possibility of falling out. Therefore, after mounting the diode 1 before resin sealing on the loading frame 36 and before mounting the loading frame 36 on the lower mold 102, the electronic component missing detection mechanism 42 causes the loading of the diode 1 on the loading frame 36. Detect if there are any omissions. Therefore, first, after the transport plate 63 is retracted, the lifter table 57 receiving the loading frame 36 on which a large number of diodes 1 are mounted side by side by the loading frame receiving lifter 59 is retracted. Then, the loading frame receiving lifter 59 is raised, and further, the chuck 108 of the loading frame transport mechanism 101 is closed. Then, the receiving lifters 59 and 61 are lowered, and the chuck 108 holds the loading frame 36. Then, the transport plate 106 of the loading frame transport mechanism 101 retracts,
The loading frame 36 is located on the table 72 of the electronic component missing detection mechanism 42. Here, after the table 72 is slightly raised together with the base 71 and the loading frame 36 is placed on the table 72, the chuck 108 is opened. further,
After the table 72 is slightly lowered together with the base 71, the transport plate 106 is moved forward. In this initial state, the photoelectric switch 81 has the opening groove 38 on the rear side of the loading frame 36.
Is located slightly to the left of the wire holding groove 39 at the left end. This is the scanning start position shown in FIG. Then, the ball screw 76 rotates at a constant speed by the drive of the motor 79, and along with this, the photoelectric switch 81 linearly moves to the right at a constant speed together with the nut 77 screwed onto the ball screw 76. To go. Laser light is emitted from the photoelectric switch 81, and the laser light scans the left and right opening groove portions 38 on the rear side of the loading frame 36 along the arrangement of the diodes 1 there. When scanning of these two opening groove portions 38 is completed, the table 72
Is retracted, the photoelectric switch 81 is
The opening groove 38 on the front side of 36 is located slightly to the right of the wire holding groove 39 at the right end. With this as the scanning start position, this time the photoelectric switch 81 linearly moves to the left at a constant speed, and the laser light from this photoelectric switch 81 is aligned with the opening groove portions 38 on the front side of the loading frame 36 arranged side by side. Are scanned along the array of diodes 1 there. During such scanning, a pulley 85 that rotates integrally with the ball screw 76
The rotation is transmitted from the belt to the pulley 84 via the belt 86, and the magnet 87 provided on the support shaft 83 that rotates integrally with the pulley 84 periodically approaches and separates from the magnetic sensor 88. As a result, every time the photoelectric switch 81 moves by the pitch p of the wire holding groove 39 of the loading frame 36, a pulse signal is output from the magnetic sensor 88 as shown in FIG. The pulse from this magnetic sensor 88 is
The counting means 92 counts. Then, from this count, the number of rotations of the ball screw 76 can be known, and from this, the relative position of the photoelectric switch 81 with respect to the loading frame 36 can be known. On the other hand, if the laser light emitted from the light emitting portion of the photoelectric switch 81 hits the wire 2 of the diode 1 on the loading frame 36, this wire 2
Then, the laser light is reflected, the reflected light is incident on the light receiving portion of the photoelectric switch 81, and the photoelectric switch 81 outputs a pulsed signal. That is, when the laser beam passes between the pair of wire holding grooves 39 holding the wire 2, the photoelectric switch 81 outputs a pulse, but the wire 2 is missing.
When laser light passes through the space, the photoelectric switch 81 does not output a pulse. Therefore, each time the photoelectric switch 81 moves by the pitch p of the wire holding groove 39, the magnetic sensor
Since a pulse is output from 88, this magnetic sensor 88
The presence or absence of the wire 2 of the diode 1 in the wire holding groove 39 can be determined by checking whether or not there is a pulse output from the photoelectric switch 81 corresponding to each pulse from. Further, by counting the pulses from the magnetic sensor 88 by the counting means 92, the position of the wire holding groove 39 where the wire 2 of the diode 1 is missing in the loading frame 36 can be known. In this way, by collating the detection by the photoelectric switch 81 and the detection by the magnetic sensor 88, when the diode 1 is missing in the loading frame 36, the missing can be known and the missing position can be specified. If the mounting of the diode 1 on the loading frame 36 is missing, the display unit 94 informs and displays that the mounting of the diode 1 is missing and the missing position. In this case, a dummy pin is manually attached to the pair of wire holding grooves 39 in which the diode 1 is missing in the loading frame 36, either on the table 72 or after the loading frame 36 is carried out from the table 72. This dummy pin has substantially the same length as the entire diode 1, and has the same diameter as the wire 2, and can be distinguished from the wire 2 by color. For example, the wire 2 of the axial type diode 1 is a copper wire plated with gold, but the dummy pin is a simple copper wire without plating. The dummy pin is placed on the magazine 31, for example, and the electronic component supply mechanism 41
It is installed at an appropriate position such as.

After detecting whether or not the diode 1 is missing in the loading frame 36 as described above, the loading frame for the table 72 is loaded.
The loading frame 36 is returned to the loading frame receiving lifter 59 by the loading frame transfer mechanism 101 through a process reverse to that of loading the 36. Next, the lifter table 57 is moved forward to position the loading frame 36 below the carrying plate of a loading frame carrying mechanism (not shown) similar to the loading frame carrying mechanism 101. Here, after the loading frame receiving lifter 59 on which the loading frame 36 is placed moves up, the chuck of the loading frame transfer mechanism is closed. Then, the loading frame receiving lifter 59 descends and the chuck holds the loading frame 36. After that, the transfer plate held by the loading frame 36 moves to the right, and FIG.
Upper mold 141 and lower mold 142 in the mold open state as shown in FIG.
Enter between Then, by driving the direct drive motor 131 of the mold clamping mechanism 121, the lower platen 126 and the lower mold 142 rise. As a result, as shown in FIGS. 14 and 15, the loading frame 36 is mounted on the lower mold 142. At this time, the loading frame 36 moves down relative to the lower mold 142,
The wire 2 of the diode 1 extends from the wire holding groove 39 of the loading frame 36 to the wire fitting groove 158 of the lower mold 142.
Then, the diode 1 is transferred from the loading frame 36 to the lower mold 142. In addition, wire 2
In the horizontal state, the lower half thereof fits in the wire fitting groove 158 of the lower mold 142. Then, after the chuck is opened, the lower mold 142 is lowered together with the lower platen 126. afterwards,
The transport plate moves to the left and returns. Then, the resin supply mechanism 44 applies a thermosetting resin tablet to the upper die 141.
The mold is clamped as well as loaded in the pot of, but at the time of this mold clamping operation, first the electric direct drive motor.
Driven by 131, lower platen 126 and lower mold 142
Rises. Then, the turntable 127 rotates a predetermined angle,
The upper support 128 is aligned with the lower support 130. afterwards,
By pressing the hydraulic cylinder device 129, the lower support 13
0 pushes up the upper support 128, and the lower mold 142 further rises, and as shown in FIGS. 13 and 15, this lower mold is
142 is joined to the upper mold 141, and the mold clamping is completed. In addition,
In this state, the mold clamping pressure is such that the lower supports are in contact with each other.
Received by 130 and top support 128. In the mold clamped state, the upper half of the wire 2 of the diode 1 is fitted in the wire fitting groove 157 of the upper mold 141. Then, the thermosetting resin loaded in the pot of the upper mold 141 flows into the mold cavity 156 from the cull 153 through the runner 154 and the gate 155 by the descending plunger 134 and is filled therein. Thus, the resin sealing portion 3 of the diode 1
Is molded.

Then, after the curing time, the pressure applied to the hydraulic cylinder device 129 is released, the turntable 127 rotates a predetermined angle, the upper support 128 comes off the lower support 130, and then the direct drive motor 131 By driving, the lower mold 142 is lowered, and the upper mold 141 and the lower mold 142 are opened. With this mold opening, transfer molding machine 43
The resin-sealed diode 1 is released from the mold together with the loading frame 36 by the ejection mechanism incorporated in the. Thereafter, the loading frame carrying mechanism (not shown) carries the loading frame 36 from the lower mold 142 to the gate break mechanism 45 together with the molded diode 1 of the resin sealing portion 3 and the like. Then, in the gate break mechanism 45, the diode 1 and the resin of the runner 154 and the cull 153 portion connected to the resin sealing portion 3 are separated at the gate 155 portion. Then runner
154 and Cull 153 resin is loading frame
It is removed from 36 and falls into runner yard 46. Then,
By a loading frame transfer mechanism (not shown),
The loading frame 36 with the remaining diode 1 is conveyed to the electronic component storage mechanism 47. In the electronic component storage mechanism 47, the resin-sealed diode 1 is transferred from the loading frame 36 to the magazine 31. This transfer is
Basically, the empty magazine 31 is passed through the opening groove portion 38 of the loading frame 36 on which the diode 1 is mounted from the bottom to the top. As a result, both wires 2 of the diode 1 move from the wire holding groove 39 of the loading frame 36 to the wire holding groove 34 of the magazine 31, and the diode 1 is placed on the magazine 31. On the other hand, the empty loading frame 36 is returned to the electronic component supply mechanism 41 by a loading frame transport mechanism (not shown).

By the way, when the resin sealing portion 3 is molded with the dummy pin mounted on the loading frame 36, the resin sealing portion is also molded on the dummy pin, and the diode molded by the resin sealing portion 3 is molded. 1 and the molded dummy pin of the resin sealing portion cannot be distinguished in terms of shape. However, due to the difference in color of the wire 2, the diode 1 and the dummy pin in which the resin sealing portion is molded can be distinguished. By utilizing this, the dummy pin may be removed later.

As described above, according to the configuration of the above embodiment, the diode 1 before resin sealing is loaded into the loading frame.
After mounting on 36, this loading frame 36
Before mounting on the 142, the electronic component missing detection mechanism 42
Whether or not the diode 1 is missing in the loading frame 36 can be automatically confirmed, and this confirmation can be performed reliably and efficiently. Therefore, it is advantageous for automating the molding process of the resin sealing portion 3 of the diode 1 as in the above embodiment. Further, since it is possible to automatically confirm whether or not the diode 1 is missing in the loading frame 36,
The wire fitting grooves 157 and 158, in which the wire 2 of the diode 1 is missing in 141 and 142, can be reliably closed by the dummy pins. Therefore, when the mold cavity 156 is filled with the resin, the resin enters the unfilled wire fitting grooves 157 and 158, and the mold 141 and 158 are inserted through the wire fitting grooves 157 and 158.
142 It is possible to reliably prevent resin from leaking out. In addition to the photoelectric switch 81 for detecting the presence or absence of the wire 2 of the diode 1, a magnetic sensor for position detection
By providing 88, the position where the diode 1 is missing in the loading frame 36 can be specified, and the work of attaching the dummy pin to this missing position becomes easy. By the way, for example, the moving speed of the photoelectric switch 81 is constant, and the laser light loading frame of the photoelectric switch 81 is used.
If the scanning start position in 36 is definitely set to a fixed position, the scanning start time and the photoelectric switch are considered in consideration of the predetermined moving speed of the photoelectric switch 81, the scanning start position, and the pitch p of the wire fitting groove 39. It is theoretically possible to determine the missing position of the diode 1 in the loading frame 36 from the time interval of the pulse output from 81. However, this is actually difficult due to some variations in the scan start position, fluctuations in the rotation speed of the motor 79, or other errors. On the other hand, in the above-described embodiment, since the magnetic sensor 88 that periodically generates a pulse is interlocked with the movement of the photoelectric switch 81, the instability of driving the photoelectric switch 81 and the influence of various errors are affected. Therefore, the missing position of the diode 1 in the loading frame 36 can be accurately and reliably detected. In the embodiment, the photoelectric switch 81 is linearly moved through the ball screw 76 and the nut 77 which are rotationally driven by the motor 79, and the rotation speed of the ball screw 76 is detected by the magnetic sensor 88. Not only is it simple, but the arithmetic processing is also simple. For example, as in the above-described embodiment, the rotation of the ball screw 76 is transmitted to the support shaft 83 having the magnet 87 fixed to the magnetic sensor 88 via the pulleys 84 and 85 and the belt 86, and the photoelectric switch 81 is wire-fitted. If a pulse is output from the magnetic sensor 88 every time the pitch p of the groove 39 moves, this pulse only needs to be counted and no special arithmetic processing is required. Further, when the pitch p of the wire fitting groove 39 is changed due to the replacement of the molds 141 and 142, the pulleys 84 and 85 and the belt 86 are replaced, and the photoelectric switch 81 is also connected to the wire fitting groove 39. A pulse may be output from the magnetic sensor 88 every time the pitch p is moved. On the other hand, pulleys 84 and 85 and belt 86
It is also possible to deal with the change of the pitch p by the arithmetic processing in the computer 91 without exchanging the parts, and in this case, the pulleys 84 and 85 and the belt 86 part itself are unnecessary. However, in order to reduce the instability of the drive of the photoelectric switch 81 and various errors as described above, the relationship between the pitch p of the wire fitting groove 39 and the interval of the pulse output from the magnetic sensor 88 is as simple as possible. Better.

The present invention is not limited to the above embodiment, but various modifications can be made. For example,
In the above embodiments, the resin sealing of the axial type diode 1 is described as an example, but the present invention is not limited to this, and the present invention can be applied to resin sealing of other electronic components.
Further, in the above embodiment, the motor having the rotation output shaft 80.
Although the photoelectric switch 81 is linearly driven by the ball screw 76 and the nut 77 by 79, the photoelectric switch 81 may be linearly driven by the motor having the rotation output shaft through the pulley and the belt. Good. In the above embodiment, the loading frame 36 is fixed and the photoelectric switch 81 is moved with respect to the loading frame 36. However, the photoelectric switch is fixed,
The loading frame may be moved with respect to this photoelectric switch. Further, the optical sensor for detecting the presence or absence of the electronic component is not limited to the laser type photoelectric switch as in the above-mentioned embodiment, and it is for position detection for detecting the relative position of the optical sensor with respect to the loading frame. The sensor is not limited to the magnetic sensor as in the above embodiment.

[0024]

According to the invention of claim 1, an optical sensor for optically detecting the presence or absence of an object at a predetermined position,
An electronic component missing detection mechanism having a moving means for moving the loading frame relative to the optical sensor along the arrangement of the electronic components mounted on the loading frame and so that these electronic components pass through predetermined positions is provided. Thus, after mounting the electronic components before resin sealing on the loading frame, and before mounting the loading frame on the molding machine, it is possible to automatically confirm whether or not the electronic components are missing in the loading frame. This ensures reliable and efficient operation, and is also advantageous in automating the resin sealing process for electronic components. Moreover, since the electronic component missing detection mechanism has a position detection sensor that detects the relative position of the optical sensor with respect to the loading frame in conjunction with the moving means, it may cause instability of driving by the moving means and various errors. The position where the electronic component is missing in the loading frame can be accurately and surely specified without being affected, and the work for dealing with the missing electronic component is facilitated.

Further, according to the second aspect of the present invention, while a large number of electronic components are mounted on the loading frame linearly and side by side at a constant pitch, the moving means is driven by a power source for rotation. A shaft, and a power transmission means for converting the rotation of the drive shaft into a linear motion to linearly move the optical sensor and the loading frame,
Since the position detection sensor detects the rotation amount of the drive shaft, it is possible to reliably and efficiently confirm the presence or absence of a missing electronic component by specifying its position with a simple structure and arithmetic processing.

[Brief description of drawings]

FIG. 1 is a transverse cross-sectional view of an electronic component missing detection mechanism, showing an embodiment of an apparatus for molding a resin-sealed portion of an electronic component of the present invention.

FIG. 2 is a vertical sectional view of the electronic component missing detection mechanism of the same.

FIG. 3 is a right side view of the position detecting sensor portion of the above.

FIG. 4 is a block diagram of the same electronic component missing detection mechanism as above.

FIG. 5 is a timing chart showing the operation of the electronic component missing detection mechanism of the above.

FIG. 6 is a schematic plan view of the entire molding apparatus of the above.

FIG. 7 is a perspective view of the same magazine.

FIG. 8 is a perspective view of the same loading frame.

FIG. 9 is a front view of the above electronic component supply mechanism.

FIG. 10 is a cross-sectional view illustrating transfer of a diode between the magazine and the loading frame of the same.

FIG. 11 is a right side view of the same loading frame transport mechanism as above.

FIG. 12 is a front view of the transfer molding machine in the mold open state.

FIG. 13 is a front view of the transfer molding machine in the mold clamping state.

FIG. 14 is a plan view of the upper and lower molds.

FIG. 15 is a sectional view of a part of the mold in the same mold clamping state.

FIG. 16 is a perspective view of a diode.

FIG. 17 is a perspective view of a part of a mold showing an example of a conventional apparatus for molding a resin-sealed portion of an electronic component.

FIG. 18 is a partial cross-sectional view of the same mold.

FIG. 19 is a perspective view of the same loading frame.

[Explanation of symbols]

 1 Diode (electronic component) 2 Wire 3 Resin sealing part 4 Element body part 36 Loading frame 42 Electronic component missing detection mechanism 43 Molding machine (transfer molding machine) 74 Moving means 76 Ball screw (driving shaft, power transmitting means) 77 Nut (Power transmission means) 79 Motor (power source) 81 Laser photoelectric switch (optical sensor) 88 Magnetic sensor (position detection sensor)

Continuation of front page (51) Int.Cl. ⁵ Identification code Office reference number FI Technical display area B29K 105: 20 B29L 31:34 4F

Claims (2)

[Claims] 1. A resin-sealed portion molding apparatus for an electronic component, which encapsulates an element body portion of an electronic component having a wire protruding from the element body portion, with a loading frame on which a large number of electronic components are mounted side by side, and the loading frame. Equipped with a molding machine for molding a resin sealing portion of an electronic component, and an electronic component missing detection mechanism, and this electronic component missing detection mechanism,
An optical sensor for optically detecting the presence or absence of an object at a predetermined position, and a loading on the optical sensor along the arrangement of the electronic components mounted on the loading frame and so that these electronic components pass through the predetermined position. A resin sealing of an electronic component, comprising: moving means for relatively moving the frame, and a position detection sensor for detecting a relative position of the optical sensor with respect to the loading frame in association with the moving means. Stop forming device. 2. A resin-sealed portion molding apparatus for electronic parts, wherein a large number of electronic parts are mounted linearly and at a constant pitch on a loading frame, wherein the moving means includes a drive shaft rotatably driven by a power source. And a power transmission unit that converts the rotation of the drive shaft into a linear motion to linearly move the optical sensor and the loading frame with each other, and the position detection sensor detects the rotation amount of the drive shaft. An apparatus for molding a resin-sealed portion of an electronic component according to claim 1, wherein