JPH05109923A - Composite multilayer circuit board - Google Patents
Composite multilayer circuit boardInfo
- Publication number
- JPH05109923A JPH05109923A JP30110791A JP30110791A JPH05109923A JP H05109923 A JPH05109923 A JP H05109923A JP 30110791 A JP30110791 A JP 30110791A JP 30110791 A JP30110791 A JP 30110791A JP H05109923 A JPH05109923 A JP H05109923A
- Authority
- JP
- Japan
- Prior art keywords
- conductor pattern
- circuit board
- filter
- dielectric
- distributed constant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
Landscapes
- Control Of Motors That Do Not Use Commutators (AREA)
- Filters And Equalizers (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、多層回路基板に係り、
より詳細には、フィルタ回路を内蔵した複合セラミック
多層回路基板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer circuit board,
More specifically, the present invention relates to a composite ceramic multilayer circuit board containing a filter circuit.
【０００２】[0002]
【従来の技術】近年、ディジタル機器の進展により、多
くのノイズ対策用チップ部品が提供されている。しかし
ながら、該機器のポータブル化等の小型化に伴った電源
用ノイズ対策部品は十分に小さいとは言い難く、アセン
ブリメーカーで集中定数素子であるチップコンデンサー
やチップインダクタを用いてＴ型やπ型等のフィルタを
回路基板上に組み立てているのが現状である。2. Description of the Related Art In recent years, with the progress of digital equipment, many chip parts for noise suppression have been provided. However, it is hard to say that the noise suppression parts for power supply accompanying the miniaturization of the equipment such as portable equipment are not sufficiently small. The current situation is to assemble the above filter on a circuit board.
【０００３】しかし、この構成の場合、多くの部品点数
を組み合わせる形態となるため、前記機器の小型化に限
度が生じており、前記フィルタの一層の小型化、高性能
化が求められている。However, in the case of this configuration, since a large number of parts are combined, there is a limit to downsizing of the device, and further downsizing and high performance of the filter are required.
【０００４】そこで、本発明者は、この課題を解決する
ために、先に、『信号導体層とアース導体層とを絶縁層
を介在させて交互に積層し、かつ該信号導体層とアース
導体層とを、それぞれ多段に直列接続した構成』（特願
平２ー１９１０００号明細書参照）の分布定数素子を用
いたノイズフィルタと、『高誘電体層の片面に渦巻状の
インダクタ導体層を、また他面に渦巻状コンデンサ導体
層を形成し、更にこれらの両側には絶縁体層を積層し、
かつこれらは一体的に焼成してなる構成』（特願平２ー
２２９６４０号明細書参照）の分布定数素子を用いた内
蔵型ＬＣフィルタを提案した。Therefore, in order to solve this problem, the present inventor firstly "laminates a signal conductor layer and an earth conductor layer alternately with an insulating layer interposed therebetween, and further, the signal conductor layer and the earth conductor. And a noise filter using a distributed constant element having a configuration in which layers are connected in series in multiple stages "(see Japanese Patent Application No. 2-191000), and" a spiral inductor conductor layer is provided on one surface of a high dielectric layer. , And form a spiral-shaped capacitor conductor layer on the other surface, and further laminate insulator layers on both sides of these layers,
In addition, a built-in LC filter using a distributed constant element having a structure in which these are integrally fired "(see Japanese Patent Application No. 2-229640) was proposed.
【０００５】そして、これらのフィルタは、前記各導体
層がチップ内部に内蔵され、外気に非接触状態の構成と
しているので、その信頼性を向上させ得ると共に、その
構成を一層、コンパクト化できるという利点を有する。Further, in these filters, since each of the conductor layers is built in the inside of the chip and is in a non-contact state with the outside air, the reliability can be improved and the structure can be made more compact. Have advantages.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、前述し
たフィルタの場合、次のような課題が残る。すなわち、 高インダクタンスが必要な電源用フィルタとする場
合、チップ自体の小型化に限度がある。 小型化された回路基板上にチップを載せると、該基
板上のスペースが狭くなる。 等の課題が残る。However, in the case of the above-mentioned filter, the following problems remain. That is, in the case of a power supply filter that requires high inductance, there is a limit to miniaturization of the chip itself. Placing a chip on a miniaturized circuit board reduces the space on the board. Issues such as remain.
【０００７】ところで、低温焼成のセラミック回路基板
においては、小型化のために、内蔵コンデンサを作り、
バイパスコンデンサとしてフィルタの代わりに使用する
試みがされている。しかし、この構成の場合、該フィル
タが集中定数型フィルタであるため、十分なノイズ除去
特性を得られないという問題が指摘されている。By the way, in a low temperature fired ceramic circuit board, a built-in capacitor is formed to reduce the size.
Attempts have been made to use it as a bypass capacitor instead of a filter. However, in the case of this configuration, since the filter is a lumped constant type filter, it has been pointed out that a sufficient noise removal characteristic cannot be obtained.
【０００８】そこで、本発明者は、このような点に鑑
み、種々・研究した結果、分布定数素子を用いてフィル
タ回路を構成すると共に、該フィルタ回路を回路基板内
部に取り込み、これを一体焼成することで、任意のイン
ダクタンス値を得ることができ、かつ回路基板の表面の
スペースを大きくとることが可能で、ディジタル機器等
の大幅な小型化を実現できることを究明した。Therefore, the present inventor has variously studied in view of such a point, and as a result, constructs a filter circuit using a distributed constant element, takes the filter circuit into a circuit board, and integrally burns it. By doing so, it has been clarified that an arbitrary inductance value can be obtained, a large space can be provided on the surface of the circuit board, and a drastic downsizing of a digital device or the like can be realized.
【０００９】本発明は、以上の課題に対処して創作した
ものであって、その目的とする処は、回路基板表面にチ
ップ部品を組み合わせてフィルタを構成する必要がな
く、かつノイズ除去特性を向上させ得ることができると
共に、回路基板表面のスペースを有効に使用できるよう
にした複合多層回路基板を提供することにある。The present invention has been made in response to the above-mentioned problems, and its object is to eliminate the need to form a filter by combining chip parts on the surface of a circuit board and to have a noise elimination characteristic. Another object of the present invention is to provide a composite multilayer circuit board that can be improved and can effectively use the space on the surface of the circuit board.
【００１０】[0010]
【課題を解決するための手段】そして、上記目的を達成
するための手段としての本発明の複合多層回路基板は、
８００〜１０００℃で同時焼成可能な導体を内層導体と
して有する多層回路基板において、該回路基板内部に信
号導体パターンとアース導体パターンとを誘電体を介し
て対向させたフィルタ回路を組み込み、一体的に焼成
し、かつ該フィルタ回路は多段に直列接続され、分布定
数型ノイズフィルタを形成した構成としたものである。The composite multi-layer circuit board of the present invention as a means for achieving the above object,
In a multilayer circuit board having a conductor that can be simultaneously fired at 800 to 1000 ° C. as an inner layer conductor, a filter circuit in which a signal conductor pattern and an earth conductor pattern are opposed to each other through a dielectric is incorporated into the circuit board, and integrated. The filter circuit is fired, and the filter circuits are connected in series in multiple stages to form a distributed constant type noise filter.
【００１１】また、本発明の他の多層回路基板は、前記
発明において、前記信号導体パターンとアース導体パタ
ーンとを、誘電体を介して対応する巻線状導体パターン
によって形成した構成よりなる。Further, another multilayer circuit board of the present invention is the same as the above-mentioned invention, wherein the signal conductor pattern and the ground conductor pattern are formed by corresponding winding conductor patterns via a dielectric.
【００１２】[0012]
【作用】本発明の多層回路基板は、基板内部に組み込ま
れている信号導体パターンとアース導体パターンとを誘
電体を介して対向させていることより、両パターンによ
りコンデンサを形成し、該コンデンサによるキャパシタ
ンス成分と、該両パターンのインダクタンス成分とによ
ってフィルタを構成し、かつ該フィルタを多段に直列接
続するようにしているので分布定数型フィルタを構成す
ることより、少ない素子数でもって広帯域で大きな減衰
を得ることができる。In the multi-layer circuit board of the present invention, the signal conductor pattern and the ground conductor pattern incorporated in the board are opposed to each other through the dielectric, so that a capacitor is formed by both patterns and A filter is composed of a capacitance component and an inductance component of both patterns, and the filters are connected in series in multiple stages. Therefore, by configuring a distributed constant type filter, a large number of elements can be used for large attenuation in a wide band. Can be obtained.
【００１３】また、フィルタ回路を基板内部に組み込
み、一体的に焼成した構成としていることより、回路基
板自体の構成をコンパクト化でき、かつ該回路基板表面
のスペースを有効に利用できるように作用する。Further, since the filter circuit is built in the substrate and integrally fired, the structure of the circuit board itself can be made compact and the space on the surface of the circuit board can be effectively used. ..
【００１４】[0014]
【実施例】以下、図面を参照しながら、本発明を具体化
した実施例について説明する。ここに、図１〜図５は、
本発明の実施例を示し、図１は断面図、図２は一対のフ
ィルタ回路部分の概略拡大展開斜視図、図３は図１の等
価回路図、図４は本実施例の回路基板に内蔵したフィル
タの減衰特性を示す減衰曲線図、図５は他の実施例の断
面図である。Embodiments of the present invention will be described below with reference to the drawings. Here, FIG. 1 to FIG.
FIG. 1 is a sectional view, FIG. 2 is a schematic enlarged exploded perspective view of a pair of filter circuit parts, FIG. 3 is an equivalent circuit diagram of FIG. 1, and FIG. 4 is a built-in circuit board of this embodiment. FIG. 5 is an attenuation curve diagram showing the attenuation characteristics of the above filter, and FIG. 5 is a sectional view of another embodiment.
【００１５】本実施例の複合多層回路基板は、概略する
と、回路基板１の内部に分布定数型ＬＣ複合フィルタ１
を組み込み、これを一体的に焼成した構成よりなる。そ
して、該焼成は、８００〜１０００℃の温度で低温焼成
（同時焼成）し、回路基板１の内部に分布定数型ＬＣ複
合フィルタ２を複合化している。ここで、分布定数型と
は、Ｌ素子と、Ｃ素子が分割された形で多数のＬ・Ｃ定
数が分布していること（図３（ａ））と、高周波領域で
は、それぞれ分割Ｌ・Ｃ内に、あるいはＬ・Ｃ間に分布
容量や分布インダクタンスが発生し、図３（ｂ）のよう
な等価回路になっていることの両者の意味を有する。The composite multi-layer circuit board of the present embodiment is roughly described in which the distributed constant type LC composite filter 1 is provided inside the circuit board 1.
And is integrally fired. Then, the firing is performed at a low temperature (simultaneous firing) at a temperature of 800 to 1000 ° C., and the distributed constant type LC composite filter 2 is compounded inside the circuit board 1. Here, the distributed constant type means that a large number of L · C constants are distributed in a form in which the L element and the C element are divided (FIG. 3A), and in the high frequency region, each is divided into L · C constants. This means that a distributed capacitance or a distributed inductance is generated in C or between L and C to form an equivalent circuit as shown in FIG. 3B.
【００１６】回路基板１は、セラミック多層回路基板で
あって、CaO （またはMgO)−Al2 O3−SiO2−B2O 系ガラ
ス粉末：４０〜８０重量％と、アルミナ粉末：２０〜６
０重量％とからなる低温焼成材料をドクターブレード法
により１００μｍ厚みのグリーンテープ３とし、これを
所定サイズに切断・積層した基板よりなる。ここで、各
グリーンテープ３には、通常の基板と同様に、Ag導体ペ
ーストによる配線回路（パターン）４が印刷され多層回
路を形成している。そして、積層されているグリーンテ
ープ３，３間には、分布定数型フィルタ回路２が形成さ
れている。The circuit board 1 is a ceramic multi-layer circuit board, and comprises CaO (or MgO) -Al 2 O 3 -SiO 2 -B 2 O based glass powder: 40 to 80% by weight and alumina powder: 20 to 6%.
A low temperature firing material consisting of 0% by weight was used as a green tape 3 having a thickness of 100 μm by a doctor blade method, and the green tape 3 was cut and laminated into a predetermined size. Here, a wiring circuit (pattern) 4 made of Ag conductor paste is printed on each green tape 3 to form a multi-layer circuit, similar to a normal substrate. A distributed constant type filter circuit 2 is formed between the stacked green tapes 3 and 3.
【００１７】分布定数型フィルタ回路２は、信号導体パ
ターン５とアース導体パターン６とを誘電体７を介して
対向させた一対のフィルタ回路８を、多層化されている
回路基板に沿って多段に直列接続することで形成されて
いる。ここで、信号導体パターン５とアース導体パター
ン６としては、Ag系、Cu系、あるいはAu系導体ペースト
を用い、両パターン５，６が対向・対応するスパイラル
状等の巻線状パターンとしている。そして、両導体パタ
ーン５，６のインダクタンス成分と、両パターン５，６
間誘電体によるキャパシタンス成分により、フィルタ回
路８を得ている。また、前記誘電体７としては、誘電率
εが８０程度の鉛・チタン・硼酸系誘電体（PbO −TiO2
−B2O3）を用いている。In the distributed constant type filter circuit 2, a pair of filter circuits 8 in which a signal conductor pattern 5 and an earth conductor pattern 6 are opposed to each other with a dielectric 7 in between are arranged in multiple stages along a multilayered circuit board. It is formed by connecting in series. Here, as the signal conductor pattern 5 and the ground conductor pattern 6, Ag-based, Cu-based, or Au-based conductor paste is used, and both patterns 5 and 6 are in a spiral-shaped winding pattern in which the patterns 5 and 6 face and correspond to each other. Then, the inductance components of both conductor patterns 5 and 6
The filter circuit 8 is obtained by the capacitance component of the inter-dielectric. As the dielectric 7, a lead / titanium / boric acid-based dielectric (PbO 2 —TiO 2 ) having a dielectric constant ε of about 80 is used.
-B 2 O 3 ) is used.
【００１８】そして、分布定数型フィルタ回路２を構成
する信号導体パターン５は、スルーホール（あるいは、
ビアホール等）９を介して信号ラインまたは電源ライン
に接続され、またアース導体パターン６は、スルーホー
ル１０を介してアースラインに接続されている。The signal conductor pattern 5 constituting the distributed constant type filter circuit 2 is provided with a through hole (or
A signal line or a power supply line is connected via a via hole 9), and the ground conductor pattern 6 is connected to a ground line via a through hole 10.
【００１９】ところで、本実施例の複合多層回路基板
は、前述したグリーンテープ３の上面にAg導体ペースト
でスパイラル状のアース導体パターン６をスクリーン印
刷し、該アース導体パターン６の上部に誘電体ペースト
をスクリーン印刷して誘電体層７を形成すると共に、該
誘電体層７の上面にアース導体パターン６に対向し、か
つ対応するスパイラル状の信号導体パターン５をスクリ
ーン印刷し、両パターン５，６により一対のフィルタ回
路８を形成し、該フィルタ回路を形成したグリーンテー
プをラミネートし、８００〜１０００℃で低温焼成する
ことで製作している。また各層の信号導体パターンはス
ルーホールを介して直列に信号ラインへ、アース導体パ
ターンもスルーホールを介して直列にアースラインへ接
続される。なお、前記誘電体層７は、必要に応じて、誘
電率εの異なる複合ペロブスカイト等の約９００℃で同
時焼成できる材料を用い、厚さが約３０〜１００μｍの
グリーンテープとしたものを用い、これを積層するよう
にしてもよい。By the way, in the composite multilayer circuit board of this embodiment, a spiral earth conductor pattern 6 is screen-printed on the upper surface of the green tape 3 with Ag conductor paste, and the dielectric paste is formed on the earth conductor pattern 6. Is screen-printed to form a dielectric layer 7, and a spiral signal conductor pattern 5 facing the earth conductor pattern 6 and corresponding to the ground conductor pattern 6 is screen-printed on the upper surface of the dielectric layer 7 to form both patterns 5, 6 A pair of filter circuits 8 are formed by, the green tape on which the filter circuits are formed is laminated, and low temperature firing is performed at 800 to 1000 ° C. to manufacture. The signal conductor pattern of each layer is connected to the signal line in series through the through hole, and the ground conductor pattern is connected to the earth line in series through the through hole. The dielectric layer 7 is made of a material such as a composite perovskite having a different permittivity ε that can be simultaneously fired at about 900 ° C., and a green tape having a thickness of about 30 to 100 μm is used as the dielectric layer 7, You may make it laminate | stack this.
【００２０】そして、本実施例の複合多層回路基板によ
れば、信号導体パターンとアース導体パターンとを誘電
体を介して対向させて形成したフィルタ回路を基板内部
に組み込む構成としていることより、グリーンテープ３
上を広く利用できるので、大きいインダクタンスが容易
に得られ、高特性フィルタを得ることができように作用
する。また、フィルタ回路を基板内部に組み込み、一体
的に焼成した構成としていることより、回路基板自体の
構成をコンパクト化でき、かつ該回路基板表面のスペー
スを有効に利用できるように作用する。According to the composite multi-layer circuit board of this embodiment, the filter circuit formed by the signal conductor pattern and the ground conductor pattern facing each other with the dielectric interposed therebetween is incorporated into the board. Tape 3
Since the upper part can be widely used, a large inductance can be easily obtained, and a high characteristic filter can be obtained. Further, since the filter circuit is built into the substrate and integrally fired, the structure of the circuit board itself can be made compact and the space on the surface of the circuit board can be effectively used.
【００２１】ところで、本実施例の複合多層回路基板に
ついて、その減衰特性について調べた処、図４に示すよ
うに、前述した本発明者が先に提案した内蔵型ＬＣフィ
ルタと同様に、２つの大きな共振が、離れた周波数帯域
に現れ、広帯域の減衰が発現することが確認できた。こ
のことより、基板内に分布定数型フィルタ回路を組み込
んだ構成であっても、例えば、先に本発明者が提案した
フィルタチップと同様の作用をさせ得ることが確認でき
た。By the way, when the attenuation characteristics of the composite multilayer circuit board of the present embodiment were examined, as shown in FIG. 4, it was found that the two characteristics were the same as the built-in LC filter previously proposed by the present inventor. It was confirmed that a large resonance appeared in the distant frequency band and a wide-band attenuation appeared. From this, it was confirmed that even the configuration in which the distributed constant type filter circuit is incorporated in the substrate can cause the same action as, for example, the filter chip previously proposed by the present inventor.
【００２２】なお、本発明は、上述した実施例に限定さ
れるものでなく、本発明の要旨を変更しない範囲内で変
形実施できるものを含む。因みに、分布定数型フィルタ
回路としては、図５に示すような構成としてもよいこと
は当然である。The present invention is not limited to the above-described embodiments, but includes modifications that can be implemented without changing the gist of the present invention. Incidentally, it goes without saying that the distributed constant type filter circuit may be configured as shown in FIG.
【００２３】[0023]
【発明の効果】以上の説明より明らかなように、本発明
の複合多層回路基板によれば、基板内部に組み込まれて
いる信号導体パターンとアース導体パターンとを誘電体
を介して対向させていることより、両パターンによりコ
ンデンサを形成し、該コンデンサによるキャパシタンス
成分と、該両パターンのインダクタンス成分とによって
フィルタを構成し、かつ該フィルタを多段に直列接続す
るようにしているので分布定数型フィルタを構成するこ
とより、少ない素子数でもって広帯域の減衰を発現で
き、高特性フィルタを得ることができるという効果を有
する。As is apparent from the above description, according to the composite multilayer circuit board of the present invention, the signal conductor pattern and the ground conductor pattern incorporated in the board are opposed to each other via the dielectric. Therefore, a capacitor is formed by both patterns, a filter is configured by the capacitance component of the capacitor and the inductance component of both patterns, and the filters are connected in series in multiple stages. With the configuration, it is possible to obtain wideband attenuation with a small number of elements and obtain a high characteristic filter.
【００２４】また、本発明の複合多層回路基板によれ
ば、フィルタ回路を基板内部に組み込み、一体的に焼成
した構成としていることより、回路基板自体の構成をコ
ンパクト化でき、かつ該回路基板表面のスペースを有効
に利用できるという効果を有する。Further, according to the composite multilayer circuit board of the present invention, since the filter circuit is built in the board and integrally fired, the structure of the circuit board itself can be made compact, and the surface of the circuit board can be made compact. This has the effect that the space can be effectively used.
【図１】 本発明の実施例の断面図である。FIG. 1 is a cross-sectional view of an embodiment of the present invention.
【図２】 一対のフィルタ回路部分の概略拡大展開斜視
図である。FIG. 2 is a schematic enlarged exploded perspective view of a pair of filter circuit portions.
【図３】 図１の等価回路図である。FIG. 3 is an equivalent circuit diagram of FIG.
【図４】 本実施例の回路基板に内蔵したフィルタの減
衰特性を示す減衰曲線図である。FIG. 4 is an attenuation curve diagram showing an attenuation characteristic of a filter built in the circuit board of this embodiment.
【図５】 他の実施例の断面図である。FIG. 5 is a cross-sectional view of another embodiment.
１・・・回路基板、２・・・分布定数型ＬＣ複合フィル
タ、３・・・グリーンテープ、４・・・配線回路、５・
・・信号導体パターン、６・・・アース導体パターン、
７・・・誘電体、８・・・一対のフィルタ回路、９，１
０・・・スルーホール（あるいは、ビアホール等）1 ... Circuit board, 2 ... Distributed constant type LC composite filter, 3 ... Green tape, 4 ... Wiring circuit, 5 ...
..Signal conductor pattern, 6 ... Ground conductor pattern,
7 ... Dielectric material, 8 ... Pair of filter circuits, 9, 1
0 ... Through hole (or via hole, etc.)
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０１Ｌ 25/18 Ｈ０１Ｐ 1/203 9183−5Ｊ 7220−4Ｍ Ｈ０１Ｌ 23/52 Ｂ 7220−4Ｍ 25/04 Ｚ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Internal reference number FI Technical display location H01L 25/18 H01P 1/203 9183-5J 7220-4M H01L 23/52 B 7220-4M 25/04 Z
Claims (2)
体を内層導体として有する多層回路基板において、該回
路基板内部に信号導体パターンとアース導体パターンと
を誘電体を介して対向させたフィルタ回路を組み込み、
一体的に焼成し、かつ該フィルタ回路は多段に直列接続
され、分布定数型ノイズフィルタを形成していることを
特徴とする複合多層回路基板。1. A multi-layer circuit board having a conductor that can be simultaneously fired at 800 to 1000 ° C. as an inner layer conductor, wherein a filter circuit in which a signal conductor pattern and a ground conductor pattern are opposed to each other through a dielectric substance inside the circuit board. Embedded,
A composite multi-layer circuit board, characterized in that it is fired integrally and the filter circuits are connected in series in multiple stages to form a distributed constant type noise filter.
とが、誘電体を介して対応する巻線状導体パターンより
なる請求項１に記載の複合多層回路基板。2. The composite multilayer circuit board according to claim 1, wherein the signal conductor pattern and the ground conductor pattern are formed of corresponding winding-shaped conductor patterns with a dielectric interposed therebetween.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30110791A JPH05109923A (en) | 1991-10-20 | 1991-10-20 | Composite multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30110791A JPH05109923A (en) | 1991-10-20 | 1991-10-20 | Composite multilayer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05109923A true JPH05109923A (en) | 1993-04-30 |
Family
ID=17892930
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30110791A Pending JPH05109923A (en) | 1991-10-20 | 1991-10-20 | Composite multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05109923A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5831331A (en) * | 1996-11-22 | 1998-11-03 | Philips Electronics North America Corporation | Self-shielding inductor for multi-layer semiconductor integrated circuits |
| WO2000074142A1 (en) * | 1999-06-01 | 2000-12-07 | Alcatel Usa Sourcing, L.P. | Multiple level spiral inductors used to form a filter in a printed circuit board |
| KR100364926B1 (en) * | 1999-06-03 | 2002-12-16 | 사단법인 고등기술연구원 연구조합 | Leadless Type LTCC Module And Manufacturing Method Thereof |
| WO2006090611A1 (en) * | 2005-02-25 | 2006-08-31 | Murata Manufacturing Co., Ltd. | Lc filter |
| US20230036907A1 (en) * | 2020-05-07 | 2023-02-02 | Murata Manufacturing Co., Ltd. | Multilayer substrate module |
-
1991
- 1991-10-20 JP JP30110791A patent/JPH05109923A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5831331A (en) * | 1996-11-22 | 1998-11-03 | Philips Electronics North America Corporation | Self-shielding inductor for multi-layer semiconductor integrated circuits |
| WO2000074142A1 (en) * | 1999-06-01 | 2000-12-07 | Alcatel Usa Sourcing, L.P. | Multiple level spiral inductors used to form a filter in a printed circuit board |
| KR100364926B1 (en) * | 1999-06-03 | 2002-12-16 | 사단법인 고등기술연구원 연구조합 | Leadless Type LTCC Module And Manufacturing Method Thereof |
| WO2006090611A1 (en) * | 2005-02-25 | 2006-08-31 | Murata Manufacturing Co., Ltd. | Lc filter |
| US20230036907A1 (en) * | 2020-05-07 | 2023-02-02 | Murata Manufacturing Co., Ltd. | Multilayer substrate module |
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