JPH049952A - Production of intaglio printing plate - Google Patents

Abstract

PURPOSE:To obtain fine patterns of high accuracy by intaglio printing which is improved in the transfer characteristic of ink by forming metallic parts between the resist materials patterned by the positive patterns of ink cell disposition. CONSTITUTION:The resist material 18 is first applied on a base material 3 consisting of a copper plate and is exposed by the positive patterns of the ink cell disposition by master glass 9. The resist material 8 is thereafter developed to remove the unnecessary parts. The patterned resist materials 8 are cured. Copper plating is then applied on the plate surface to form the metallic parts 10 between the resist materials 18 and thereafter, the surface is leveled off to obtain the metallic parts 10 of the negative patterns of the ink cell disposition. The top end faces of the metallic parts 10 are thereafter polished to peel and remove the resist materials 18, by which the ink cells 6 having the less ruggedness are formed on the inner side faces of the resist materials 8 by tracing the side surface shapes thereof. The ruggedness is decreased in the shapes of both inner side faces 60 of the ink cells 6 in the resulted printing plate 1 and the transfer property of the ink is improved. The waste of the ink is, therefore, eliminated and the fine patterns are surely obtd.

Description

[Detailed description of the invention] [Industrial application field]

The present invention relates to a method for producing a printing plate for intaglio printing or intaglio offset printing when performing fine pattern printing, for example, fine pattern printing to obtain a liquid crystal color filter.

[Conventional technology]

Conventionally, intaglio printing has been used to print fine patterns, and intaglio printing is also used to manufacture color filters for liquid crystals that require high precision. As shown in FIG. 6, the printing plate 1 used for this intaglio printing is made by patterning a resist material on a plate material 2 with a negative pattern of ink cell arrangement using the photolithography method, and then performing an etching process to form the ink cells. It is formed using an etching method.

[Problem to be solved by the invention]

By the way, as shown in FIG. 6, the plate material 2 used for printing plates usually has a copper layer (formed by copper plating) 4 and an etching stop layer 5 on a base material 3 from the upper layer side. It has a layered structure. In the ink cell 6 obtained by patterning and etching the resist material as described above, the bottom surface is relatively flat because etching is regulated by the etching stop layer 5.
The 100-yen side surface 6o of the ink cell 6 is uneven because there are areas where etching progresses quickly and areas where it does not due to the crystal structure of copper, etc., and the inner surface area of the ink cell 6 becomes large. As a result, when ink is transferred from the printing plate, ink remains on the inner surface of the ink cell, as shown in Figure 7.
On the printing substrate (glass substrate, etc.), each side of the image line 7 is printed about 5 μm thinner than the plate dimension (ink cell dimension) D, and the side part 70 is printed in a wavy state. Ru. However, the above-mentioned conditions in which the drawing lines are thin or the edges are wavy are not acceptable for fine patterns such as color filters. (within the acceptable range), especially line 7
This becomes a big problem when trying to obtain an ultra-fine pattern with a width d of 5 μm% or 10 μm. That is, as shown in FIG. 8, ink A remains on the bottom surface of the ink cell 6 at a thickness of about 5 μm (width indicated by a in the figure), and on the side surface of the ink cell 6 at a thickness of about 5 μm (width already indicated in the figure). If you want to obtain a wide print line during normal printing, for example, to obtain a print line with a width of 100 μm, the ink cell should be is formed. However, when obtaining extremely thin lines, for example, 5μ
An ink cell that produces a fine pattern such as a 110 μm print line has an extremely narrow width, and the amount of ink transferred from the plate is also small, making it extremely difficult to control the amount of transfer and the print width. Note that C indicates the depth of transferred ink, which is approximately 5 μm. Therefore, the present invention aims to reduce the irregularities on the side surface of the ink cell and improve the transferability of ink, and to obtain a fine pattern with higher precision by intaglio printing.

[Means to solve the problem]

The present invention has been made in consideration of the above-mentioned problems, and involves patterning a resist material with a positive pattern of ink cell arrangement on a base material, curing the resist material, and applying metal plating between the resist materials to form a positive pattern on the base material. Provided is a method for producing an intaglio printing plate, comprising: patterning a metal part with a negative pattern for arranging ink cells, and then polishing the upper end surface of the metal part and removing the resist material to form ink cells. This solves the above problem.

[For use]

In the present invention, since the metal portion is formed between the resist materials patterned with a positive pattern of ink cell arrangement, the side surface of the metal portion traces the uneven side shape of the resist material, and the resist material After removing the ink cell, the 100-yen side surface of the ink cell formed between the metal parts becomes smooth.

【Example】

Next, the present invention will be explained in detail based on the embodiments shown in FIGS. 1 to 5. It should be noted that the parts having the same configuration as those of the conventional example shown in FIGS. 6 to 9 are given the same reference numerals, and the explanation thereof will be omitted. In the present invention, the printing plate 1 is, as shown in FIG.
A resist material 8 is applied onto a base material 3 made of a copper plate, and exposed using a master glass 9 in a positive pattern of ink cell arrangement. Thereafter, the resist material 8 is developed to remove unnecessary portions, and the patterned resist material 8 is hardened (FIG. 2). Next, the printing plate is plated with copper to form a metal portion 10 between the resist materials 8, and then this is leveled to obtain a metal portion 1° of a negative pattern in which ink cells are arranged (FIG. 3). Thereafter, by polishing the upper end surface of the metal part 1o and peeling off the renost material 8, an ink cell 6 with less unevenness on the inner surface shape is formed by tracing the side surface shape of the resist material 8 (FIG. 4). ). In the printing plate 1 obtained by the above-described method, as shown in FIG. 5, the shape of the 100-yen side surface 60 of the ink cell 6 has fewer irregularities, and the thickness of the ink A remaining on the inner surface 60 side during ink transfer is reduced. It became possible to obtain a condition in which the thickness was approximately 2 μm. From this, in order to obtain a printing plate with a printing line width of 10 μm, it is sufficient to shift the width of the ink cell 6 by about 2 μm on both sides to obtain a printing plate with a width of 15 μm. Fine patterns can be printed reliably.

【Effect of the invention】

As explained above, according to the present invention, when obtaining a printing plate for intaglio printing or intaglio offset printing, a resist material is patterned on a base material with a bond pattern of ink cell arrangement, and the resist material is cured. The metal part is patterned with a negative pattern of ink cell arrangement on the base material by applying metal plating in between, and then the upper end surface of the metal part is polished and the resist material is removed to form the ink cell. The shape of the 100-yen side surface becomes smooth. Therefore, the thickness of the ink remaining on the inner surface side at the time of ink transfer is reduced, thereby reducing ink waste and making it easier to control the amount of ink transfer. Further, it is possible to reliably obtain a fine pattern without causing fine drawing lines of a desired width to become wavy, thereby achieving excellent practical effects.

[Brief explanation of drawings]

Figures 1 to 4 show an embodiment of the method for manufacturing an intaglio printing plate according to the present invention, with Figure 1 being an explanatory diagram showing the state during exposure, and Figure 2 being an explanatory diagram showing the state after development. , FIG. 3 is an explanatory diagram showing a copper plating state, FIG. 4 is an explanatory diagram showing a printing plate, FIG. 5 is an explanatory diagram showing an ink cell of a printing plate according to one embodiment, and FIG. 6 is an explanatory diagram showing a conventional one. FIG. 7 is an explanatory diagram showing the state of the print line, and FIGS. 8 and 9 are explanatory diagrams showing the state after the ink has been transferred. 1... Printing plate 2... Base material 6... Ink cell 8... Resist material 9... Master glass 10...・Metal part A... Ink Fig. 1 Fig. 4 Fig. 5 Fig. 2 Fig. 3 Fig. 6

Claims (1)

[Claims] A resist material is patterned on the base material with a positive pattern of ink cell arrangement, and this is cured. Metal plating is applied between the resist materials, and a metal part is patterned on the base material with a negative pattern of ink cell arrangement. A method for manufacturing an intaglio printing plate, comprising polishing the upper end surface of the metal part and removing the resist material to form an ink cell.