JPH05109221A - Supporting piece for electronic and electric parts - Google Patents

Abstract

PURPOSE:To enable rapid attenuation of the vibrations of electronic and electric parts, such as head sliders and relay contacts, and, therefore, to prevent the generation various problems occurring in the vibrations of these parts. CONSTITUTION:The supporting piece for the electronic and electric parts is formed of a spring material constituted by providing a coating layer of nickel or nickel alloy or nickel substrate solder on the surface of a copper alloy material having a spring characteristic.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a head slider in a magnetic disk device which is a storage device such as an electronic computer.
The present invention relates to a support piece for supporting electronic / electrical parts such as relay contacts in a relay device used in an electric circuit.

[0002]

[Prior Art]

(Prior art example 1) There are a floppy disk device and a fixed disk device in a magnetic disk device of an electronic computer, both of which have a head slider having a magnetic head for exchanging data by following the movement of a rotating magnetic disk and its support. A piece is provided.

FIG. 10 is a partial schematic view showing a magnetic head portion used in the above-mentioned floppy disk device.
In the figure, reference numeral 1 denotes a floppy disk sheet to be inserted into a floppy disk device, and 2 denotes a magnetic head which is close to the floppy disk sheet 1 and writes or reads data by contacting with a contact pressure of about 15 to 20 gf. The head sliders 3 are supporting pieces for supporting the head slider 2 and have spring properties, and are called gimbal springs.

FIG. 11 is a plan view showing the support piece 3. The support piece 3 is made by etching a copper alloy such as beryllium copper having a thickness of about 0.05 to 0.15 mm or a plate material having a spring property such as stainless steel.

FIG. 12 is a perspective view showing a magnetic head portion in a fixed disk device. In the figure, 4 is a head slider having a magnetic head for writing and reading data in the vicinity of a hard disk (not shown), and 5 is a spring-like support piece for supporting the head slider 4. The support piece 5 is made of three members obtained by etching (or pressing) a stainless steel plate material, and keeps the distance between the hard disk (not shown) and the head slider 4 at 1 μm or less.

The magnetic disk device for an electronic computer, particularly the magnetic head portion, is constructed as described above, and each actuator or positioning mechanism accesses a precisely defined track of the magnetic disk to rotate the disk. Information is written and read in combination.

(Prior art example 2) Also, in a relay device used in an electric circuit, a supporting piece for supporting a relay contact is used. The relay device mentioned here relays a signal from one electric circuit to another electric circuit, and when the input current reaches a constant value, the electric contact opens and closes to control the operation of the device connected to the same or another electric circuit. It is a device that does.

FIG. 13 is a partial detailed view showing the internal structure of the above-mentioned relay device, particularly showing the contact portion. In the figure, 11 is a plate thickness having a spring property of 0.1t to
Fixed contact 1 in which 0.5 t of copper alloy material is used to support the moving contact 14a and 12 is a material having no spring property.
4b is a supporting piece. The two support pieces 11 and 12 are arranged in parallel by making the contacts 14a and 14b near the tips face each other and fixing the base ends to the fixing member 13. The support pieces 11 and 12 are connected to another electric circuit (not shown). Reference numeral 15 is a substantially Z-shaped link rod having an intermediate portion supported by a rotary shaft 15, one end portion 15a being locked to the support piece 11, and the other end portion 15b being close to the coil 17. When a voltage is applied to the coil 17, the coil 17 generates a magnetic field that attracts the other end 15b of the link rod 15. When the link rod 15 is attracted by the coil 17 and rotates in the direction of arrow A, the contact point 14a and the contact point 14b come into contact with each other.

Next, the operation of the relay device will be described. When the voltage applied to the coil 17 is gradually increased, when the voltage reaches a certain value, the other end 15b of the link rod 15 is attracted to the coil 17 and the support piece 11 is pushed in the direction of the arrow C, so that the contacts 14a, 14b. Touch (this state is called a moving state). Next, when the voltage applied to the coil 17 is gradually decreased, when the value reaches a certain value, the other end 15b moves away from the coil 17, the supporting piece 11 moves in the direction of the arrow D, and the contacts 14a, 14b. Leave (this state is called open state).

FIG. 14 shows changes in voltage between the contacts 14a and 14b, and FIG. 15 shows changes in current. In each case, a certain rise time is not stable, a bounce chattering phenomenon (hereinafter referred to as a bounce phenomenon) occurs, and then a stable state is achieved.

[0011]

However, in the magnetic disk device of Conventional Example 1, since the supporting pieces 3 and 5 are made of a spring material such as a copper alloy or stainless steel having a large longitudinal elastic coefficient, the floppy disk is used. In the case of a disk device, the magnetic head in contact with the floppy disk sheet 1 vibrates due to the wobbling of the rotating floppy disk sheet 1 or surface irregularities, or due to the moving operation of the magnetic head. Further, in the case of a fixed disk device, the magnetic head vibrates due to wind generated by the rotation of the hard disk.
In the case of a floppy disk device, this vibration of the magnetic head causes a loss of recording / playback accuracy.
In the case of a fixed disk device, the magnetic head collides with the hard disk, causing a serious defect of damaging the hard disk. Further, noise due to resonance of the support pieces 3 and 5 is also a problem common to both devices.

For this reason, conventionally, structural measures have been taken to obtain the correct attitude of the head slider, and measures have been taken to add a damper to the support piece of the head slider for the purpose of preventing vibration or changing the resonance frequency. Came. However, the material of the support piece of the head slider has hardly been studied, and the problem of vibration damping or vibration isolation itself has not been solved.

On the other hand, in the relay device of Conventional Example 2,
Since the support piece 11 is made of a copper alloy material having a large longitudinal elastic coefficient, a bounce phenomenon occurs at the start of moving or opening, and the operation is not stable, and cannot be used during this time. Therefore, the time required for the operation is long and the operation is slow. Also,
Excessive energy (hereinafter referred to as arc) may be generated between the contacts 14a and 14b when the bounce phenomenon occurs. When an arc is generated, the contact points 14a and 14b are melted and instantly cooled and fixed and welded.
4b is deformed, which causes abnormal operation.

Therefore, conventionally, a capacitor is added between the contacts to prevent re-ignition of the arc, reduce the number of times of bounces, and adjust the relationship between the contact moving speed and the spring load to reduce the bounce time. It has been shortened. However, the material of the support piece 11, which is greatly involved in the bounce phenomenon, has not been studied, and the problem of vibration suppression or vibration isolation of itself has not been solved.

The present invention has been made to solve the above problems, and can quickly damp vibrations of electronic / electrical parts such as head sliders and relay contacts, and therefore electronic / electrical parts. It is an object of the present invention to obtain a support piece for the same component that can solve the various problems described above caused by the vibration of the component.

[0016]

A support piece of an electronic / electrical component according to the present invention has a large longitudinal elastic coefficient and has a spring property on a surface of a copper alloy material. (Simply called nickel)
It is made of a spring material provided with a coating layer.

In order to effectively damp the vibration of the copper alloy material, it is necessary that the nickel coating layer has a thickness of at least 1% or more of that of the copper alloy material. But,
If the thickness of the coating layer is too large, the vibration of the copper alloy material can be greatly dampened, but the rigidity is increased and the spring property of the copper alloy material may be restricted. It should be 15% or less of the material. Normal,
The thickness of the nickel coating layer is preferably 5% or more and 10% or less of the thickness of the copper alloy material.

Depending on the application, the coating layer contains nickel and iron (component ratio Ni / Fe = 18/1 to 1).
(0/1) and nickel containing phosphorus (phosphorus content 2 to 15%) can also be used to obtain the same effect. Further, Ni is used as a base (the thickness is 0.25 to 1 of the copper alloy material).
%) The same effect can be obtained by using the solder as a coating layer.

[0019]

[Operation] When vibration is applied to the support piece, the copper alloy material having a large longitudinal elastic coefficient tends to be largely deformed by an exciting force,
In addition, since it has a spring property, a stress for continuing the vibration is applied. Therefore, the damping of vibration is small. On the other hand, the nickel coating layer exhibits sufficient elongation with respect to displacement due to an exciting force, and acts to prevent (attenuate) the vibration due to the internal stress of nickel itself.

[0020]

【Example】

(Embodiment 1) Hereinafter, an embodiment of the present invention will be described by taking a supporting piece of a head slider in a floppy disk device as an example.

This supporting piece is arranged as shown in FIG. 10 as in the case of the conventional example 1, and the plan shape thereof is the shape shown in FIG. The supporting piece of the head slider according to this example is a 0.08 mm-thick copper alloy material consisting of Sn 6 wt%, Ni 9 wt% and residual Cu, subjected to ordinary electric field degreasing and acid treatment, and then subjected to a known nickel plating bath. The spring material was electroplated with nickel to a thickness of 5 μm in a known manner.

In order to confirm the damping effect of this spring material,
A spring material made of a copper alloy having the same composition and not coated with nickel was used as Comparative Example 1, a spring material obtained by electroplating the above copper alloy material with solder to a thickness of 5 μm was used as Comparative Example 2, and the above copper alloy material was used with 0 nickel. A vibration test was performed on each spring material by using a vibration test device, using as a comparative example 3 a spring material in which an undercoat was plated to a thickness of 0.2 μm and a solder was electroplated thereon to a thickness of 5 μm.

FIG. 1 is a block diagram showing the vibration test apparatus. In the figure, reference numeral 21 denotes an exciter having one end fixed with a sample 22 obtained from the spring material and applying vibration.
A pulse generator 3 is connected to the vibrator 21 and sends a trigger pulse to the vibrator 21. A waveform analyzer 24 is connected to the pulse generator 23, sends a signal to the pulse generator 23, and receives a signal from a photonic sensor 25 for detecting the displacement of the sample 22 resonating by the vibrator 21. , 26 are synchroscopes for displaying the output signal of the waveform after the designated delay time analyzed by the waveform analyzer 25. 27 is connected to the waveform analysis device 24,
It is a computer that receives the waveform data output from the waveform analyzer 24 and calculates the attenuation coefficient of the sample.

The vibration test was conducted in Example 1 and Comparative Examples 1 to 3.
Samples were obtained by cutting the spring material of No. 2 into a width of 7 mm and a length of 50 mm.

The vibration test using the above vibration test apparatus was repeated 15 times for each of the spring materials of Example 1 and Comparative Examples 1 to 3, and the average value was obtained. The results are shown in Table 1.

[0026]

[Table 1] The vibration waveform of each spring material was also examined. 2-5
Shows the result. That is, FIG. 2 shows the vibration waveform of the sample of Example 1, FIG. 3 shows the vibration waveform of the sample of Comparative Example 1, FIG. 4 shows the vibration waveform of the sample of Comparative Example 2, and FIG. The vibration waveform of the sample of FIG.

As shown in Table 1, the spring material used for the support piece of the head slider of Example 1 was different from that of Comparative Example 1 in that
It showed a large damping coefficient of about 10 times. Further, from the comparison between Comparative Example 2 and Comparative Example 3, it was confirmed that the effect of the solder coating layer having nickel as the base is greater than that of the coating layer of the solder alone. That is, according to Example 1, it was confirmed that a large damping effect can be obtained by providing the nickel-based coating layer.

In the above embodiment, nickel (and solder) is used as a support piece for the head slider by electroplating.
Although the spring material covered with the above has been described, the spring material covered with another method, for example, the hot dipping method can be similarly described. However, since the vibration mode may be biased unless the coating has a uniform thickness, an electroplating method having a high coating uniformity is advantageous.

Further, in the above embodiment, the supporting piece of the head slider for the floppy disk has been described, but the supporting piece of the head slider for the fixed disk using the same spring material can be similarly described.

(Embodiment 2) Next, an embodiment of the present invention will be described by taking a supporting piece of a relay contact as an example.

This supporting piece is arranged as shown in FIG. 13 as in the second conventional example. The support piece of the relay contact according to this example is a known copper sulfate plating bath known in the art after electrolytic degreasing and acid treatment on a copper alloy material having a thickness of 0.1 mm consisting of Sn 6 wt%, Ni 9 wt% and residual Cu. Method was made of spring material electroplated with nickel to a thickness of 5 μm.

In order to confirm the damping effect of this spring material,
A spring material made of a copper alloy having the same composition and not coated with nickel was used as Comparative Example 4, a spring material obtained by electroplating the copper alloy material with solder to a thickness of 5 μm was used as Comparative Example 5, and nickel was used to have a thickness of 0.2 μm. Undercoat with 5 and solder on it
A vibration test was performed on each spring material using Comparative Example 6 as the spring material electroplated with a thickness of μm. For the vibration test, the vibration test device of FIG. 1 used in Example 1 was used.

The vibration test was conducted in Example 2 and Comparative Examples 4-6.
The spring material of No. 1 was cut into pieces each having a width of 7 mm and a thickness of 50 mm, and cut pieces were used as samples.

Tests by the above-mentioned vibration test apparatus were conducted for each of the spring materials of Example 1 and Comparative Examples 1 to 15 for 15 times.
Repeated times, the average value was obtained. The results are shown in Table 2.

[0035]

[Table 2] The vibration waveform of each spring material was also examined. 6 shows the vibration waveform of the sample of Example 2, FIG. 7 shows the vibration waveform of the sample of Comparative Example 4, FIG. 8 shows the vibration waveform of the sample of Comparative Example 5, and FIG. 9 shows the vibration waveform of the sample of Comparative Example 6. Are shown respectively.

As shown in Table 2, the material used for the support piece of the relay contact of Example 2 showed a large damping coefficient of about 10 times that of Comparative Example 4. In addition, Comparative Example 5 and Comparative Example 6
From the comparison, it was confirmed that the solder coating layer having nickel underlayer had a greater effect than the coating layer of the solder alone. That is, according to Example 2, it was confirmed that a large damping effect can be obtained by providing the nickel-based coating layer.

In the above embodiment, the spring material coated with nickel (and solder) by the electroplating method has been described as the support piece of the relay contact, but the spring material coated by other methods such as the hot dip coating method is also applicable. The same can be explained. However, since the vibration mode may be biased unless the coating has a uniform thickness, an electroplating method having a high coating uniformity is advantageous.

[0038]

As described above, the supporting piece of the electronic / electrical component according to the present invention is a spring material in which a coating layer of nickel or nickel alloy or nickel-base solder is provided on the surface of a copper alloy material having spring properties. Since it is built-in, even if vibration is applied to the supporting electronic / electrical component, it can be quickly attenuated, and therefore various problems caused by the vibration of the electronic / electrical component can be prevented in advance. ..

[Brief description of drawings]

FIG. 1 is a block diagram showing a vibration testing device for spring materials.

FIG. 2 is a diagram showing a vibration waveform when a sample obtained from the spring material of Example 1 is used.

FIG. 3 is a diagram showing a vibration waveform when a sample obtained from the spring material of Comparative Example 1 is used.

FIG. 4 is a diagram showing a vibration waveform when a sample obtained from a spring material of Comparative Example 2 is used.

FIG. 5 is a diagram showing a vibration waveform when a sample obtained from the spring material of Comparative Example 3 is used.

FIG. 6 is a diagram showing a vibration waveform when a sample obtained from the spring material of Example 2 is used.

FIG. 7 is a diagram showing a vibration waveform when a sample obtained from the spring material of Comparative Example 4 is used.

FIG. 8 is a diagram showing a vibration waveform when a sample obtained from a spring material of Comparative Example 5 is used.

FIG. 9 is a diagram showing a vibration waveform when a sample obtained from a spring material of Comparative Example 6 is used.

FIG. 10 is used in a floppy disk device,
Side view of conventional support piece of head slider

11 is a plan view of the support piece in FIG.

FIG. 12 is a perspective view of a support piece of a conventional head slider used in a fixed disk device.

FIG. 13 is a side view of a main part of a relay device in which a conventional support piece for a relay contact is used.

FIG. 14 is a graph showing changes in voltage between contacts when the relay device of FIG. 13 operates.

FIG. 15 is a graph showing changes in current between contacts during operation of the relay device of FIG.

[Explanation of symbols]

 2,4 Head slider 3,5,11 Support piece 14a Moving contact

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hisatoshi Ito 1-157 Miyashita, Sagamihara City, Kanagawa Sanryo Electric Co., Ltd.

Claims (1)

[Claims] 1. Electronic devices such as head sliders and relay contacts
A support piece for an electric component, which is made of a spring material in which a coating layer of nickel or nickel alloy or nickel-base solder is provided on the surface of a copper alloy material having spring properties Support piece.