JPH05160310A - Electronic device cooled by fluid - Google Patents

Abstract

PURPOSE:To equalize the temperatures of from high heating density elements to low heating density elements, and reduce temperature ripple by forming electronic devices into modules according to the heating densities of the elements, and using boiling heat conduction and convection heat conduction each in its proper way. CONSTITUTION:A high heating density module unit 1 consisting of a high heating density element is arranged on the downstream side of a refrigerant circulation system, and a low heating density module unit 2 consisting of a low heating density element on the upstream of the refrigerant circulation system. Refrigerant liquid, which has passed each unit 1 and 2, is heat-exchanged with a liquid cooler 4, and then, it is supplied to a pump 3 so as to cool each unit 1 and 2 again directly. Hereby, an electronic device, which is high in reliability and in which the processing operation is high speed, is provided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device in which a semiconductor element or the like is immersed in a liquid and directly cooled, and more particularly to an ultra high speed computer provided with a high heat density element.

[0002]

2. Description of the Related Art With the progress of high integration technology of semiconductor devices and high density mounting of devices on a substrate, a liquid cooling super-immersion system in which a large amount of heat generated from the device is removed by directly immersing the device in a liquid High speed computers have been proposed. JP-A-59
-145548 discloses a logic module in which a large number of printed circuit boards on which a large number of elements are mounted are stacked in a stack.
Modules such as memory module, memory module, power module, etc.
Liquid cooling computer that immerses all the cooling units together in a single refrigerant container and forcibly circulates the refrigerant liquid between the multiple printed circuit boards stacked in a stack using the liquid circulation pump provided outside the container to cool the device. -A device is disclosed.
In this device, since the heat generation density of the element is relatively small at 1 W / cm ² or less, the element can be satisfactorily cooled in the single-phase flow state of the liquid refrigerant, that is, in the state where boiling bubbles are not generated.

Further, a liquid cooling computer device for cooling the high heat generation density element by causing boiling on the element surface is disclosed in Japanese Patent Publication No. 48-.
It is disclosed in Japanese Patent No. 6301. In this device, a computer is composed of an assembly of a plurality of small chambers each having at least one electronic element module, the pressure in each small chamber is made uniform, and the liquid refrigerant is independently supplied to each small chamber unit. A method of supplying a flow rate is shown.

[0004]

SUMMARY OF THE INVENTION In the prior art disclosed in Japanese Patent Laid-Open No. 145548/1984, the heat generation density of the device is so large that heat cannot be removed unless boiling is intensely generated. In a computer device, a problem of gas-liquid two-phase flow in which boiling bubbles are mixed in the refrigerant flow, that is, time variation of the element temperature due to instability of the refrigerant circulation system or insufficient liquid supply to the element It does not take into account such factors as output and output.

Further, since the heat generation densities of the respective elements such as the logic LSI and the memory LSI mounted on each module unit are almost the same, if the liquid refrigerant of the same supercooling temperature is evenly flowed to each module unit, The element temperature is kept almost the same, but no consideration is given to the case where the heat generation density of each element is different by about two digits as seen in recent ultra-high speed computers, and each element temperature cannot be made uniform. There is a problem.

Furthermore, since each module unit is collectively immersed in one refrigerant container, all the refrigerant in the container must be drained every time the module or the element is repaired. Also, problems such as contamination of the computer by the refrigerant occur.

Further, in the apparatus described in Japanese Patent Publication No. 48-6301, although the coolant liquid is circulated by the pump, its role is merely to set the free liquid level provided above the electronic element module group. It just lifts the refrigerant liquid to its buffer reservoir. The supply of the refrigerant liquid to each small chamber containing the module and the discharge of the two-phase refrigerant containing boiling bubbles from each small chamber use the position head of the refrigerant liquid lifted in the buffer reservoir. Only. Further, due to the practical restriction of the installation height of the buffer reservoir, the position head of the refrigerant liquid cannot be so large that the flow rate of the refrigerant liquid supplied to each small chamber cannot be increased.

As a result, the flow velocity of the refrigerant liquid flowing on the surface of the element mounted on the module is unavoidably small, and the heat transfer form is substantially similar to the natural convection type pool boiling heat transfer. There is a problem that too much heat cannot be dissipated from the element. In order to compensate for this lack of heat radiation, studs (radiation fins) are attached to the back of each element in this device. However, even if studs are used, if the required heat radiation increases, a larger amount of liquid supply will be required. It is necessary to secure it to prevent liquid dripping. Further, mounting the studs on the individual elements poses an industrial problem in terms of manufacturing cost and handling. Further, since the position head is used for supplying the refrigerant liquid, the adjustment range of the pressure in each small chamber and the saturation temperature of the refrigerant uniquely determined by this pressure is very narrow. Therefore, in boiling heat transfer in which the amount of heat radiated from the element is almost determined by the difference (superheat) between the element surface temperature and the saturation temperature of the refrigerant, for example, in the logic module and the memory module, the heat generation density is It becomes impossible to make the junction temperatures of the extremely different elements uniform.

Further, in order to remove the influence of the gas-liquid two-phase refrigerant flow discharged from each small chamber on the entire flow system, the refrigerant discharge output conduit provided in each small chamber separates gas and liquid and vapor refrigerant. And a single phase separation column that collects the liquid refrigerant. However, this phase separation column operates normally at a low flow rate where gas and liquid are completely separated, and when the element heat generation amount is large and a high flow rate is required, the gas phase inside the phase separation column is increased. And the flow of liquid phase becomes a counter flow and the flow becomes more unstable. Also, in order to avoid this problem, even if the buffer reservoir is eliminated and the pump discharge pipe is directly connected to the input column that distributes the refrigerant liquid to each small chamber to increase the refrigerant circulation amount, there is a phase separation column. The whole flow system including the pump becomes unstable. As a result, there is a problem in that each element cannot be cooled normally and normal operation of the computer cannot be expected.

An object of the present invention is to increase the degree of integration of semiconductor devices,
Efficiently cooling the heat generated by semiconductor elements, which increases due to high-density mounting, enables cooling even when the amount of heat generated by each element is high, and keeps the temperature variation between each element within a prescribed range. is there.

Another object of the present invention is to provide a cooling device capable of keeping the fluctuation of each element temperature small so that it is constituted by a large number of high heat density elements and an assembly of element cooling devices and the like. An object of the present invention is to provide an electronic device whose operation processing speed is increased, particularly an ultra-high speed computer.

[0012]

SUMMARY OF THE INVENTION The above-mentioned problems are solved by a logic element in an electronic device in which a high heat generation density element is immersed in an electrically insulating refrigerant liquid typified by, for example, a fluorocarbon and cooled.
Elements with different functions, such as memory elements, or elements with different heat generation densities are grouped and mounted on multiple modules.
Each module is supplied as a unit to each module by separately supplying the supercooled refrigerant liquid with a pump, and the elements in each module are forced to convection heat transfer of the refrigerant liquid according to their heat generation density, or Cooling using convection boiling heat transfer in which forced convection and boiling coexist, and each module is parallel or series with the flow of the refrigerant, or a mixture of parallel series is provided, depending on the type of module. Installed below, and at the inlet or inside of the modules installed in parallel, a resistance element such as a throttle having a pressure loss larger than the pressure loss of the gas-liquid two-layer flow on the downstream side of the module is provided. Will be solved.

[0013]

The elements having different functions such as logic elements and memory elements or elements having different heat generation densities are grouped and mounted on a plurality of modules, and each module is used as a unit. The individual supercooled refrigerant liquid is supplied to the pump by a pump. In addition, each module is arranged in parallel to the flow of the refrigerant, in series, or in a mixed arrangement of parallel and series, depending on the amount of heat generated by the module.

As a result, the pressure of the refrigerant in the module, and thus the saturation temperature of the refrigerant, is made different for each module. Then, the elements in each module are cooled by forced convection heat transfer of the refrigerant liquid or convection boiling heat transfer in which forced convection and boiling coexist, depending on the heat generation density. As a result, the temperature of each element, from elements with extremely high heat density such as logic elements to elements with low heat density such as memory elements, can be set within a specified temperature range and the elements can be cooled uniformly, and electronic devices can operate at high speed. Can be operated with.

Further, a resistance element such as a throttle having a pressure loss larger than the pressure loss of the gas-liquid two-layer flow on the downstream side of the module is provided at the entrance or inside of the modules installed in parallel. .. As a result, the pressure fluctuations caused by the unstable flow generated in the gas-liquid two-layer flow downstream cause
Fluctuations in the amount of refrigerant liquid supplied to the heater can be suppressed, and temperature fluctuations in each element can be reduced. In addition, since the fluctuation of the refrigerant supply amount is small, it is possible to prevent the module from being dried out, and to prevent the element temperature from rapidly increasing.

Further, it is possible to prevent a situation in which the flow of the refrigerant becomes more unstable and runaway due to the instability of the flow due to the gas-liquid two-layer flow coupled with the fluctuation of the amount of the refrigerant liquid supplied to each module. To do. As a result, it is possible to stably operate the electronic device without destroying it.

Further, each module is installed in the pipeline of the refrigerant pipe directly connected to the pump. As a result, the refrigerant liquid is directly supplied from the pump to the module, and
Since the refrigerant is forcibly discharged from the module, it is possible to prevent a situation in which, for example, a high heat-generating module or the like is blocked by vapor due to boiling bubbles and the module is dried out and the element cannot be cooled.

Further, the module having a small calorific value is cooled by the single-phase flow forced convection heat transfer which has a low heat transfer coefficient but does not generate a boiling bubble, and the boiling bubble generation amount in the entire electronic device is reduced. Thereby, the gas-liquid two-layer flow of the refrigerant circulation system can be set to the bubble flow or the plug flow region where the flow is stable.

In addition, since the structure is such that the refrigerant liquid is individually supplied to each of the modules having different functions,
Since replacement and repair can be performed in module units during maintenance work such as logic change or element repair, work can be performed easily and in a short time, and the down time of the electronic device can be shortened as much as possible.

[0020]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a system diagram of a refrigerant circulation system showing an embodiment of the present invention, and FIG. 2 is a cycle diagram shown on a Mollier diagram. An embodiment of the present invention will be described by comparing these drawings. Here, the vertical axis of FIG. 2 is the refrigerant pressure, the horizontal axis is the enthalpy, the two-dot chain lines 7 and 8 represent the saturated liquid line and the saturated vapor line, respectively, and the one-dot chain line 9 is the isotherm of the temperatures T ₁ and T ₂ . Represents. Further, the points a to f represent the states of the points A to F shown in FIG.

The refrigerant (state b) pressurized by the refrigerant circulation pump 3 is decompressed by the pressure loss in the piping elements (not shown) such as valves and elbows inserted between the BCs of the piping 5 and between the BCs. (State c), for example, memory module
And a low heat generation density module such as a power supply module are flown into the low heat generation density module unit 2. In the low heat generation density module unit 2, the refrigerant cools the element, while the refrigerant itself is heated and decompressed, and the liquid (state d) and the vapor (state d ') are mixed to form the low heat generation density module. Outflow from unit 2. Here, when the heat generation density of the module is so small that boiling of the refrigerant does not occur, the state d ′ does not exist and the liquid flows out only with the liquid.

The refrigerant flowing out of the low heat generation density module unit 2 is decompressed by the pressure loss between the DEs of the refrigerant pipe 5 and the pipe elements (not shown). In addition, the vapor bubble in the state d'is mixed with the supercooled liquid in the state d in the DE between the pipes 5 and condensed (state e), and at least one high heat density module such as a logic module is provided. It is guided to the built-in high heat density module unit 1. In the high heat generation density module 1, the refrigerant cools the high heat generation element by convective boiling heat transfer. On the other hand, the heated and boiled refrigerant is
The liquid (state f) and the vapor (state f ′) are discharged from the high heat generation density module unit 1 in a two-phase flow state in which they are mixed.
The gas and liquid of the two-phase flow refrigerant that has exited the high heat generation density module unit 1 are mixed and stirred between the FGs of the pipe 5, and part or all of the vapor in the state f ′ is condensed (states g and g ′), After being completely liquefied by the liquid cooler 4 that exchanges heat with the cooler unit 6 (state a), it is returned to the refrigerant circulation pump 3 again. Inside these high heat density module unit 1, piping 5
The refrigerant is depressurized by the pressure loss between the FGs and in each part of the piping element (not shown). Here, FIG. 1 shows a case where each of the high heat generation density module unit 1 and the low heat generation density module unit 2 is configured by two, but it is needless to say that the same is true even when the number of each configuration unit is changed. Yes. Further, in FIG. 1, two units are grouped into two stages within each group, and the two groups are connected in series, but three stages within each group according to the heat generation density of the module. As described above, each group may be connected in series.

In the above embodiment, the refrigerant pressure in the high heat generation density module unit 1 and the low heat generation density module unit 2 is P due to the pressure loss in each of the above elements.
₁ and P ₂ (P ₁ and P ₂ are the average pressures in the units 1 and 2, respectively) are different. Moreover, the pressure of the unit 2 constituted by the low heat generation density module can be kept higher than the pressure of the unit 1 constituted by the high heat generation density module. As a result, the refrigerant saturation temperature (boiling point) T ₂ of the unit 2 constituted by the low heat generation density module is high, while the refrigerant saturation temperature (boiling point) T _{1 of} the unit 1 constituted by the high heat generation density module is high. Can be set low and the heat transfer coefficient can be changed for each unit. That is, in a low heat generation density module that requires a small heat transfer coefficient in order to keep the element temperature at a certain level, the boiling heat transfer having a high heat transfer coefficient is suppressed by setting the refrigerant saturation temperature high, and the liquid unit temperature is suppressed. The element is cooled by convection forced convection heat transfer or convection boiling heat transfer in which boiling slightly occurs.

On the other hand, in a high heat generation density module which requires a high heat transfer coefficient, the refrigerant saturation temperature is kept low and
Forced convection heat transfer with well-developed boiling efficiently cools the device. As a result, the temperature of the elements can be accurately maintained at a preset level from the low heat generating element to the high heat generating element without changing the temperature of the refrigerant liquid by using a special external means. Further, the temperature drift margin of the device can be reduced, and therefore, the device can be designed at high speed. As a result, it is possible to prevent the delay time mismatch between the modules and to operate the electronic device at high speed.

Further, in this embodiment, since the low exothermic density module is cooled by the liquid single-phase flow or the flow producing only a slight boiling, the amount of boiling bubbles in the refrigerant piping system is small and the void ratio is also small. This suppresses flow instability associated with the gas-liquid two-phase flow in the refrigerant circulation system. In addition, since the flow pressure loss of the two-phase flow due to the mixture of bubbles is small, it is possible to prevent an unnecessary pressure from being applied to the module in order to satisfy the required flow rate. Further, there is also an advantage that the refrigerant saturation temperature can be lowered and the element having a higher heat generation can be cooled.

Further, it is possible to reduce the diameter of the refrigerant piping element, the refrigerant circulation pump, or the like, which makes it possible to reduce the size and weight of the electronic device and reduce the power consumption of the pump.

Further, in the above embodiment, since the refrigerant is forcibly circulated by using the pump, even in the downstream portion of the module, the supercooled refrigerant liquid and the boiling bubbles are mixed in the negative quality. The phase refrigerant can be flowed at a high flow rate, and the condensation of boiling bubbles in the refrigerant pipe is promoted. As a result, the void fraction of the refrigerant piping system becomes smaller, and the refrigerant pressure recovers as the volume flow rate decreases, that is, the two-phase flow velocity decreases, and the pressure loss in the refrigerant piping system further decreases.

FIG. 3 is a system diagram of a refrigerant circulation system of an electronic device showing another embodiment of the present invention. The difference between this embodiment and the embodiment shown in FIG. 1 is that the module unit groups are arranged in series in the embodiment of FIG. 1, whereas the module unit groups are arranged in parallel in this embodiment. It has been placed in. Also, a resistance element 11 such as a throttle valve is provided on the refrigerant inlet side of the high heat density module unit 1 and a resistance element 12 is also provided on the refrigerant outlet side of the low heat density module unit 2, which is also different. There is.

The resistance element 11 plays a role equivalent to between the low heat generation density module unit 2 and the DE of the refrigerant pipe 5 in FIG. 1, and the resistance element 12 functions between the refrigerant pipe DE and the high heat generation density in FIG. It has a function equivalent to that of the module unit 1. In the present embodiment, the case where the resistance element is installed outside each unit is shown, but even if it is provided inside each unit, the effect does not change at all.

FIG. 4 is a system diagram of a refrigerant circulation system in the high heat generation density module unit 1 of the electronic device according to another embodiment of the present invention. At least two high heat generation density modules 101 are mounted in the high heat generation density module unit 1, and a resistance element 102 such as a throttle valve is provided on each refrigerant inlet side of the high heat generation density module 101. Is provided. In this embodiment, the resistance element 102 having a flow resistance larger than the increase value of the pressure loss of the refrigerant due to the gas-liquid two-phase flow on the downstream side of the high heat generation density module 101 is provided on the upstream side of the high heat generation density module 101. It is provided in. Thereby, even if the high heat generation modules 101 are arranged in parallel,
The pressure fluctuation caused by the flow instability in the downstream gas-liquid two-phase flow is prevented. And each high heat generation module 101
Fluctuations in the amount of refrigerant liquid supplied to the device (fluid vibration) are suppressed, and temperature fluctuations in each element are reduced. Further, the fluid vibration is prevented from diverging to make the module dry out (dripping), and the element temperature is prevented from rising sharply.

In this embodiment, the resistance element 102 is provided outside each high heat generation module 101, but even if it is provided inside each module, the effect is not changed.
However, it is necessary to provide a resistance element on the upstream side of the refrigerant for each element that generates boiling bubbles.

FIG. 5 shows another embodiment of the present invention. FIG. 5 is a sectional view showing the internal structure of the high heat generation density module of the electronic device. A nozzle 113 is arranged so as to project in the element direction from the coolant supply header 116 for each of a large number of elements 112 mounted on the substrate 111 via the electrical connection member 115. Then, the partition member 114 for partitioning the respective elements causes the refrigerant jet port 121 to pass through the element cooling chamber 122.
It is provided so as to be contained inside. Further, a refrigerant return header 117 is formed between the element cooling chamber 122 and the refrigerant supply header 116, which are partitioned by the partition member 114, and all the element cooling chambers 122 are on the opposite side of the element surface from the liquid return header. A coolant discharge port 120 opening to 117 is provided.

From the refrigerant supply pipe 118 to the refrigerant supply header 11
The refrigerant guided to the nozzle 6 passes through the aperture 123 and the nozzle 113.
And is ejected as a collision jet on the surface of each element 112. The jet flow colliding with each element 112 changes its flow direction by 90 degrees and flows radially on the element surface. Then, at that time, it is heated by the element and flows to the downstream side while generating boiling bubbles. The two-phase refrigerant containing the bubbles collides with the partition member 114 provided at the end portion of the element, and the flow direction is changed to 9
The coolant return header 1 is changed from the element cooling chamber 122 by changing it by 0 degree
After flowing out to 17, the refrigerant passes through the refrigerant return pipe 119 and is discharged to the outside of the high heat generation density module 101.

In this embodiment, since the nozzle 113 penetrates the refrigerant return header 117 and projects into the element cooling chamber 114, it is not affected by the flow in the refrigerant return header 117 which is orthogonal to the jet flow direction. The jet reaches the element surface. As a result, it is possible to prevent the jet velocity from decreasing due to the diffusion of the jet flow.

As described above, the velocity gradient of the jet impinging on the element surface near the element surface can be made extremely large without being affected by the surrounding flow, and the development of the temperature boundary layer on the element surface can be suppressed to a small level. You can As a result,
It suppresses the excessive development of the diameter of the boiling bubble generated on the element surface. Further, the amount of bubbles can be reduced, and burnout of the element can be prevented. Furthermore, the void fraction of the gas-liquid two-phase flow flowing out of the module can be reduced.

On the other hand, since the partition member is provided at the end of the element so as to surround the entire circumference of the element, vigorous mixing of the boiling bubbles and the supercooled refrigerant liquid is promoted at the end of the element. Then, it promotes the condensation and disappearance of the bubbles in the refrigerant liquid. As a result, the bubble diameter of the gas-liquid two-phase flow flowing out of the module can be reduced, and the flow with a small void ratio can be obtained.

Further, since a throttle is provided at the entrance of each nozzle, the pressure loss at this throttle becomes dominant, and the refrigerant can be evenly distributed to each nozzle. Further, since a flow resistance larger than the increase value of the pressure loss due to the gas-liquid two-phase flow on the downstream side of the module can be added in this part, the pressure generated due to the unstable flow of the gas-liquid two-phase flow on the downstream side. It is possible to suppress the fluctuation of the refrigerant liquid supply amount to each module due to the fluctuation.

FIG. 6 is a system diagram of a refrigerant circulation system of an electronic device showing another embodiment of the present invention. Logic module units 13a, 13b, storage control module units 14a, 14b, power supply module unit 15
Processor housings 17a, 1 in which a, 15b, etc. are stored
7b, a memory housing 18 in which the storage module unit 16 and the like are stored, and a cooling unit 19 in which the liquid cooler 4, the cooler unit 6 and the circulation pumps 3 and 21 are stored, and an electronic device is provided. It is configured. Then, the housing groups 17a, 17b, 18 for performing the arithmetic processing operation and the cooling unit 19 for cooling the refrigerant are separately installed. Further, containers 20a, 20b, such as a bellows, whose volume can be changed are provided on the refrigerant inlet side of the high heat density module units 13a, 13b, 14a, 14b installed in parallel.

The refrigerant liquid pressurized by the refrigerant circulation pump 3 is
Flowing through each of the module units installed in series and in parallel while gradually lowering the pressure, on the way, at the refrigerant inlet portion of the high heat generation density module units 13a, 13b, 14a, 14b, the containers 20a, 20b are pressurized by the refrigerant themselves. Inflate to store a portion of the refrigerant. With this configuration, it is possible to separately install each component device having a different operation action, such as the arithmetic operation casing and the refrigerant cooling casing, and the maintenance of each device becomes easy. Further, even when the refrigerant circulation pump 3 is stopped due to some abnormality, the container 20
The refrigerant stored in the containers 20a, 20b by the restoring force of a, 20b is transferred to the high heat generation density module units 13a, 13b,
14a, 14b, the time until switching to a backup refrigerant circulation pump (not shown),
The high heat generating element can be cooled.

FIG. 7 is a system diagram of a refrigerant circulation system of an electronic device showing another embodiment of the present invention. The system configuration is almost the same as that of the embodiment shown in FIG. 6, but in the middle of the refrigerant return pipe,
The difference from the above embodiment is that the suction type auxiliary refrigerant pump 22 is installed at the inlet of the liquid cooler. With this configuration, it is not necessary to shorten the length of the refrigerant pipe and increase the pressure in the high heat density module, which has weak mechanical strength in order to overcome the pressure loss of the pipe portion. The refrigerant saturation temperature in the density module can be kept low.

FIG. 8 is a system diagram of a refrigerant circulation system of an electronic device showing another embodiment of the present invention. The system configuration is almost the same as that of the embodiment shown in FIG. 6, but the cooling unit is divided into the refrigerant cooling / circulating unit 23 and the cooler unit 6, and the refrigerant cooling / circulating unit 23 is a casing for performing an arithmetic processing operation. The difference is that they are installed on the groups 17 and 18 side. With this configuration, the length of the refrigerant pipe can be shortened, and the pressure increase in the high heat generation density module having low mechanical strength can be suppressed.

FIG. 9 is a system diagram of a refrigerant circulation system of an electronic device showing another embodiment of the present invention. The liquid cooler 4 and a constant pressure device 24 having a variable volume such as a bellows container are installed inside the processor housing 17 and on the downstream side of the high heat density module units 13 and 14. As a result, the refrigerant liquid is caused to flow completely in the liquid single-phase flow state in the pipe having a relatively long pipe length from the liquid cooler 4 to the refrigerant circulation pump, and the length flowing in the gas-liquid two-phase flow state is shortened as much as possible. To do. As a result, the flow can be stabilized.

Further, the constant pressure device 24 absorbs the expansion of the refrigerant due to heating and the generation of boiling bubbles, and the refrigerant pressure inside the constant pressure device 24 is always kept at atmospheric pressure. And the pressure in each module is also maintained at about atmospheric pressure. Further, the refrigerant circulation system can pressurize the refrigerant by the back pressure of the constant pressure device without injecting a different kind of gas such as nitrogen gas to pressurize the refrigerant above its saturated vapor pressure. It can be kept in a supercooled state. As a result, it is possible to prevent the burnout heat flux from decreasing due to the mixture of different gases, or the condensation heat transfer coefficient from decreasing due to the mixture of the non-condensable gas. Further, in this embodiment, the liquid cooler and the constant pressure device are shown as an integral one, but they may be separated.

FIG. 10 is a sectional view of a memory module unit showing another embodiment of the present invention. Many storage elements 12
The memory-substrates 124 on which the memory cells 5 are mounted are arranged in a stack. Then, the memory-substrate 12 adjacent to each other
Between the four is a flexible membrane 126, such as a diaphragm.
A coolant channel 127 constituted by is formed.
The refrigerant passage 127 is connected to the refrigerant supply pipe 128 and the refrigerant discharge pipe 129, respectively. With such a configuration, the flexible partition wall of the coolant channel 127 is brought into close contact with the storage element 125 by the hydraulic pressure of the coolant flowing therein, and heat can be efficiently removed from the storage element with a small contact thermal resistance. ..

Further, since the memory substrate 124 is not directly immersed in the coolant liquid, it is not necessary to require the liquid sealing function for the connector for data transfer, and a general standard product can be used. .. Further, the maintenance work of the storage module unit, which is frequently added and repaired, becomes easy. In addition, the amount of refrigerant used can be reduced as compared with the case of immersion.

FIG. 11 is a perspective sectional view of a swirl preventer at the refrigerant outlet of a liquid cooler showing another embodiment of the present invention. A swirl preventer 130 having a right-handed blade 131 is provided at the refrigerant outlet portion 132 of the liquid cooler 4. The liquefied liquid refrigerant cooled by the heat exchanger portion (not shown) of the liquid cooler passes through the blades 131, then flows out from the outlet of the liquid cooler, and is guided to the refrigerant circulation pump. With this configuration, it is possible to prevent a left-handed vortex flow that is generated due to the refrigerant channel suddenly contracting at the outlet of the liquid cooler. Then, the entrainment of the refrigerant bubbles by this vortex flow,
Then, it is possible to prevent the suction of bubbles to the refrigerant circulation pump.

As a result, it is possible to prevent the liquid supply capacity from being lowered by the cavitation of the pump, the fluctuation of the discharge pressure, and the generation of noise. Here, in the Southern Hemisphere, the blade is left-handed.

[0049]

According to the present invention, a logic element of an electronic device,
Elements having different functions, such as memory elements, or elements having different heat generation densities are grouped and mounted on a plurality of modules, and each module is individually supplied with a supercooled refrigerant by a pump. The modules are arranged in parallel, in series, or in a mixed arrangement of parallel and series with respect to the flow of the refrigerant, depending on the type of module. This causes the refrigerant pressure in each module, and thus the saturation temperature of the refrigerant, to differ. And, forced convection heat transfer of the refrigerant liquid according to the heat generation density of the elements in each module, or
Cooling is performed by convection boiling heat transfer in which forced convection and boiling coexist.

As a result, it is possible to uniformly cool the temperature of various elements within a predetermined temperature range from an element having a very high heat generation density such as a logic element to an element having a low heat generation density such as a memory element. Can be operated at high speed. Further, the electronic device according to the present invention has a resistance element such as a throttle having a pressure loss larger than the pressure loss of the gas-liquid two-layer flow on the downstream side of the module at the entrance or inside of the modules installed in parallel. Is provided, the fluctuation of the refrigerant supply amount to each module due to the pressure fluctuation causing the unstable gas-liquid two-layer flow gas downstream of the module is suppressed. Then, the temperature fluctuation of each element is reduced, and the element temperature is prevented from rapidly increasing due to the dryout of the module.

In addition, it is possible to prevent a situation in which the unstable flow of the gas-liquid two-layer flow and the fluctuation of the refrigerant supply amount to each module are coupled and the flow of the refrigerant diverges more unstablely to cause a runaway. You can As a result, it is possible to stably operate the electronic device without destroying it. In addition, each module of the electronic device
The refrigerant is installed on the refrigerant pipe line directly connected to the pump, the refrigerant liquid is directly supplied to the module by the pump, and the refrigerant is forcibly discharged from the module. As a result, it is possible to prevent a situation in which, for example, a high heat generation density module or the like is vapor-blocked by boiling bubbles, and the module cannot dry out and the element cannot be cooled.

Further, since the module having a small heat generation amount is cooled by the single-phase forced convection heat transfer which has a low heat transfer coefficient but does not generate boiling bubbles, the amount of boiling bubbles generated in the entire electronic device can be reduced. Therefore, the gas-liquid two-layer flow of the refrigerant circulation system can be set to the bubble flow or the plug flow region where the flow is stable.

Further, since the refrigerant liquids are separately supplied in units of modules having different functions, it is possible to easily carry out maintenance work such as logic change or repair of elements in a short time. The downtime can be shortened.

[Brief description of drawings]

FIG. 1 is a system diagram of a refrigerant circulation system of an electronic device showing an embodiment of the present invention.

FIG. 2 is a refrigerant cycle diagram of the embodiment shown in FIG.

FIG. 3 is a system diagram of a refrigerant circulation system of an electronic device showing another embodiment of the present invention.

FIG. 4 is a system diagram of a refrigerant circulation system in a high heat generation module unit of an electronic device according to another embodiment of the present invention.

FIG. 5 is a perspective sectional view showing a structure in a high heat generation density module of an electronic device according to another embodiment of the present invention.

FIG. 6 is a system diagram of a refrigerant circulation system of an electronic device showing another embodiment of the present invention.

FIG. 7 is a system diagram of a refrigerant circulation system of an electronic device according to another embodiment of the present invention.

FIG. 8 is a system diagram of a refrigerant circulation system of an electronic device showing another embodiment of the present invention.

FIG. 9 is a system diagram of a refrigerant circulation system of an electronic device showing another embodiment of the present invention.

FIG. 10 is a sectional view of a memory module unit according to another embodiment of the present invention.

FIG. 11 is a perspective cross-sectional view of a vortex shelter at a refrigerant outlet portion of a liquid cooler showing another embodiment of the present invention.

[Explanation of symbols]

1 ... High heat density module unit, 2 ... Low heat density module unit, 3 ... Refrigerant circulation pump, 4 ... Liquid cooler, 5 ... Refrigerant piping, 6 ... Cooler unit, 7 ... Saturated liquid line, 8 ... Saturated Steam line, 9 ... Isotherm, 11 ... Refrigerant inlet side resistance element, 12 ... Refrigerant outlet side resistance element, 13a, 1
3b ... Logical module unit, 14a, 14b ... Storage control module unit, 15a, 15
b ... power supply module unit, 16 ... storage module unit, 17a, 17b ... processor housing, 18 ... memory housing, 19 ... cooling unit, 20a, 20b
... Bellows container, 21 ... Cooling water pump, 22 ... Refrigerant suction pump, 23 ... Refrigerant cooling circulation unit, 24 ... Constant pressure device, 101 ... High heat generation density module, 102 ... Resistance element, 111 ... Substrate, 112 ... Element, 113 ... Nozzle, 1
14 ... Partition member, 115 ... Electrical connection member, 116 ... Refrigerant supply header, 117 ... Refrigerant return header, 118 ... Refrigerant supply pipe, 119 ... Refrigerant return pipe, 120 ... Refrigerant discharge port, 1
21 ... Refrigerant ejection port, 122 ... Element cooling chamber, 123 ... Throttle, 124 ... Memory-substrate, 125 ... Storage element, 126
... Diaphragm 127 ... Refrigerant flow path, 128 ... Refrigerant supply pipe, 129 ... Refrigerant discharge pipe, 130 ... Swirl preventer, 131
... Vanes, 132 ... Refrigerant outlet

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Toshio Hatta 502 Jinritsucho, Tsuchiura-shi, Ibaraki Hiritsu Seisakusho Co., Ltd.Mechanical Research Laboratory (72) Toshio Hatada 502 Kintate-cho, Tsuchiura-shi, Ibaraki Hiritsu Seisakusho Co., Ltd. Inside the Mechanical Research Institute (72) Inoue Kou 502 Jinritsu-cho, Tsuchiura-shi, Ibaraki Hiritsu Manufacturing Co., Ltd. Inside the Mechanical Research Laboratory (72) Inventor Shigeyuki Sasaki 502 Kintate-cho, Tsuchiura-shi, Ibaraki Inside the Hiritsu Manufacturing Mechanical Research Co., Ltd. 72) Inventor Yasuo Ozone 502 Jinritsu-cho Machinery Research Center, Tsuchiura-shi, Ibaraki Prefecture Machinery Research Institute, Inc. (72) Inventor Shozo Nakamura 502 Kintate-cho, Tsuchiura-shi, Ibaraki Machinery Research Center, Hiritsu Factory, Inc. (72) Inventor Hiroshi Yasuda 502 Jinritsu-cho, Tsuchiura-shi, Ibaraki Machinery Research Institute, Hiritsu Manufacturing Co., Ltd. (72) Inventor Ken Kasai 1 Horiyamashita, Hadano City, Kanagawa Prefecture Hiritsu Manufacturing Co., Ltd. Kanagawa Plant

Claims (14)

[Claims] 1. An assembly of a plurality of module units each comprising a module having an element mounted therein, wherein in an electronic device cooled by a liquid refrigerant, the element is directly immersed in the liquid refrigerant to form the plurality of module units. Are a low heat generation density module unit equipped with a low heat density element and a high heat density module unit equipped with a high heat density element, and a refrigerant circulation pump for supplying the liquid refrigerant to the module unit and the plurality of modules. Means for changing the pressure and saturation temperature of the liquid refrigerant supplied to the liquid unit, the means for suppressing the boiling of the liquid refrigerant on the surface of the low heat generation density module to suppress the boiling of the liquid refrigerant on the surface of the high heat density module. An electronic device cooled by a liquid, characterized in that it promotes boiling of a liquid refrigerant. 2. In an electronic device comprising a plurality of module units each comprising a semiconductor element mounted module and cooled by a liquid refrigerant, the semiconductor element is directly immersed in the liquid refrigerant, and the liquid refrigerant is cooled by the module. The electronic device is provided with a means for changing the pressure and saturation temperature of the liquid refrigerant supplied to the plurality of module units, and the means is supplied to the module unit having a large heat generation density. An electronic device cooled by a liquid, characterized in that the pressure and the saturation temperature of the liquid refrigerant are low, and the pressure and the saturation temperature of the liquid refrigerant supplied to a module unit having a small heat generation density are high. 3. An electronic device comprising a module unit comprising a plurality of modules each having a semiconductor element mounted therein, wherein the semiconductor element is directly immersed in the liquid refrigerant, and the module unit is provided with the liquid refrigerant. The electronic device is provided with a refrigerant circulating pump for supplying the liquid refrigerant, and the plurality of module units are arranged so that the liquid refrigerant flows through a module unit having a small heat generation density and a module unit having a large heat generation density in series. A module unit having a small heat generation density is disposed upstream of the module unit having a large heat generation density, and means for changing the pressure and saturation temperature of the liquid refrigerant supplied to the plurality of module units is provided, The means is a module with a large heat generation density.
The electronic device is characterized in that the pressure and saturation temperature of the liquid refrigerant supplied to the module unit are lowered, and the pressure and saturation temperature of the liquid refrigerant supplied to the module unit having a small heat generation density are increased. 4. An electronic device comprising a plurality of module units each comprising a module on which a semiconductor element is mounted and cooled by a liquid refrigerant, wherein the semiconductor element is directly immersed in the liquid refrigerant, and the electronic device is provided with the liquid refrigerant. The module
And a plurality of module units are arranged so that the liquid refrigerant flows in parallel through the plurality of module units, and a liquid refrigerant outlet side and a heat generation density of the module unit having a small heat generation density. A resistance element is provided on the liquid refrigerant inlet side of the large module unit, and means for changing the pressure and saturation temperature of the liquid refrigerant supplied to the plurality of module units is provided.
The means lowers the pressure and saturation temperature of the liquid refrigerant supplied to the module unit having a large heat generation density, and increases the pressure and saturation temperature of the liquid refrigerant supplied to the module unit having a small heat generation density. And electronic device. 5. An electronic device comprising a plurality of module units each comprising a semiconductor element mounted module, wherein the semiconductor element is directly immersed in the liquid refrigerant, and the liquid refrigerant is cooled by the module. And a means for changing the pressure and saturation temperature of the liquid refrigerant supplied to the plurality of module units are provided in the electronic device, and the means supplies the module unit having a large heat generation density. The pressure and saturation temperature of the liquid refrigerant to be low, increase the pressure and saturation temperature of the liquid refrigerant supplied to the small module unit of the heat density,
Each of the at least two high heat density module refrigerant inlets is provided with a resistance element having a flow resistance larger than an increase value of the pressure loss due to the refrigerant gas-liquid two-phase flow on the downstream side of the module refrigerant. Characterized electronic device. 6. A logical operation device including a logic module unit having a semiconductor element mounted therein and a power supply module unit, and a main storage device having a storage module unit having a semiconductor element mounted therein and a power supply module unit. Prepare,
In an electronic device cooled by a liquid refrigerant, the semiconductor element is directly immersed in the liquid refrigerant, a refrigerant circulation pump for supplying the liquid refrigerant to each module unit, and the liquid supplied to each module unit. A means for changing the pressure and the saturation temperature of the refrigerant is provided in the electronic device, and the means lowers the pressure and the saturation temperature of the liquid refrigerant supplied to the module unit having the large heat generation density, and the module unit having the small heat generation density. To increase the pressure and saturation temperature of the liquid refrigerant supplied to the, and each module unit is arranged so that the liquid refrigerant flows in a series in the logical operation device, and the main storage device and the logical operation device are The main storage device and the logical operation device are arranged so that the liquid refrigerant flows in a series, and the main storage device is connected to the logical operation device. Electronic device to be cooled by liquid, characterized in that disposed on the refrigerant upstream side. 7. A logical operation device having a logic module unit having a semiconductor element and a power supply module unit, and a main memory device having a memory module unit having a semiconductor element and a power supply module. In an electronic device that is cooled by a liquid refrigerant, the semiconductor element is directly immersed in the liquid refrigerant, and the liquid circulation refrigerant that supplies the liquid refrigerant to the module unit and the plurality of modules.
Means for changing the pressure and saturation temperature of the liquid refrigerant supplied to the unit, the means for lowering the pressure and saturation temperature of the liquid refrigerant supplied to the module unit having a large heat generation density, The pressure and the saturation temperature of the liquid refrigerant supplied to the module unit having a small heat generation density are increased, and each module unit is arranged in the logical operation device so that the liquid refrigerant flows in a series, and the main memory device is provided. And the main memory device and the logical operation device are arranged so that the liquid refrigerant flows in parallel in the logical operation device, and a resistance element is provided on the liquid refrigerant outlet side of the main memory device and the liquid refrigerant inlet side of the logical operation device. An electronic device which is cooled by a liquid. 8. An electronic device cooled by a liquid according to claim 1, wherein the electronic device is provided with a liquid cooler for cooling a refrigerant and a cooler unit. 9. An electron cooled by a liquid according to claim 8, wherein a refrigerant suction pump is provided on a refrigerant inlet side of the liquid cooler, and a refrigerant pressure pump is provided on a refrigerant outlet side of the liquid cooler. apparatus. 10. The module unit according to claim 8, wherein the module unit includes a high heat generation density module unit, and a container whose volume is variable by internal pressure is provided on the refrigerant upstream side of the high heat generation density module. An electronic device cooled by the described liquid. 11. The module unit according to claim 8, wherein the module unit includes a high heat generation density module unit, and a container whose volume is variable by internal pressure is provided on the refrigerant downstream side of the high heat generation density module unit. An electronic device cooled by the described liquid. 12. A coolant supply member for supplying a coolant to the semiconductor element, a coolant supply header for distributing the coolant to the coolant supply member, and a flow direction of the coolant supplied from the coolant supply member to the semiconductor element to a semiconductor. After cooling the element, a partition member that changes in a direction away from the semiconductor element cooling surface in the direction normal to the semiconductor element cooling surface, a refrigerant discharge port formed by this partition member and this refrigerant supply member, and this refrigerant supply header 9. The electronic device according to claim 8, further comprising: a refrigerant return header that is located between the two and discharges the refrigerant from which heat is removed from the semiconductor element from the refrigerant discharge port. 13. An electronic device cooled by a liquid according to claim 8, wherein a coolant passage having a flexible partition wall is provided between adjacent substrates having a low density module. 14. The liquid according to claim 8, wherein a swirl preventer having a right-handed refrigerant guide vane in the northern hemisphere and a left-handed refrigerant guide vane in the southern hemisphere is provided at a refrigerant outlet portion of said liquid cooler. Electronic device cooled by.