JPH0493252A - Manufacture of laminated film - Google Patents
Manufacture of laminated filmInfo
- Publication number
- JPH0493252A JPH0493252A JP2211009A JP21100990A JPH0493252A JP H0493252 A JPH0493252 A JP H0493252A JP 2211009 A JP2211009 A JP 2211009A JP 21100990 A JP21100990 A JP 21100990A JP H0493252 A JPH0493252 A JP H0493252A
- Authority
- JP
- Japan
- Prior art keywords
- film
- polystyrene resin
- polystyrene
- psp
- resin layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 5
- 229920005990 polystyrene resin Polymers 0.000 claims abstract description 35
- 229920005989 resin Polymers 0.000 claims abstract description 23
- 239000011347 resin Substances 0.000 claims abstract description 23
- 238000003851 corona treatment Methods 0.000 claims abstract description 14
- 238000010030 laminating Methods 0.000 claims abstract description 11
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 13
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 13
- 239000004794 expanded polystyrene Substances 0.000 claims description 8
- 229920006327 polystyrene foam Polymers 0.000 claims description 5
- 239000000463 material Substances 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 6
- 239000004793 Polystyrene Substances 0.000 abstract description 5
- 229920002223 polystyrene Polymers 0.000 abstract description 5
- 101001086872 Hydrogenobacter thermophilus (strain DSM 6534 / IAM 12695 / TK-6) Phosphoserine phosphatase 1 Proteins 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 33
- 229920006248 expandable polystyrene Polymers 0.000 description 14
- 239000004698 Polyethylene Substances 0.000 description 9
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
- UFRKOOWSQGXVKV-UHFFFAOYSA-N ethene;ethenol Chemical compound C=C.OC=C UFRKOOWSQGXVKV-UHFFFAOYSA-N 0.000 description 3
- 239000004715 ethylene vinyl alcohol Substances 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 238000005187 foaming Methods 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000002253 acid Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 238000002788 crimping Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 229920006163 vinyl copolymer Polymers 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、ポリスチレン系発泡シートとポリスチレン樹
脂以外のフィルムとを良好に貼り合せて積層フィルムを
製造する方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a method for manufacturing a laminated film by laminating a polystyrene foam sheet and a film other than polystyrene resin in a good manner.
（従来の技術および発明が解決しようとする課題）従来
より、ポリスチレン系発泡シート（以下ｒｐｓｐＪとい
う。）は外観に優れ成形性もよいことから、食品包装用
のトレー等に使用されている。しかしＰＳＰはカスバリ
ヤー性に乏しいため、内容物を空気中の酸素等から遮断
するためにカスバリヤー性の良い材料をＰＳＰに積層す
る必要かある。ところが、ＰＳＰはポリスチレン樹脂以
外のフィルムとの接着性か悪く、発泡しているために均
一な接着面が得られず、また比較的耐熱性に乏しいこと
から、ガスバリヤ−性の良い材料との貼り合せが困敷で
あるという問題があった。(Prior Art and Problems to be Solved by the Invention) Polystyrene foam sheets (hereinafter referred to as rpspJ) have been used for food packaging trays and the like because of their excellent appearance and good moldability. However, since PSP has poor gas barrier properties, it is necessary to laminate a material with good gas barrier properties on the PSP in order to block the contents from oxygen in the air. However, PSP has poor adhesion with films other than polystyrene resin, and because it is foamed, a uniform adhesion surface cannot be obtained, and it has relatively poor heat resistance, making it difficult to adhere to materials with good gas barrier properties. There was a problem that it was difficult to match.
（課題を解決するための手段）
本発明は、上記課題を解決せんとしたものであり、その
要旨はＰＳＰとポリスチレン樹脂以外のフィルムを積層
するにあたり、予め前記ポリスチレン樹脂以外のフィル
ムの積層面にコロナ放電処理を施し、前記ＰＳＰ及びポ
リスチレン樹脂以外のフィルムの両者を、非発泡ポリス
チレン系樹脂層又はエチレン酢酸ビニル共重合体層を介
在させて、熱圧着することを特徴とする積層フィルムの
製造方法である。(Means for Solving the Problems) The present invention aims to solve the above problems, and its gist is that when laminating PSP and a film other than polystyrene resin, the laminated surface of the film other than polystyrene resin is A method for producing a laminated film, which comprises subjecting the PSP and a film other than polystyrene resin to a corona discharge treatment and thermocompression-bonding them with a non-foamed polystyrene resin layer or an ethylene-vinyl acetate copolymer layer interposed therebetween. It is.
ＰＳＰは、発泡倍率が２〜１５倍、厚さ０．５〜２１１
１Ｉのものが好適に用いられる。PSP has a foaming ratio of 2 to 15 times and a thickness of 0.5 to 211.
1I is preferably used.
ポリスチレン樹脂以外のフィルムとしては、ＰＳＰとの
積層面にポリスチレン樹脂以外の樹脂層が配された単層
または積層フィルムであればよく、たとえばポリエチレ
ン（以下ｒＰＥ」という。）／接着ｌ／エチレンー＃−
酸ビニル共重合体ケン化物（以下ｒＥｖ叶、という。）
／ポリアミド（以下ｒＰＡ」という。）／接着層／エチ
レンｉ！ｒ！：酸ビニル共重合体（以下「ＥｖＡ」とい
う。） 、ＥＶＯＩ（／ＰＡ／接着層／ＰＥあるいはＥ
ＶＡ／ＥＶＯＨ／ＥＶＡ等が挙げられる。The film other than polystyrene resin may be a single-layer or laminated film in which a layer of resin other than polystyrene resin is arranged on the laminated surface with PSP, such as polyethylene (hereinafter referred to as "rPE")/adhesive l/ethylene-#-.
Saponified acid vinyl copolymer (hereinafter referred to as rEvKo)
/Polyamide (hereinafter referred to as "rPA")/Adhesive layer/Ethylene i! r! : Acid vinyl copolymer (hereinafter referred to as "EvA"), EVOI (/PA/adhesive layer/PE or E
Examples include VA/EVOH/EVA.
ＰＳＰに非発泡ポリスチレン系樹脂層を設けるなめには
、単に両者を加熱圧着するだけで同種の樹脂同士である
ので強力に積層することができる。To provide a non-expanded polystyrene resin layer on PSP, simply heat and press the two together, and since they are of the same type of resin, they can be laminated strongly.
非発泡ポリスチレン系樹脂層としては汎用ポリスチレン
のほか、スチレン−ブタジェン共重合体からなるフィル
ムが好適に用いられる。この非発泡ポリスチレン系樹脂
層はポリスチレン！！Ｉ脂以外のフィルムがポリオレフ
ィン系樹脂の場合に特に好ましく使用できる。As the non-foamed polystyrene resin layer, in addition to general-purpose polystyrene, a film made of styrene-butadiene copolymer is suitably used. This non-foamed polystyrene resin layer is polystyrene! ! It can be particularly preferably used when the film other than I-based resin is a polyolefin resin.
ＰＳＰにＥＶＡ層を設けるには、ＰｓＰに対して、ＥＶ
Ａ樹脂を極く薄く押出ラミネートするこ以外のフィルム
として、ＥＶＯＨまなはＰＡを使用す゛る場合に接着し
易く好ましい。To provide an EVA layer in PSP, EV
When using EVOH or PA as a film other than extremely thin extrusion lamination of A resin, it is preferable because it is easy to adhere.
ポリスチレン樹脂以外のフィルムの積層面には予めコロ
ナ放電処理を施して、表面を荒らしておく。The laminated surface of the film other than polystyrene resin is previously subjected to corona discharge treatment to roughen the surface.
一方、ＰＳＰ側に配した非発泡ポリスチレン系樹脂層ま
たは、ＥＶＡ層にもコロナ放電処理を施しておくとさら
に接着強度が向上する。On the other hand, if the non-expanded polystyrene resin layer or EVA layer disposed on the PSP side is also subjected to corona discharge treatment, the adhesive strength will be further improved.
そして、このｐｓｐｍの非発泡ポリスチレン系樹脂層ま
たはＥＶＡ層に対し、前記ポリスチレン樹脂以外のフィ
ルムの積層面を向がい合わせた状態で、熱圧着ロールで
挟圧し熱圧着することにより、どの層も強固に接着した
積層フィルムが得られる。Then, with the laminated surface of the non-polystyrene resin film facing the pspm non-foamed polystyrene resin layer or EVA layer, all layers are firmly bonded by pressing and thermocompression bonding with thermocompression rolls. A laminated film is obtained which is adhered to.
第１図に本発明を実施するための装置の一例を概略正面
図で示す。この例では、ＰＳＰｌ側に非発泡ポリスチレ
ン系樹脂層２を貼り合せる方法において、ＰＳＰｌと非
発泡ポリスチレン系樹脂層２と、Ｅ４層面３１を有する
ポリスチレン樹脂以外のフィルム３とを並列して繰り出
し、非発泡ポリスチレン系樹脂層２とポリスチレン樹脂
以外のフィルム３との間に、コロナ放電処理用の電極４
を配置しておき、ポリスチレン樹脂以外のフィルムの積
層面３１のみまなは、ボッスチレン樹脂以外のフィルム
の積層面と非発泡ポリスチレン系樹脂層面との双方をコ
ロナ処理する。その後熱圧着ロール５によって前記３層
１，２．３を一度に熱圧着することによりいずれの面も
良好に接着され、得られた積層フィルムは巻き取られる
。この時、ポリスチレン樹脂以外のフィルム側のロール
のみを加熱しておくことによりＰＳＰの熱変形が小さい
。FIG. 1 shows a schematic front view of an example of an apparatus for implementing the present invention. In this example, in the method of bonding the non-foamed polystyrene resin layer 2 to the PSPL side, PSPL, the non-foamed polystyrene resin layer 2, and a film 3 other than polystyrene resin having an E4 layer surface 31 are fed out in parallel, An electrode 4 for corona discharge treatment is provided between the foamed polystyrene resin layer 2 and the film 3 other than polystyrene resin.
are arranged, and both the laminated surface 31 of the film other than the polystyrene resin and the non-foamed polystyrene resin layer surface are subjected to corona treatment. Thereafter, the three layers 1, 2.3 are thermocompression bonded at once using a thermocompression roll 5, so that both surfaces are well bonded, and the obtained laminated film is wound up. At this time, thermal deformation of the PSP is reduced by heating only the roll on the film side other than the polystyrene resin.
なお本発明方法においては、ＰＳＰＩに非発泡ポリスチ
レン系樹脂層２を貼り合せる工程と、非発泡ポリスチレ
ン系樹脂層とポリスチレン樹脂以外のフィルムを貼り合
せる工程とは任意の順序で行うことかできる。In the method of the present invention, the step of laminating the non-foamed polystyrene resin layer 2 to PSPI and the step of laminating the non-foamed polystyrene resin layer and a film other than polystyrene resin can be performed in any order.
以下、実施例を挙げてさらに詳しく説明する。Hereinafter, the present invention will be explained in more detail with reference to examples.
（実施例１）
第１図に示すように、厚さＯ，１ｌｌｎＩＩｌ、 発
泡倍率１０倍のＰＳＰＩと厚さ０．０３ｕの非発泡ポリ
スチレン系樹脂層２および低密度Ｐ Ｅ ／ ＥＶＯＩ
（／低密度ＰＥ／ＥＶＡの構成を有するポリスチレン樹
脂以外のフィルム３との３層を並行に繰り出す。(Example 1) As shown in FIG. 1, PSPI with a thickness of O, 1llnIIl and a foaming ratio of 10 times, a non-foamed polystyrene resin layer 2 with a thickness of 0.03u, and a low density PE/EVOI
(Three layers of film 3 other than polystyrene resin having a structure of /low density PE/EVA are fed out in parallel.
次いで、非発泡ポリスチレン系ｔ！ｊ脂層２側は１１ｋ
Ｗのコロナ放電処理用の電［２４、低密度ＰＥ面（積層
面３１）には１．８ｋ１４のコロナ放電処理用の電極４
を設置しておき、第１表に示すように、非発泡ポリスチ
レン系樹脂層２と低密度ＰＥ面（１１層面３１）の両方
、片面のみコロナ処理するか、まったくコロナ処理しな
い場合について、積層フィルム３例の圧着ロール５の温
度を１４５°Ｃ１１６０°Ｃとし、圧着スピードを２０
ｍ／分、１０ｍ／分として圧着して積層フィルムを得た
。この積層フィルムのＰＳＰＩと非発泡ポリスチレン系
樹脂層２の剥離強度はＰＳＰＩの破断強度よりも大きか
つな。一方弁発泡ポリスチレン系樹脂層２と低密度ＰＥ
面３との剥離強度は第１表に示すように、１０ｇ／１５
１ｉ幅〜５００ｇ／１５１ｎ幅であった。Next, non-expanded polystyrene t! j Fat layer 2 side is 11k
Electrode for corona discharge treatment of W [24, electrode 4 for corona discharge treatment of 1.8k14 on the low density PE surface (laminated surface 31)
As shown in Table 1, if both the non-expanded polystyrene resin layer 2 and the low-density PE surface (11-layer surface 31) are corona treated, only one side, or not corona treated at all, the laminated film The temperature of the crimping roll 5 in the three cases was 145°C and 1160°C, and the crimping speed was 20°C.
m/min and 10 m/min to obtain a laminated film. The peel strength between PSPI and the non-foamed polystyrene resin layer 2 of this laminated film is greater than the breaking strength of PSPI. One-valve foamed polystyrene resin layer 2 and low density PE
The peel strength with surface 3 is 10g/15 as shown in Table 1.
The width was 1i to 500g/151n.
なお、本発明中で剥離強度の測定は、２０℃で１８０’
Ｃ薊離、剥離速度２００ ＩＩｎ／分で行なった。In addition, in the present invention, the peel strength is measured at 180' at 20°C.
C peeling was carried out at a peeling rate of 200 IIn/min.
第１表から明らかなように、非発泡ポリスチレン系樹脂
層と低密度ＰＥ面の両方にコロナ処理した実験Ｎ０．１
は剥離強度は５００ｇ／１５ｕ＋幅と大きかった。また
、低密度ＰＥ面のみコロナ処理した実験恥２は１００
ｇ／ １５１ｎｌｖｉト実ＨＥＩＲ界ノ強度を保った。As is clear from Table 1, experiment No. 1 in which both the non-expanded polystyrene resin layer and the low-density PE surface were subjected to corona treatment.
The peel strength was as high as 500g/15u+width. In addition, Experiment Shame 2, in which only the low-density PE surface was treated with corona, was 100
g/151 nlvi to maintain the actual HEIR field strength.
これに対して、非発泡ポリスチレン系樹脂層のみコロナ
処理したもの、コロナ処理を全くしなかったものは３０
〜１０ｇ／１５１ｎ幅と極めて低い強度を示しな。一方
、実験ＮＯ，５のようにコロナ処理しないものについて
剥離強度を３００ｇ／１５１ｎ幅まで上げようとすると
、圧着スピードを半分に落しかつ、圧着ロール温度を
１６０″Ｃに上げなくてはならず、ＰＳＰ変形や収縮が
生じ、極めて効率の悪いものであった。On the other hand, when only the non-expanded polystyrene resin layer was corona treated or when no corona treatment was applied at all, the
It shows an extremely low strength of ~10g/151n width. On the other hand, when trying to increase the peel strength to 300g/151n width for a sample without corona treatment, as in Experiment No. 5, the pressure bonding speed was halved and the pressure roll temperature was increased.
The temperature had to be raised to 160''C, which caused PSP deformation and contraction, which was extremely inefficient.
（実施例２）
厚さ０．７５ｎｎ、発泡倍率１０倍のＰＳＰに、ＥＶＡ
を１８０℃で押出ラミネートして０．０１５ｉｎの層を
設けこのＥＶＡ面を１．１Ｖでコロナ処理しな。(Example 2) EVA was added to PSP with a thickness of 0.75 nn and a foaming ratio of 10 times.
Extrusion lamination was performed at 180°C to provide a 0.015 inch layer and the EVA surface was corona treated at 1.1V.
ＰＳＰとＥＶＡ面の剥離強度は、ＰＳＰの破断強度より
大きかった。The peel strength between PSP and EVA surface was greater than the breaking strength of PSP.
一方、ＥＶＯＨ／ Ｐ Ａ ／接着樹脂／ＥＶＡノＥＶ
ＯＩ（面に２．０ｋＷでコロナ処理して、前記ＥＶＡ面
に重ね合せ、圧着ロール温度１４０°Ｃ２圧着スピード
１５ｍ／分、圧着圧力１０ｋｇ／ Ｃ１１で圧着したと
ころ、ＥＶＡ面とＥν叶面との剥離強度は、４５０ｇ／
１５１１１１幅と十分なものであった。On the other hand, EVOH/PA/adhesive resin/EVA
The OI (surface was corona treated with 2.0 kW, superimposed on the EVA surface, and crimped at a pressure roll temperature of 140°C, pressure speed of 15 m/min, and pressure of 10 kg/C11. Peel strength is 450g/
The width was 151,111 mm, which was sufficient.
（発明の効果）
以上説明したように本発明はＰＳＰとポリスチレン樹脂
以外のフィルムを積層するにあたり、予め前記ポリスチ
レン樹脂以外のフィルムの積層面にコロナ放電処理を施
し、前記ＰＳＰ及びポリスチレン樹脂以外のフィルムの
両者を、非発泡ポリスチレン系樹脂層又はＥＶＡ層を介
在させて、熱圧着することを特徴とする積層フィルムの
製造方法であるから、ＰＳＰとポリスチレン樹脂以外の
フィルムとを効率よく確実に貼り合せて積層フィルムを
製造することができる。(Effects of the Invention) As explained above, in the present invention, when laminating PSP and a film other than polystyrene resin, corona discharge treatment is applied in advance to the laminated surface of the film other than polystyrene resin, and the film other than the PSP and polystyrene resin is laminated. This method of producing a laminated film is characterized by thermocompression-bonding both of them with a non-expanded polystyrene resin layer or an EVA layer interposed therebetween, so it is possible to efficiently and reliably bond PSP and a film other than polystyrene resin. A laminated film can be manufactured using this method.
第１図は本発明を実施するための装置を示す概略正面図
である。
１、・・ポリスチレン系発泡シート、２・・・非発泡ポ
リスチレン系樹脂層、３・・・ポリスチレン樹脂以外の
フィルム、３１・・・積層面。FIG. 1 is a schematic front view showing an apparatus for carrying out the present invention. 1. Polystyrene foam sheet, 2. Non-foamed polystyrene resin layer, 3. Film other than polystyrene resin, 31. Laminated surface.
Claims (1)
ィルムを積層するにあたり、予め前記ポリスチレン樹脂
以外のフィルムの積層面にコロナ放電処理を施し、前記
ポリスチレン系発泡シート及びポリスチレン樹脂以外の
フィルムの両者を、非発泡ポリスチレン系樹脂層又はエ
チレン酢酸ビニル共重合体層を介在させて、熱圧着する
ことを特徴とする積層フィルムの製造方法。When laminating a polystyrene foam sheet and a film other than polystyrene resin, corona discharge treatment is applied to the laminated surface of the non-polystyrene resin film in advance, and both the polystyrene foam sheet and the non-polystyrene resin film are laminated with non-expanded polystyrene. 1. A method for producing a laminated film, which comprises thermocompression bonding with a resin layer or an ethylene-vinyl acetate copolymer layer interposed therebetween.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2211009A JP2978543B2 (en) | 1990-08-09 | 1990-08-09 | Manufacturing method of laminated film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2211009A JP2978543B2 (en) | 1990-08-09 | 1990-08-09 | Manufacturing method of laminated film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0493252A true JPH0493252A (en) | 1992-03-26 |
| JP2978543B2 JP2978543B2 (en) | 1999-11-15 |
Family
ID=16598826
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2211009A Expired - Fee Related JP2978543B2 (en) | 1990-08-09 | 1990-08-09 | Manufacturing method of laminated film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2978543B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6893529B1 (en) * | 1993-10-05 | 2005-05-17 | Tetra Laval Holdings & Finance S.A. | Method of producing a laminate material |
-
1990
- 1990-08-09 JP JP2211009A patent/JP2978543B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6893529B1 (en) * | 1993-10-05 | 2005-05-17 | Tetra Laval Holdings & Finance S.A. | Method of producing a laminate material |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2978543B2 (en) | 1999-11-15 |
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