JPH05120922A - Wire harness - Google Patents

Wire harness

Info

Publication number
JPH05120922A
JPH05120922A JP3309814A JP30981491A JPH05120922A JP H05120922 A JPH05120922 A JP H05120922A JP 3309814 A JP3309814 A JP 3309814A JP 30981491 A JP30981491 A JP 30981491A JP H05120922 A JPH05120922 A JP H05120922A
Authority
JP
Japan
Prior art keywords
insulating film
wire harness
circuit
conductor
main circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3309814A
Other languages
Japanese (ja)
Other versions
JP2624063B2 (en
Inventor
Kazuto Saka
和人 阪
Masayoshi Hashimoto
昌佳 橋本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Wiring Systems Ltd
Original Assignee
Sumitomo Wiring Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Wiring Systems Ltd filed Critical Sumitomo Wiring Systems Ltd
Priority to JP3309814A priority Critical patent/JP2624063B2/en
Priority to EP92309889A priority patent/EP0540319B1/en
Priority to DE69230660T priority patent/DE69230660T2/en
Publication of JPH05120922A publication Critical patent/JPH05120922A/en
Priority to US08/471,168 priority patent/US5598627A/en
Application granted granted Critical
Publication of JP2624063B2 publication Critical patent/JP2624063B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Insulated Conductors (AREA)
  • Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)

Abstract

PURPOSE:To improve the circuit formability of a wire harness used for electric machinery and apparatus, and the like, and to reduce forming cost. CONSTITUTION:On an insulating film 9, conductors 8 are arranged on a wiring circuit having bending portions, curved portions, or branching portions, crossing portions freely. A main circuit portion 1 is composed of 'a conductor wiring circuit board 3 on the insulating film', which is made by coating and covering the conductors 8 with another insulating film 12, and a connection portion 14B is to be connected to the connection portion 14A of the main circuit portion 1. A branching connection portion 2, which is composed of a printed wiring board 4, putting leading wires 5 in connection, is also connected thereto and combined so as to form a wire harness.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、複写機(PPC)・パ
ーソナルコンピューター(PC)・ファクシミリ・ビデ
オテープレコーダー・ビデオカメラ等の電気機器やオフ
ィスオートメーション機器の電気配線、または、自動車
インストルメントパネル部の電気配線に使用するワイヤ
ハーネスに関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to electric wiring for copiers (PPCs), personal computers (PCs), facsimiles, video tape recorders, video cameras, etc., and electrical wiring for office automation equipment, or automobile instrument panel parts. The present invention relates to a wire harness used for the electric wiring.

【0002】[0002]

【従来の技術】前記の電気機器やオフィスオートメーシ
ョン機器用等のワイヤハーネスは、樹脂フィルムのベー
スフィルムに導体回路をプリントした可撓性平型印刷配
線板(以下、この可撓性平型印刷配線板をFPCとい
う)を用いるものが公知であり、このFPCを用いたワ
イヤハーネスは、回路が密に設けられて小形化コンパク
ト化すると共に、接続すべきコネクタの配置に合せた回
路形成が容易な利点を有している。
2. Description of the Related Art A wire harness for electric appliances and office automation equipment is a flexible flat printed wiring board (hereinafter, referred to as a flexible flat printed wiring board) in which a conductor circuit is printed on a resin film base film. A plate using an FPC) is known, and a wire harness using this FPC is provided with dense circuits to make it compact and compact, and it is easy to form a circuit according to the arrangement of connectors to be connected. Have advantages.

【0003】[0003]

【発明が解決しようとする課題】しかし、ワイヤハーネ
スに用いるFPCはエッチング工程等が必要になるの
で、複雑な導体回路形成の場合にFPCを多層になす
と、表面と裏面のエッチング工程等が必要になって加工
工程が複雑化し、その複雑化によるコスト高を生ずる。
さらに、構造上、標準化して異なる回路群間で共用でき
る部分がないので、回路変更への対応性に劣ると共に、
ワイヤハーネス全体が個別製作となってコスト高を助長
する難点がある。
However, since the FPC used for the wire harness requires an etching process or the like, when the FPC is formed in multiple layers in the case of forming a complicated conductor circuit, the etching process of the front surface and the back surface is required. As a result, the machining process becomes complicated, and the cost increases due to the complication.
Furthermore, since there is no part that can be standardized and shared between different circuit groups in terms of structure, it is inferior in adaptability to circuit changes and
The entire wire harness is individually manufactured, which increases the cost.

【0004】[0004]

【課題を解決するための手段】以上の技術課題を解決す
る本発明のワイヤハーネスは「絶縁性フィルム上に、導
体を配設して配線回路を形成し、少くとも、該導体の上
半部分の露出部分を、柔軟な絶縁性材料で被覆した「絶
縁性フィルム上の導体配線回路板」からなる主回路部
と、該主回路部の導体と導電路を導通して該主回路部に
接続され、かつ、取り出し電線を接続する印刷配線板か
らなる分岐接続部との接続組み合せ構造」が特徴であ
る。
The wire harness of the present invention for solving the above technical problems is described as follows: "A conductor is disposed on an insulating film to form a wiring circuit, and at least an upper half portion of the conductor is formed. The exposed portion of the main circuit part consisting of a "conductor wiring circuit board on an insulating film", which is covered with a flexible insulating material, and the conductor of the main circuit part are electrically connected to the conductive path to connect to the main circuit part. And a combined structure of connection with a branch connecting portion made of a printed wiring board for connecting the taken-out electric wire ".

【0005】詳しくは、前記の「絶縁性フィルム上の絶
縁導体配線回路板」は、絶縁性フィルムとして、厚さ1
0〜500ミクロンのポリエチレンテレフタレート(P
ET)・ポリ塩化ビニール(PVC)・ポリイミド(P
I)・ポリフェニレンサルファイド(PPS)等のもの
から任意のものが用いられ、導線として0.03〜1.
0粍直径の軟銅線・軟銅錫メッキ線・その他のメッキ線
・銅合金線・異種金属を組み合せたクラッド線、また
は、それ等の単線を複数本撚り合せた撚線を裸線、また
は、絶縁を施した絶縁導線(例えばマグネットワイヤー
等)が用いられ、前記の絶縁性フィルム上に屈曲・湾曲
または分岐・交差自在に配列されて所要の主回路が形成
される。
Specifically, the above-mentioned "insulated conductor wiring circuit board on an insulating film" has a thickness of 1 as an insulating film.
0-500 micron polyethylene terephthalate (P
ET), polyvinyl chloride (PVC), polyimide (P
I). Polyphenylene sulfide (PPS) or the like is used, and 0.03 to 1.
Zero-diameter annealed copper wire, annealed copper-tin plated wire, other plated wires, copper alloy wire, clad wire that combines different metals, or stranded wire in which multiple single wires such as these are stranded, or insulated An insulated conductive wire (for example, a magnet wire or the like) that has been subjected to the above is used, and a required main circuit is formed on the insulating film by being flexibly / curved or branched / intersectingly arranged.

【0006】そして、裸線導体を用いる場合は、前記の
絶縁性フィルム上に配設された導体の露出部分を絶縁す
るために、その絶縁性フィルム上の導体に絶縁性樹脂を
コーテングしたり、前記の絶縁性フィルムと同一の絶縁
性フィルムをオーバーコートして被覆したり、その絶縁
性フィルムに粘着性樹脂または接着性樹脂をラミネート
したもので該導体の上半部分の露出部分が被覆される。
When a bare wire conductor is used, in order to insulate the exposed portion of the conductor disposed on the insulating film, an insulating resin is coated on the conductor on the insulating film, The same insulating film as the above-mentioned insulating film is overcoated and covered, or the insulating film is laminated with an adhesive resin or an adhesive resin to cover the exposed part of the upper half of the conductor. .

【0007】そして、以上の「絶縁性フィルム上の絶縁
導体配線回路板」と接続する印刷配線板は、硬質・半硬
質基板上の公知の印刷配線板、または、公知の可撓性印
刷配線板が用いられ、両者に形成した接続部の前記の導
体と印刷配線板の導電路が、機械的接合手段・半田付け
等の接合接着手段、または加熱による熔着手段等によっ
て接続導通される。そして、その印刷配線板には、コネ
クタピンの半田付け接続・加熱による熔着手段等によっ
て、コネクタを有する平型平行電線(リボンコード等)
通常電線等からなる取り出し電線群が接続され、ワイヤ
ハーネスの所要の主回路を有する「絶縁性フィルム上の
絶縁導体配線回路板」からなる主回路部の回路群が、接
続された印刷配線板の分岐接続部を介して、機器側へ接
続する取り出し電線群と導通接続して、所要回路を有す
るワイヤハーネスを構成する構造になっている。
The printed wiring board to be connected to the "insulated conductor wiring circuit board on the insulating film" is a known printed wiring board on a hard / semi-rigid board or a known flexible printed wiring board. Is used, and the conductor of the connecting portion formed on both of them and the conductive path of the printed wiring board are connected and conducted by a mechanical bonding means, a bonding / adhering means such as soldering, or a welding means by heating. Then, a flat parallel electric wire (ribbon cord or the like) having a connector is provided on the printed wiring board by soldering connection of connector pins or welding means by heating.
The circuit group of the main circuit part consisting of the "insulated conductor wiring circuit board on the insulating film", which has the required main circuit of the wire harness connected to the extracted electric wire group consisting of normal electric wires, is connected to the printed wiring board. It has a structure in which a wire harness having a required circuit is configured by conducting connection with a group of extraction electric wires connected to the device side through a branch connection portion.

【0008】[0008]

【作用】以上の構成の本発明のワイヤハーネスは、ワイ
ヤハーネスの主回路を有する「絶縁性フィルム上の絶縁
導体配線回路板」の主回路部と、取り出し電線群を有す
る印刷配線板の分岐接続部、との接続組み合せ構造から
なるので、回路形成の容易化とワイヤハーネスの小形化
・コンパクト化のメリットを確保することができる。そ
して、前記主回路部のみの交換変更によってワイヤハー
ネスの回路変更に対応できるので、ワイヤハーネスの回
路変更に対する対応が迅速かつ簡便にできると共に、前
記分岐接続部は、異なる主回路部間で共用するための規
格化標準化が可能になる。
According to the wire harness of the present invention having the above structure, the main circuit portion of the "insulated conductor wiring circuit board on the insulating film" having the main circuit of the wire harness and the branch connection of the printed wiring board having the taken-out electric wire group are connected. Since it has a combined structure of connecting parts and parts, it is possible to secure the merits of facilitating circuit formation and downsizing and compacting of the wire harness. Further, since it is possible to deal with the circuit change of the wire harness by changing the change of only the main circuit part, it is possible to quickly and easily cope with the circuit change of the wire harness, and the branch connection part is shared between different main circuit parts. Standardization for standardization becomes possible.

【0009】さらに、該主回路部を形成する「絶縁性フ
ィルム上の絶縁導体配線回路板」は、そのまま(エッチ
ング加工不要)多層構成ができると共に、絶縁導体によ
る交差配列が可能になるので、高密度回路の回路成形の
自由度が向上し、その回路成形がし易くなる。
Furthermore, the "insulated conductor wiring circuit board on the insulating film" forming the main circuit portion can have a multilayer structure as it is (no etching process is required), and a crossed arrangement of insulated conductors is possible. The degree of freedom in forming the circuit of the density circuit is improved, and the circuit can be easily formed.

【0010】[0010]

【実施例】以下、実施例に基づいて詳しく説明する。ま
ず、本発明第一実施例のワイヤハーネスの構成を示す図
1を参照して、本発明のワイヤハーネスは「絶縁性フィ
ルム上の絶縁導体配線回路板3(以下、単に絶縁導体回
路板3という)からなる主回路部1と、主回路部1と接
続する印刷配線板4からなり、所要の取り出し電線5を
接続した分岐接続部2との接続組み合せによって構成さ
れ、主回路部1に形成された主回路7が分岐接続部2を
介して取り出し電線5に引き出され、機器側に接続され
る構造になっている。
Embodiments will be described in detail below based on embodiments. First, with reference to FIG. 1 showing the configuration of the wire harness of the first embodiment of the present invention, the wire harness of the present invention is described as follows: "Insulated conductor wiring circuit board 3 on an insulating film (hereinafter, simply referred to as insulated conductor circuit board 3). ) And a printed circuit board 4 connected to the main circuit section 1 and a branch connection section 2 to which a required take-out electric wire 5 is connected, and is formed in the main circuit section 1. The main circuit 7 is drawn out to the extraction electric wire 5 through the branch connection portion 2 and connected to the device side.

【0011】詳しくは、絶縁導体回路板3は、図2図3
参照、40ミクロンの粘着層10を有する25ミクロン
厚さのポリエチレンテレフタレート(以下、PETとい
う)フィルムの絶縁性フィルム9の上に、0.1粍直径
の錫メッキ軟銅線の導体8を用いて、屈曲・湾曲・分岐
自在に配設した主回路7を形成し、その上から、40ミ
クロン厚さの熱可塑性接着層11を有する25ミロン厚
さのPETフィルムの絶縁性フィルム12をオーバーコ
ートして被覆し、導体8の上方露出部分を絶縁すると共
に、重合した絶縁性フィルム9・12を、導体8がなす
回路の輪郭に沿って切断して形状を整え、一側縁に絶縁
性フィルム9上の導体8の端部を密に並べて露出させた
接続部14Aが形成されている。そして、導体8の間隔
は0.5・0.8・1.0・1.2粍等の細ピッチに配
列される。
More specifically, the insulated conductor circuit board 3 is shown in FIG.
For reference, on a 25-micron-thick polyethylene terephthalate (hereinafter referred to as PET) film insulating film 9 having a 40-micron adhesive layer 10, a tin-plated annealed copper conductor 8 having a diameter of 0.1 μm is used. The main circuit 7 is formed so that it can be bent, bent, and branched freely, and an insulating film 12 of a 25-millon PET film having a 40-micron-thick thermoplastic adhesive layer 11 is overcoated thereon. While covering and insulating the upper exposed portion of the conductor 8, the polymerized insulating films 9 and 12 are cut along the contour of the circuit formed by the conductor 8 to adjust the shape, and the insulating film 9 is provided on one side edge. The connection portion 14A is formed by exposing the end portions of the conductors 8 closely arranged. The conductors 8 are arranged at a fine pitch such as 0.5 / 0.8 / 1.0 / 1.2.

【0012】さらに、この絶縁導体回路板3の導体8
は、図5図6参照、形成すべき主回路7の形態に応じ
て、屈曲・湾曲自在にして、絶縁性フィルム9の輪郭も
分岐・多枝形状等に自在に形成されると共に、図6例示
のように、導体8の中間の相互を半田付け、または、任
意の溶接手段によって導通接続して、平行交差・十字交
差等の分岐部13を設けて配線される。
Further, the conductor 8 of the insulated conductor circuit board 3
5 and 6, according to the form of the main circuit 7 to be formed, the insulating film 9 can be freely bent or curved, and the contour of the insulating film 9 can be freely branched or branched. As illustrated, the middles of the conductors 8 are soldered or conductively connected by any welding means, and wiring is provided by providing branch portions 13 such as parallel intersections and cross intersections.

【0013】一方、分岐接続部2をなす印刷配線板4
は、図1参照、硬質の基板15の裏面に所要の導電路
(図示しない)が印刷された方形板体をなすと共に、そ
の一側縁に沿って導電路端部16を細かいピッチで配列
した接続部14Bが形成されており、この接続部14B
と絶縁導体回路板3の接続部14Aを、重合すると導体
8と導電路端部16が接続導通する構造になっている。
なお、この実施例における接続部14A14Bの接続
は、絶縁導体回路板3の下側に補強板17を当てて、補
強板17と印刷配線板4によって絶縁導体回路板3をサ
ンドイッチ状に機械的に狭着し、取付けボルト18によ
って固定される。
On the other hand, the printed wiring board 4 forming the branch connection portion 2
Referring to FIG. 1, a rectangular plate having a required conductive path (not shown) is printed on the back surface of the hard substrate 15, and conductive path end portions 16 are arranged at a fine pitch along one side edge thereof. The connecting portion 14B is formed, and the connecting portion 14B is formed.
When the connection portion 14A of the insulated conductor circuit board 3 is superposed, the conductor 8 and the end portion 16 of the conductive path are connected and conducted.
In addition, in the connection of the connecting portions 14A and 14B in this embodiment, the reinforcing plate 17 is applied to the lower side of the insulated conductor circuit board 3, and the insulated conductor circuit board 3 is mechanically sandwiched by the reinforcing plate 17 and the printed wiring board 4. It is tightly attached and is fixed by the mounting bolt 18.

【0014】さらに、この分岐接続部2には、所定位置
にコネクタピンの挿着孔19が貫設されており、図4参
照、この挿着孔19に取り出し電線5のコネクタ20の
コネクタピン21を貫通させ、裏側へ突き出したコネク
タピン21と導電路22が半田付け接続される。そし
て、この実施例の取り出し電線5は細い電線を細かいピ
ッチで並列して両端にコネクタ20を設けた板状の平行
電線が用いてある。
Further, a connector pin insertion hole 19 is provided at a predetermined position in the branch connection portion 2, and the connector pin 21 of the connector 20 of the take-out electric wire 5 is inserted into the insertion hole 19 as shown in FIG. And the conductive path 22 is connected by soldering. The take-out electric wire 5 of this embodiment is a plate-like parallel electric wire in which thin electric wires are arranged in parallel at a fine pitch and connectors 20 are provided at both ends.

【0015】つぎに、本発明の変化・態様について説明
する。即ち、図7参照、本発明のワイヤハーネスの主要
部を構成する主回路群1と分岐接続部2と取り出し電線
5は、前記実施例に限定されず、単数の分岐接続部2に
複数の主回路部1を接続したり、または、接続部14A
に分岐接続部2を接続した主回路部1に、他の接続部1
4Cを設け、他の分岐接続部2Aまたは、他の取り出し
電線を接続したり、或は、図示しないが、分岐接続部2
の中央位置の接続部に、主回路部1を接続する等の変化
がある。
Next, changes and modes of the present invention will be described. That is, referring to FIG. 7, the main circuit group 1, the branch connecting portions 2 and the lead-out electric wires 5 which constitute the main portion of the wire harness of the present invention are not limited to the above-mentioned embodiment, and a single branch connecting portion 2 has a plurality of main portions. Circuit part 1 is connected, or connection part 14A
The main circuit section 1 in which the branch connection section 2 is connected to the other connection section 1
4C is provided to connect to another branch connection part 2A or another extraction electric wire, or, although not shown, the branch connection part 2
There is a change such as connecting the main circuit portion 1 to the connection portion at the central position of.

【0016】つぎに、絶縁導体回路板3の他の実施例を
図8を参照して説明する。即ち、この図8のものは、粘
着層10を有するポリイミド(PI)の絶縁性フィルム
9の上に、ポリウレタン絶縁マグネットワイヤの導体8
を配設し、その上に接着層11を有するポリイミド(P
I)の絶縁性フィルム12がオーバーコートされてい
る。この実施例の導体8は絶縁導体のため、同一の絶縁
性フィルム9の上で導体交差ができる。この絶縁導体交
差を用いると主回路板1の回路設計の自由度が向上す
る。
Next, another embodiment of the insulated conductor circuit board 3 will be described with reference to FIG. That is, in FIG. 8, the conductor 8 of the polyurethane insulated magnet wire is formed on the polyimide (PI) insulating film 9 having the adhesive layer 10.
And a polyimide (P
The insulating film 12 of I) is overcoated. Since the conductor 8 of this embodiment is an insulated conductor, the conductors can intersect on the same insulating film 9. The use of this insulated conductor crossing improves the degree of freedom in circuit design of the main circuit board 1.

【0017】一方、主回路板1と分岐接続部2の接続手
段は、図1実施例以外の手段として、図9参照、印刷配
線板4の上面に取付けたコネクタ20のコネクタピン2
1を裏側の導電路22に半田付けし、このコネクタ20
に主回路板1の接続部14Aを挿着接続したり、また
は、主回路部1の接続部14Aと分岐接続部2の接続部
14Bを重ねて半田付け接着接続することがある。
On the other hand, as means for connecting the main circuit board 1 and the branch connecting portion 2 to each other as shown in FIG. 9, as a means other than the embodiment shown in FIG.
1 is soldered to the conductive path 22 on the back side, and the connector 20
In some cases, the connection portion 14A of the main circuit board 1 may be inserted and connected, or the connection portion 14A of the main circuit portion 1 and the connection portion 14B of the branch connection portion 2 may be overlapped and soldered and connected.

【0018】[0018]

【発明の効果】以上の説明のとおり、本発明のワイヤハ
ーネスは、主回路を有する「絶縁性フィルム上の絶縁導
体配線回路板」からなる主回路部と、取り出し電線を有
する印刷配線板からなる分岐接続部、との接続組み合せ
を特徴とするので、回路の交差や多層化が容易になって
回路の成形性に優れると共に、回路板のエッチング工程
が不要になる。そして、その分岐接続部を共用にした主
回路部のみの交換が自在となるので、ワイヤハーネスの
回路変更の対応が迅速にして低コストで行えると共に、
共用性を有する分岐接続部の標準量産化とエッチング工
程無用の成形性によって、ワイヤハーネスの成形コスト
の低減を図る等の効果がある。
As described above, the wire harness of the present invention is composed of the main circuit portion including the "insulated conductor wiring circuit board on the insulating film" having the main circuit, and the printed wiring board having the extraction electric wire. Since it is characterized by the combination of the connection with the branch connection portion, the crossing of the circuit and the multi-layering are facilitated, the moldability of the circuit is excellent, and the etching process of the circuit board is not necessary. And since it is possible to freely exchange only the main circuit part that shares the branch connection part, it is possible to quickly and inexpensively respond to the circuit change of the wire harness,
Due to the standard mass production of the common branch connection portion and the moldability without an etching step, there are effects such as reduction of the molding cost of the wire harness.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明第一実施例のワイヤハーネスの構造を示
す斜視図
FIG. 1 is a perspective view showing a structure of a wire harness according to a first embodiment of the present invention.

【図2】図1実施例の「絶縁性フィルム上の絶縁導体配
線回路板」の部分平面図
FIG. 2 is a partial plan view of an “insulated conductor wiring circuit board on an insulating film” in FIG. 1 embodiment.

【図3】図1実施例の「絶縁性フィルム上の絶縁導体配
線回路板」の部分断面図
FIG. 3 is a partial sectional view of an “insulated conductor wiring circuit board on an insulating film” of FIG. 1 embodiment.

【図4】図1実施例の印刷配線板と取り出し電線の接続
状態を示す側面図
FIG. 4 is a side view showing a connection state between the printed wiring board and the taken-out electric wire in the embodiment of FIG.

【図5】図1実施例の「絶縁性フィルム上の絶縁導体配
線回路板」の他の態様の平面図
FIG. 5 is a plan view of another embodiment of the “insulated conductor wiring circuit board on the insulating film” of FIG. 1 embodiment.

【図6】図1実施例の「絶縁性フィルム上の絶縁導体配
線回路板」の導体の配線形態を示す平面図
FIG. 6 is a plan view showing the wiring form of the conductor of the “insulated conductor wiring circuit board on the insulating film” of the embodiment of FIG. 1;

【図7】本発明の他の実施例のワイヤハーネスを示す斜
視図
FIG. 7 is a perspective view showing a wire harness according to another embodiment of the present invention.

【図8】本発明の他の実施例の「絶縁性フィルム上の絶
縁導体配線回路板」の断面図
FIG. 8 is a sectional view of an “insulated conductor wiring circuit board on an insulating film” according to another embodiment of the present invention.

【図9】本発明の他の実施例の「絶縁性フィルム上の絶
縁導体配線回路板」と印刷配線板の接続手段を示す側面
FIG. 9 is a side view showing the connecting means between the “insulated conductor wiring circuit board on the insulating film” and the printed wiring board according to another embodiment of the present invention.

【符号の説明】[Explanation of symbols]

1 主回路部 2 分岐接続部 3 絶縁性フィルム上の絶縁導体配線回路板 4 印刷配線板 5 取り出し電線 7 主回路 8 導体 9・12 絶縁性フィルム 10 粘着層 11 接着層 13 分岐部 14 接続部 15 基板 16 導電路端部 19 挿着孔 20 コネクタ 21 コネクタピン 22 導電路 1 Main Circuit Part 2 Branch Connection Part 3 Insulated Conductor Wiring Circuit Board on Insulating Film 4 Printed Wiring Board 5 Taken Out Electric Wire 7 Main Circuit 8 Conductor 9 ・ 12 Insulating Film 10 Adhesive Layer 11 Adhesive Layer 13 Branch Part 14 Connection Part 15 Board 16 Conductive path end 19 Insertion hole 20 Connector 21 Connector pin 22 Conductive path

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 絶縁性フィルム上に、導体を配設して配
線回路を形成し、少くとも、該導体の上半部分の露出部
分を、柔軟な絶縁性材料で被覆した「絶縁性フィルム上
の絶縁導体配線回路板」からなる主回路部と、該主回路
部の導体と導電路を導通して該主回路部と接続され、か
つ、取り出し電線を接続する印刷配線板からなる分岐接
続部、との接続組み合せ構造を特徴とするワイヤハーネ
ス。
1. A "on an insulating film" in which a conductor is disposed on an insulating film to form a wiring circuit, and at least an exposed portion of the upper half of the conductor is covered with a flexible insulating material. Main circuit part consisting of an insulated conductor wiring circuit board ", and a branch connection part consisting of a printed wiring board which is connected to the main circuit part by conducting a conductive path with the conductor of the main circuit part and which connects a take-out electric wire. A wire harness characterized by a combined structure of connection with and.
【請求項2】 屈曲・湾曲または交差・分岐自在に、導
体を配設して回路を形成した「絶縁性フィルム上の絶縁
導体配線回路板」からなる請求項1のワイヤハーネス。
2. The wire harness according to claim 1, comprising an "insulated conductor wiring circuit board on an insulating film" in which a circuit is formed by arranging conductors so that they can be bent / curved or intersected / branched.
【請求項3】 電線を並列した板状の平行電線によって
取り出し電線を形成した請求項1または請求項2のワイ
ヤハーネス。
3. The wire harness according to claim 1, wherein the take-out electric wire is formed by a plate-shaped parallel electric wire in which the electric wires are arranged in parallel.
【請求項4】 絶縁被覆導体で回路を形成した「絶縁性
フィルム上の絶縁導体配線回路板」からなる請求項1ま
たは請求項2または請求項3のワイヤハーネス。
4. The wire harness according to claim 1, which comprises an "insulated conductor wiring circuit board on an insulating film" in which a circuit is formed of an insulating coated conductor.
JP3309814A 1991-10-29 1991-10-29 Wire harness Expired - Fee Related JP2624063B2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP3309814A JP2624063B2 (en) 1991-10-29 1991-10-29 Wire harness
EP92309889A EP0540319B1 (en) 1991-10-29 1992-10-28 A wire harness
DE69230660T DE69230660T2 (en) 1991-10-29 1992-10-28 Wiring harness
US08/471,168 US5598627A (en) 1991-10-29 1995-06-06 Method of making a wire harness

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3309814A JP2624063B2 (en) 1991-10-29 1991-10-29 Wire harness

Publications (2)

Publication Number Publication Date
JPH05120922A true JPH05120922A (en) 1993-05-18
JP2624063B2 JP2624063B2 (en) 1997-06-25

Family

ID=17997571

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3309814A Expired - Fee Related JP2624063B2 (en) 1991-10-29 1991-10-29 Wire harness

Country Status (1)

Country Link
JP (1) JP2624063B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6344613B1 (en) * 1999-04-22 2002-02-05 Visteon Global Technologies, Inc. Automobile electrical circuit assembly with transparent protective cover
JP2008537288A (en) * 2005-04-07 2008-09-11 スリーエム イノベイティブ プロパティズ カンパニー Cable harness body
CN113593774A (en) * 2021-07-30 2021-11-02 长春捷翼汽车零部件有限公司 Method for manufacturing wire harness and wire harness

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5753384Y2 (en) * 1978-11-30 1982-11-19
JPS61271707A (en) * 1985-05-28 1986-12-02 矢崎総業株式会社 Wire harness
JPS647712U (en) * 1987-07-01 1989-01-17
JPH01283708A (en) * 1988-05-11 1989-11-15 Yazaki Corp Wire harness
JPH0264162U (en) * 1988-11-04 1990-05-14
JPH03149709A (en) * 1989-11-06 1991-06-26 Yazaki Corp Flat wire harness and its manufacture

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5753384Y2 (en) * 1978-11-30 1982-11-19
JPS61271707A (en) * 1985-05-28 1986-12-02 矢崎総業株式会社 Wire harness
JPS647712U (en) * 1987-07-01 1989-01-17
JPH01283708A (en) * 1988-05-11 1989-11-15 Yazaki Corp Wire harness
JPH0264162U (en) * 1988-11-04 1990-05-14
JPH03149709A (en) * 1989-11-06 1991-06-26 Yazaki Corp Flat wire harness and its manufacture

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6344613B1 (en) * 1999-04-22 2002-02-05 Visteon Global Technologies, Inc. Automobile electrical circuit assembly with transparent protective cover
JP2008537288A (en) * 2005-04-07 2008-09-11 スリーエム イノベイティブ プロパティズ カンパニー Cable harness body
CN113593774A (en) * 2021-07-30 2021-11-02 长春捷翼汽车零部件有限公司 Method for manufacturing wire harness and wire harness

Also Published As

Publication number Publication date
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