JPH0491498A - Method of power supply - Google Patents

Abstract

PURPOSE:To make it possible to prevent a drop in potential and reduce the size by connecting a potential side of a power source unit with a first inlet terminal laid on a mother board, the ground side of the power source unit with a second input terminal laid on a cooling plate, and supplying the ground side by way of the cooling plate. CONSTITUTION:A first input terminal 8 is laid on a mother board 5 held by a frame 15. A potential side B of a supply bar 10A from a power supply unit 6 is connected with the first input terminal 8 by means of a connector 11D while a second input terminal 9 is laid on a cooling plate 2 of a cooling module 1. A ground side G of the supply bar 10A is connected with the second input terminal 9 by means of a connector C. The potential side B of the power source unit 6 is connected with a power source pad 5A of the mother board 5 while the ground side is connected with a ground pad 5B of the mother board by way of the cooling plate 2.

Description

[Detailed Description of the Invention] [Summary] A power supply method configured such that power is supplied from a power supply unit to a cooling module equipped with a cooling plate through the cooling plate, by shortening the power supply path. A cooling module having a cooling plate for cooling electronic components mounted on a board, and a motherboard mounting a plurality of the cooling modules, with the aim of preventing a drop in electric potential and downsizing by simplifying the configuration. a power supply unit that supplies power to the cooling module, the potential side of the power supply unit is connected to a first input terminal provided on the motherboard, and the ground side of the power supply unit is connected to the cooling plate. The cooling plate is connected to a second input terminal provided thereon, and the ground side is configured to be supplied through the cooling plate.

[Industrial application field]

The present invention relates to a power supply method in which power is supplied from a power supply unit to a cooling module equipped with a cooling plate through the cooling plate.

In recent years, as electronic components such as semiconductor devices have become more densely packaged and faster, the boards on which these electronic components are mounted are fixed to cooling plates through which coolant is circulated to form cooling modules. ing.

Furthermore, when a plurality of such cooling modules are used to construct an electronic device such as a large computer main unit or a supercomputer, ECL-based theoretical circuit elements are often used as electronic components due to the demand for higher performance. - Boat fishing requires multiple voltages and large currents.

Therefore, when configuring such an electronic device, it is important to minimize the potential drop in the power supply path to each cooling module and to increase the mounting efficiency of the cooling module. Become.

[Conventional technology]

Conventionally, the configuration was as shown in the conventional explanatory diagram of FIG. 5. FIG. 5(a) is a plan view, and FIG. 5(b) is a side view.

As shown in FIG. 5(a), a plurality of cooling module supers 1 are mounted on a motherboard 5 stacked on a ground frame 13, and power is supplied to each cooling module 1 by a supply bar connected to a power supply unit 6. 10^ and IOB are stretched around the outer periphery of the motherboard 5.

In addition, as shown in (b) in the supply bars 1OA and IOH, a ground side G and a potential side B are formed as a pair by interposing an insulating material for each of different potentials, and the ground side G is connected to the ground frame 13 by the connector 11B, and the ground connection block 12
It is supplied to the ground pattern of the motherboard 5 via B.

On the other hand, the potential side B is connected to a power supply connection block 12A by a connector 11A, and is supplied to the power supply pattern of the motherboard 5 via the connection block 12A.

Further, the cooling module 1 mounted on the motherboard 5 is configured to cool the electronic components 4 mounted on the board 3 by means of a cooling plate 2 through which a coolant is circulated.
The contacts arranged in the main board 5 are installed by being inserted into and removed from the motherboard 5.

Therefore, the power supply pattern and the ground pattern of the motherboard 5 are each connected to the board 3 through contacts, and power is supplied from the power supply unit 6 to the electronic components 4 of each cooling plate 2.

[Problem to be solved by the invention]

However, in a configuration in which the ground side G of the power supply is connected by arranging such a ground frame 13, the ground side G is connected to the supply bars 1OA and IOB as a power supply path.
It is connected to the ground frame 13 from the ground frame 13, and further connected to the motherboard 5 from the ground frame 13 via the connection block 12B, so that it passes through many members.

Therefore, there has been a problem in that the potential decreases due to contact resistance between each member, especially when supplying a large current.

In addition, in such a configuration in which the supply bars 1OA and IOB are stretched along the outer periphery of the ground frame 13, mounting space is occupied by the supply bars 1OA and IOB, which causes problems such as poor mounting efficiency and increased external size. It had

Therefore, an object of the present invention is to prevent a drop in potential by shortening the power supply path, and to achieve miniaturization by simplifying the configuration.

[Means to solve the problem]

Figure 1 is an explanatory diagram of the principle of the invention of bookcase 1, and Figure 2 is an illustration of the principle of the invention of bookcase 2.
FIG. 2 is a diagram illustrating the principle of the invention.

As shown in FIG. 1, a cooling module 1 includes a cooling plate 2 for cooling electronic components 4 mounted on a board 3;
It includes a motherboard 5 on which a plurality of cooling modules 1 are mounted, and a power supply unit 6 that supplies power to the cooling modules 1. At the same time as connecting to the input terminal 8, the ground side G of the power supply unit 6 is connected to a second input terminal 9 disposed on the cooling plate 2, and the ground side G is supplied through the cooling plate 2. As shown in FIG. 2, a cooling module 1 having a cooling plate 2 for cooling electronic components 4 mounted on a board 3, a motherboard 5 on which a plurality of cooling modules I are mounted, and A power supply unit 7 supplies power to the cooling module 1, and a potential side B of the power supply unit 7 is connected to a first input terminal 8 disposed on the motherboard 5 by a shorting bar 7B, and the power supply unit 7 An electrode 7A on the ground side G provided on a predetermined surface of the unit 7 is locked so as to come into contact with the cooling plate 2, so that the ground side G is supplied through the cooling plate 2.

With this configuration, the above-mentioned problem is solved.

[Operation] That is, the motherboard 5 is provided with a first input terminal 8, the cooling plate 2 of the cooling module 1 is provided with a second input terminal 9, and the potential side B of the power supply unit 6 is provided with the first input terminal 8.
In this case, the ground side G is connected to the cooling plate 2, or the motherboard 5 is provided with a first input terminal 8, and the potential side B of the power supply unit 7 is connected to the first input terminal 8. is brought into contact with the cooling plate 2, and the ground side G is connected to the cooling plate 2.

Therefore, in either case, the ground side G is connected to the motherboard 5 via the cooling plate 2.

Therefore, with this configuration, compared to the case where connection is made via the conventional ground frame 13, it is possible to shorten the supply path, prevent a drop in potential, and further,
It is possible to achieve miniaturization by improving mounting efficiency.

〔Example〕

Hereinafter, the first invention and the invention of the book box 2 will be explained in detail with reference to FIGS. 3 and 4. FIG. 3 is a side view of an embodiment according to the first invention, and FIG. 3 is a side view of an embodiment according to the second invention. The same reference numerals indicate the same objects throughout the figures.

As shown in FIG. 3, a first input terminal 8 is arranged on the motherboard 5 held by the frame 15, and the potential side B of the supply bar 1OA from the power supply unit 6 is connected to the first input terminal 8. At the same time, a second input terminal 9 is arranged on the cooling plate 2 of the cooling module 1, and the ground side G of the supply bar 1OA is connected to the second input terminal 9 by the connection tool 110. 11C.

Therefore, the potential side B of the power supply unit 6 can be connected to the power supply pad lung of the motherboard 5, and the ground side G can be connected to the ground pad 5B of the motherboard 5 via the cooling plate 2. If the output potential is one potential, the path of the power supply is from the ground pad 5B to the motherboard 5 as shown by the arrow.
The contact 38 connects the substrate 3 through the inner thigh pattern of the
The electronic component 4 is connected to the power supply pad 5A via the substrate 3, the contacts 1-3A, and the inner thigh pattern of the motherboard 5.

In this case, if a shorting piece 3B is provided between the side surface of the board 3 and the cooling plate 2, the connection on the ground side G is made as shown by the arrow without connecting via the motherboard 5.
It is also possible to connect the cooling plate 2 directly to the substrate 3.

Therefore, by extending the supply bar 10^ from the power supply unit 6 and the IOB around the outer periphery of the motherboard 5, power can be supplied to each electronic component 4 mounted on the cooling module 1. I can do it.

In the case of FIG. 4, the power supply unit 7 is locked so that the electrode 7A of the power supply unit 7 is brought into contact with the cooling plate 2 of the cooling module 1, and the output terminal 7C of the power supply unit 7 is connected to the motherboard 5 by the shorting bar 7B. The first
It is configured to be connected to the input terminal 8 of the.

Further, the motherboard 5 is formed to be held by a frame 15.

Therefore, the potential side B of the power supply unit 7 can be connected to the power supply pad 58 of the motherboard 5, and the ground side G
is connected to the ground pad 5B of the motherboard 5 via the cooling plate 2. If the potential output from the power supply unit 7 is one potential, the path of the power supply is from the ground pad 5B as shown by the arrow. It is connected to the electronic component 4 mounted on the board 3 by the contact 3A through the inner thigh pattern of the motherboard 5, and is connected from the electronic component 4 to the power supply pad 5A via the board 3, the contact 3A, and the inner thigh pattern of the motherboard 5. It is formed so that

In this case, if the shorting piece 3B is provided between the side surface of the board 3 and the cooling plate 2, the connection on the ground side G will be made as shown by the arrow without connecting via the motherboard 5, as described above. It becomes possible to connect the cooling plate 2 directly to the substrate 3.

Therefore, by locking the power supply unit 7 to the cooling plate 2 without stretching the supply bars 1OA and 10B from the power supply unit 6 around the outer periphery of the motherboard 5 as described above, the cooling module 1 can be Power can be supplied to each mounted electronic component 4.

Furthermore, in such a configuration, the power supply unit 7 is brought into close contact with the cooling plate 2, and there is an advantage that the cooling plate 2 cools the electronic components 4 and the power supply unit 7 at the same time.

In this way, in both the configurations shown in FIG. 3 and FIG. In the case of , supply bar 1OA,
Connection by IOB becomes unnecessary.

〔Effect of the invention〕

As explained above, according to the present invention, by connecting the ground side G from the power supply unit via the cooling plate 2, it is possible to shorten the power supply path and simplify the configuration.

Therefore, compared to the conventional art, it is possible to prevent a drop in the potential of the power supplied from the power supply unit, and to achieve miniaturization due to improved mounting efficiency, which has great practical effects.

[Brief explanation of drawings]

FIG. 1 is an explanatory diagram of the principle of the invention of wood brush 1. FIG. 2 is an explanatory diagram of the principle of the invention of wood brush 2. FIG. 3 is a side view of an embodiment of the invention of the wood brush 1. FIG. 4 is a side view of an embodiment of the invention of the wood brush 2. FIG. 5 is an explanatory diagram of the conventional technology, in which (a) shows a front view and (b) shows a side view. In the figure, 1 is a cooling module, and 2 is a cooling plate. 3 is a board, 4 is an electronic component. 5 is the motherboard, 6 and 7 are the power supply units. 8 is the first input terminal, 9 is the second input terminal. 7A indicates an electrode, and 7B indicates a shorting bar.

Claims (1)

[Claims] [1] A cooling module (1) having a cooling plate (2) for cooling an electronic component (4) mounted on a substrate (3), and a plurality of cooling modules (1) mounted therein. The cooling module includes a motherboard (5) and a power supply unit (6) that supplies power to the cooling module (1), and the potential side (B) of the power supply unit (6) is disposed on the motherboard (5). At the same time, the ground side (G) of the power supply unit (6) is connected to the second input terminal (9) disposed on the cooling plate (2). A power supply method characterized in that the ground side (G) is supplied through the cooling plate (2). [2] A cooling module (1) having a cooling plate (2) that cools electronic components (4) mounted on a board (3), and a motherboard (5) on which a plurality of the cooling modules (1) are mounted; A power supply unit (7) that supplies power to the cooling module (1), and a potential side (B) of the power supply unit (7) is connected to the motherboard (5) by a shorting bar (7B). While connecting to the first input terminal (8), the ground side (G) electrode (7A) provided on a predetermined surface of the power supply unit (7) is locked so as to come into contact with the cooling plate (2). , the ground side (G) is connected to the cooling plate (
2) A power supply method characterized in that power is supplied via.