JPH0497597A - Guide structure of electronic circuit package in shelf - Google Patents

Abstract

PURPOSE:To receive electronic circuit packages different in thickness by constituting a guide rail out of the first sidewall, which becomes the datum plane, and the second sidewall capable of elastic deformation. CONSTITUTION:A guide rail 17, which extends in the depth direction of a shelf is made between the sidewall 13 of a crosspiece 12 and the sidewall 16 of a metal fitting 15. The distance between the sidewalls 13 and 16 is set a little larger than the thickness of the one, which is the thinnest among the electronic packages 5 to be stored, and when storing a package 5 thicker than this, with the insertion of the package the sidewall 16 is elastically deformed outward, with the margin of the crosspiece 12 as a fulcrum, and increases the distance to the sidewall 13 to receives it. At that time, by the elastic force of the sidewall 16, the package is pressed toward the sidewall 16, and the package is introduced into a shelf with the sidewall 13 as a datum plane. In this way, it becomes possible to store a plural its of kinds of electronic circuit packages different in thickness in the same shelf using the guide rail of the same constitution.

Description

[Detailed Description of the Invention] [Summary] When a large number of electronic circuit packages are mounted in parallel on the shelf of an electronic device, a small number of standardized structures are used to guide each package to the depths of the shelf. The purpose is to provide a guide structure that allows electronic circuit packages of different thicknesses to be mounted on the same shelf using parts made of aluminum. One of the edges of the elongated remaining area extending in the depth direction between the openings is bent to form a first side wall that stands upright on the inside of the shelf, and a metal fitting extending in the depth direction having a substantially L-shaped cross section is formed. , a second side wall is fixed along the first side wall so that its bottom surface overlaps with the bottom surface of the remaining area, and a second side wall that is elastically displaceable in the width direction is formed by the raised web portion of the metal fitting; A groove formed between the shelf and the second side wall facing the shelf is configured to receive electronic circuit pancakes having different thicknesses and introduce them into the shelf.

[Industrial application field]

The present invention relates to a structure for guiding each electronic circuit package to the depths of the shelf when a large number of electronic circuit package are mounted in parallel on the shelf of an electronic device.

[Conventional technology]

In an electronic device, as shown in FIG. 4, a backboard 3 with a large number of connectors 2 arranged in parallel is fixed at the back of a box-shaped shelf 1, and electronics are connected in the depth direction from an opening 4 on the front side of the shelf 10. The circuit package 5 is inserted and the connector 6 fixed to the rear edge of each electronic circuit package 5 is fitted into the connector 2 on the backboard side.

BACKGROUND OF THE INVENTION Recent electronic devices have become more densely packaged in order to improve processing speed and downsize the device itself, and the amount of wiring in the electronic circuit packages that make up these devices has also become enormous. In order to cope with this, there is a trend towards multi-layered electronic circuit package, and the thickness of the board is increasing. On the other hand, in contrast to this, electronic circuit packages with a small amount of wiring have a tendency to reduce the number of layers and reduce the board thickness, thereby reducing the size and weight of the electronic device as a whole. For this reason, there is an increasing possibility that a plurality of types of electronic circuit packages having different board thicknesses are mixedly mounted on the same shelf.

In such a case, the problem is how to properly fit the connector on the electronic circuit pancase to the connector on the backboard side. In the case of conventional shelves where the electronic circuit packages were all the same thickness, the connectors on the bankboard example were spaced at regular intervals.

On the other hand, on both the bottom plate and the top plate of the shelf, guide rails are prepared as separate parts at the same intervals as the installation intervals of the connectors on the backboard side, and have a certain groove width to prevent the electronic circuit package from wobbling. was fixed. Therefore, if the electronic circuit package was inserted into the shelf along this guide rail, the connector on the electronic circuit package side and the connector on the backboard side would naturally match, allowing for easy fitting. However, when electronic circuit packages of various thicknesses are mixed, this conventional method cannot be used.

In order to solve these problems, for example, as shown in FIG.
b, and an electronic circuit package 5 adapted to this groove width.
a and 5b into the stack rails 3a and 3b, respectively, or, as shown in FIG. The guide rail 3C is installed in alignment with the position of the connector 2 on the backboard side, and all electronic circuit packages of different thicknesses are inserted into this guide rail 3C.

[Problem to be solved by the invention]

In the case of the method shown in FIG. 5, the guide rails 3a are
, 3b, etc., and the assembly work becomes complicated.

In addition, in the case of the method shown in Figure 6, only one type of guide rail is required, so fewer types of parts are needed.
When a thin electronic circuit package is introduced, there is a drawback that the looseness becomes large and it is difficult to fit it with a connector on the bank board side.

The present invention solves the problems of the prior art and provides a guide rail structure that allows electronic circuit packages of different thicknesses to be mounted on the same shelf using a small number of standardized parts. purpose.

[Means to solve the problem]

The purpose of this is to provide the bottom plate and/or the top plate of the shelf with a first side wall that is not displaced and serves as a reference surface, and a second side wall that is elastically displaceable with respect to the first side wall. A guide structure for an electronic circuit package, characterized in that electronic circuit packages of different thickness are received in a guide rail formed by a groove between the guide rails and introduced into a shelf, and
A first side wall that stands upright inside the shelf is formed by bending one of both edges of the elongated remaining area extending in the depth direction between the plurality of ventilation openings provided in parallel on the bottom plate and/or the top plate of the shelf. a metal fitting extending in the depth direction having a substantially L-shaped cross section is fixed along the first side wall so that its bottom surface overlaps the bottom surface of the remaining area, and a web portion of the metal fitting that rises A second side wall that is elastically displaceable in the width direction is formed, and electronic circuit packages having different thicknesses are received in a groove formed between the first side wall and a second side wall facing the first side wall and introduced into the shelf. This is achieved by a guide structure of an electronic circuit package characterized by the following.

[For production]

When installing electronic circuit packages inside the shelf,
A corner of the package is inserted between the first and second side walls. Then, the second side wall is displaced outward in accordance with the thickness of the package, and presses and clamps the package with the first side wall with a moderate elastic force, so that the package can be pushed along the first side wall to the back of the shelf. It can be pushed in smoothly. Since the connector on the backboard side is positioned with respect to the first side wall, which is not displaced, the connector attached to the electronic circuit package is reliably engaged therewith, and a good electrical connection is obtained.

Hereinafter, the present invention will be explained in more detail based on preferred embodiments shown in the drawings.

〔Example〕

FIG. 1 shows a perspective view of the guide rail of the present invention installed integrally with the bottom plate of the shelf. Correspondingly, guide rails having the same structure are provided on the top plate side, and these guide rails work together to guide and hold the upper and lower edges of the electronic circuit package.

A plurality of rectangular ventilation openings 11 for cooling the heat generated by electronic components mounted on the electronic circuit package are provided in parallel on the bottom plate 10 of the sheet metal type via crosspieces 12 of a predetermined width extending in the depth direction. It is being

During this processing, one edge of the foregoing 12 is bent upward to form an upright first side wall 13 having a certain height. The tip thereof is bent obliquely toward the ventilation opening 11 to form a tapered portion 14 .

Corresponding to the other edge of the part 12, there is also an elongated metal fitting 1 made of an elastic thin plate and having an approximately L-shaped cross section.
Prepare 5. The length and width of this metal fitting 15 are set to correspond to the length and width of the aforementioned metal fitting 12.

This metal fitting 15 is positioned such that its bottom surface overlaps the bottom surface of the crosspiece 12, and its side wall 16 (hereinafter referred to as the second side wall) stands up from the other edge of the crosspiece 12, and the bottom surfaces of the metal fitting 15 are positioned by spot welding, etc. It is fixed to the crosspiece 12 by means. As a result, a guide rail 17 extending in the depth direction of the shelf 1 is formed between the first (!I!l wall 13, which is a part of the crosspiece 12), and the second side wall 16 of the metal fitting 15. The state is shown in Figure 2.

The distance d between the first side wall 13 and the second side wall 16 is set to be slightly larger than the thickness t of the thinnest one of the electronic circuit packages 5 scheduled to be accommodated.
), this can be easily accommodated.

When accommodating an electronic circuit package 5 thicker than this,
As the electronic circuit package is inserted, the second side wall 16 elastically deforms outward using the edge of the crosspiece 12 as a fulcrum, increasing the distance from the first side wall 13 to accommodate it, as shown in FIG. 2(b). . At this time, the electronic circuit package is pressed toward the first side wall 16 by the elastic force of the second side wall 16, and the electronic circuit package is introduced into the shelf using the second side wall 13 as a reference plane.

In this way, it is possible to accommodate a plurality of types of electronic circuit packages having different thicknesses in the same shelf using guide rails having the same configuration.

Another embodiment of the invention is shown in FIG. According to this, since the bent portion 18 is provided on the bottom surface of the metal fitting 15 constituting the second side wall 16, there is an advantage that the second side wall 16 can be easily elastically deformed.

In the above example, the first side wall and the second side wall are constructed as separate members, but it is also possible to obtain them by molding them integrally.

Further, the material used is not limited to metal, and strong elastic plastics and the like can also be used.

〔Effect of the invention〕

As described in detail above, according to the present invention, the guide rail is configured by the first side wall serving as a reference surface and the elastically deformable second side wall. automatically adjusted accordingly. This allows electronic circuit packages of different thicknesses to be accommodated.

Also, in that case, the electronic circuit package is introduced into the shelf along the first side wall that does not displace.
It can be correctly fitted to the backboard side connector installed with the side wall as a reference.

[BRIEF DESCRIPTION OF THE DRAWINGS] Fig. 1 is a perspective view showing an example of the basic configuration of the guide structure of the present invention, and Fig. 2 (a) is a cross section of the guide structure of the present invention when accommodating a thin electronic circuit package. 2(b) is a cross-sectional view of the guide structure of the present invention when accommodating a thick electronic circuit package, FIG. 3 is a cross-sectional view showing another example of the guide structure of the present invention, and FIG. 5 and 6 are plan views showing the guide rail structure of a conventional shelf. ■ 1... Shelf 3... Backboard 10... Bottom plate 11... - Ventilation opening 12... - Crosspiece 13... First side wall 14... - Tapered portion 15... Metal fittings 16... -Second side wall 17...-Guide rail 18...Bending portion Guide of the present invention*! FIG. 3 is a cross-sectional view showing another example of the guide structure of the present invention. FIG. 4 is a perspective view showing an example of the guide structure of the present invention. A plan view showing the conventional shelf guide rail structure. Figure 6 is a plan view showing the guide rail structure of the shelf.

Claims (3)

[Claims] 1. The bottom plate and/or top plate (10) of the shelf includes a first side wall (13) that does not displace and serves as a reference surface, and a first side wall (13) that serves as a reference surface.
A second side wall (16) that is elastically displaceable is provided facing the second side wall (16), and electronic circuits with different thicknesses are mounted on the guide rail (17) formed by the groove between the both side walls (13, 16). A guide structure for an electronic circuit package, characterized in that the package (5) is received and introduced into a shelf. 2. The inner side of the shelf is folded by bending one of both edges of the elongated remaining area (12) extending in the depth direction between the plurality of ventilation openings (11) provided in parallel on the bottom plate and/or the top plate (10) of the shelf. A metal fitting (15) extending in the depth direction and having a substantially L-shaped cross section is formed with a first side wall (13) that stands upright on the side wall (13). a second side wall (16) fixed along the first side wall (13) and elastically displaceable in the width direction by a web portion of the raised metal fitting (15);
The first side wall (13) and the second side wall (16) facing the first side wall (13).
) A guide structure for an electronic circuit package, characterized in that electronic circuit packages (5) having different thicknesses are received in grooves formed between the guide structure and the electronic circuit packages (5) and are introduced into the shelf. 3. The guide structure according to claim 1 or 2, wherein the connector (2) on the backboard (3) side of the rear surface of the shelf is positioned with reference to the first side wall (13).