JPH0492491A - Hole drilling process for printed circuit board - Google Patents
Hole drilling process for printed circuit boardInfo
- Publication number
- JPH0492491A JPH0492491A JP20823690A JP20823690A JPH0492491A JP H0492491 A JPH0492491 A JP H0492491A JP 20823690 A JP20823690 A JP 20823690A JP 20823690 A JP20823690 A JP 20823690A JP H0492491 A JPH0492491 A JP H0492491A
- Authority
- JP
- Japan
- Prior art keywords
- soluble lubricant
- water
- polyoxyethylene sorbitan
- sheet
- monoester
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 21
- 238000005553 drilling Methods 0.000 title claims abstract description 11
- 239000000314 lubricant Substances 0.000 claims abstract description 34
- 229920001214 Polysorbate 60 Polymers 0.000 claims abstract description 16
- 229910052751 metal Inorganic materials 0.000 claims abstract description 16
- 239000002184 metal Substances 0.000 claims abstract description 16
- 239000011888 foil Substances 0.000 claims abstract description 14
- 239000002985 plastic film Substances 0.000 claims description 5
- 239000012212 insulator Substances 0.000 claims description 4
- 239000010410 layer Substances 0.000 abstract description 16
- 239000007864 aqueous solution Substances 0.000 abstract description 7
- 235000014113 dietary fatty acids Nutrition 0.000 abstract description 4
- 239000000194 fatty acid Substances 0.000 abstract description 4
- 229930195729 fatty acid Natural products 0.000 abstract description 4
- 239000004033 plastic Substances 0.000 abstract description 4
- 239000011248 coating agent Substances 0.000 abstract description 3
- 238000000576 coating method Methods 0.000 abstract description 3
- 150000004665 fatty acids Chemical class 0.000 abstract description 3
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 abstract description 2
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 abstract description 2
- 239000011247 coating layer Substances 0.000 abstract description 2
- 239000004745 nonwoven fabric Substances 0.000 abstract description 2
- 230000000379 polymerizing effect Effects 0.000 abstract description 2
- 239000000600 sorbitol Substances 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 description 6
- 239000000203 mixture Substances 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 2
- 239000001818 polyoxyethylene sorbitan monostearate Substances 0.000 description 2
- 235000010989 polyoxyethylene sorbitan monostearate Nutrition 0.000 description 2
- JNYAEWCLZODPBN-JGWLITMVSA-N (2r,3r,4s)-2-[(1r)-1,2-dihydroxyethyl]oxolane-3,4-diol Chemical compound OC[C@@H](O)[C@H]1OC[C@H](O)[C@H]1O JNYAEWCLZODPBN-JGWLITMVSA-N 0.000 description 1
- WCOXQTXVACYMLM-UHFFFAOYSA-N 2,3-bis(12-hydroxyoctadecanoyloxy)propyl 12-hydroxyoctadecanoate Chemical compound CCCCCCC(O)CCCCCCCCCCC(=O)OCC(OC(=O)CCCCCCCCCCC(O)CCCCCC)COC(=O)CCCCCCCCCCC(O)CCCCCC WCOXQTXVACYMLM-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 241000047703 Nonion Species 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229920000604 Polyethylene Glycol 200 Polymers 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- -1 fatty acid ester Chemical class 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 125000001475 halogen functional group Chemical group 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229940057400 trihydroxystearin Drugs 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、両面或いは多層プリント配線板のスルーホー
ル孔明は方法に関し、水溶性滑剤を配置することにより
、孔明は時のドリルビットの発熱を抑え、高品質で高能
率の孔明けをするものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for drilling through-holes in double-sided or multilayer printed wiring boards. It allows for high-quality, high-efficiency drilling.
絶縁体に金属箔が接着された積層体に表裏導通用のドリ
ル孔明けを該積層体の片面或いは両面に水溶性滑剤を配
置して行う方法が、ＵＳＰ−４，７８１，４９５及びＵ
ＳＰ−４，９２９，３７０！： 開示すし、コレラノ方
法は固形の水溶性滑剤であるジエチレングリコールやジ
プロピレングリコールなどのグリコール類と脂肪酸など
の剛性ワックス、非イオン系界面活性剤との混合物を紙
などに含浸したシートを用いることが開示されている。A method of drilling holes for front and back conduction in a laminate in which metal foil is bonded to an insulator by placing a water-soluble lubricant on one or both sides of the laminate is described in USP-4,781,495 and U.
SP-4,929,370! The Collellano method uses a sheet of paper or the like impregnated with a mixture of solid water-soluble lubricants such as glycols such as diethylene glycol and dipropylene glycol, rigid waxes such as fatty acids, and nonionic surfactants. Disclosed.
ところが、これらの方法は、ドリル発熱防止効果が不十
分であったり、多孔質シートへのこれら混合物の含浸性
が劣ったり、さらにベタツキがあったりする欠点があっ
た。However, these methods have drawbacks such as insufficient effectiveness in preventing drill heat generation, poor impregnation of the mixture into the porous sheet, and stickiness.
本発明は、上記の課題を解決すべ（鋭意検討した結果、
水溶性滑剤としてポリオキシエチレンソルビタンのモノ
エステルを用いる方法を見出し、これに基づいて完成し
たものである。The present invention aims to solve the above problems (as a result of intensive studies,
They discovered a method of using monoester of polyoxyethylene sorbitan as a water-soluble lubricant, and completed the process based on this method.
すなわち、本発明は、絶縁体に金属箔が接着された積層
体に表裏導通用のドリル孔明けを該積層体の片面或いは
両面に水溶性滑剤を配置して行う方法において、該水溶
性滑剤がポリオキシエチレンソルビタンのモノエステル
であることを特徴とするプリント配線板の孔明は加工法
であり、該水溶性滑剤が、多孔質シートに該ポリオキシ
エチレンソルビタンのモノエステルを配置した水溶性滑
剤シートとして配置するものであること、プラスチック
スシート又は金属箔に該ポリオキシエチレンソルビタン
のモノエステルを塗布した水溶性滑剤シートとして配置
するものであること、又はプラスチックスシート又は金
属箔で該ポリオキシエチレンソルビタンのモノエステル
を挟んでなる水溶性滑剤シートとして配置するものであ
ることであり、更に該水溶性滑剤が、該積層体に該ポリ
オキシエチレンソルビタンのモノエステルを塗布するこ
とにより配置するものであることを特徴とするプリント
配線板の孔明は加工法である。That is, the present invention provides a method in which a water-soluble lubricant is placed on one or both sides of the laminate to drill holes for front and back conduction in a laminate in which a metal foil is bonded to an insulator. A method of manufacturing a printed wiring board characterized in that the water-soluble lubricant is a monoester of polyoxyethylene sorbitan, and the water-soluble lubricant is a water-soluble lubricant sheet in which the monoester of polyoxyethylene sorbitan is arranged on a porous sheet. The polyoxyethylene sorbitan monoester is applied to a plastic sheet or metal foil as a water-soluble lubricant sheet, or the polyoxyethylene sorbitan monoester is applied to a plastic sheet or metal foil. The polyoxyethylene sorbitan monoester is arranged as a water-soluble lubricant sheet sandwiching a sorbitan monoester, and the water-soluble lubricant is arranged by coating the polyoxyethylene sorbitan monoester on the laminate. Printed wiring board drilling is a processing method that is characterized by:
以下、本発明の構成について説明する。The configuration of the present invention will be explained below.
本発明の絶縁体に金属箔が接着された積層体とは、金属
箔と電気絶縁体とが一体化された種々のプリント配線板
用として使用される材料であり、金属箔張積層板、内層
にプリント配線網を有する多層積層板、内層にプリント
配線網を有する多層金属箔張積層板、金属箔張プラスチ
ックスフィルムなどが例示されるものである。The laminate of the present invention in which a metal foil is bonded to an insulator is a material used for various printed wiring boards in which a metal foil and an electrical insulator are integrated, and includes metal foil-clad laminates, inner layers, etc. Examples include a multilayer laminate having a printed wiring network on the inner layer, a multilayer metal foil-clad laminate having a printed wiring network on the inner layer, and a metal foil-clad plastic film.
本発明の水溶性滑剤であるポリオキシエチレンソルビタ
ンのモノエステルは、一般に、ソルビトールに酸化エチ
レンを付加重合した後、脂肪酸を用いてエステル化した
ものであり、具体的にはポリオキシエチレンソルビタン
モノステアレート、などが例示される。The monoester of polyoxyethylene sorbitan, which is the water-soluble lubricant of the present invention, is generally obtained by addition polymerizing ethylene oxide to sorbitol and then esterifying it with a fatty acid. Examples include rate, etc.
本発明の水溶性滑剤を本発明の積層体に配置する方法と
しては、単に水溶性滑剤を適宜、加熱或いは加温又は水
溶液として厚さ０．０１〜３ ｍｍの塗布層を形成する
方法；紙、プラスチックス不織布、多孔質金属シートな
どに適宜、加熱或いは加温又は水溶液として水溶性滑剤
を含浸してなる厚さ０゜Ｏ１〜３ ＋ｏｍのシートとし
て配置する方法；プラスチックスや金属箔の少なくとも
片面に適宜、加熱或いは加温又は水溶液として厚さ０．
０１〜３ ｍｍの水溶性滑剤層を塗布したシートとして
塗布面側を重ねる方法；更に、プラスチックスや金属箔
で適宜、加熱或いは加温又は水溶液として厚さ０．０１
〜３肛の水溶性滑剤層を形成しはさんでなるサンドイッ
チシートとして重ねる方法などである。積層体への配置
は片面の場合、ドリルビット側となるように本発明の水
溶性滑剤を配置することが好適であり、また、両面とな
るように配置することはより好ましい。Methods for disposing the water-soluble lubricant of the present invention in the laminate of the present invention include simply heating or heating the water-soluble lubricant as appropriate, or forming an aqueous solution to form a coating layer with a thickness of 0.01 to 3 mm; , a method of disposing a plastic nonwoven fabric, a porous metal sheet, etc., as a sheet with a thickness of 0°O1 to 3 + om, which is prepared by heating or heating or impregnating a water-soluble lubricant as an aqueous solution; One side is heated or heated as appropriate, or as an aqueous solution to a thickness of 0.
A method of stacking the coated side as a sheet coated with a water-soluble lubricant layer of 0.01 to 3 mm; further, heating or heating as appropriate with plastic or metal foil, or as an aqueous solution with a thickness of 0.01 mm.
The method includes forming a layer of water-soluble lubricant of ~3 layers and stacking them as a sandwich sheet. When the laminate is placed on one side, it is preferable to place the water-soluble lubricant of the present invention on the drill bit side, and more preferably on both sides.
以下、実施例等により本発明を説明する。 The present invention will be explained below with reference to Examples.
実施例１
厚さ０．１５ｍｍの紙に、ポリオキシエチレンソルビタ
ンモノステアレート（ノニオン５Ｔ−２２１：日本油脂
社製）を１００°Ｃで溶融し、塗布量か６０重量％とな
るようにロールを用いて塗布した後、室温まで冷却して
、水溶性滑剤シート（以下１本シートｌ」と記す）を得
た。Example 1 Polyoxyethylene sorbitan monostearate (Nonion 5T-221: manufactured by NOF Corporation) was melted at 100°C on paper with a thickness of 0.15 mm, and a roll was applied so that the coating amount was 60% by weight. After applying the mixture, it was cooled to room temperature to obtain a water-soluble lubricant sheet (hereinafter referred to as "one sheet 1").
厚さ１．６ｎ＋ｍのガラスエポキシ６層板（内層４層、
内層銅箔厚さ７０虜、外層厚さ１８−銅箔）を用いドリ
ル孔明は加工を下記条件にて行った。1.6n+m thick 6-layer glass epoxy board (4 inner layers,
Drilling was carried out under the following conditions using an inner layer of copper foil (thickness: 70 mm, outer layer thickness: 18 mm).
〔配置〕 （ドリルビット側より）
本シートのベタツキの有無、スミャー発生状況を試験し
た結果を第１表に示した。[Arrangement] (From the drill bit side) Table 1 shows the results of testing the presence or absence of stickiness of this sheet and the occurrence of smear.
また、孔明は後、６層板を４Ｎ −ＨＣＩに２５℃で５
分間浸漬した後、ハローの発生状況を評価した。In addition, Komei later added a 6-layer plate to 4N-HCI at 25°C.
After being immersed for a minute, the occurrence of halo was evaluated.
その結果を第２表に示した。The results are shown in Table 2.
比較例１
本シートを用いず、 １００Ｊ、ｒｓアルミニウム箔／
６層板／６層板／紙フェノール積層板の配置とするほか
は実施例１と同様にした結果を第１．２表に示した。Comparative Example 1 Without using this sheet, 100J, rs aluminum foil/
The results are shown in Table 1.2 in the same manner as in Example 1 except that the arrangement was 6-layer board/6-layer board/paper phenol laminate.
比較例２
ＰＥＧ ２００ トリヒドロキシステアリン６７０−を
５４℃とし、これにジプロピレングリコール２５０ｍ１
を加え混合した後、６２℃とし、脂肪酸エステル（商品
名； Ｐａｒｉｃｉｎ １３． Ｃａｓ Ｃｅｎ社製
） ８０ｍ１を添加混合した。Comparative Example 2 PEG 200 Trihydroxystearin 670- was heated to 54°C, and dipropylene glycol 250ml was added to it.
After adding and mixing, the mixture was heated to 62° C., and 80 ml of fatty acid ester (trade name: Paricin 13, manufactured by Cas Cen) was added and mixed.
上記で得た混合物を６０℃で厚さ０．１５ｍｎ＋の紙に
６０重量％となるようにロールを用いて塗布した後、室
温まで冷却して、水溶性滑剤シート（以下「シート２」
と記す）を得た。The mixture obtained above was coated on a 0.15 mm thick paper using a roll at 60°C to a concentration of 60% by weight, then cooled to room temperature and coated with a water-soluble lubricant sheet (hereinafter referred to as "Sheet 2").
) was obtained.
このシート２を本シート１の代わりに用いる他は実施例
１と全く同様とした結果を第１．２表に示した。Table 1.2 shows the results obtained in exactly the same manner as in Example 1 except that this sheet 2 was used in place of this sheet 1.
実施例２
ポリオキシエチレンソルビタンモノステアレートを１０
０℃で溶融し、厚さ１００ｐのアルミニウム箔の片面に
厚さ０．３ｍｍとなるように塗布した後、その塗布面上
に厚さ１００ｍのアルミニウム箔を乗せ、室温まで冷却
して、水溶性滑剤シート（以下「本シート２」と記す）
を得た。Example 2 10% polyoxyethylene sorbitan monostearate
After melting at 0℃ and applying it to a thickness of 0.3 mm on one side of a 100p thick aluminum foil, place a 100m thick aluminum foil on the coated surface, cool it to room temperature, and apply water-soluble Lubricant sheet (hereinafter referred to as "this sheet 2")
I got it.
配置をドリルビット側より、本シート２／６層板／６層
板／紙フェノール積層板とする他は実施例１と同様とし
た結果を第１．２表に示した。The results are shown in Table 1.2, except that the arrangement was the same as in Example 1, except that from the drill bit side, the sheets were 2/6-layer board/6-layer board/paper-phenol laminate.
第１表
ドリル孔明は性を改良されるものであり、工業的な実用
性は極めて高いものである。The drill holes shown in Table 1 have improved properties and have extremely high industrial practicality.
特許出願人 三菱瓦斯化学株式会社 代理人（９０７０）弁理士 小環 貞文第２表 〔発明の作用および効果〕Patent applicant: Mitsubishi Gas Chemical Co., Ltd. Agent (9070) Patent Attorney Sadafumi Kokan Table 2 [Operation and effects of the invention]
Claims (1)
ドリル孔明けを該積層体の片面或いは両面に水溶性滑剤
を配置して行う方法において、該水溶性滑剤がポリオキ
シエチレンソルビタンのモノエステルであることを特徴
とするプリント配線板の孔明け加工法。 ２ 該水溶性滑剤が、多孔質シートに該ポリオキシエチ
レンソルビタンのモノエステルを配置した水溶性滑剤シ
ートとして配置するものである請求項１記載のプリント
配線板の孔明け加工法。 ３ 該水溶性滑剤が、プラスチックスシート又は金属箔
に該ポリオキシエチレンソルビタンのモノエステルを塗
布した水溶性滑剤シートとして配置するものである請求
項１記載のプリント配線板の孔明け加工法。 ４ 該水溶性滑剤が、プラスチックスシート又は金属箔
で該ポリオキシエチレンソルビタンのモノエステルを挟
んでなる水溶性滑剤シートとして配置するものである請
求項１記載のプリント配線板の孔明け加工法。 ５ 該水溶性滑剤が、該積層体に該ポリオキシエチレン
ソルビタンのモノエステルを塗布することにより配置す
るものである請求項１記載のプリント配線板の孔明け加
工法。[Scope of Claims] 1. A method for drilling holes for front and back conduction in a laminate in which metal foil is bonded to an insulator by disposing a water-soluble lubricant on one or both sides of the laminate, the method comprising: A method for forming holes in a printed wiring board, characterized in that is a monoester of polyoxyethylene sorbitan. 2. The method for drilling holes in a printed wiring board according to claim 1, wherein the water-soluble lubricant is arranged as a water-soluble lubricant sheet in which the polyoxyethylene sorbitan monoester is arranged on a porous sheet. 3. The method for drilling holes in a printed wiring board according to claim 1, wherein the water-soluble lubricant is arranged as a water-soluble lubricant sheet in which the polyoxyethylene sorbitan monoester is applied to a plastic sheet or metal foil. 4. The method of perforating a printed wiring board according to claim 1, wherein the water-soluble lubricant is arranged as a water-soluble lubricant sheet comprising the polyoxyethylene sorbitan monoester sandwiched between plastic sheets or metal foils. 5. The method for drilling holes in a printed wiring board according to claim 1, wherein the water-soluble lubricant is placed by applying the monoester of polyoxyethylene sorbitan to the laminate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20823690A JP2855821B2 (en) | 1990-08-08 | 1990-08-08 | Drilling method for printed wiring boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20823690A JP2855821B2 (en) | 1990-08-08 | 1990-08-08 | Drilling method for printed wiring boards |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0492491A true JPH0492491A (en) | 1992-03-25 |
| JP2855821B2 JP2855821B2 (en) | 1999-02-10 |
Family
ID=16552910
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20823690A Expired - Lifetime JP2855821B2 (en) | 1990-08-08 | 1990-08-08 | Drilling method for printed wiring boards |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2855821B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5507603A (en) * | 1993-08-05 | 1996-04-16 | Dai-Ichi Kogyo Seiyaku Co., Ltd. | Method for drilling thru-holes on a lamination substrate and a sheet used therein |
| US6794022B2 (en) | 2000-04-06 | 2004-09-21 | Kabushiki Kaisha Kobe Seiko Sho | Metal plate coated with lubricating resin and drilling processing method of printed wiring board use thereof |
-
1990
- 1990-08-08 JP JP20823690A patent/JP2855821B2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5507603A (en) * | 1993-08-05 | 1996-04-16 | Dai-Ichi Kogyo Seiyaku Co., Ltd. | Method for drilling thru-holes on a lamination substrate and a sheet used therein |
| US6794022B2 (en) | 2000-04-06 | 2004-09-21 | Kabushiki Kaisha Kobe Seiko Sho | Metal plate coated with lubricating resin and drilling processing method of printed wiring board use thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2855821B2 (en) | 1999-02-10 |
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