JPH0498864U - - Google Patents
Info
- Publication number
- JPH0498864U JPH0498864U JP845291U JP845291U JPH0498864U JP H0498864 U JPH0498864 U JP H0498864U JP 845291 U JP845291 U JP 845291U JP 845291 U JP845291 U JP 845291U JP H0498864 U JPH0498864 U JP H0498864U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP845291U JPH0498864U (en) | 1991-01-31 | 1991-01-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP845291U JPH0498864U (en) | 1991-01-31 | 1991-01-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0498864U true JPH0498864U (en) | 1992-08-26 |
Family
ID=31740810
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP845291U Pending JPH0498864U (en) | 1991-01-31 | 1991-01-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0498864U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8691632B1 (en) | 2002-11-08 | 2014-04-08 | Amkor Technology, Inc. | Wafer level package and fabrication method |
| US9159672B1 (en) | 2010-08-02 | 2015-10-13 | Amkor Technology, Inc. | Through via connected backside embedded circuit features structure and method |
| US9324614B1 (en) | 2010-04-06 | 2016-04-26 | Amkor Technology, Inc. | Through via nub reveal method and structure |
| US9431323B1 (en) | 2011-11-29 | 2016-08-30 | Amkor Technology, Inc. | Conductive pad on protruding through electrode |
-
1991
- 1991-01-31 JP JP845291U patent/JPH0498864U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8691632B1 (en) | 2002-11-08 | 2014-04-08 | Amkor Technology, Inc. | Wafer level package and fabrication method |
| US9406645B1 (en) | 2002-11-08 | 2016-08-02 | Amkor Technology, Inc. | Wafer level package and fabrication method |
| US9324614B1 (en) | 2010-04-06 | 2016-04-26 | Amkor Technology, Inc. | Through via nub reveal method and structure |
| US9159672B1 (en) | 2010-08-02 | 2015-10-13 | Amkor Technology, Inc. | Through via connected backside embedded circuit features structure and method |
| US9431323B1 (en) | 2011-11-29 | 2016-08-30 | Amkor Technology, Inc. | Conductive pad on protruding through electrode |