JPH0496855U - - Google Patents
Info
- Publication number
- JPH0496855U JPH0496855U JP1991008590U JP859091U JPH0496855U JP H0496855 U JPH0496855 U JP H0496855U JP 1991008590 U JP1991008590 U JP 1991008590U JP 859091 U JP859091 U JP 859091U JP H0496855 U JPH0496855 U JP H0496855U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991008590U JPH0496855U (ja) | 1991-01-29 | 1991-01-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1991008590U JPH0496855U (ja) | 1991-01-29 | 1991-01-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0496855U true JPH0496855U (ja) | 1992-08-21 |
Family
ID=31741034
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1991008590U Pending JPH0496855U (ja) | 1991-01-29 | 1991-01-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0496855U (ja) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01151252A (ja) * | 1987-12-08 | 1989-06-14 | Shinko Electric Ind Co Ltd | セラミックパッケージとその製造方法 |
-
1991
- 1991-01-29 JP JP1991008590U patent/JPH0496855U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01151252A (ja) * | 1987-12-08 | 1989-06-14 | Shinko Electric Ind Co Ltd | セラミックパッケージとその製造方法 |