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Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filedfiledCritical
Priority to JP40714590UpriorityCriticalpatent/JPH0493827U/ja
Publication of JPH0493827UpublicationCriticalpatent/JPH0493827U/ja
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
H01L2224/732—Location after the connecting process
H01L2224/73201—Location after the connecting process on the same surface
H01L2224/73203—Bump and layer connectors
H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
Landscapes
Wire Bonding
(AREA)
Devices For Indicating Variable Information By Combining Individual Elements
(AREA)