JPH0499097A - Servo motor driver - Google Patents

Abstract

PURPOSE:To reduce in size by providing a recess at a heat sink, clamping a semiconductor component at the recess, and superposing a circuit board thereon. CONSTITUTION:A recess 5 is provided at an opposite side to a fin 3, and a semiconductor component 11, etc., is clamped at the recess. The depth of the recess 5 of a heat sink 2 is substantially equal to the height of the components 11, 12, 13 to be clamped. The component 11 is a diode module, the components 12, 13 are transistor modules, and clamped at the sink 2 to disperse heat generated during operation through the sink 2 with screws 21-26. Small-sized printed boards 42, 43 having a controller for controlling a servo motor are soldered to a pattern 24 on a circuit board 30. The pattern 31 of the board 30 is clamped at the component 11, the pattern 32 is clamped at the component 12, and the pattern 33 is clamped at the component 13. Thus, the components 11, 12, 13 are electrically connected with the board 30.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a servo motor drive device, and particularly to a servo motor drive device used in a numerical control device, a robot control device, or the like.

[Conventional technology]

Servo motor drive devices that drive servo motors are widely used in numerical control devices, robots, PCs (programmable controllers), and the like. These servo motor drive devices are stored in a locker of a numerical control device or a robot control device. Furthermore, the machine-side control circuit is usually incorporated into a rocker called a power panel.

These lockers are required to be more compact in order to reduce the installation area of systems such as CNC machine tools. As a result, servo motor drive devices are also required to be more compact.

On the other hand, in order to automate the assembly of these servo motor drive devices, robots are used to perform the assembly work, and consideration has been given to facilitating the assembly work by robots.

FIG. 3 is an exploded view of a conventional servo motor drive device.

4 is a plan view of the servo motor of FIG. 3 after assembly. The servo motor drive device 50 has a heat sink 51
It is mainly composed of.

Semiconductor components 61, 62, and 63 are screwed to the heat sink 51.

A wiring board 70 is screwed to the semiconductor components 61, 62, and 63. This wiring board 70 is provided with a pattern for wiring by screwing. For example, by fixing the semiconductor component 63 to the pattern portion 73 with screws 91 and 92,
Electrical continuity is established between the semiconductor component 63 and the wiring board 70. The semiconductor component 61 is screwed to the pattern section 71, and the semiconductor component 62 is screwed to the pattern section 72. Furthermore, electrical components such as an electrolytic capacitor 81, an electromagnetic switch 82, and a connector 74 are soldered to the wiring board 70.

A control circuit printed circuit board 100 is soldered with an IC (not shown) constituting a control circuit for controlling the servo motor. Further, a connector 101 is soldered to the control circuit printed board 100 and is coupled to a connector 74 of the wiring board 70.

These heat sink 51, wiring board 70, and control circuit printed board 100 are assembled into a servo motor drive device 50.

[Problem to be solved by the invention]

However, in such a servo motor drive device, there are semiconductor components 61 and 62 between the heat sink 51 and the wiring board 70.
．． 63, the other spaces are not used. Further, in the wiring board 70, the space other than the electrolytic capacitor 81 and the electromagnetic switch 82 is not utilized. In other words, there is still room for spatial miniaturization.

The present invention has been made in view of these points, and it is an object of the present invention to provide a more compact servo motor drive device.

Another object of the present invention is to provide a servo motor drive device that further reduces wasted space.

[Means to solve the problem]

In order to solve the above problems, the present invention provides a servo motor drive device that drives a servo motor without wiring, in which a heat sink has cooling fins on one side and recesses for screwing semiconductor components on the other side. and the semiconductor component screwed to the heat sink, and a pattern that provides electrical continuity when screwed to the semiconductor component, and when combined with the heat sink, the semiconductor component has a pattern on the front surface of the heat sink. A servo motor drive device is provided, which includes a small printed board and a wiring board soldered so that electrical components are positioned thereon.

[Effect]

A recess is provided in the heat sink, a semiconductor component is screwed into the recess, and a wiring board is placed on top of the recess. Therefore, there is almost no wasted space between the heat sink and the wiring board.

Furthermore, since the small printed circuit board and electrical components attached to the wiring board are soldered to positions located in front of the heat sink when the wiring board is combined with the heat sink, the space in front of the heat sink can be used effectively.

As a result, a servo motor drive device with no wasted space can be constructed.

〔Example〕

Hereinafter, one embodiment of the present invention will be described based on the drawings.

FIG. 1 is an exploded view of the servo motor drive device of the present invention. FIG. 2 is a plan view taken from arrow A in FIG. The servo motor drive device 1 is constructed using a heat sink 2 as a base. The heat sink 2 has cooling fins 3.

It has a recess 5 on the side opposite to the fin 3, and a semiconductor component 11, etc., which will be described later, is screwed into this recess. heat sink 2
After assembly, other parts will be placed close to the front surface 4 of the device. hole 6
．． 7 is used when assembling the servo motor drive device 1 to the rocker.

The depth of the recess 5 of the heat sink 2 is approximately the same as the height of the semiconductor component 11, 12, 13 to be screwed. The semiconductor component 11 is a diode module, and the semiconductor component 12.
Reference numeral 13 denotes a transistor module, which is screwed to the heat sink 2 with screws 21 to 26 so that heat generated during operation can be dissipated via the heat sink 2.

Small printed circuit boards 41, 42, and 43 having control circuits for controlling the servo motor are soldered to the wiring board 30 at the positions of the patterns 34. Furthermore, the electrolytic capacitor 45 is soldered to the pattern 35, the electromagnetic switch 46 is soldered to the pattern 36, and the terminal block 47 is soldered to the pattern 37. These solderings are performed before the wiring board 30 is assembled to the heat sink 2. The small printed circuit boards 41 to 43 include a control circuit for controlling the servo motor, and one board is used for each axis of the servo motor.

Moreover, the pattern 31 of the wiring board 30 is attached to the semiconductor component 11,
The pattern 32 is screwed to the semiconductor component 12, and the pattern 33 is screwed to the semiconductor component 13. One screw 48a, 48b, 49c for each pattern.
, and the others are omitted. - As a result, the semiconductor components 11, 12, and 13 are electrically connected to the wiring board 30.

In this way, the servo motor drive device 1 is assembled by screwing the heat sink 2 and the semiconductor components 11, 12, 13,
Further, it is only necessary to screw the wiring board 30 onto the semiconductor components 11 to 13, which is extremely simple, and can be assembled by a robot.

Further, as is clear from FIG. 2, the semiconductor components 11 and the like are arranged between the heat sink 2 and the wiring board 30, and there is almost no wasted space. Further, in front of the front surface 4 of the heat sink 2, small printed circuit boards 41, 42, and 43 are arranged above, and an electrolytic capacitor 45 and an electromagnetic switch 46 are arranged below. As a result, the space in front of the front surface 4 of the heat sink 2 is also effectively used.

As a result, the volume is approximately half that of a conventional servo motor drive device.

In the above description, the electrolytic capacitor 45, the electromagnetic switch 46, and the terminal block 47 were used as electrical components, but in reality, smaller electrical components are mounted on the wiring board 30, but these are omitted.

Further, the arrangement of the servo motor drive device described above is an example, and the positions of the details of each component can be changed as appropriate.

〔Effect of the invention〕

As explained above, in the present invention, a semiconductor component is attached to the recess of the heat sink, and a small printed circuit board attached to a wiring board is positioned in front of the heat sink, so that a servo motor drive device can be realized without wasting space. Can be configured. As a result, the volume of the servo motor drive device can be reduced by half compared to the conventional one.

Also, the structure is extremely simple, and assembly by robots is easy, reducing assembly time.

[Brief explanation of the drawing]

Fig. 1 is an exploded view of the servo motor drive device of the present invention, Fig. 2 is a plan view taken in the direction of the arrow in Fig. 1, Fig. 3 is an exploded view of a conventional servo motor drive device, and Fig. 4 is an exploded view of the servo motor drive device of the present invention. FIG. 4 is a plan view of the servo motor of FIG. 3 after assembly; Servo motor drive device゛°Heat sink - Front side - Recessed part Semiconductor parts Semiconductor parts Semiconductor parts - Wiring board - Small printed board Small printed board Small printed board Electrolytic capacitor Electromagnetic switch Figure 2 t$4 figure

Claims (6)

[Claims] (1) A servo motor drive device that drives a servo motor without wiring, which includes a heat sink that has cooling fins on one side and a recess for screwing semiconductor components on the other side, and a heat sink that is screwed to the heat sink. The semiconductor component has a pattern that provides electrical continuity by screwing the semiconductor component to the semiconductor component, and when combined with the heat sink, a small printed board and the electrical component are positioned in front of the heat sink. A servo motor drive device comprising: a wiring board soldered so as to do so; and a servo motor drive device. (2) The servo motor drive device according to claim 1, wherein the wiring board is coupled to the heat sink via the semiconductor component. (3) The servo motor drive device according to claim 1, wherein the small printed board includes a control circuit for controlling the servo motor. (4) The servo motor drive device according to claim 3, wherein one small printed board is provided for each axis or every two axes of the servo motor. (5) The servo motor drive device according to claim 1, wherein the semiconductor component includes at least a transistor module or a diode module. (6) The servo motor drive device according to claim 1, wherein the electric component includes at least an electrolytic capacitor or an electromagnetic switch.