JPH05131510A - Resin molding method and molding die - Google Patents

Resin molding method and molding die

Info

Publication number
JPH05131510A
JPH05131510A JP32375391A JP32375391A JPH05131510A JP H05131510 A JPH05131510 A JP H05131510A JP 32375391 A JP32375391 A JP 32375391A JP 32375391 A JP32375391 A JP 32375391A JP H05131510 A JPH05131510 A JP H05131510A
Authority
JP
Japan
Prior art keywords
mold
resin
movable
die
molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP32375391A
Other languages
Japanese (ja)
Inventor
Tadamasa Kidera
忠正 木寺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyoda Gosei Co Ltd
Original Assignee
Toyoda Gosei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyoda Gosei Co Ltd filed Critical Toyoda Gosei Co Ltd
Priority to JP32375391A priority Critical patent/JPH05131510A/en
Publication of JPH05131510A publication Critical patent/JPH05131510A/en
Pending legal-status Critical Current

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  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

PURPOSE:To provide the stamping molding method and a molding die used in said method. CONSTITUTION:A mold M consists of a fixed mold 1, an intermediate plate 3 and a movable mold 2, and a cam 22 movable back and forth by a hydraulic cylinder 2 and a retaining pin 21 projected in the direction of the intermediate plate 3 by the back and forth movement of said cam 22 are installed on the movable mold 2. An interval L in formed between the intermediate plate 3 and the movable mold 2, and a cavity 14 is formed in said mold M by first protruding the retaining pin 21 and then mold clamping, and resin is injected. After that, the retaining pin 21 is moved backward and the intermediate plate 3 and the movable mold 2 are mold clamped completely and a resin product is molded by stamping molding.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、樹脂成形方法及び成形
用金型に関するものであり、詳しくは金型を途中まで閉
じ、その後樹脂を注入し型締めをおこなうスタンピング
成形方法及びその方法に用いられる成形用金型に関する
ものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin molding method and a molding die, and more particularly, to a stamping molding method in which the mold is closed halfway and then resin is injected to perform mold clamping, and a method therefor. The present invention relates to a molding die used.

【0002】[0002]

【従来の技術】従来、図4に示すように、型閉めを一旦
止め樹脂を射出しその後完全に型閉めを行うスタンピン
グ成形は、一回の成形で多数個取りを行う成形用金型M
はホットランナ構造を用いて固定型3と可動型2とスラ
イドコア5を用いた構造としていた。つまり、固定型3
内に設けられているホットランナブロック16及びホッ
トランナノズル17によりランナ及びノズルを温調する
ことにより固定型3と可動型2とスライドコア5で設け
られるキャビティ14内に樹脂を注入しその後スタンピ
ング成形を行っていた。
2. Description of the Related Art Conventionally, as shown in FIG. 4, stamping molding, in which a mold is temporarily stopped and a resin is injected, and then the mold is completely closed, is a molding die M in which a large number of pieces are taken in one molding.
Uses a hot runner structure and uses a fixed mold 3, a movable mold 2, and a slide core 5. That is, fixed type 3
A hot runner block 16 and a hot runner nozzle 17 provided inside adjust the temperature of the runner and the nozzle to inject resin into the cavity 14 formed by the fixed mold 3, the movable mold 2 and the slide core 5, and then stamping molding. Was going on.

【0003】[0003]

【発明が解決しようとする課題】しかし、上記の成形用
金型Mを用いると、ホットランナノズル17の温度のば
らつきにより樹脂の注入量にばらつきが生じ成形不良の
原因となっていた。また、成形用金型内にホットランナ
ブロック16、ホットランナノズル17というホットラ
ンナ構造を設けているため成形用金型の費用が高価にな
り、また成形用金型のホットランナブロック16、ホッ
トランナノズル17の温調を行うためランニングコスト
が高くなっていた。そして、温調機等の付属設備が必要
となっていた。
However, when the molding die M is used, the injection amount of the resin varies due to the variation in the temperature of the hot runner nozzle 17, which is a cause of defective molding. Moreover, since the hot runner block 16 and the hot runner nozzle 17 are provided in the molding die, the cost of the molding die is high, and the hot runner block 16 and the hot runner of the molding die are expensive. Since the temperature of the nozzle 17 is adjusted, the running cost is high. Then, auxiliary equipment such as a temperature controller was required.

【0004】[0004]

【課題を解決するための手段】本発明は、上記問題点を
解決するために、可動型と固定型と中板と前記固定型と
前記中板との型閉め状態を保持する保持部材を設けた金
型を用いた樹脂成形方法であって、樹脂通路を形成する
前記固定型と前記中板の型閉めを前記保持部材により保
持し、前記中板と前記可動型を所定の間隔を開けるよう
に型閉めを行い、前記可動型と前記中板との間に前記樹
脂通路を経由して樹脂を注入し、再び前記可動型と前記
中板の間を型閉めを行い、キャビティを形成するととも
に樹脂成形品を成形することを特徴とする樹脂成形方法
を採用した。
In order to solve the above problems, the present invention provides a movable die, a fixed die, an intermediate plate, and a holding member for holding the mold closed state of the fixed die and the intermediate plate. A resin molding method using a metal mold, wherein the fixed mold forming the resin passage and the mold closure of the middle plate are held by the holding member, and the middle plate and the movable mold are opened at a predetermined interval. The mold is closed, the resin is injected between the movable mold and the middle plate through the resin passage, and the mold is closed again between the movable mold and the middle plate to form a cavity and resin molding. A resin molding method is used which is characterized by molding the product.

【0005】そして、上記発明に使用する成形用金型と
しては、固定型と中板と可動型と保持部材とからなる成
形用金型において、前記保持部材は、前記可動型側に配
置され、前記可動型から中板に向かって進退可能な保持
ピンと前記保持ピンの進出状態を固定させる移動手段と
からなることを特徴とするものである。
The molding die used in the above invention is a molding die composed of a fixed die, an intermediate plate, a movable die and a holding member, wherein the holding member is arranged on the movable die side, It is characterized in that it comprises a holding pin capable of advancing and retracting from the movable die toward the middle plate, and a moving means for fixing the advanced state of the holding pin.

【0006】[0006]

【作用】上記した樹脂成形方法は、固定型と中板と間の
型閉めを保持部材により保持するため、固定型と中板と
で形成される樹脂通路を通じて中板と可動型間に樹脂を
注入した状態でも、固定型と中板の型閉めは保持され
る。その後、保持部材の突出した状態での固定を解除
し、後退可能とすることにより可動型と中板の間を再び
金型を型閉めすることにより完全に型締めを行い、目的
の樹脂成形品を得ている。
In the resin molding method described above, since the mold closing between the fixed mold and the intermediate plate is held by the holding member, the resin is provided between the intermediate plate and the movable mold through the resin passage formed by the fixed mold and the intermediate plate. Even in the injected state, the mold closing of the fixed mold and the middle plate is maintained. After that, the fixing of the holding member in the protruding state is released, and the holding member is retracted so that the mold is closed again between the movable mold and the intermediate plate, and the mold is completely clamped to obtain the desired resin molded product. ing.

【0007】[0007]

【実施例】次に、本発明に係わる樹脂成形方法及び成形
金型の実施例について、図1から図3に基づき説明す
る。
EXAMPLES Next, examples of the resin molding method and the molding die according to the present invention will be described with reference to FIGS.

【0008】図1に示す成形用金型Mは、固定型1、可
動型2、中板3、、スライドコア5を主要な構成要素と
しおり、固定型1は取付板11とランナ板12とからな
り、可動型2には、保持ピン21、カム22及び油圧シ
リンダ23からなる保持部材と、補助スプリング24が
設けられている。
The molding die M shown in FIG. 1 has a fixed die 1, a movable die 2, an intermediate plate 3, and a slide core 5 as main components, and the fixed die 1 includes a mounting plate 11 and a runner plate 12. The movable die 2 is provided with a holding member including a holding pin 21, a cam 22 and a hydraulic cylinder 23, and an auxiliary spring 24.

【0009】取付板11は、射出成形機のノズル(図示
しない)から供給される樹脂通路111が形成され、こ
の樹脂通路111は、ランナ板12と中板3とで形成す
る樹脂通路112へと通じている。
A resin passage 111 supplied from a nozzle (not shown) of the injection molding machine is formed in the mounting plate 11, and this resin passage 111 leads to a resin passage 112 formed by the runner plate 12 and the intermediate plate 3. I understand.

【0010】中板3は、型開き量を決める移動可能なロ
ッド31を有し、取付板11に取り付けられているガイ
ドピンにて摺動可能な様に取り付けられている。また、
中板3の下部にはスライドピン51によりスライドする
スライドコア5を配置する凹部が設けられている。そし
て、中板3とランナ板12とで形成された樹脂通路11
2は、中板3と可動型2とスライドコア5から形成され
るキャビティ14に通じるゲート13に通じている。
The intermediate plate 3 has a movable rod 31 which determines the mold opening amount, and is attached so as to be slidable by a guide pin attached to the attachment plate 11. Also,
In the lower part of the intermediate plate 3, a recess is provided in which the slide core 5 which slides by the slide pin 51 is arranged. Then, the resin passage 11 formed by the middle plate 3 and the runner plate 12
2 communicates with a gate 13 which communicates with a cavity 14 formed by the intermediate plate 3, the movable die 2 and the slide core 5.

【0011】スライドコア5は、中板3に固定された屈
曲したスライドピン51の移動によりスライド可能に設
けられている。
The slide core 5 is slidably provided by the movement of a bent slide pin 51 fixed to the intermediate plate 3.

【0012】一方、可動型2には、油圧シリンダ23に
より上面に低い位置221と高い位置222を有するカ
ム22を移動することにより中板3側に突出する保持ピ
ン21が設けられ、保持ピン21の固定が解除され再度
型閉めを行う時、中板3とランナ板4が開くのを防ぐた
め補助スプリング24が設けられている。
On the other hand, the movable die 2 is provided with a holding pin 21 protruding toward the middle plate 3 by moving a cam 22 having a lower position 221 and a higher position 222 on the upper surface by a hydraulic cylinder 23. An auxiliary spring 24 is provided in order to prevent the middle plate 3 and the runner plate 4 from opening when the fixing is released and the mold is closed again.

【0013】成形方法を説明すると、まず、金型Mは、
可動型2と中板3の間、中板3とランナ板12の間及び
取付板11とランナ板12の間で型が開いている。この
状態でキャビティ14を形成する可動型2の表面に表皮
Iをセットする。その後、油圧シリンダー23を前進さ
せることによりカム22の上面の低い位置221から高
い位置222に保持ピン21の下面211を移動させ保
持ピン21を可動型2表面より中板3方向に突出させ
る。そして型閉めを行う。
Explaining the molding method, first, the mold M is
The mold is open between the movable mold 2 and the middle plate 3, between the middle plate 3 and the runner plate 12, and between the mounting plate 11 and the runner plate 12. In this state, the skin I is set on the surface of the movable die 2 forming the cavity 14. After that, by moving the hydraulic cylinder 23 forward, the lower surface 211 of the holding pin 21 is moved from the lower position 221 on the upper surface of the cam 22 to the higher position 222, and the holding pin 21 is projected from the surface of the movable die 2 toward the intermediate plate 3. Then the mold is closed.

【0014】すると、図2に示すように、保持ピン21
がL分の距離中板3方向に突出しているため可動型2と
中板3の間に保持ピン21の突出分Lの隙間が開くこと
になる。この時、スライドコア5は、屈曲しているスラ
イドピン51により既に型閉め時の位置まで移動して、
可動型2とスライドコア5と中板3とでキャビティ14
を形成している。
Then, as shown in FIG. 2, the holding pin 21
Is protruded in the direction of the middle plate 3 by a distance of L, so that a gap corresponding to the protrusion L of the holding pin 21 is opened between the movable die 2 and the middle plate 3. At this time, the slide core 5 is already moved to the position when the mold is closed by the bent slide pin 51,
The movable mold 2, the slide core 5, and the intermediate plate 3 form a cavity 14
Is formed.

【0015】この状態で、射出成形機から樹脂を樹脂通
路111、112、ゲート13を通じてキャビティ14
内に射出する。この時、保持ピン21で間隔Lを保持し
ているため樹脂の射出時、ランナ板12と中板3及びラ
ンナ板12と取付板11が開く事がない。
In this state, the resin is injected from the injection molding machine through the resin passages 111 and 112 and the gate 13 into the cavity 14
It shoots in. At this time, since the distance L is held by the holding pin 21, the runner plate 12 and the intermediate plate 3, and the runner plate 12 and the mounting plate 11 do not open when the resin is injected.

【0016】そして、その後、油圧シリンダ9が後退
し、それに伴いカム22が後退することにより高い位置
222から低い位置221に保持ピン21の下面211
が移動する。この時、樹脂通路112内にある樹脂の残
圧により中板3とランナ板12の間及びランナ板12と
取付板11の間が開かないように、補助スプリング24
により型が開くのを防止している。
Then, after that, the hydraulic cylinder 9 retracts and the cam 22 retracts accordingly, so that the lower surface 211 of the holding pin 21 moves from the high position 222 to the low position 221.
Moves. At this time, the auxiliary spring 24 prevents the space between the middle plate 3 and the runner plate 12 and the space between the runner plate 12 and the mounting plate 11 from opening due to the residual pressure of the resin in the resin passage 112.
Prevents the mold from opening.

【0017】保持ピン21を後退可能にした後、再び金
型Mを型締めを行い可動型2と固定型3の間隔Lを無く
し、スタンピング成形する事により、所定の表皮付の樹
脂成形物を成形する。
After making the holding pin 21 retractable, the mold M is clamped again to eliminate the gap L between the movable mold 2 and the fixed mold 3 and stamping molding is carried out to obtain a resin molding with a predetermined skin. Mold.

【0018】成形後、型開き動作にはいると、まずラン
ナ板12と中板3の間が開き成形品とゲート13の樹脂
を切り離す。この時、ゲート13、樹脂通路112の固
まった樹脂ゲートは、ランナ板12側について行く。そ
して、次にランナ板12と取付板11の間が開きランナ
板12についている樹脂ゲートを離型し、最後に中板3
と可動型2の間が開きこの動きに従ってスライドピン6
に沿ってスライドコア5が移動し表皮付の樹脂成形品が
金型Mから取り出せる状態となる。
When the mold opening operation is started after the molding, the runner plate 12 and the intermediate plate 3 are opened first, and the molded product and the resin of the gate 13 are separated. At this time, the gate 13 and the resin gate in which the resin passage 112 is solidified follow the runner plate 12 side. Then, the space between the runner plate 12 and the mounting plate 11 is opened, the resin gate attached to the runner plate 12 is released, and finally the middle plate 3
And the movable die 2 open, and the slide pin 6 follows this movement.
The slide core 5 moves along with it, and the resin-molded product with the skin can be taken out from the mold M.

【0019】[0019]

【発明の効果】保持部材により中板と固定型の型閉めを
保持しているため、ホットランナ構造が不要となる。こ
のため金型の費用が低減でき、また、金型の維持費が低
減できる。そして、ホットランナノズルの温度調節が必
要となくなるため樹脂の射出量のばらつきによる成形品
の不良が低減する。また、通常の射出成形機を用いて低
圧成形が可能となる。
EFFECTS OF THE INVENTION Since the holding member holds the middle plate and the fixed mold, the hot runner structure is not required. Therefore, the die cost can be reduced, and the die maintenance cost can be reduced. Further, since it is not necessary to adjust the temperature of the hot runner nozzle, defects in the molded product due to variations in the injection amount of resin are reduced. In addition, low pressure molding can be performed using an ordinary injection molding machine.

【図面の簡単な説明】[Brief description of drawings]

【図1】 本発明の金型を示すもので、金型を完全に閉
めている状態を示している図。
FIG. 1 is a view showing a mold of the present invention, showing a state in which the mold is completely closed.

【図2】 本発明の金型を示すもので、金型を途中まで
型閉めし、樹脂を射出する状態の図。
FIG. 2 is a view showing a mold of the present invention, in which the mold is closed halfway and a resin is injected.

【図3】 本発明の金型で図2の状態まで型閉めし、樹
脂をキャビティ内に射出している図。
FIG. 3 is a diagram in which the mold of the present invention is closed to the state of FIG. 2 and resin is injected into the cavity.

【図4】従来のホットランナ構造を備えた金型の図。FIG. 4 is a view of a mold having a conventional hot runner structure.

【符号の説明】[Explanation of symbols]

1 固定型 11 取付板 12 ランナ板 2 可動型 21 保持ピン 3 中板 5 スライドコア M 金型 L 間隔 1 Fixed type 11 Mounting plate 12 Runner plate 2 Movable type 21 Holding pin 3 Middle plate 5 Slide core M Mold L spacing

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 可動型と固定型と中板と前記固定型と前
記中板との型閉め状態を保持する保持部材を設けた金型
を用いた樹脂成形方法であって、 樹脂通路を形成する前記固定型と前記中板の型閉めを前
記保持部材により保持し、前記中板と前記可動型を所定
の間隔を開けるように型閉めを行い、 前記可動型と前記中板との間に前記樹脂通路を経由して
樹脂を注入し、 再び前記可動型と前記中板の間を型閉めを行い、キャビ
ティを形成するとともに樹脂成形品を成形することを特
徴とする樹脂成形方法。
1. A resin molding method using a mold provided with a movable die, a fixed die, an intermediate plate, and a holding member for holding the closed state of the fixed die and the intermediate plate, wherein a resin passage is formed. Hold the mold closing of the fixed mold and the middle plate by the holding member, perform mold closing so as to open the predetermined distance between the middle plate and the movable mold, and between the movable mold and the middle plate. A resin molding method comprising injecting a resin through the resin passage, closing a mold between the movable mold and the middle plate again to form a cavity and molding a resin molded product.
【請求項2】 固定型と中板と可動型と保持部材とから
なる成形用金型において、 前記保持部材は、前記可動型側に配置され、前記可動型
から中板に向かって進退可能な保持ピンと前記保持ピン
の進出状態を固定させる固定手段とからなることを特徴
とする成形用金型。
2. A molding die comprising a fixed die, an intermediate plate, a movable die and a holding member, wherein the holding member is arranged on the movable die side and is movable back and forth from the movable die toward the intermediate plate. A molding die comprising a holding pin and a fixing means for fixing the advancing state of the holding pin.
JP32375391A 1991-11-12 1991-11-12 Resin molding method and molding die Pending JPH05131510A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32375391A JPH05131510A (en) 1991-11-12 1991-11-12 Resin molding method and molding die

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32375391A JPH05131510A (en) 1991-11-12 1991-11-12 Resin molding method and molding die

Publications (1)

Publication Number Publication Date
JPH05131510A true JPH05131510A (en) 1993-05-28

Family

ID=18158241

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32375391A Pending JPH05131510A (en) 1991-11-12 1991-11-12 Resin molding method and molding die

Country Status (1)

Country Link
JP (1) JPH05131510A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03173623A (en) * 1989-12-04 1991-07-26 Japan Steel Works Ltd:The Method and device for injection compression molding in three piece mold

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03173623A (en) * 1989-12-04 1991-07-26 Japan Steel Works Ltd:The Method and device for injection compression molding in three piece mold

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