JPH0493172U - - Google Patents
Info
- Publication number
- JPH0493172U JPH0493172U JP40165490U JP40165490U JPH0493172U JP H0493172 U JPH0493172 U JP H0493172U JP 40165490 U JP40165490 U JP 40165490U JP 40165490 U JP40165490 U JP 40165490U JP H0493172 U JPH0493172 U JP H0493172U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP40165490U JPH0493172U (OSRAM) | 1990-12-25 | 1990-12-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP40165490U JPH0493172U (OSRAM) | 1990-12-25 | 1990-12-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0493172U true JPH0493172U (OSRAM) | 1992-08-13 |
Family
ID=31879704
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP40165490U Pending JPH0493172U (OSRAM) | 1990-12-25 | 1990-12-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0493172U (OSRAM) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002067638A1 (en) * | 2001-02-19 | 2002-08-29 | Sony Corporation | Printed wiring board, multilayer printed wiring board, and, method of detecting foreign matter and voids in inner layer of multilayer printed wiring board |
-
1990
- 1990-12-25 JP JP40165490U patent/JPH0493172U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002067638A1 (en) * | 2001-02-19 | 2002-08-29 | Sony Corporation | Printed wiring board, multilayer printed wiring board, and, method of detecting foreign matter and voids in inner layer of multilayer printed wiring board |