JPH05125538A - Method and apparatus for automatic manufacture - Google Patents
Method and apparatus for automatic manufactureInfo
- Publication number
- JPH05125538A JPH05125538A JP28763691A JP28763691A JPH05125538A JP H05125538 A JPH05125538 A JP H05125538A JP 28763691 A JP28763691 A JP 28763691A JP 28763691 A JP28763691 A JP 28763691A JP H05125538 A JPH05125538 A JP H05125538A
- Authority
- JP
- Japan
- Prior art keywords
- manufacturing
- data
- manufacturing equipment
- equipment
- product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 301
- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000012545 processing Methods 0.000 claims description 48
- 238000004364 calculation method Methods 0.000 claims description 9
- 238000007689 inspection Methods 0.000 claims description 6
- 230000010485 coping Effects 0.000 claims description 3
- 238000004544 sputter deposition Methods 0.000 abstract description 50
- 239000000758 substrate Substances 0.000 abstract description 29
- 239000010408 film Substances 0.000 description 55
- 239000000047 product Substances 0.000 description 54
- 230000015572 biosynthetic process Effects 0.000 description 46
- 238000003745 diagnosis Methods 0.000 description 20
- 238000005259 measurement Methods 0.000 description 18
- 239000007789 gas Substances 0.000 description 16
- 235000012431 wafers Nutrition 0.000 description 16
- 239000010409 thin film Substances 0.000 description 12
- 238000010586 diagram Methods 0.000 description 9
- 238000012937 correction Methods 0.000 description 8
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 230000007547 defect Effects 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- 238000012546 transfer Methods 0.000 description 5
- 229910052786 argon Inorganic materials 0.000 description 4
- 238000001514 detection method Methods 0.000 description 4
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- -1 argon ions Chemical class 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000013523 data management Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004949 mass spectrometry Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
- 238000007514 turning Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/30—Computing systems specially adapted for manufacturing
Landscapes
- Multi-Process Working Machines And Systems (AREA)
- General Factory Administration (AREA)
- Physical Vapour Deposition (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Management, Administration, Business Operations System, And Electronic Commerce (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は製造設備の自動化技術に
係り、特に薄膜形成や薄膜加工などの微細加工設備に好
適な製造設備の自動製造方法および自動製造装置に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an automation technology for manufacturing equipment, and more particularly to an automatic manufacturing method and apparatus for manufacturing equipment suitable for fine processing equipment such as thin film formation and thin film processing.
【0002】[0002]
【従来の技術】従来の製造設備の自動化技術はロボット
を中心とするメカトロニクスの進歩により実施されてき
ており、特に、製造設備の機械部品の加工や組み立て作
業の自動化に適用されている。この他に機械加工ではな
く半導体を中心とする物理化学現象を薄膜形成や薄膜微
細加工に応用した薄膜用製造設備でも自動化に関する報
告として、例えば「ソリッド ステート テクノロジ
ー」(1990年5月)第149頁から第154頁
(“SOLID STATE TECHNOLOGY”
(May 1990)P149−154)の「インテグ
レイテッドプロセシング イクイプメント」(“Int
egrated Processing Equipm
ent”)がある。この報告の薄膜の加工・製造設備は
成膜や加工用基板やウェハを従来のロボット技術の応用
でハンドリングし、予め定めたシーケンスにより薄膜の
成膜やエッチング等の加工を行う自動製造装置である。2. Description of the Related Art Conventional automation technology for manufacturing equipment has been implemented due to the progress of mechatronics centered on robots, and in particular, it has been applied to automation of machining and assembling work of mechanical parts of manufacturing equipment. In addition to this, as a report on automation in a thin-film manufacturing facility in which a physicochemical phenomenon centering on a semiconductor is applied to thin-film formation and thin-film microfabrication instead of mechanical processing, for example, “Solid State Technology” (May 1990) p. 149. To page 154 ("SOLID STATE TECHNOLOGY"
(May 1990) P149-154), "Integrated Processing Equipment"("Int
Egged Processing Equipm
ent ”). The thin film processing / manufacturing equipment in this report handles substrates and wafers for film formation and processing by applying conventional robot technology, and performs processing such as thin film formation and etching according to a predetermined sequence. This is an automatic manufacturing device.
【0003】従来この種の薄膜の成膜技術では一般的に
はスパッタリング法が普及しており、この方法は不活性
なアルゴンガスを真空チャンバでプラズマ放電させ、そ
のプラズマ中のアルゴンイオンを電界で加速して成膜材
料に衝突させ、成膜材料を空間に放出させてその放出し
た成膜材料粒子を成膜対象基板上に堆積させて薄膜を形
成するものである。このスパッタリング法では成膜や加
工前の製造設備の運転状態として真空チャンバの到達真
空度があり、製造設備の製造動作シーケンスとして成膜
対象基板の加熱の有無やスパッタクリーニングと呼ぶ前
処理の有無があって、上記の成膜時の製造設備の制御因
子として真空チャンバに導入するアルゴンガスの流量や
圧力と、プラズマ放電の電圧や電流や成膜時間と、基板
加熱電力や成膜対象基板の温度等とがある。この成膜前
のものは事前にその膜の目的に合わせて決めおいて製造
設備にそれらを入力することにより所期の成膜を当該設
備で実現でき、さらに上記の成膜時の制御因子の圧力や
電流や電圧や時間等は事前に設定して製造中に事前設定
値より変動したら製造設備の有する制御機構により制御
して所期の設定値からの変動を補正している。このよう
に薄膜の成膜や加工の場合には事前設定の設備の電源や
流量計や圧力計などを制御して成膜や加工を行うもので
ある。In the past, a sputtering method has generally been popular in this kind of thin film forming technique. In this method, an inert argon gas is plasma-discharged in a vacuum chamber, and argon ions in the plasma are generated by an electric field. The thin film is formed by accelerating and colliding with the film forming material, discharging the film forming material into the space, and depositing the discharged film forming material particles on the film formation target substrate. In this sputtering method, the operating state of the manufacturing equipment before film formation and processing is the ultimate vacuum of the vacuum chamber, and the manufacturing operation sequence of the manufacturing equipment is whether the substrate to be film-formed is heated or not, and the pretreatment called sputter cleaning is performed. The flow rate and pressure of the argon gas introduced into the vacuum chamber, the plasma discharge voltage and current, the film formation time, the substrate heating power, and the temperature of the film formation target substrate Etc. This pre-deposition film can be realized in the equipment by deciding it in advance according to the purpose of the film and inputting them into the manufacturing equipment. The pressure, current, voltage, time, etc. are set in advance, and if they fluctuate from preset values during manufacturing, they are controlled by the control mechanism of the manufacturing equipment to correct fluctuations from the preset values. In this way, in the case of thin film formation or processing, the power supply of a preset facility, a flow meter, a pressure gauge, or the like is controlled to perform film formation or processing.
【0004】[0004]
【発明が解決しようとする課題】上記従来技術は通常の
薄膜の成膜を行うスパッタリング法では上記の制御パラ
メータがプラズマ放電を発生し維持するためのもので成
膜や加工時の放電状態とは直接の関係がないため、すな
わち上記したプラズマ放電のように物理化学現象を応用
したものでは弱電離プラズマと呼ぶ非平衡な状態にあっ
て上記パラメータの事前設定値で成膜や加工のプラズマ
状態の本質をモニタするものではないため、事前設定値
の電圧や電流や圧力などの値が同一であっても放電の状
態を異にして再現性の高い成膜や加工ができず、自動的
に製造する場合には不良が発生してもチェックできずに
不良品を製造してしまうという問題があった。また最近
では半導体を中心として薄膜の形成や加工は微細化が進
んで製造条件が厳しくなっているため、製造設備の状態
の僅かの変動により製造結果として不良が発生する場合
が多くなっているが、しかし上記従来技術の製造設備で
設定した制御パラメータのモニタでは製造設備に起因し
た不良であっても上記パラメータに不良現象として反映
しないことから製造時に発生している現象を十分に把握
できない場合があるため、上記従来技術の自動製造装置
の機能のみでは安定に製品を製造することが困難である
という問題があった。In the above-mentioned prior art, the above-mentioned control parameters are for generating and maintaining plasma discharge in the ordinary sputtering method for forming a thin film, and what is the discharge state during film formation or processing. Since there is no direct relationship, that is, in the non-equilibrium state called weak ionization plasma in the case of applying a physicochemical phenomenon such as the above-mentioned plasma discharge, the plasma state of film formation or processing is set by the preset values of the above parameters. Since it does not monitor the essence, even if the preset values of voltage, current, pressure, etc. are the same, it is not possible to perform highly reproducible film formation and processing with different discharge conditions, and the manufacturing is automatically performed. In that case, there is a problem in that even if a defect occurs, it cannot be checked and a defective product is manufactured. In addition, recently, as the thin film formation and processing centering on semiconductors have become finer and the manufacturing conditions have become more stringent, a slight change in the state of the manufacturing equipment often causes defects as a result of manufacturing. However, even if a defect due to the manufacturing equipment is not reflected in the above-mentioned parameter as a defective phenomenon by the monitor of the control parameter set in the manufacturing equipment of the above-mentioned conventional technology, the phenomenon occurring at the time of manufacture may not be sufficiently grasped. Therefore, there is a problem that it is difficult to stably manufacture a product only by the function of the above-described conventional automatic manufacturing apparatus.
【0005】本発明の目的は製造設備の製造状態を把握
するために製造設備の部位の動作を示す情報と製造設備
の運転状態を表す情報と製造設備を運転して製造した製
品の製造結果を表す情報と製造装置の運転状態を判定で
きる製品の品質情報などとを用いて製造設備の状態の変
動を把握でき、またその製造設備の状態の変動に関して
取得したデータを元に製造設備の製造状態を予め制定し
たルールにより判定して製造状態の良否を製造時に常時
監視でき、さらにその製造設備の状態の変動に関して取
得したデータを元に製造設備の事象を解析して製造設備
の状態の良否判定用ルールを制定するのを支援できる自
動製造方法および自動製造装置を提供することにある。An object of the present invention is to provide information indicating the operation of parts of the manufacturing equipment, information indicating the operating status of the manufacturing equipment, and manufacturing results of products manufactured by operating the manufacturing equipment in order to grasp the manufacturing status of the manufacturing equipment. It is possible to grasp the fluctuation of the state of the manufacturing equipment by using the information shown and the quality information of the product that can judge the operating state of the manufacturing equipment, and the manufacturing state of the manufacturing equipment based on the data acquired regarding the fluctuation of the state of the manufacturing equipment. It is possible to constantly monitor the quality of the manufacturing state by making decisions based on the rules established in advance during manufacturing.Furthermore, the event of the manufacturing facility is analyzed based on the data acquired regarding the fluctuation of the state of the manufacturing facility, and the quality of the manufacturing facility is determined. An object of the present invention is to provide an automatic manufacturing method and an automatic manufacturing apparatus that can assist in establishing a usage rule.
【0006】[0006]
【課題を解決するための手段】上記目的を達成するため
に、本発明の自動製造方法および自動製造装置は、製造
設備の運転時に製造設備の部位の動作と製造設備の運転
状態に関わる情報や製造設備の製品の製造時の製造状態
に関わる情報などをそれぞれ時系列データとして取得
し、さらに製造設備の製品の製造作業用のチャンバなど
で処理の後に製品の製造結果を検出する検査ステージな
どで製造した製品の品質状態を表す製品特性情報を取得
して、上記時系列データが時間軸を合わせた形態とする
が上記製造結果に関わる情報が時系列データでなく製品
ワーク毎に製品品質データとして取得されるため上記時
系列データとは製造設備の部位の動作に対応して連結す
ることにより、上記時系列データである製造設備の製品
の製造状態の変動の結果として製造設備の製品の製造結
果である1製品ワークの品質データが対応することから
製造設備の部位の動作情報による1製品ワークの製造終
了の検出とその1製品ワークの検査ステージなどでの品
質データの検出から上記時系列データと製品の品質デー
タを連結できるようにして、製造設備の運転状態や製造
状態と当該製造状態での製品の製造結果すなわち製品の
品質データを結び付けて把握できるようにしたものであ
る。In order to achieve the above object, the automatic manufacturing method and the automatic manufacturing apparatus of the present invention provide information relating to the operation of parts of the manufacturing equipment and the operating state of the manufacturing equipment during the operation of the manufacturing equipment. At an inspection stage that acquires information related to the manufacturing state of the product in the manufacturing equipment as time series data, and further detects the manufacturing result of the product after processing in the chamber for manufacturing operations of the product in the manufacturing equipment. The product characteristic information indicating the quality condition of the manufactured product is acquired, and the time series data is in a form in which the time axis is matched, but the information related to the above manufacturing result is not the time series data but the product quality data for each product work. Since it is acquired, the time series data is linked to correspond to the operation of the parts of the manufacturing equipment, so that the fluctuation of the manufacturing state of the product of the manufacturing equipment, which is the time series data, is changed. As a result, the quality data of one product work, which is the production result of the product of the production equipment, corresponds to the detection of the end of production of one product work from the operation information of the parts of the production equipment and the quality of the inspection stage of the one product work. By connecting the above-mentioned time-series data and product quality data from the detection of data, it is possible to grasp the operating status and manufacturing status of the manufacturing equipment and the manufacturing result of the product in that manufacturing status, that is, the quality data of the product by associating them. It was done.
【0007】また本発明は予め制定した運転状態や製造
状態の判定ルールに基づいて製造設備の状態データと製
品の品質データを判定すべき区間に区分し、運転状態や
製造状態の判定ルールに特定した判定に固有の運転状態
や製造状態の特徴量算出式によって製造設備の上記区分
した区間の当該状態の特徴量を算出し、該算出した特徴
量を判定ルールに判定した判断基準式により判定するこ
とにより、製造設備の運転状態や製造状態を常にチェッ
クしながら製品を製造するようにしたものである。Further, according to the present invention, the condition data of the manufacturing equipment and the quality data of the product are divided into sections to be judged on the basis of the previously established rules for judging the operating condition and the manufacturing condition, and specified in the judging rule of the operating condition and the manufacturing condition. The characteristic amount of the state of the divided section of the manufacturing equipment is calculated by the characteristic amount calculation formula of the operating state or the manufacturing state peculiar to the determination, and the calculated characteristic amount is determined by the determination criterion formula determined by the determination rule. As a result, the product is manufactured while constantly checking the operating condition and manufacturing condition of the manufacturing equipment.
【0008】さらに本発明は製造設備の部位の動作と製
造設備の運転時の運転状態に関わる状態や製造設備の製
品の製造時の製造状態に関わる情報とをそれぞれ時系列
データとして取得して記憶する手段と、さらに製造設備
の製品の製造作業用のチャンバなどでの処理の後に製品
の製造結果を検出する検査ステージなどで製造した製品
の品質状態を表す製品特性情報を取得して記憶する手段
とを設け、上記製造設備の部位の動作情報による1製品
ワークの製造終了の検出とその1製品ワークの検査ステ
ージなどでの品質データの検出から上記時系列データと
製品の品質データを連結させ、その連結したデータの解
析を行う期間(区間)を製品ワークの識別子などにより
区分して当該データを運転状態や製造状態の変動と製品
品質パラメータの変動について同一時間軸上で表示する
ことにより、製造設備の運転中や製造中のパラメータの
変動による製品の品質データの変動の知見を得易くでき
ることから当該データの解析による上記した判定ルール
の判定の基になる知見を得られるようにしたものであ
る。Furthermore, the present invention acquires and stores, as time-series data, the operation of the parts of the manufacturing equipment, the status related to the operating status of the manufacturing equipment during operation, and the information related to the manufacturing status during manufacturing of the products of the manufacturing equipment. And means for acquiring and storing product characteristic information representing a quality state of a product manufactured at an inspection stage or the like for detecting the manufacturing result of the product after processing in a chamber for manufacturing the product of the manufacturing facility. And connecting the time series data and the quality data of the product from the detection of the end of production of one product work based on the operation information of the parts of the manufacturing equipment and the detection of the quality data at the inspection stage of the one product work, The period (section) in which the linked data is analyzed is divided by product work identifiers, etc., and the data is analyzed for changes in operating and manufacturing conditions and product quality parameters. By displaying the dynamics on the same time axis, it is possible to easily obtain the knowledge of the fluctuation of the quality data of the product due to the fluctuation of the parameter during the manufacturing facility operation or manufacturing. It is intended to obtain the underlying knowledge.
【0009】[0009]
【作用】上記の自動製造方法および自動製造装置は、製
造設備の運転時の製造設備の部位の動作を部位が動作し
た項目とその動作した時刻について記憶するとともに、
製造設備の運転状態や製品の製造状態に関わる情報を製
造設備の運転時の運転状態や製品の製造時の製造状態の
時々刻々の変動とその動作した時刻について記憶し、さ
らに製造設備の製造した製品の品質状態を表す製品特性
情報を製造結果を検出する検査ステージなどにより取得
し、上記製造設備の部位の動作データと製造設備の運転
状態データや製造状態データを同一の時間軸で突き合わ
せ、さらに製品の品質データをも製造設備の部位の動作
データに対応した製造結果てある1製品ワークの品質デ
ータとして上記同一時間軸上に突き合わせ、このように
時間軸を合わせた形態にすることによって製品の品質デ
ータも時系列データとして扱うことができるため、製造
設備の運転状態や製品の製造状態と当該製造状態での製
造結果すなわち製品の品質データを結び付けて製造設備
の運転状態や製造状態の変動を把握できることから、製
造設備で発生している事象を把握し易くできることによ
り製造設備の状態を正確に把握して製造設備の状態を判
定するための判定ルール(診断ルール)の構築を容易に
する。The above-described automatic manufacturing method and automatic manufacturing apparatus store the operation of the part of the manufacturing equipment during the operation of the manufacturing equipment as to the item operated by the part and the time when the part operates.
Information related to the operating status of the manufacturing equipment and the manufacturing status of the product is stored with respect to the momentary fluctuations of the operating status of the manufacturing equipment during operation and the manufacturing status during the manufacturing of the product, and the operating time, and the manufacturing equipment was manufactured. Acquire product characteristic information that represents the quality state of the product by an inspection stage that detects the manufacturing result, and match the operation data of the parts of the manufacturing equipment with the operating status data and manufacturing status data of the manufacturing equipment on the same time axis. The quality data of the product is also matched with the above-mentioned same time axis as the quality data of one product work, which is the production result corresponding to the operation data of the part of the manufacturing facility, and the time axis is adjusted in this way to make the product Since quality data can also be treated as time-series data, the operating status of manufacturing equipment, the manufacturing status of products, and the manufacturing results in that manufacturing status, that is, manufacturing Since it is possible to grasp the operating status of manufacturing equipment and fluctuations in manufacturing status by linking the quality data of the manufacturing equipment, it is possible to easily grasp the events occurring in the manufacturing equipment and accurately grasp the status of the manufacturing equipment to check the manufacturing equipment status. To facilitate the construction of a judgment rule (diagnosis rule) for judgment.
【0010】また上記より構築した製造設備の状態の判
定ルールに従って上記同一時間軸上で発生した事象を予
め決めた特徴量算出式により製造設備の状態を反映する
特徴量を算出し、この特徴量を判断基準に当てはめて特
徴量の比較や変動傾向判定などの処理を行うことにより
製造設備の運転状態や製品の製造状態の判定を行うか、
あるいは上記同一時間軸上に突き合わせた製造設備の運
転状態や製品の製造状態の変動とその製品の製造結果の
品質データとも予め決めた判定ルールの関係に対して当
てはまるか否かの判定を行うことができる。さらに上記
の判定した結果でもし製造設備に異常があるような場合
には製造設備の運転条件や製品の製造条件の変更を指示
したり、あるいは対処すべき製造設備の部位の動作やそ
の方法についても指示することができる。Further, according to the rule for judging the state of the manufacturing equipment constructed as described above, the characteristic quantity reflecting the state of the manufacturing equipment is calculated by the characteristic quantity calculation formula for the event occurring on the same time axis, and the characteristic quantity is calculated. Whether the operating condition of the manufacturing equipment or the manufacturing condition of the product is judged by applying features such as
Alternatively, it is determined whether or not the variation of the operating state of the manufacturing equipment or the manufacturing state of the product matched on the same time axis and the quality data of the manufacturing result of the product are applicable to the relationship of the predetermined determination rule. You can Furthermore, if there is an abnormality in the manufacturing equipment as a result of the above judgment, it is instructed to change the operating conditions of the manufacturing equipment or the manufacturing conditions of the product, or the operation of the part of the manufacturing equipment to be dealt with and its method. Can also be instructed.
【0011】[0011]
【実施例】以下に本発明の一実施例を図1から図6によ
り説明する。図1は本発明による自動製造方法および自
動製造装置の一実施例を示す成膜装置の自動製造装置の
ハードウェア構成図である。図1において、製造設備と
して薄膜の成膜装置に適用した場合の自動製造装置の構
成例を示し、本構成では設備状態判定用計算機100
と、装置コントローラ(シーケンサ)101と、モニタ
データ処理用計算機401とがネットワーク501を介
して接続し、成膜装置であるスパッタ装置201がモニ
タデータ計測補正ステージ402と、成膜結果モニタス
テージ301とそれぞれウェハ搬送経路302により接
続している。またこれらのスパッタ装置201と、モニ
タデータ計測補正ステージ402と、成膜結果モニタス
テージ301とがモニタデータ処理用計算機401に接
続し、スパッタ装置201が装置コントローラ101に
接続しており、モニタデータ処理用計算機401と装置
コントローラ101からそれぞれモニタデータと装置部
位動作データをネットワー501により設備状態判定用
計算機100に通信できる。設備状態判定用計算機10
0にはディスプレイ110と、キーボード120も接続
できる。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. FIG. 1 is a hardware configuration diagram of an automatic manufacturing apparatus of a film forming apparatus showing an embodiment of the automatic manufacturing method and the automatic manufacturing apparatus according to the present invention. FIG. 1 shows a configuration example of an automatic manufacturing apparatus when applied to a thin film deposition apparatus as manufacturing equipment. In this configuration, the equipment state determination computer 100 is used.
The apparatus controller (sequencer) 101 and the monitor data processing computer 401 are connected via a network 501, and the sputtering apparatus 201, which is a film forming apparatus, has a monitor data measurement correction stage 402 and a film formation result monitor stage 301. The wafer transfer paths 302 are connected to each other. Further, the sputter device 201, the monitor data measurement correction stage 402, and the film formation result monitor stage 301 are connected to the monitor data processing computer 401, and the sputter device 201 is connected to the device controller 101. The monitor data and the device part operation data can be communicated from the computer 401 and the device controller 101 to the facility state computer 100 via the network 501, respectively. Calculator 10 for equipment status determination
A display 110 and a keyboard 120 can also be connected to 0.
【0012】この構成で、成膜対象基板はモニタデータ
計測補正ステージ402よりスパッタ装置201に搬入
されるが、モニタデータ計測補正ステージ402は成膜
対象基板をスパッタ装置201で成膜する製造状態をモ
ニタするパラメータを計測する際にその基板の固有の特
性値を測定する。例えば製造状態の温度をスパッタ装置
201で赤外線により測定する際にはその基板の放射係
数を当該モニタデータ計測補正ステージ402で測定
し、また当該モニタデータ計測補正ステージ402で成
膜対象基板を加熱してその基板から放出されるガスなど
をモニタすることができる。これらのモニタデータ計測
補正ステージ402で成膜処理前に計測されたモニタデ
ータはモニタデータ処理用計算機401に送信され、モ
ニタデータ処理用計算機401ではその送信データを記
憶して、スパッタ装置201で製造状態をモニタしたデ
ータと結び付けることにより製造状態の実測定データと
して記憶する。またスパッタ装置201で成膜処理した
製造結果のモニタデータは成膜対象基板が成膜結果モニ
タステージ301に搬送された時点で測定される。例え
ばスパッタ装置201での半導体の成膜処理の場合には
膜のシート抵抗値や反射率や膜厚などの製品特性データ
を成膜結果モニタステージ301で測定し、この成膜結
果モニタステージ301で成膜処理後に計測されたモニ
タデータも同様にモニタデータ処理用計算機401に送
信して記憶される。また装置コントローラ(シーケン
サ)101はスパッタ装置201をコントロールし、こ
れと合わせて該装置の部位の動作をモニタして、その情
報を設備状態判定用計算機100に送信し、これと同様
にモニタデータ処理用計算機401からも上記で記憶し
たモニタデータを設備状態判定用計算機100に送信す
る。設備状態判定用計算機100は装置コントローラ1
01とモニタデータ処理用計算機401から送信された
データにより製造設備であるスパッタ装置201の状態
を判定する。With this configuration, the film formation target substrate is carried into the sputtering apparatus 201 from the monitor data measurement / correction stage 402. The monitor data measurement / correction stage 402 shows the manufacturing state in which the film formation target substrate is formed by the sputtering apparatus 201. When measuring the parameter to be monitored, the characteristic value peculiar to the substrate is measured. For example, when the temperature in the manufacturing state is measured by the sputtering apparatus 201 by infrared rays, the radiation coefficient of the substrate is measured by the monitor data measurement / correction stage 402, and the film formation target substrate is heated by the monitor data measurement / correction stage 402. The gas released from the substrate can be monitored. The monitor data measured by the monitor data measurement / correction stage 402 before the film formation process is transmitted to the monitor data processing computer 401, and the monitor data processing computer 401 stores the transmission data and manufactures it in the sputtering apparatus 201. By linking the condition with the monitored data, it is stored as the actual measurement data of the manufacturing condition. Further, the monitor data of the manufacturing result of the film formation processing performed by the sputtering apparatus 201 is measured when the film formation target substrate is conveyed to the film formation result monitor stage 301. For example, in the case of semiconductor film formation processing by the sputtering apparatus 201, product characteristic data such as sheet resistance value, reflectance, and film thickness of a film are measured by the film formation result monitor stage 301, and by this film formation result monitor stage 301. Similarly, the monitor data measured after the film forming process is also transmitted to and stored in the monitor data processing computer 401. Further, the device controller (sequencer) 101 controls the sputtering device 201, monitors the operation of the parts of the device together with this, and transmits the information to the equipment state determination computer 100, and similarly performs monitor data processing. The monitor data stored as described above is also transmitted from the application computer 401 to the equipment state determination computer 100. The equipment state determination computer 100 is the device controller 1
01 and the data transmitted from the monitor data processing computer 401 determines the state of the sputtering apparatus 201, which is a manufacturing facility.
【0013】図2は図1のスパッタ装置201の一実施
例を示す装置内部の断面模式図である。図2において、
スパッタ装置201の成膜対象基板220の処理チャン
バ215の内部で、成膜対象基板220は成膜材料21
1に対向して位置し、この成膜対象基板220は該基板
の搬送室216からゲートバルブ234を介して搬送さ
れる。成膜対象基板220に対向した成膜材料211は
スパッタ装置201に装着し、スパッタ電極210は放
電発生用電源(スパッタ電源)212に電気的に接続す
る。また処理チャンバ215には放電ガスのガス配管2
31からガス導入バルブ232を介してガスが導入さ
れ、処理チャンバ215を真空に排気する真空排気ポン
プ230はメインバルブ233を介して処理チャンバ2
15に装着している。さらにスパッタ装置201の処理
チャンバ215には成膜対象基板220の製造状態のモ
ニタとして成膜対象基板220の温度を測定する温度計
241が設けられ、ビューポート240を通して該温度
を測定する。またスパッタ装置201の運転状態を表す
処理チャンバ215内の真空状態のモニタとして質量分
析計242が設けられ、仕切りバルブ243を介して処
理チャンバ215の真空の質をモニタする。FIG. 2 is a schematic sectional view of the inside of the sputtering apparatus 201 showing an embodiment of FIG. In FIG.
Inside the processing chamber 215 of the film formation target substrate 220 of the sputtering apparatus 201, the film formation target substrate 220 is the film formation material 21.
1, the substrate 220 to be film-formed is transferred from the transfer chamber 216 of the substrate through the gate valve 234. The film-forming material 211 facing the film-forming target substrate 220 is mounted on the sputtering apparatus 201, and the sputtering electrode 210 is electrically connected to a discharge generating power supply (sputtering power supply) 212. In the processing chamber 215, the gas pipe 2 for the discharge gas
A gas is introduced from 31 through the gas introduction valve 232, and the vacuum exhaust pump 230 that evacuates the processing chamber 215 to a vacuum is provided through the main valve 233.
It is attached to 15. Further, in the processing chamber 215 of the sputtering apparatus 201, a thermometer 241 for measuring the temperature of the film formation target substrate 220 is provided as a monitor of the manufacturing state of the film formation target substrate 220, and the temperature is measured through the view port 240. Further, a mass spectrometer 242 is provided as a monitor of the vacuum state in the processing chamber 215 indicating the operating state of the sputtering apparatus 201, and the quality of the vacuum in the processing chamber 215 is monitored via the partition valve 243.
【0014】この構成で、スパッタ装置201には図1
と同様に設備状態判定用計算機100と、モニタデータ
処理用計算機401と、装置コントローラ(シーケン
サ)101などを接続しており、装置コントローラ10
1は成膜対象基板220と、ゲートバルブ234と、放
電発生用電源212と、放電ガスの導入バルブ232
と、ガス配管231と、真空排気ポンプ230と、メイ
ンバルブ233などの各部位の動作をモニタし、その動
作した部位の項目とその時刻を記憶している。またモニ
タデータ処理用計算機401は成膜対象基板220の製
造状態のモニタである温度計241と、装置の運転状態
の真空ガス雰囲気のモニタである質量分析計242との
両モニタデータを取得し、そのモニタデータとその時刻
を記憶している。装置コントローラ101とモニタデー
タ処理用計算機401とに記憶したデータは設備状態判
定用計算機100に送信され、そのデータによりスパッ
タ装置201の状態が判定される。With this structure, the sputtering apparatus 201 is shown in FIG.
In the same manner as described above, the equipment state determination computer 100, the monitor data processing computer 401, the device controller (sequencer) 101, etc. are connected, and the device controller 10
Reference numeral 1 is a film formation target substrate 220, a gate valve 234, a discharge generation power source 212, and a discharge gas introduction valve 232.
The operation of each part such as the gas pipe 231, the vacuum exhaust pump 230, and the main valve 233 is monitored, and the item of the operated part and the time are stored. Further, the monitor data processing computer 401 acquires both monitor data of a thermometer 241 which is a monitor of a manufacturing state of the film formation target substrate 220 and a mass spectrometer 242 which is a monitor of a vacuum gas atmosphere in an operating state of the apparatus, The monitor data and the time are stored. The data stored in the apparatus controller 101 and the monitor data processing computer 401 is transmitted to the equipment state determination computer 100, and the state of the sputtering apparatus 201 is determined by the data.
【0015】図3は図1と図2の設備状態判定用計算機
100の判定システム(診断システム)の判定処理(診
断処理)の一実施例を示す処理の流れ図である。図3に
おいて、はじめに設備状態判定(診断)用計算機101
は製造設備のスパッタ装置201の測定データすなわち
製造設備のスパッタ装置201の部位の動作の来歴とス
パッタ装置201の成膜対象基板220などの加工(成
膜)条件との各データの判定(診断)を行う部分につい
て測定データを選択する(処理S1)。この場合に測定
データ量は例えば2000〜3000件となってデータ
量が多くなり判定(診断)処理に不適であり、そこで本
実施例では製造設備のスパッタ装置201の部位の動作
の来歴データから例えば“製造設備のある動作からある
動作までの間のデータのみを選択する”などのルールの
データ選択ルールをもとに製造設備の動作項目による加
工(成膜)条件データの分類をする(処理S2)。つぎ
に分類した加工(成膜)条件データを対応する判定(診
断)ルールによるデータの特徴量の算出方法に従って処
理し、測定データを計算機でも判断できる形態の特徴量
に変換する(処理S3)。ついで判定(診断)ルールの
基準による特徴量の判定評価方法に従って処理し、その
特徴量同士の大小比較や特徴量の基準値に対する大小比
較などの判断により測定データの判定(診断)をするこ
とができるようにする(処理S4)。つぎに測定データ
の特徴量の判定評価結果の出力を行うが、この測定デー
タの判定(診断)結果の出力は測定データの特徴量を算
出する時に判定(診断)ルールの中にある判定(診断)
項目について予めわかっているので、測定データの特徴
量を判断(比較など)することにより判定(診断)結果
として当該測定データが判定(診断)項目に対して正常
か異常かを判断できる。また上記判定(診断)結果に対
応する対処方法を示すメッセージを表示したり、判定
(診断)結果に対応して当該設備の部位の動作を変更す
る制御情報を出力することもできる。なお上記判定(診
断)ルールとしては診断項目と、診断のための特徴量抽
出の計算式と、特徴量を計算する測定データの範囲と、
特徴量を判断する判断の計算と、その判断結果の出力と
の各項目とすることができる(処理S5)。FIG. 3 is a flow chart of a process showing an embodiment of a judgment process (diagnosis process) of the judgment system (diagnosis system) of the equipment state judgment computer 100 shown in FIGS. In FIG. 3, first, a computer 101 for equipment state determination (diagnosis)
Is a determination (diagnosis) of measurement data of the sputtering apparatus 201 of the manufacturing equipment, that is, each history of the operation of the portion of the sputtering apparatus 201 of the manufacturing equipment and processing (film forming) conditions of the film formation target substrate 220 of the sputtering apparatus 201. The measurement data is selected for the portion for performing (step S1). In this case, the amount of measured data is, for example, 2000 to 3000, and the amount of data is large, which is unsuitable for the determination (diagnosis) processing. Therefore, in this embodiment, for example, from the history data of the operation of the part of the sputtering apparatus 201 of the manufacturing equipment, The processing (film formation) condition data is classified according to the operation item of the manufacturing equipment based on the data selection rule of the rule such as "select only data from a certain operation of the manufacturing equipment" (process S2). ). Next, the classified processing (film formation) condition data is processed according to the method of calculating the feature amount of data according to the corresponding determination (diagnosis) rule, and the measured data is converted into a feature amount that can be judged by a computer (process S3). Then, processing is performed according to the method of evaluating and evaluating the feature quantity based on the criteria of the judgment (diagnosis) rule, and the measurement data can be judged (diagnosed) by comparing the feature quantities with each other or comparing the feature quantity with the reference value. It is made possible (process S4). Next, the evaluation result of the determination of the feature amount of the measurement data is output. The output of the determination (diagnosis) result of the measurement data is the determination (diagnosis) rule in the determination (diagnosis) rule when calculating the feature amount of the measurement data. )
Since the item is known in advance, it is possible to judge whether the measurement data is normal or abnormal with respect to the judgment (diagnosis) item as a judgment (diagnosis) result by judging (comparing) the characteristic amount of the measurement data. It is also possible to display a message indicating a coping method corresponding to the determination (diagnosis) result, or output control information for changing the operation of the part of the equipment in accordance with the determination (diagnosis) result. As the determination (diagnosis) rule, a diagnostic item, a formula for extracting a feature amount for diagnosis, a range of measurement data for calculating the feature amount,
The calculation of the judgment for judging the characteristic amount and the output of the judgment result can be used as the respective items (process S5).
【0016】図4は図1と図2の製造設備のスパッタ装
置201の部位の動作データと運転状態や製造状態のモ
ニタデータを同一時間軸上に突き合わせた出力の一実施
例を示す表示図である。図4において、装置コントロー
ラ101による製造設備のスパッタ装置201の各部位
のメインバルブ233とガス導入バルブ231とゲート
バルブ234とスパッタ電源212のOPEN(O
N),CLOSE(OFF)動作のモニタデータを時系
列に時間軸3001上に示し、モニタデータ処理用計算
機401によるスパッタ装置201の運転状態や製造状
態のモニタデータを質量分析計242や温度計241の
モニタ項目毎に多軸トレンド図3002で示している。
図4中の時間軸は一部省略してあるが、図2のメインバ
ルブ233がOPEN(〇印)になってから真空排気ポ
ンプ230による処理チャンバ215内の真空排気が開
始される。このスパッタ装置201の運転状態は質量分
析計242の質量分析データのマスNO.1(H)とマ
スNO.2(H2 )とマスNO.18(H2O)などの
ガスの量が低下していることでわかる。ついで放電ガス
の導入バルブ232のOPENにより質量分析計242
のデータのマスNO.40のアルゴンガスが増加し、こ
れはスパッタ装置201のスパッタ動作の用意を開始し
たことを示している。つぎにゲートバルブ234のOP
EN,CLOSEにより成膜対象基板220の処理チャ
ンバ215と搬送室216間の出入を示す。ついでスパ
ッタ電源212のON,OFF(・印)により成膜材料
211のスパッタによる成膜対象基板220の成膜の開
始と終了を示しており、このスパッタ装置201の製造
状態の成膜対象基板(ウェハ)220の温度計241に
よる温度データが示される。このように製造設備のスパ
ッタ装置201の各部位の動作データと運転状態や製造
状態のデータを同一時間軸上で突き合わせることによ
り、スパッタ装置201の部位の動作と運転状態や製造
状態とを時間(時刻)で区切り切り出して出力し表示す
ることができる。FIG. 4 is a display diagram showing an embodiment of an output in which the operation data of the portion of the sputtering apparatus 201 of the manufacturing equipment of FIGS. 1 and 2 and the monitor data of the operating condition and the manufacturing condition are matched on the same time axis. is there. In FIG. 4, the main valve 233, the gas introduction valve 231, the gate valve 234, and the OPEN (O of the sputtering power source 212 of each part of the sputtering apparatus 201 of the manufacturing equipment by the apparatus controller 101 are open.
N) and CLOSE (OFF) operation monitor data are shown in time series on the time axis 3001, and the monitor data of the operating state and manufacturing state of the sputtering apparatus 201 by the monitor data processing computer 401 is used as the mass spectrometer 242 and the thermometer 241. A multi-axis trend diagram 3002 is shown for each monitor item.
Although the time axis in FIG. 4 is partially omitted, after the main valve 233 of FIG. 2 becomes OPEN (marked with ◯), the vacuum exhaust of the processing chamber 215 by the vacuum exhaust pump 230 is started. The operating state of the sputtering apparatus 201 is the mass NO. Of the mass spectrometry data of the mass spectrometer 242. 1 (H) and mass NO. 2 (H 2 ) and the mass NO. It can be seen that the amount of gas such as 18 (H 2 O) is decreasing. Then, the discharge gas introduction valve 232 is opened and the mass spectrometer 242 is opened.
Mass NO. The argon gas of 40 increased, which indicates that the sputtering apparatus 201 has started to prepare for the sputtering operation. Next, the OP of the gate valve 234
EN and CLOSE indicate entry and exit between the processing chamber 215 and the transfer chamber 216 of the film formation target substrate 220. Next, the start and end of film formation of the film formation target substrate 220 by the sputtering of the film formation material 211 are indicated by turning on and off (•) of the sputtering power source 212, and the film formation target substrate in the manufacturing state of the sputtering apparatus 201 ( Wafer) 220 thermometer 241 temperature data is shown. In this way, by comparing the operation data of each part of the sputtering apparatus 201 of the manufacturing equipment with the operating state and manufacturing state data on the same time axis, the operation of the part of the sputtering apparatus 201 and the operating state and manufacturing state can be compared with each other. It can be separated and output by (time) and displayed.
【0017】図5は図1と図2の製造設備のスパッタ装
置201の製品品質データを管理する出力の一実施例を
示す表示図である。図5において、横軸に成膜対象基板
220のウェハNOをとり、縦軸にはスパッタ装置20
1で製造(成膜)後の製品の品質データの例を示し、こ
こでは品質データとしてウェハ上の異物数と、シート抵
抗と、反射率とを測定した結果についてプロットしてあ
る。図5からウェハNO.9,10でシート抵抗と反射
率が他のウェハNOよりも増加しており、この状態はす
べて予め制定した許容規格区間内であるが、しかしウェ
ハNO.9,10が他のウェハNOに比べて異なった傾
向を示していることがわかる。FIG. 5 is a display diagram showing an embodiment of an output for managing the product quality data of the sputtering apparatus 201 of the manufacturing equipment shown in FIGS. In FIG. 5, the horizontal axis represents the wafer NO of the target substrate 220 for film formation, and the vertical axis represents the sputtering apparatus 20.
1 shows an example of the quality data of the product after manufacturing (film formation). Here, the results of measuring the number of foreign substances on the wafer, the sheet resistance, and the reflectance are plotted as the quality data. From FIG. The sheet resistance and the reflectance were higher than those of the other wafers Nos. 9 and 10, and this state is all within the allowable standard section established in advance, but the wafer No. It can be seen that 9 and 10 show different tendencies as compared with other wafer Nos.
【0018】図6は図1と図2の製造設備のスパッタ装
置201の判定(診断)処理の一実施例を示す表示図で
ある。図6において、図5での異常に値が変動したウェ
ハNO.9,10の前後をスパッタ電源212のON,
OFFと、製造状態のモニタ値の温度計241のウェハ
温度変動と、図5でのウェハの反射率とを同一時間軸上
に示している。図6でのウェハNOは図1と図2の装置
コントローラ101によるスパッタ電源212のON,
OFF動作データから成膜対象基板220へのスパッタ
の開始と終了が判定でき、また図5でのウェハNOも成
膜対象基板220のシリアルな処理終了すなわちスパッ
タ終了により測定されるので、両者の対応をつけること
ができる。そこで図6からはウェハNO.9,10のウ
ェハ温度が低下し、これに対応して製品の製造結果であ
るウェハNO.9,10の反射率の増加の変動が出たこ
とがわかる。またこのような知見から上記した図5での
製品の品質データがその規格区間の内にあればよいとい
う判定(診断)ルールを見直すことができる。FIG. 6 is a display diagram showing an embodiment of the determination (diagnosis) process of the sputtering apparatus 201 of the manufacturing equipment of FIGS. 6, the wafer NO. Before and after 9, 10 the sputter power supply 212 is turned on,
OFF, the wafer temperature variation of the thermometer 241 of the manufacturing state monitor value, and the wafer reflectance in FIG. 5 are shown on the same time axis. The wafer NO in FIG. 6 is the ON state of the sputtering power source 212 by the apparatus controller 101 in FIGS. 1 and 2.
The start and end of the sputtering on the film formation target substrate 220 can be determined from the OFF operation data, and the wafer NO in FIG. Can be turned on. Therefore, from FIG. The wafer temperatures of Nos. 9 and 10 decreased, and correspondingly, the wafer No. It can be seen that fluctuations in the reflectance increase of 9 and 10 occurred. Further, from such knowledge, it is possible to review the determination (diagnosis) rule that the quality data of the product in FIG.
【0019】上記実施例は製造設備のスパッタ装置とし
て半導体の例について説明したが、スパッタ装置であれ
ば半導体用に限らずに磁気ディスクの磁気媒体用または
配線基板の配線膜や抵抗体膜用のものにも適用できる。
また製造設備のスパッタ装置に限らずに物理化学反応を
利用したプラズマエッチングやプラズマCVD(Che
miccal Vaper Deposition)装
置などにも装置の運転状態や製造状態のモニタ項目を変
更することなどにより適用できる。In the above-mentioned embodiment, a semiconductor was used as an example of a sputtering apparatus for manufacturing equipment. However, the sputtering apparatus is not limited to a semiconductor, but may be used for a magnetic medium of a magnetic disk or a wiring film or a resistor film of a wiring board. It can also be applied to things.
Further, the plasma etching or plasma CVD (Che (Che)
It can also be applied to a mechanical vapor deposition device by changing monitor items of the operating state and manufacturing state of the device.
【0020】[0020]
【発明の効果】本発明によれば製造設備の部位の動作を
示す情報と製造設備の運転状態や製品の製造状態をモニ
タした情報と製品の製造結果の品質データとを共通の時
間軸上に表示したり、それらの情報やデータの意味を計
算機上で解釈したりできることから、製造設備の運転状
態や製品の製造状態の良否を常時判定(診断)しながら
製造設備を自動運転できるので、従来の自動運転では製
品の不良が発生する場合があったものを本発明の自動運
転では常に品質状態とともに設備の運転状態や製造状態
を判定して製品を製造することにより、製造中に不良が
発生した時にも最小限の不良数で対処できる。また上記
のように製造設備で製品を品質チェックしながら製造で
きるので、製造設備を安定に連続運転できることから無
人化もできるなどの効果がある。According to the present invention, the information indicating the operation of the parts of the manufacturing equipment, the information monitoring the operating status of the manufacturing equipment and the manufacturing status of the product, and the quality data of the manufacturing result of the product are placed on a common time axis. Since it is possible to display and interpret the meaning of those information and data on a computer, it is possible to automatically operate the manufacturing equipment while always judging (diagnosing) the operating status of the manufacturing equipment and the quality of the product manufacturing status. In the automatic driving of the present invention, a product defect may occur, but in the automatic operation of the present invention, a defect occurs during manufacturing by always judging the operating condition and manufacturing condition of the equipment together with the quality condition and manufacturing the product. Even when you do, you can deal with the minimum number of defects. Further, as described above, since the product can be manufactured while checking the quality in the manufacturing facility, the manufacturing facility can be stably operated continuously, so that unmanned operation can be performed.
【図1】図1は本発明による自動製造方法および自動製
造装置の一実施例を示すハードウェア構成図FIG. 1 is a hardware configuration diagram showing an embodiment of an automatic manufacturing method and an automatic manufacturing apparatus according to the present invention.
【図2】図2は図1のスパッタ装置の断面模式図2 is a schematic sectional view of the sputtering apparatus of FIG.
【図3】図3は図1と図2の処理の流れ図FIG. 3 is a flow chart of the processing of FIGS. 1 and 2.
【図4】図4は図1と図2の製造設備部位動作と運転・
製造状態データの突き合わせ表示図[Fig. 4] Fig. 4 shows the operation and operation of the manufacturing equipment parts of Fig. 1 and Fig. 2.
Matching display of manufacturing status data
【図5】図5は図1と図2の製品品質データ管理の表示
図FIG. 5 is a display diagram of product quality data management of FIGS. 1 and 2.
【図6】図6は図1と図2の判定・診断処理の表示図FIG. 6 is a display diagram of the determination / diagnosis processing of FIGS. 1 and 2;
100…設備状態判定用計算機、101…装置コントロ
ーラ、110…ディスプレイ、120…キーボード、2
01…スパッタ装置、210…スパッタ電極、211…
成膜材料、212…放電発生用電源(スパッタ電源)、
215…処理チャンバ、216…搬送室、220…成膜
対象基板、230…真空排気ポンプ、231…ガス配
管、232…ガス導入バルブ、233…メインバルブ、
234…ゲートバルブ、240…ビューポート、241
…温度計、242…質量分析計、243…仕切りバル
ブ、301…成膜結果モニタステージ、302…ウェハ
搬送経路、401…モニタデータ処理用計算機、402
…モニタデータ計測補正ステージ、501…ネットワー
ク、3001…時間軸、3002…多軸トレンド図100 ... Calculator for equipment state determination, 101 ... Device controller, 110 ... Display, 120 ... Keyboard, 2
01 ... Sputtering device, 210 ... Sputtering electrode, 211 ...
Film forming material, 212 ... Discharge generating power supply (sputtering power supply),
215 ... Processing chamber, 216 ... Transfer chamber, 220 ... Substrate for film formation, 230 ... Vacuum exhaust pump, 231, ... Gas pipe, 232 ... Gas introduction valve, 233 ... Main valve,
234 ... Gate valve, 240 ... Viewport, 241
... thermometer, 242 ... mass spectrometer, 243 ... partition valve, 301 ... film formation result monitor stage, 302 ... wafer transfer path, 401 ... monitor data processing computer, 402
... Monitor data measurement / correction stage, 501 ... Network, 3001 ... Time axis, 3002 ... Multi-axis trend diagram
───────────────────────────────────────────────────── フロントページの続き (72)発明者 下社 貞夫 神奈川県横浜市戸塚区吉田町292番地 株 式会社日立製作所生産技術研究所内 (72)発明者 小林 秀 神奈川県横浜市戸塚区吉田町292番地 株 式会社日立製作所生産技術研究所内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Sadao Sadao, 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Inside the Hitachi, Ltd. Institute of Industrial Science (72) Inventor, Shu Kobayashi 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Banchi Co., Ltd. Hitachi, Ltd. Production Technology Laboratory
Claims (17)
作と製造設備の運転状態に関わる情報とをそれぞれ時系
列データとして取得し、該製造設備の部位の動作と製造
設備の運転状態に関わる情報の変動とのデータをこれら
のデータの時間軸を合わせて出力することを特徴とする
自動製造方法。1. When operating a manufacturing facility, information relating to the operation of the part of the manufacturing facility and the operating state of the manufacturing facility is respectively acquired as time-series data, and related to the operation of the part of the manufacturing facility and the operating state of the manufacturing facility. An automatic manufacturing method characterized in that data with information fluctuations is output with the time axis of these data aligned.
作と製造設備の運転状態に関わる情報と製造設備の製品
の製造結果に関わる情報とをそれぞれ時系列データとし
て取得し、該製造設備の部位の動作と製造設備の運転状
態に関わる情報の変動とのデータをこれらのデータの時
間軸を合わせて出力し、該製造設備の製品の製造結果に
関わる情報を製造設備の部位の動作の製造動作後に出力
することを特徴とする自動製造方法。2. When operating the manufacturing equipment, information relating to the operation of the parts of the manufacturing equipment and the operating state of the manufacturing equipment and information relating to the manufacturing result of the product of the manufacturing equipment are respectively acquired as time series data, and the manufacturing equipment The data of the operation of the part and the fluctuation of the information related to the operating state of the manufacturing equipment are output by matching the time axis of these data, and the information related to the manufacturing result of the product of the manufacturing equipment is output for the manufacture of the operation of the part of the manufacturing equipment. An automatic manufacturing method characterized by outputting after operation.
作の変化情報と製造設備の製品の製造状態に関わる情報
と製造設備の製品の製造結果に関わる情報とを製造設備
の製品の製造時に製品製造作業に併せて取得することを
特徴とする自動製造方法。3. Manufacturing of a product of a manufacturing facility, information on a change in operation of a part of the manufacturing facility during operation of the manufacturing facility, information on a manufacturing state of a product of the manufacturing facility, and information on a manufacturing result of a product of the manufacturing facility. An automatic manufacturing method, which is sometimes acquired in conjunction with product manufacturing work.
作と製造設備の運転状態に関わる情報とをそれぞれ時系
列データとして取得する手段と、該製造設備の部位の動
作と製造設備の運転状態に関わる情報の変動とのデータ
をこれらのデータの時間軸を合わせて出力する手段とを
備えることを特徴とする自動製造装置。4. A means for respectively acquiring, as time-series data, an operation of a part of the manufacturing equipment and information relating to an operating state of the manufacturing equipment during operation of the manufacturing equipment, and an operation of the part of the manufacturing equipment and an operating status of the manufacturing equipment. An automatic manufacturing apparatus, which is provided with a means for outputting data regarding fluctuations in information relating to the above, with the time axis of these data aligned.
歴と製造設備で製品を加工する時の加工条件パラメータ
の時間変化の来歴とを記憶する手段と、該記憶データの
一覧を表示する手段と、該表示されたデータについての
選択を受け付けて該選択されたデータを時間軸を共通に
して表示する手段とを備えたことを特徴とする自動製造
装置。5. A means for storing a history of operating time changes of parts of a manufacturing equipment and a history of time changes of processing condition parameters when a product is processed in the manufacturing equipment, and means for displaying a list of the stored data. And an means for receiving selection of the displayed data and displaying the selected data with a common time axis.
作と製造設備の運転状態に関わる情報とをそれぞれ時系
列データとして取得する手段と、予め制定される診断ル
ールとして診断対象となる事象を示す診断項目毎に該事
象に関わるデータの範囲を特定するデータ分類ルールと
該事象に固有の特徴量を算出するための特徴量算出式と
該算出される特徴量についての判断基準および判断結果
から成る判定ルールとを記憶する手段と、上記取得され
た時系列データを上記診断ルールに規定される条件に従
って当てはめて当該ルールに規定される事象が発生して
いるか否かを判定する手段として上記取得されたデータ
から上記診断ルールの診断項目毎にデータ分類ルールに
従うデータを取り出して該データについて特徴量算出式
を用いて特徴量を算出して該特徴量を判定ルールの判断
基準に当てはめて対応する事象の判断結果を得る機能を
備える判定する手段とを備えることを特徴とする自動製
造装置。6. A means for acquiring, as time-series data, the operation of a part of the manufacturing equipment and the information related to the operating state of the manufacturing equipment when the manufacturing equipment is operating, and an event to be diagnosed as a diagnostic rule established in advance. From the data classification rule that specifies the range of data related to the event for each diagnostic item, the feature amount calculation formula for calculating the feature amount unique to the event, the determination criteria and the determination result for the calculated feature amount And a means for storing the determination rule, and a means for applying the acquired time-series data according to a condition defined by the diagnostic rule to determine whether or not an event defined by the rule occurs. From the collected data, data that complies with the data classification rule is extracted for each diagnostic item of the above diagnostic rule, and the characteristic amount is calculated for this data using the characteristic amount calculation formula. An automatic manufacturing apparatus comprising: a determination unit that has a function of outputting the determination result of a corresponding event by applying the characteristic amount to a determination criterion of a determination rule.
作と製造設備の運転状態に関わる情報とをそれぞれ時系
列データとして取得する手段と、予め制定される診断ル
ールとして診断対象となる事象を示す診断項目毎に該事
象に関わるデータの範囲を特定するデータ分類ルールと
該事象に固有の特徴量を算出するための特徴量算出式と
該算出される特徴量についての判断基準および判断結果
から成る判定ルールとを記憶する手段と、上記取得され
た時系列データを上記診断ルールに規定される条件に従
って当てはめて当該ルールに規定される事象が発生して
いるか否かを判定する手段として上記取得されたデータ
から上記診断ルールの診断項目毎にデータ分類ルールに
従うデータを取り出して該データについて特徴量算出式
を用いて特徴量を算出して該特徴量を判定ルールの判断
基準に当てはめて対応する事象の判断結果を得る機能を
備える判定する手段と、該判定する手段の上記判断結果
に対応する当該設備の対処方法を示すメッセージを表示
する手段とを備えることを特徴とする自動製造装置。7. A means for acquiring, as time-series data, the operation of a part of the manufacturing facility and information relating to the operating state of the manufacturing facility when the manufacturing facility is in operation, and an event to be diagnosed as a diagnostic rule established in advance. From the data classification rule that specifies the range of data related to the event for each diagnostic item, the feature amount calculation formula for calculating the feature amount unique to the event, the determination criteria and the determination result for the calculated feature amount And a means for storing the determination rule, and a means for applying the acquired time-series data according to a condition defined by the diagnostic rule to determine whether or not an event defined by the rule occurs. From the collected data, data that complies with the data classification rule is extracted for each diagnostic item of the above diagnostic rule, and the characteristic amount is calculated for this data using the characteristic amount calculation formula. A message indicating the determination means having a function of obtaining the determination result of the corresponding event by applying the feature amount to the determination criteria of the determination rule, and a message indicating the coping method of the equipment corresponding to the determination result of the determination means. An automatic manufacturing apparatus comprising: means for displaying.
作と製造設備の運転状態に関わる情報とをそれぞれ時系
列データとして取得する手段と、予め制定される診断ル
ールとして診断対象となる事象を示す診断項目毎に該事
象に関わるデータの範囲を特定するデータ分類ルールと
該事象に固有の特徴量を算出するための特徴量算出式と
該算出される特徴量についての判断基準および判断結果
から成る判定ルールとを記憶する手段と、上記取得され
た時系列データを上記診断ルールに規定される条件に従
って当てはめて当該ルールに規定される事象が発生して
いるか否かを判定する手段として上記取得されたデータ
から上記診断ルールの診断項目毎にデータ分類ルールに
従うデータを取り出して該データについて特徴量算出式
を用いて特徴量を算出して該特徴量を判定ルールの判断
基準に当てはめて対応する事象の判断結果を得る機能を
備える判定する手段と、該判定する手段の上記判断結果
に対応して当該設備の部位の動作を変更する制御情報を
出力する手段とを備えることを特徴とする製造設備の診
断システムを有する自動製造装置。8. A means for acquiring, as time-series data, information relating to the operation of a part of the manufacturing equipment and the operating state of the manufacturing equipment when the manufacturing equipment is operating, and an event to be diagnosed as a diagnostic rule established in advance. From the data classification rule that specifies the range of data related to the event for each diagnostic item, the feature amount calculation formula for calculating the feature amount unique to the event, the determination criteria and the determination result for the calculated feature amount And a means for storing the determination rule, and a means for applying the acquired time-series data according to a condition defined by the diagnostic rule to determine whether or not an event defined by the rule occurs. From the collected data, data that complies with the data classification rule is extracted for each diagnostic item of the above diagnostic rule, and the characteristic amount is calculated for this data using the characteristic amount calculation formula. A determination means having a function of obtaining the determination result of a corresponding event by applying the feature amount to the determination criteria of the determination rule, and changing the operation of the part of the equipment corresponding to the determination result of the determination means An automatic manufacturing apparatus having a diagnostic system for manufacturing equipment, comprising:
作と製造設備の運転状態に関わる情報と製造設備の製品
の製造結果に関わる情報とをそれぞれ時系列データとし
て取得する手段と、該製造設備の部位の動作と製造設備
の運転に関わる情報の変動とのデータをこれらのデータ
の時間軸を合わせて出力して該製造設備の製品の製造結
果に関わる情報を製造設備の部位の動作の製造動作後に
出力する手段とを備えることを特徴とする自動製造装
置。9. A means for acquiring, as time-series data, information relating to the operation of a part of the manufacturing facility and the operating state of the manufacturing facility and information relating to the manufacturing result of a product of the manufacturing facility when the manufacturing facility is operating, and the manufacturing. The data of the operation of the equipment part and the fluctuation of the information related to the operation of the manufacturing equipment are output by matching the time axis of these data, and the information related to the manufacturing result of the product of the manufacturing equipment is output. An automatic manufacturing apparatus comprising: means for outputting after a manufacturing operation.
動作の変化情報と製造設備の製品の製造状態に関わる情
報と製造設備の製品の製造結果に関わる情報とを製造設
備の製品の製造時に製品製造作業に併せて取得する手段
を備えることを特徴とする自動製造装置。10. Manufacturing of a product of a manufacturing facility, information on a change in operation of a part of the manufacturing facility during operation of the manufacturing facility, information on a manufacturing state of a product of the manufacturing facility, and information on a manufacturing result of a product of the manufacturing facility. An automatic manufacturing apparatus, characterized in that it is equipped with a means for acquiring the product at the time of manufacturing the product.
来歴と製造設備で製品を製造する時の製造状態のパラメ
ータの時間変化の来歴とを記憶する手段と、製造設備で
製造した製品の製造検査結果の情報を記憶する手段と、
これらの両記憶データの一覧を表示する手段と、該表示
されたデータについての選択を受け付けて該選択された
データを時間軸を共通にして表示する手段とを備えるこ
とを特徴とする自動製造装置。11. A means for storing a history of operating time change of a part of a manufacturing facility and a history of time change of parameters of a manufacturing state when a product is manufactured by the manufacturing facility, and manufacturing of the product manufactured by the manufacturing facility. Means for storing information on the inspection result,
An automatic manufacturing apparatus comprising: means for displaying a list of these two stored data; and means for accepting selection of the displayed data and displaying the selected data with a common time axis. ..
動作と製造設備の製品の製造状態に関わる情報とをそれ
ぞれ時系列データとして取得する手段と、該製造設備の
部位の動作データから予め制定した該部位の動作に関連
付けて製造設備の製造結果に関わる情報を取得する手段
と、予め制定される診断ルールを記憶する手段と、上記
取得された両データを上記診断ルールに規定される条件
に従って当てはめて製造設備の製品の製造状態を判定し
ながら製品を製造する手段とを備えることを特徴とする
自動製造装置。12. A means for acquiring, as time-series data, an operation of a part of the manufacturing equipment and information relating to a manufacturing state of a product of the manufacturing equipment when operating the manufacturing equipment, and preliminarily established from operation data of the part of the manufacturing equipment. Means for acquiring information relating to the manufacturing result of the manufacturing equipment in association with the operation of the part, means for storing a diagnostic rule established in advance, and both of the acquired data according to the conditions specified by the diagnostic rule. An automatic manufacturing apparatus comprising: means for manufacturing a product while applying the product to a manufacturing facility to determine the manufacturing state of the product.
動作と製造設備の製品の製造状態に関わる情報とをそれ
ぞれ時系列データとして取得する手段と、該製造設備の
部位の動作データから予め制定した該部位の動作に関連
付けて製造設備の製造結果に関わる情報を取得する手段
と、予め制定される診断ルールを記憶する手段と、上記
取得された両データを上記診断ルールに規定される条件
に従って当てはめて当該ルールに規定される事象が発生
しているか否かを判定する手段とを備えることを特徴と
する自動製造装置。13. A means for acquiring, as time-series data, an operation of a part of the manufacturing equipment and information relating to a manufacturing state of a product of the manufacturing equipment when the manufacturing equipment is in operation, and previously established from operation data of the part of the manufacturing equipment. Means for acquiring information relating to the manufacturing result of the manufacturing equipment in association with the operation of the part, means for storing a diagnostic rule established in advance, and both of the acquired data according to the conditions specified by the diagnostic rule. An automatic manufacturing apparatus comprising: means for determining whether or not an event defined by the rule has occurred.
動作と製造設備の製品の製造状態に関わる情報とをそれ
ぞれ時系列データとして取得する手段と、該製造設備の
部位の動作データから予め制定した該部位の動作と関連
付けて製造設備の製造結果に関わる情報を取得する手段
と、予め制定される診断ルールを記憶する手段と、上記
取得された両データを上記診断ルールに規定される条件
に従って当てはめて当該ルールに規定される事象が発生
しているか否かを判定する手段と、該判定する手段の判
定結果に対応する当該設備の対処方法を示すメッセージ
を表示する手段とを備えることを特徴とする自動製造装
置。14. A means for acquiring, as time-series data, operation of a part of the manufacturing equipment and information relating to a manufacturing state of a product of the manufacturing equipment when operating the manufacturing equipment, and preliminarily established from operation data of the part of the manufacturing equipment. Means for acquiring information relating to the manufacturing result of the manufacturing equipment in association with the operation of the part, means for storing a diagnostic rule established in advance, and both of the acquired data according to the conditions specified by the diagnostic rule. It is characterized by comprising means for determining whether or not an event defined by the rule has occurred, and means for displaying a message indicating a coping method of the facility corresponding to the determination result of the determining means. And automatic manufacturing equipment.
動作と製造設備の製品の製造状態に関わる情報とをそれ
ぞれ時系列データとして取得する手段と、該製造設備の
部位の動作データから予め制定した該部位の動作に関連
付けて製造設備の製造結果に関わる情報を取得する手段
と、予め制定される診断ルールを記憶する手段と、上記
取得された両データを上記診断ルールに規定される条件
に従って当てはめて当該ルールに規定される事象が発生
しているか否かを判定する手段と、該判定する手段の判
定結果に対応して当該設備の部位の動作や製品の製造状
態を変更する制御情報を出力する手段とを備えることを
特徴とする自動製造装置。15. A means for acquiring, as time-series data, an operation of a part of the manufacturing equipment and information relating to a manufacturing state of a product of the manufacturing equipment when the manufacturing equipment is in operation, and previously established from operation data of the part of the manufacturing equipment. Means for acquiring information relating to the manufacturing result of the manufacturing equipment in association with the operation of the part, means for storing a diagnostic rule established in advance, and both of the acquired data according to the conditions specified by the diagnostic rule. A means for determining whether or not an event prescribed by the rule is applied and control information for changing the operation of the part of the equipment or the manufacturing state of the product corresponding to the determination result of the determining means are applied. An automatic manufacturing apparatus comprising: a means for outputting.
置が成膜装置の部位の動作を制御するシーケンサと成膜
装置内のガスの成分を検出するガス分析装置とを備え、
上記製造設備の運動時に製造設備の部位の動作と製造設
備の運転状態に関わる情報とをそれぞれ時系列データと
して取得する手段が製造設備の部位の動作として成膜装
置のシーケンサから出力される成膜装置の各部位の動作
状態を示す情報と製造設備の運転状態に関わる情報とし
てガス分析装置の出力とをそれぞれに時刻を示す情報を
付して取り込む機能を備えることを特徴とする請求項4
または請求項6または請求項7または請求項8記載の自
動製造装置。16. The manufacturing equipment is a film forming apparatus, and the film forming apparatus comprises a sequencer for controlling the operation of parts of the film forming apparatus and a gas analyzer for detecting gas components in the film forming apparatus.
Means for acquiring the operation of the part of the manufacturing equipment and the information relating to the operating state of the manufacturing equipment as time-series data during the movement of the manufacturing equipment is output from the sequencer of the film forming apparatus as the operation of the part of the manufacturing equipment. 5. A function for taking in the information indicating the operating state of each part of the device and the output of the gas analyzer as information relating to the operating condition of the manufacturing facility, with the information indicating the time attached thereto, respectively.
Alternatively, the automatic manufacturing apparatus according to claim 6 or claim 7 or claim 8.
置が成膜装置の部位の動作を制御するシーケンサと成膜
装置内のガスの成分を検出するガス分析装置とを備え、
上記製造設備の運動時に製造設備の部位の動作と製造設
備の運転状態に関わる情報と製造設備の製品の製造結果
に関わる情報とをそれぞれ時系列データとして取得する
手段が製造設備の部位の動作として成膜装置のシーケン
サから出力される成膜装置の各部位の動作状態を示す情
報と製造設備の運転状態に関わる情報としてガス分析装
置の出力と製造設備の製品の製造結果に関わる情報とし
て製品の抵抗値および反射率の情報とをそれぞれに時刻
を示す情報を付して取り込む機能を備えることを特徴と
する請求項9記載の自動製造装置。17. The manufacturing equipment is a film forming apparatus, and the film forming apparatus comprises a sequencer for controlling the operation of parts of the film forming apparatus and a gas analyzer for detecting a gas component in the film forming apparatus.
As the operation of the part of the manufacturing equipment, the means for acquiring the information related to the operation of the part of the manufacturing equipment and the operating state of the manufacturing equipment and the information related to the manufacturing result of the product of the manufacturing equipment as the time-series data during the movement of the manufacturing equipment As information related to the operating status of each part of the film forming equipment and information related to the operating status of the manufacturing equipment that is output from the sequencer of the film forming equipment 10. The automatic manufacturing apparatus according to claim 9, further comprising a function of adding information indicating a time to each of the information on the resistance value and the reflectance and capturing the information.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28763691A JPH05125538A (en) | 1991-11-01 | 1991-11-01 | Method and apparatus for automatic manufacture |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28763691A JPH05125538A (en) | 1991-11-01 | 1991-11-01 | Method and apparatus for automatic manufacture |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH05125538A true JPH05125538A (en) | 1993-05-21 |
Family
ID=17719796
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP28763691A Pending JPH05125538A (en) | 1991-11-01 | 1991-11-01 | Method and apparatus for automatic manufacture |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH05125538A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19951988B4 (en) * | 1998-12-22 | 2007-01-18 | Teijin Seiki Co. Ltd. | Planetary friction gear with pressing means |
JP2019125252A (en) * | 2018-01-18 | 2019-07-25 | トヨタ自動車株式会社 | Information processor, data management system, data management method, and program |
-
1991
- 1991-11-01 JP JP28763691A patent/JPH05125538A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19951988B4 (en) * | 1998-12-22 | 2007-01-18 | Teijin Seiki Co. Ltd. | Planetary friction gear with pressing means |
JP2019125252A (en) * | 2018-01-18 | 2019-07-25 | トヨタ自動車株式会社 | Information processor, data management system, data management method, and program |
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