JPH0493145U - - Google Patents
Info
- Publication number
- JPH0493145U JPH0493145U JP1990401600U JP40160090U JPH0493145U JP H0493145 U JPH0493145 U JP H0493145U JP 1990401600 U JP1990401600 U JP 1990401600U JP 40160090 U JP40160090 U JP 40160090U JP H0493145 U JPH0493145 U JP H0493145U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
- H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
- H10W72/07254—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting changes in dispositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W72/241—Dispositions, e.g. layouts
- H10W72/242—Dispositions, e.g. layouts relative to the surface, e.g. recessed, protruding
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990401600U JPH0493145U (https=) | 1990-12-25 | 1990-12-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990401600U JPH0493145U (https=) | 1990-12-25 | 1990-12-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0493145U true JPH0493145U (https=) | 1992-08-13 |
Family
ID=31879659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990401600U Pending JPH0493145U (https=) | 1990-12-25 | 1990-12-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0493145U (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1531492A3 (en) * | 2003-11-14 | 2018-07-11 | Stanley Electric Co., Ltd. | Semiconductor device and its manufacturing method capable of preventing short circuit of electrodes when semiconductor device is mounted on sub-mount substrate |
-
1990
- 1990-12-25 JP JP1990401600U patent/JPH0493145U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1531492A3 (en) * | 2003-11-14 | 2018-07-11 | Stanley Electric Co., Ltd. | Semiconductor device and its manufacturing method capable of preventing short circuit of electrodes when semiconductor device is mounted on sub-mount substrate |