JPH0497341U - - Google Patents
Info
- Publication number
- JPH0497341U JPH0497341U JP1991005074U JP507491U JPH0497341U JP H0497341 U JPH0497341 U JP H0497341U JP 1991005074 U JP1991005074 U JP 1991005074U JP 507491 U JP507491 U JP 507491U JP H0497341 U JPH0497341 U JP H0497341U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991005074U JP2513472Y2 (en) | 1991-01-17 | 1991-01-17 | Wire-bonding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991005074U JP2513472Y2 (en) | 1991-01-17 | 1991-01-17 | Wire-bonding equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0497341U true JPH0497341U (en) | 1992-08-24 |
| JP2513472Y2 JP2513472Y2 (en) | 1996-10-09 |
Family
ID=31735348
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1991005074U Expired - Lifetime JP2513472Y2 (en) | 1991-01-17 | 1991-01-17 | Wire-bonding equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2513472Y2 (en) |
-
1991
- 1991-01-17 JP JP1991005074U patent/JP2513472Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2513472Y2 (en) | 1996-10-09 |