JPH049902A - Fine pattern forming method - Google Patents

Abstract

PURPOSE:To form high-density printing elements of even 5 to 10mum printing elements by electrodepositing a resin coating material in fine patterns on a substrate for electrodeposition in an conductive layer liquid and transferring this coating material to a pattern forming substrate. CONSTITUTION:A conductive layer 12 is formed on one surface of a glass substrate 11 and an insulating photoresist 13 is formed thereon to desired patterns. This substrate 1 for conductive layer is immersed into the conductive layer liquid 3 of an anion resin dissolved with 14wt.% water-soluble resin coating material 2. The resin coating material 2 is electrodeposited on a conductive release layer 14 when the electrodeposition is executed for two minutes under 50V condition by connecting the conductive layer 12 to a positive electrode. The resin coating material 4 peels from the release layer 14 and is transferred to the pattern forming substrate 5 when the pattern forming substrate 5 made of glass is brought into contact with this electrodeposition resin coating material 4 and +5000V voltage is impressed thereto from the surface.

Description

[Detailed description of the invention] [Industrial application field]

The present invention relates to a method for manufacturing a filter used in image input/output devices such as liquid crystal display devices and image sensors, and more particularly to a method for repeatedly forming fine patterns on a substrate.

[Conventional technology]

As a means of repeatedly forming fine patterns on a transparent substrate, as is well known, photolithography or other techniques are used to form image grooves in the desired pattern on a copper plate, etc., and this is used as a printing plate using the offset method. There is a method of printing on a glass substrate or the like.

[Problem to be solved by the invention]

The resolution of the filter improves as the line width becomes narrower and clearer. Therefore, a fine pattern is drawn on a photoresist and the metal surface is etched to form a narrow image groove, but when the image width reaches a level of, for example, 5 to 10 μl, etching with a uniform depth is not possible. It has been difficult to manufacture high-precision printing plates due to problems such as difficulty in printing, and it has also been extremely difficult to faithfully apply ordinary ink to printing plates and faithfully transfer it to printing materials. Further, during printing, since the image groove is narrow, the ink transfer rate to the substrate is reduced, and there is a problem in that it is not possible to color with sufficient density. For this reason, 5 to 101. There has been a long-awaited development of a method for forming fine patterns that can form a sufficiently thick image line even with a narrow image width of about 100 m, and therefore can form an image line with a high density.

[Means to solve the problem]

The present invention has been made in order to solve the above-mentioned problems of the prior art, and includes forming an insulating resist in a pattern on a conductive layer to form an electrodepositing substrate, and using the electrodepositing substrate as an electrodepositing substrate containing a resin paint. A fine method characterized in that the resin paint is electrodeposited on the exposed part of the conductive layer by immersion in a liquid, and then the electrodeposited resin paint is transferred to a pattern-forming substrate placed in contact with or in close proximity to the electrodeposited resin paint. A method for forming a pattern is provided.

[Effect]

Since the method for forming a fine pattern according to the present invention has the above-mentioned structure, the electrodeposition substrate on which the conductive layer has an insulating resist remaining in a desired pattern is placed in an electrodeposition solution containing dissolved or dispersed resin paint. When the electrodeposition solution is immersed in water and an appropriate voltage is applied, the resin paint charged and contained in the electrodeposition solution is attracted to the exposed portion of the conductive layer of the electrodeposition substrate, and is selectively electrodeposited. After the resin paint is electrodeposited to a desired thickness by electrodeposition for a predetermined period of time, the substrate for electrodeposition is pulled up from the electrodeposition solution.
If the pattern-forming substrate is placed in contact with or in close proximity to the electrodeposition resin paint, and an appropriate voltage is applied from the back side of the pattern-formation substrate, the electrodeposition resin paint is peeled off from the conductive layer of the electrodeposition substrate and the pattern is formed. Transfer to the formation substrate side. Furthermore, by forming an adhesive on the surface of the patterned substrate, the transfer of the pattern can be easily achieved. Next, the present invention will be explained in more detail based on the drawings.

[Embodiment 1] Reference numeral 1 denotes a substrate for electrodeposition, and a conductive layer 12 is formed flat on one side of a flat glass substrate 11, and an insulating photoresist 13 is left on the conductive layer 12 in a desired pattern. The structure is as follows. Conductor 1 [Layer 12 is copper, chromium, aluminum, IT. A metal having excellent electrical conductivity is formed to an appropriate thickness by conventionally known means such as vapor deposition or sputtering. Furthermore, as a means for forming the insulating photoresist 13 in a desired pattern, a conventionally well-known method such as photolithography is appropriately applied to form the photoresist 13 with desired precision. Reference numeral 14 indicates the conductive layer 11 from which the photoresist 13 has been removed.
It is a conductive peeling layer formed on the surface of Adds conductivity. The electrodepositing substrate 1 having the above structure was coated with 14 wt % of a water-soluble resin paint 2 (an acrylic resin made of a copolymer of methyl acrylate and chlorohequin acrylate colored red with CI red pigment N009). When the conductive layer 12 was connected to the positive electrode and electrodeposition was performed for 2 minutes under the conditions of 50 V and an inter-electrode distance of 10 cm, The negatively charged resin paint 2 contained in the electrodeposition liquid 3 was electrodeposited on the surface of the conductive release layer 14 to a thickness of 3 μm. When the resin paint 2 is electrodeposited on the conductive peeling layer 14, its width is regulated by the side surface of the insulating photoresist 13, so the electrodeposited resin paint 4 has good width accuracy and does not cause defects such as pinholes. Electrodeposited instead. After the electrodeposition step, the electrodeposition substrate 1 is pulled up from the electrodeposition liquid 3, thoroughly washed with pure water, dried, and a glass pattern forming substrate 5 is brought into contact with the electrodeposition resin paint 4. When a voltage of +5000 V was applied from the back side, the electrodeposited resin paint 4 was peeled off from the conductive release layer 14, transferred to the surface of the patterned substrate 5, and adhered thereto.

[Embodiment 2] In this embodiment, ITO is formed as a conductive layer 12 on one side of a flat glass substrate 11, and a conductive peeling layer 14 is formed on the entire surface of the conductive layer 12.
00 was coated with 10 wt % of a photopolymerization initiator, Michaelasian ketone. In this case, in order to impart conductivity to the conductive release layer 14, these resins have a thickness of 0.3 am.
It was applied to a film thickness of . The reason why an acrylic monomer can be used as a conductive release layer is that when the acrylic monomer is irradiated with ultraviolet rays or electron beams, it starts to polymerize, and when the polymerization is completed, it completely loses its initial viscosity. The electrodepositing substrate 1 having the above structure is coated with an insoluble resin coating 2 (for example, C).
I Anionic electrodeposition solution 3 (liquid temperature 25%) neutralized with ammonia water containing 1611t% of dispersed acrylic copolymer consisting of maleic acid, butyl acrylate, and hydroxymethacrylate colored blue by blue pigment NO.15 ℃) and connect the conductive layer 12 to the positive electrode.
When electrodeposition was performed for 2 minutes at a distance of 10 cm between the 00V1 electrodes, the negatively charged resin paint 2 contained in the electrodeposition solution 3 was deposited on the surface of the conductive peeling layer 14 to a thickness of 3 μm. I arrived. In this case, as in Example 1, the width of the electrodeposited resin paint 4 was regulated by the side surfaces of the insulating photoresist 13, so it was electrodeposited with good precision and without defects such as pinholes. . After the electrodeposition substrate 1 is lifted from the electrodeposition liquid 3, washed and dried, the electrodeposition resin paint 4 is electrodeposited on the surface of the conductive release layer 14.
Then, an adhesive (Toagosei ■M
The surface coated with I100) to a thickness of 0.5I is placed in contact with the surface coated with UV light (30 m J) from the glass substrate 11 side.
/cJ), the acrylic monomer starts to polymerize as described above and becomes easy to peel off from the conductive layer 12, so the electrodeposited resin paint 4 easily peels off from the conductive release layer 14 and leaves the patterned substrate 5. I was able to transfer it to. After that, apply one layer of adhesive on the surface of the patterned substrate 5.
It was cured by heating at 80° C. for 1 hour. It should be noted that the present invention is not limited to the above-mentioned embodiments, and the equipment used can be changed as appropriate. For example, the glass substrate 11 can be replaced with a film sheet, and if the conductive layer 12 has sufficient strength, the glass substrate 11 can be omitted, or an appropriate metal plate can be used instead of the glass substrate 11. It is also possible to
However, in such a case, it is preferable to cover the back surface of the conductive layer 12 with an insulating material). Further, the resist to be formed remaining on the surface of the conductive layer 12 may be a positive photoresist or a negative photoresist, and an arbitrary resin film may be formed by means such as dry etching. The pattern drawing method is not limited either. In addition to the embodiments, the conductive release layer 14 may also be formed by using silicone resin, fat, mineral oil, etc. as a base material and adding an appropriate amount of conductive substance such as carbon, copper powder, aluminum powder, etc. It is possible. As the resin paint 2, it does not matter whether it is charged positively or negatively when dissolved or dispersed in the electrodeposition liquid 3, as it can be electrodeposited by appropriately selecting the polarity of the conductive layer 12. It is also possible to use it by coloring it with pigments or dyes in order to impart a desired color. Resin paints 2 that can be used for this purpose include alkyd resin, styrene resin, Evoquin resin, phenol resin, melamine resin, etc., as well as acrylic acid, methacrylic acid, maleic acid, maleic anhydride, fumaric acid, and trimesic acid. An arbitrary pigment may be dispersed in a resin obtained by addition polymerization of an organic acid such as. By the way, after forming the electrodeposited plum fat paint 4 on the exposed part of the conductive layer 12, the photoresist is coated over the entire surface again, and the photoresist 13 that was initially formed may be removed or left.)
, a pattern is drawn on the photoresist, and a second type of resin paint colored in another color is electrodeposited on a desired position of the conductive layer 12 except for the electrodeposited resin paint 4 to form a two-color filter, or the electrodeposition is performed three times. It is also possible to repeat the process to form a so-called RGB three primary color filter.

【Effect of the invention】

As explained above, the method for forming a fine pattern according to the present invention involves forming an insulating resist in a pattern on a conductive layer to form a substrate for electrodeposition, and then using the substrate for electrodeposition by electrodeposition containing a resin paint. A fine pattern characterized by electrodepositing a resin paint on exposed parts of a conductive layer by immersing it in a liquid, and then transferring the electrodeposited resin paint to a pattern-forming substrate placed in contact with or in close proximity to the electrodeposited resin paint. With this formation method, the resin paint can be electrodeposited thickly with high precision and high efficiency between the insulating resists left in the desired pattern. Therefore, by transferring this electrodeposited resin paint onto a substrate, a pattern with high density can be formed accurately and with high efficiency even if the image line width is about 5 to 10 μm.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram of the electrodeposition substrate, FIG. 2 is an explanatory diagram of the electrodeposition process, and FIG. 3 is an explanatory diagram of the process of transferring the electrodeposition resin paint from the electrodeposition coating substrate to the pattern forming substrate. DESCRIPTION OF SYMBOLS 1... Substrate for electrodeposition, 11... Glass substrate, 12... Conductive layer, 13... Resist, 14... Conductive release layer, 2... Resin paint, 3... Electrodeposition liquid, 4...electrodeposition resin paint, S...pattern forming substrate.

Claims (1)

[Claims] An electrodeposition substrate is prepared by forming an insulating resist in a pattern on the conductive layer, and the electrodeposition substrate is immersed in an electrodeposition solution containing a resin paint to electrodeposit the resin paint on the exposed parts of the conductive layer. A method for forming a fine pattern, which comprises transferring the electrodeposition resin paint to a pattern forming substrate placed in contact with or in close proximity to the electrodeposition resin paint.