JPH051117Y2 - - Google Patents

Description

[Detailed Description of the Invention] Industrial Application Field The present invention relates to a plate-shaped heat sink suitable for dissipating heat from heat-generating electronic components such as transistors by natural air cooling.

Conventional technology Conventionally, this type of heat dissipation plate has a downward U-shaped cut in the plate surface excluding the mounting plane of electronic components.
It is known that by bending the base of the notch over the entire width, a plurality of tongue-shaped heat dissipating fins that project diagonally upward are provided (Jitsukaisho).
58-111947).

In addition to the above, parallel cuts of a predetermined length are made inward from the vertical side edges of the plate having a mounting plane for electronic components, and the divided pieces are cut at each cut. It is also known to provide a plurality of heat dissipating fins that are arranged in a straight line in the vertical direction by bending the fins alternately in the front and rear directions over the entire width at the back side (Utility Model Publication No. 159167/1987).

By the way, in the above-mentioned plate-shaped heat sink, it is most effective to form a large surface area in order to improve the cooling effect by natural air cooling. However,
In view of the need to save the mounting area of a printed circuit board and to downsize the circuit assembly, there is a limit to greatly increasing the area of the heat sink. Assuming that this heat dissipation area is constant, other factors that improve the cooling effect include reducing the temperature gradient in each part of the heat dissipation plate;
One example of this is the effective generation of air flow through natural convection.

In this industry, by improving these factors even slightly, the temperature of the heat sink due to natural air cooling can be reduced to 1℃.
However, it is hoped that this will be reduced.

Considering the above-mentioned conventional example from this point of view, in the former case, each heat dissipation fin is formed by bending the base of the notch over the entire width, so the bent portion acts as a thermal resistance, This becomes a factor that inhibits efficient heat transfer of the heat generated by the electronic components to the heat dissipation fins. Therefore, it is difficult to reduce the temperature gradient in each part of the heat sink. In addition, in the heat dissipation plate, openings corresponding to the heat dissipation fins are provided by cutting the plate in a downward U-shape, so the openings are surrounded by the plates on all sides, and an air flow is generated through the openings. hard. In addition, each heat dissipation fin located below the side of the mounting surface of the electronic component is separated from the mounting surface of the electronic component by a U-shaped notch. The heat generated by the cutting is blocked by the notch, which acts to increase the thermal resistance.

On the other hand, in the latter type, each heat dissipation fin is formed by a notch provided inward from the side edge of the plate in the vertical direction. However, since the heat dissipation fin is provided by bending the back side of the divided piece over the entire width, the bent part acts as a thermal resistance, and as with the former, heat transfer to the heat dissipation fin is efficient. I can't do it. In addition, since the heat dissipation fins are arranged in a straight line in the vertical direction, the airflow that moves upward via the lower heat dissipation fins flows along the upper heat dissipation fins, as shown in Figure 5. This will disrupt the moving airflow,
It is also difficult to efficiently dissipate heat through airflow.

Problems to be Solved by the Invention In the present invention, as in the latter conventional example, each heat dissipation fin is formed by cutting inward from the side edges in the vertical direction of the plate. An object of the present invention is to provide a heat sink for electronic components that is improved so that heat can be efficiently transferred to the heat sink, the temperature gradient in each part of the heat sink can be reduced, and heat can be efficiently dissipated by generating good air flow through natural convection. .

Means for Solving the Problems A heat dissipation plate for electronic components according to the present invention includes a plate body having a mounting plane for electronic components that heat up, and a plurality of heat dissipation plates extending inward from the side edges in the vertical direction of the plate body. The pieces divided by each cut are bent to form a plurality of heat dissipation fins, and the heat dissipation fins are continuous on the same plane as the mounting plane of the heated electronic component. It consists of a substantially triangular base, and a triangular wing whose inner side is bent at an obtuse angle with respect to the base so as to protrude in the same direction, and the protrusion dimension is such that the protrusion dimension is from the lower side of the plate. The heat dissipation fins are arranged so as to become smaller toward the upper side, and wedge-shaped openings are provided between adjacent heat dissipation fins.

Function: In this heat sink for an electronic component, heat generated by the electronic component is transferred from the mounting plane of the electronic component to each heat sink provided on the side edge of the plate. The heat dissipation fin consists of a substantially triangular base that is continuous on the mounting plane of the heat-resistant electronic component, and triangular wings that are bent so that they protrude in the same direction at an obtuse angle on the inside with respect to the base. Therefore, the triangular base and the triangular wing have approximately the same area and are continuous via the folded line along the diagonal line of the radiation fin.

The triangular base has a wide portion near the mounting position of the heated electronic component and a narrow tip portion farther from the mounting position, so that there is no portion that acts as a thermal resistance. Therefore, heat can be efficiently transferred from the heated electronic components to the entire triangular base. In addition, heat transfer to the triangular wing is carried out from the entire triangular base, which has an area approximately half of the radiation fin, to approximately half the remaining area.
The distance for heat transfer is short and easy. Therefore, even though this heat sink has a bent part from the triangular base to the triangular wing, the split piece,
In other words, the temperature gradient of the entire plate is reduced compared to a case where the heat dissipation fin has a bent portion on the back side.

In addition, wedge-shaped openings are provided between adjacent heat dissipation fins, so when heat dissipation starts from the entire heat dissipation fin, it is guided by the triangular wings from the base of the heat dissipation fin and escapes upward through the opening. Air flow is created. This air flow is generated continuously by the air warmed by the heat radiation fins rising, guided by the triangular wings of the adjacent upper heat radiation fins, and escaping upward, and sucking air from below, and acting as a rectifying plate. The air flows through the space formed by the upper and lower triangular wings, so they do not interfere with each other.
In addition, since the triangular wing is formed so that the protruding dimension gradually decreases from the lower side to the upper side of the plate, the airflow generated from the lower side is not obstructed by the airflow generated from the upper side. Therefore, a large amount of air flows smoothly through each opening, allowing efficient heat dissipation from the triangular blades.

The amount of air flowing through is large in the large part of the wedge-shaped opening, and small in the small part. Furthermore, since the width of each part of the triangular wing corresponds to the width of the wedge-shaped opening, a large amount of air flows through the wide part of the triangular wing, and a small amount of air flows through the narrow part of the triangular wing. As a result, the amount of air flowing per unit area of the triangular wing can be made approximately equal, so that heat can be dissipated in a well-balanced manner from each part of the triangular wing, and turbulence is less likely to occur.

Due to the synergistic effect of the above, the heat sink of this electronic component can efficiently transfer the heat generated by the electronic component to each heat sink, reducing the temperature gradient in each part of the heat sink, and generating a good air flow due to natural convection. Allows for efficient heat dissipation.

Embodiments The following description will be made with reference to FIGS. 1 to 4.

FIG. 1 is a front view of a heat sink according to an example of the present invention;
FIG. 2 is a side view of the heat sink, which is formed using a plate 1 made of a metal plate material with good thermal conductivity, such as an aluminum plate. The plate 1 is erected and fixed on the surface of a printed circuit board, and is formed so that the lower center of the plate serves as a mounting plane for heat-generating electronic components E such as transistors.

This plate 1 is divided into several pieces by making a plurality of parallel cuts inward from the side edges in the vertical direction, and each piece divided by the cuts is bent to create a plurality of pieces. heat dissipation fins 2a-2
f, 3a to 3f are formed. Each of the radiation fins 2a to 2f, 3a to 3f has a substantially triangular base 20 that is continuous on the same plane as the mounting plane of the electronic component E.
. . . and triangular wings 21 . . . whose inner sides are bent at an obtuse angle with respect to the base 20 . Among these components, the triangular wings 21 are provided so that their protruding dimensions become smaller from the lower side to the upper side of the plate body 1. The dimensional difference is created by successively narrowing the intervals between the cuts formed in the plate 1. Furthermore, wedge-shaped openings 22 are formed between adjacent heat radiation fins 2a to 2f and 3a to 3f, respectively.

In addition, in the heat dissipation plate shown in FIG. 1, the triangular wings 21 are formed by bending to the back side of the cut, so that the back side of the cut is formed in a somewhat curved radius shape. Further, a round hole-shaped stopper hole 4 used for fixing the electronic component E is provided on the mounting plane of the electronic component E.

The heat dissipation plate for electronic components configured in this manner has an electronic component E such as a transistor mounted on the board 1 toward the lower center of the plate, and heat generated by the electronic component E is distributed to each heat dissipation fin 2a around the component mounting plane.
2f, 3a to 3f, and is attached to the board surface of the mounting board so that the heat is radiated from the entire board including the respective radiation fins 2a to 2f, 3a to 3f.

In this heat dissipation plate for electronic components, the heat generated by the electronic component E is dissipated through each of the heat dissipation fins 2a to 2f, 3a provided on the side edges of the plate body 1 centered on the mounting plane of the electronic equipment E.
Heat is transferred up to ~3f. The heat dissipation fin 2a~
2f, 3a to 3f are substantially triangular base portions 2 that are continuous on the same plane as the mounting plane of the heat-resistant electronic equipment E;
0... and triangular wings 21... whose inner sides are bent at an obtuse angle with respect to the base 20... so that they protrude in the same direction, so the triangular base 20...
and the triangular blades 21... have substantially the same area and are continuous via folded lines extending substantially along diagonal lines of the radiation fins 2a to 2f, 3a to 3f.

The triangular bases 20 are shaped so that the wide portion is close to the mounting position of the heat-resistant electronic component E, and the tip portion farther from the mounting position is narrower, and there is no portion that acts as a thermal resistor.
Heat can be efficiently transferred from the heat-resistant electronic component E to the entire triangular base 20.
The heat transfer to the
A triangular base 2 having an area approximately half that of 3f
1...Since the treatment is performed on approximately half of the remaining area from the entire area, the distance for heat transfer is short and the treatment can be performed easily.
Therefore, even though this heat sink plate has bent portions from the triangular base 20 to the triangular wings 21, it acts to reduce the temperature gradient throughout the plate compared to a divided piece, i.e., one having a bent portion on the inner side of the heat sink fin.

Moreover, since wedge-shaped openings 22 are provided between adjacent heat dissipation fins 2a to 2f and 3a to 3f, when heat dissipation is started from the entire heat dissipation fins 2a to 2f and 3a to 3f, Heat dissipation fin 2a~
From the base 20... of 2f, 3a to 3f, the triangular wing 21...
An air flow is generated that is guided by the opening 22 and escapes upward. This air flow is caused by the heat radiation fins 2a to 2f,
The air heated by 3a to 3f rises, and the adjacent upper heat radiation fins 2a to 2f, 3a to 3f
The upper and lower triangular wings 21... are guided by the triangular wings 21... of the upper and lower triangular wings 21... and are continuously generated by suctioning air from below, acting as current plates.
Because they flow through a space formed by In addition, heat dissipation fins 2a to 2f, 3
Triangular wings 21 protruding from the bases 20 of a to 3f.
Since the protruding dimension of the plate body 1 is formed so that it becomes smaller sequentially from the lower side toward the upper side, it is possible to prevent the airflow generated from the lower side from being obstructed by the airflow generated from the upper side. Therefore, a large amount of air flows smoothly through each opening 22, and heat can be efficiently dissipated from the triangular wings 21.

The amount of air flowing through is large in the large portion of the wedge-shaped opening 22, and is small in the small portion. Also,
Since the width of each part of the triangular blades 21 corresponds to the wedge-shaped opening width, the wide portions of the triangular blades 21 have a large amount of air flowing through them, and the narrow portions of the triangular blades 21 have a small amount of air flowing through them. . As a result, the amount of air flowing per unit area of the triangular blades 21 can be made approximately equal, so that heat can be dissipated in a well-balanced manner from each part of the triangular blades 21, and turbulence is less likely to occur.

Due to the synergistic effect described above, the heat sink of this electronic component absorbs the heat generated by the electronic component E through each of the heat sinks 2a to 2f, 3a.
It is possible to efficiently transfer heat to ~3F and reduce the temperature gradient in each part of the heat sink, and also to generate a good air flow due to natural convection and to efficiently dissipate heat.

Furthermore, in the heat sink of the above-described embodiment, since the heat sink fins 2a to 2f and 3a to 3f are respectively provided at the left and right ends of the plate 1, the electronic component E
Well-balanced heat dissipation can be performed on the left and right sides of the plate 1 with the mounting plane as the center.

The heat sinks of the electronic components shown in Figures 3 and 4 are the first and second heat sinks.
In a different embodiment from the one shown in the figure, in the heat sink, triangular wings 21 of the respective heat sink fins 2a to 2f, 3a to 3f are provided so as to protrude in opposite directions at the left and right side ends. According to this heat sink, each triangular wing 21
Since the airflows generated by ... can be combined as a spiral upward airflow above the plate 1, the heat dissipation efficiency can be further improved.

In each of the above-described embodiments, the plate body 1 is formed of an aluminum plate that is difficult to solder, so it is preferable to assemble the soldering legs 5 made of a different metal material that can be soldered to the lower edge. . Furthermore, the plate 1 can be formed not only to accommodate one electronic component E, but also to have an area that allows multiple electronic components E to be mounted in parallel.

Effects of the Invention As described above, according to the heat sink for electronic components according to the present invention, the heat generated by the electronic components can be efficiently transferred to each heat dissipation fin, and a large amount of heat can be efficiently transferred to each heat dissipation fin without interfering with each other in the opening between the heat dissipation fins. Since the airflow from the lower side is not obstructed by the airflow from the upper side, efficient heat dissipation can be achieved.

[Brief explanation of the drawing]

Fig. 1 is a front view showing a heat sink according to one embodiment of the present invention, Fig. 2 is a side view including the air flow generated by the heat dissipation plate, and Fig. 3 is a front view showing a heat sink according to another embodiment of the present invention. FIG. 4 is a perspective view of a heat sink, FIG. 4 is a side view of the same heat sink, and FIG. 5 is an explanatory diagram showing an air flow generated in a heat sink according to an example of the prior art. DESCRIPTION OF SYMBOLS 1... Plate body, 2a-2f, 3a-3f... Radiation fin, 20... Base, 21... Triangular wing, 22...
...Aperture, E...Electronic parts.

Claims (1)

[Claims for Utility Model Registration] (1) A plate body having a mounting plane for heat-generating electronic components, and having a plurality of parallel cuts inward from the vertical side edges of the plate body. , in a heat sink for an electronic component, in which the pieces divided at each cut are bent to form a plurality of heat sink fins, each of the heat sink fins being approximately continuous on the same plane as the mounting plane of the electronic component that receives heat. It consists of a triangular base and a triangular wing whose inside is bent at an obtuse angle with respect to the base so as to protrude in the same direction, and the protrusion dimension of the triangular wing is from the lower side to the upper side of the plate body. 1. A heat dissipation plate for an electronic component, characterized in that the heat dissipation fins are disposed so as to become smaller toward each other, and wedge-shaped openings are provided between adjacent heat dissipation fins. (2) The heat dissipation plate for an electronic component according to claim 1, wherein the heat dissipation fins are provided at the left and right ends of the plate, respectively. (3) The electronic component according to claim 2, wherein the triangular wings protruding from the base of the heat dissipation fin are formed with protruding directions opposite to each other at the left and right ends of the plate body. Heat sink.