JPH0497352U - - Google Patents
Info
- Publication number
- JPH0497352U JPH0497352U JP3632091U JP3632091U JPH0497352U JP H0497352 U JPH0497352 U JP H0497352U JP 3632091 U JP3632091 U JP 3632091U JP 3632091 U JP3632091 U JP 3632091U JP H0497352 U JPH0497352 U JP H0497352U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991036320U JP2559991Y2 (ja) | 1990-07-26 | 1991-05-22 | 樹脂モールド型半導体装置 |
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8047490 | 1990-07-26 | ||
| JP2-80474 | 1990-08-21 | ||
| JP2-87607 | 1990-08-21 | ||
| JP8760290 | 1990-08-21 | ||
| JP2-87602 | 1990-08-21 | ||
| JP8760790 | 1990-08-21 | ||
| JP1991036320U JP2559991Y2 (ja) | 1990-07-26 | 1991-05-22 | 樹脂モールド型半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0497352U true JPH0497352U (da) | 1992-08-24 |
| JP2559991Y2 JP2559991Y2 (ja) | 1998-01-19 |
Family
ID=31950705
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1991036320U Expired - Lifetime JP2559991Y2 (ja) | 1990-07-26 | 1991-05-22 | 樹脂モールド型半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2559991Y2 (da) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51122561U (da) * | 1975-03-28 | 1976-10-04 | ||
| JPS6144450A (ja) * | 1984-08-08 | 1986-03-04 | Nec Kansai Ltd | 絶縁型半導体装置の製造方法 |
| JPS62131447U (da) * | 1986-02-12 | 1987-08-19 | ||
| JPS62138452U (da) * | 1986-02-25 | 1987-09-01 |
-
1991
- 1991-05-22 JP JP1991036320U patent/JP2559991Y2/ja not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51122561U (da) * | 1975-03-28 | 1976-10-04 | ||
| JPS6144450A (ja) * | 1984-08-08 | 1986-03-04 | Nec Kansai Ltd | 絶縁型半導体装置の製造方法 |
| JPS62131447U (da) * | 1986-02-12 | 1987-08-19 | ||
| JPS62138452U (da) * | 1986-02-25 | 1987-09-01 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2559991Y2 (ja) | 1998-01-19 |