JPH05145248A - Method of supporting printed board for electronic component - Google Patents
Method of supporting printed board for electronic componentInfo
- Publication number
- JPH05145248A JPH05145248A JP30581391A JP30581391A JPH05145248A JP H05145248 A JPH05145248 A JP H05145248A JP 30581391 A JP30581391 A JP 30581391A JP 30581391 A JP30581391 A JP 30581391A JP H05145248 A JPH05145248 A JP H05145248A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- electronic component
- plastic housing
- plastic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は電子部品用プリント基板
とプラスチック筐体の結合方法に係り、特に、プラスチ
ック筐体の剛性を向上させる結合方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for connecting a printed circuit board for electronic parts and a plastic housing, and more particularly to a method for connecting a plastic housing with improved rigidity.
【0002】[0002]
【従来の技術】従来、この種の結合方法は、図4に示す
ように、電子部品用プリント基板2をプラスチック筐体
1の底板にねじ7で固定する方法が使われていた。しか
し、図5に示されたように、何らかの原因でプラスチッ
ク筐体1の底板の中央に大きな荷重を受けると、この場
合、プラスチック筐体1のみならず電子部品用プリント
基板2も曲げ力を受けて変形する。このため電子部品用
プリント基板2にはんだ付けした電子部品(図上では省
略)にも曲げ力が作用して強度上問題があった。2. Description of the Related Art Conventionally, as shown in FIG. 4, this type of joining method has used a method of fixing a printed circuit board 2 for electronic parts to a bottom plate of a plastic housing 1 with screws 7. However, as shown in FIG. 5, when a large load is applied to the center of the bottom plate of the plastic housing 1 for some reason, in this case, not only the plastic housing 1 but also the printed circuit board 2 for electronic parts receives bending force. To transform. For this reason, the bending force also acts on the electronic component (not shown in the figure) soldered to the electronic component printed circuit board 2 and there is a problem in strength.
【0003】[0003]
【発明が解決しようとする課題】上記従来技術では、減
肉により軽量化を図ろうとすると、プラスチック筐体の
剛性が不足し、プラスチック筐体の底板の中央に大きな
荷重が加わった場合に、電子部品用プリント基板も曲が
る可能性があるという問題があった。In the above prior art, when attempting to reduce the weight by reducing the wall thickness, the rigidity of the plastic housing is insufficient, and when a large load is applied to the center of the bottom plate of the plastic housing, the electronic There is a problem that the printed circuit board for parts may also be bent.
【0004】本発明の目的は、電子部品用プリント基板
に曲げ力が作用せず、引っ張り力を分担することによっ
て、プラスチック筐体の剛性の向上を図ることにある。It is an object of the present invention to improve the rigidity of a plastic housing by sharing the tensile force without the bending force acting on the electronic component printed board.
【0005】[0005]
【課題を解決するための手段】上記目的を達成するため
に、電子部品用プリント基板の周囲に嵌合用の穴をあ
け、その穴にわずかな隙間を設けて嵌合するコラムをプ
ラスチック筐体の底板に剛に取付ける。このようにすれ
ば、電子部品用プリント基板に引っ張り力を分担するこ
とによって、プラスチック筐体の軽量化を目的とする減
肉に伴う剛性の減少による過大な変形を防止することが
出来る。In order to achieve the above object, a fitting hole is formed around a printed circuit board for electronic parts, and a small gap is provided in the hole to fit a column in a plastic housing. Rigidly attached to the bottom plate. According to this configuration, the tensile force is shared by the printed circuit board for electronic parts, so that it is possible to prevent excessive deformation due to a decrease in rigidity due to the thickness reduction for the purpose of weight reduction of the plastic housing.
【0006】[0006]
【作用】図2で説明されるように、何らかの原因でプラ
スチック筐体1が底板の中央に大きな荷重を受けるとプ
ラスチック筐体1が曲げ変形し、プラスチック筐体1の
底板に剛に取付けたコラム4は先端の距離が長くなるよ
うに移動する。その際、電子部品用プリント基板2の周
囲にあけた嵌合用の穴3とコラム4の間にわずかな隙間
を有して嵌合させると引張り力は伝達するが曲げ力は伝
達せず、電子部品用プリント基板2に引張り力が加わる
ことになり、電子部品用プリント基板2の剛性によりコ
ラム4の先端の移動が抑制され、プラスチック筐体1の
曲げ変形も抑制される。その結果、プラスチック筐体1
の剛性が向上する。As described with reference to FIG. 2, when the plastic casing 1 receives a large load in the center of the bottom plate for some reason, the plastic casing 1 is bent and deformed, and the column rigidly attached to the bottom plate of the plastic casing 1. 4 moves so that the distance of the tip becomes longer. At this time, when the electronic component printed circuit board 2 is fitted with a slight gap between the fitting hole 3 and the column 4 formed around the electronic component printed board 2, the tensile force is transmitted but the bending force is not transmitted. A tensile force is applied to the printed circuit board 2 for parts, the rigidity of the printed circuit board 2 for electronic parts suppresses the movement of the tip of the column 4, and the bending deformation of the plastic housing 1 is also suppressed. As a result, the plastic housing 1
The rigidity of is improved.
【0007】[0007]
【実施例】<実施例1>図1は、本発明の電子部品用プ
リント基板の取付け方法の全体を表わす斜視図であり、
電子部品用プリント基板2の周囲に嵌合用の穴3をあ
け、その穴3にわずかな隙間をもって嵌合するコラム4
をプラスチック筐体1の底板に剛に取付ける。図2は説
明図であり、プラスチック筐体1の底板の中央に大きな
荷重が加わった場合に、プラスチック筐体1は曲げ変形
するが、電子部品用プリント基板2が引張り荷重を分担
するためにプラスチック筐体1の剛性が向上することを
説明している。<Embodiment 1> FIG. 1 is a perspective view showing an overall method of mounting a printed circuit board for electronic parts according to the present invention.
A column 4 in which a fitting hole 3 is formed around the electronic component printed circuit board 2 and fitted into the hole 3 with a slight gap.
Is rigidly attached to the bottom plate of the plastic housing 1. FIG. 2 is an explanatory view. When a large load is applied to the center of the bottom plate of the plastic housing 1, the plastic housing 1 is bent and deformed, but the printed circuit board 2 for an electronic component shares the tensile load, so that the plastic is plastic. It has been described that the rigidity of the housing 1 is improved.
【0008】<実施例2>図3は本発明の第二の実施
例、すなわち、電子部品用プリント基板2の嵌合用の穴
3とその穴3に嵌合するコラム4の代りに曲がりやす
く、伸び縮みしにくいテープ5を用いて電子部品用プリ
ント基板2とプラスチック筐体1の底板に設けたブロッ
クと6を結合した電子部品用プリント基板の支持方法の
全体を表わす斜視図である。<Embodiment 2> FIG. 3 is a second embodiment of the present invention, that is, instead of the fitting hole 3 of the electronic component printed circuit board 2 and the column 4 fitted into the hole 3, it is easily bent, FIG. 2 is a perspective view showing an overall method of supporting an electronic component printed circuit board in which a printed circuit board for electronic component 2 and a block 6 provided on a bottom plate of a plastic housing 1 are combined with each other using a tape 5 which is hard to expand and contract.
【0009】[0009]
【発明の効果】本発明によれば、減肉により筐体の剛性
が減少した場合にも十分な剛性を得ることができる。According to the present invention, sufficient rigidity can be obtained even when the rigidity of the housing is reduced due to the thinning.
【図1】本発明の実施例の電子部品用プリント基板の斜
視図。FIG. 1 is a perspective view of a printed circuit board for electronic parts according to an embodiment of the present invention.
【図2】本発明の実施例の電子部品用プリント基板の機
能の説明図。FIG. 2 is an explanatory diagram of a function of a printed circuit board for electronic parts according to an embodiment of the present invention.
【図3】本発明の他の実施例の電子部品用プリント基板
の斜視図。FIG. 3 is a perspective view of a printed circuit board for electronic parts according to another embodiment of the present invention.
【図4】従来の電子部品用プリント基板の斜視図。FIG. 4 is a perspective view of a conventional printed circuit board for electronic parts.
【図5】従来の電子部品用プリント基板の取付け方法の
説明図。FIG. 5 is an explanatory view of a conventional method for mounting a printed circuit board for electronic parts.
1…プラスチック筐体、2…電子部品用プリント基板、
3…嵌合用の穴、4…コラム、5…テープ、6…ブロッ
ク、7…ねじ。1 ... Plastic housing, 2 ... Printed circuit board for electronic parts,
3 ... hole for fitting, 4 ... column, 5 ... tape, 6 ... block, 7 ... screw.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 米田 奈柄 茨城県土浦市神立町502番地 株式会社日 立製作所機械研究所内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor, Nana Yoneda Machinery Research Institute, Hiritsu Manufacturing Co., Ltd.
Claims (2)
ント基板とその穴にわずかな隙間を有して嵌合するコラ
ムをプラスチック筐体の底板に設けたことを特徴とする
電子部品用プリント基板の支持方法。1. A printed circuit board for an electronic component having a hole for fitting in the periphery and a column for fitting with a slight clearance in the hole are provided on a bottom plate of a plastic housing. Printed circuit board support method.
ト基板の嵌合用の穴とその穴に嵌合するコラムの代りに
曲がりやすく、伸び縮みしにくいテープを用いて電子部
品用プリント基板とプラスチック筐体の底板に設けたブ
ロックとを結合した電子部品用プリント基板の支持方
法。2. A printed circuit board for an electronic component and a plastic according to claim 1, wherein instead of the fitting hole of the printed circuit board for an electronic component and the column fitted in the hole, a tape which is easily bent and does not easily expand and contract is used. A method of supporting a printed circuit board for an electronic component, which is combined with a block provided on a bottom plate of a housing.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30581391A JPH05145248A (en) | 1991-11-21 | 1991-11-21 | Method of supporting printed board for electronic component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30581391A JPH05145248A (en) | 1991-11-21 | 1991-11-21 | Method of supporting printed board for electronic component |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH05145248A true JPH05145248A (en) | 1993-06-11 |
Family
ID=17949680
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP30581391A Pending JPH05145248A (en) | 1991-11-21 | 1991-11-21 | Method of supporting printed board for electronic component |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH05145248A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0951153A (en) * | 1995-08-07 | 1997-02-18 | Hitachi Ltd | Structure of printed board assembly |
-
1991
- 1991-11-21 JP JP30581391A patent/JPH05145248A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0951153A (en) * | 1995-08-07 | 1997-02-18 | Hitachi Ltd | Structure of printed board assembly |
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