JPH049031Y2 - - Google Patents
Info
- Publication number
- JPH049031Y2 JPH049031Y2 JP1984087091U JP8709184U JPH049031Y2 JP H049031 Y2 JPH049031 Y2 JP H049031Y2 JP 1984087091 U JP1984087091 U JP 1984087091U JP 8709184 U JP8709184 U JP 8709184U JP H049031 Y2 JPH049031 Y2 JP H049031Y2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- support
- support rods
- spray device
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 57
- 239000007921 spray Substances 0.000 claims description 20
- 239000007788 liquid Substances 0.000 claims description 12
- 229920002120 photoresistant polymer Polymers 0.000 description 10
- 238000000034 method Methods 0.000 description 8
- 238000005530 etching Methods 0.000 description 6
- 239000010408 film Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 230000018109 developmental process Effects 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- XMPZTFVPEKAKFH-UHFFFAOYSA-P ceric ammonium nitrate Chemical compound [NH4+].[NH4+].[Ce+4].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O XMPZTFVPEKAKFH-UHFFFAOYSA-P 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical compound OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
Landscapes
- Coating Apparatus (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
本考案は、透光性ガラス板に遮光性薄膜を被着
したフオトマスク基板や、半導体基板に半導体酸
化物を被着したものにそれぞれフオトレジストを
塗布した後、そのフオトレジストを所定のパター
ンで露光されたこれ等基板のパターン形成工程に
おける現像工程、エツチング工程等に使用される
スプレー装置、特に、基板を設置する支持具を改
良したスプレー装置に関する。[Detailed description of the invention] [Industrial application field] The present invention applies photoresist to a photomask substrate in which a light-shielding thin film is coated on a transparent glass plate, and a semiconductor substrate in which a semiconductor oxide is coated. After coating the photoresist, the photoresist is exposed to light in a predetermined pattern. Spray equipment used in the development process, etching process, etc. in the pattern formation process of these substrates, especially spray equipment with improved supports for installing the substrate. Regarding.
従来のスプレー装置は、第１図に示すように、
基板１の各種サイズ（例えば、６，５，４及び３
インチ）に応じて、その４隅を支持する支持具２
を使用している。すなわち、この支持具２は、最
も大きい基板１の端面との当接面３とその底面と
の載置面４とをもつて、支持部を構成し、基板１
のサイズが小さくなるに従つて、当接面５と載置
面６、当接面７と載置面８及び当接面９と載置面
１０とからなる各支持部を階段状に深くするよう
に形成している。
The conventional spray device, as shown in Fig. 1,
Various sizes of the substrate 1 (e.g. 6, 5, 4 and 3
Supports 2 to support the four corners of the
are using. That is, this support 2 has a contact surface 3 that contacts the end surface of the largest substrate 1 and a mounting surface 4 that contacts the bottom surface thereof, and constitutes a support section, and supports the substrate 1.
As the size becomes smaller, each support portion consisting of the contact surface 5 and the mounting surface 6, the contact surface 7 and the mounting surface 8, and the contact surface 9 and the mounting surface 10 is deepened in a stepwise manner. It is formed like this.
一方、このスプレー装置は、モーターによつて
回転される回転軸１１により、連結具１２を介し
て支持具２と共に基板１を回転させた状態で、チ
ヤンバー１３の天井に設置された噴出孔１４から
現像液又はエツチング液等の噴出液１５を基板１
に向けて噴出する。その際、噴出液１５は、基板
１の静止時において、例えば、同図ｂに示すよう
に基板１の対角線方向に向かつて両弧により形成
された断面両凸レンズ形状の被噴出領域１６（被
噴出領域１６の中心は回転軸ｌと一致している）
内に分布しているので、基板１の回転により基板
１の全表面を均一に噴出するようになつている。 On the other hand, in this spray device, the substrate 1 is rotated together with the support 2 via the connector 12 by a rotary shaft 11 rotated by a motor, and the spray is ejected from an ejection hole 14 installed in the ceiling of the chamber 13. A jetting liquid 15 such as a developer or an etching liquid is applied to the substrate 1.
erupts towards. At this time, when the substrate 1 is stationary, the ejected liquid 15 is directed diagonally to the substrate 1 as shown in FIG. The center of region 16 coincides with rotation axis l)
Since the particles are distributed within the same area, the entire surface of the substrate 1 is uniformly ejected by rotating the substrate 1.
しかしながら、基板１のサイズを変えて、例え
ば最も小さな基板１′を設置した場合、設置位置
が高さ方向で異なるため、被噴出領域１６の中心
軸が元の中心軸ｌより△ｌだけずれてしまうこと
から、前述した噴出の均一性を歪めることにな
り、これを原因として、基板１′のパターン形成
工程において、均一な線幅のパターンを形成する
ことができなかつた。 However, when the size of the substrate 1 is changed and, for example, the smallest substrate 1' is installed, the installation position differs in the height direction, so the central axis of the ejected area 16 is shifted by Δl from the original central axis l. As a result, the uniformity of the ejection described above is distorted, and due to this, a pattern with a uniform line width cannot be formed in the pattern forming process of the substrate 1'.
本考案は、上記した欠点を除去するためになさ
れたものであり、基板のサイズが変わつても、そ
の表面に現像液やエツチング液等の噴出液を均一
に噴出させて、均一な線幅のパターンを形成する
ことができるスプレー装置を提供することを目的
とする。
The present invention was developed to eliminate the above-mentioned drawbacks, and even if the size of the substrate changes, it is possible to uniformly spray a jet of liquid such as a developer or etching liquid onto the surface of the substrate, thereby achieving a uniform line width. An object of the present invention is to provide a spray device capable of forming a pattern.
本考案のスプレー装置は、基板１７をチヤンバ
ー１３内の支持具１８に設置し、前記チヤンバー
１３に設けられた噴出孔１４から前記基板１７に
向けて噴出液１５を噴出するスプレー装置におい
て、
前記支持具１８は、
互いに交叉し、その中心が回転軸１１と一致す
る２本の支持棒１９，２０と、
この支持棒１９，２０の前記交叉方向における
前記基板１７の端面部分に当接する当接面２６と
該端面近傍の底面部分に載置する載置面２７とを
有して前記支持棒１９，２０に取付けられる４個
の固定台３０と
を備え、
前記支持棒１９，２０は、前記交叉する点を中
心にした一対の穴２１，２１，２２，２２，２
３，２３，２４，２４，２５，２５，２６，２
６，２７，２７，２８，２８が前記基板１７の各
種サイズに応じて複数個形成され、
前記一対の穴２１，２１，２２，２２，２３，
２３，２４，２４，２５，２５，２６，２６，２
７，２７，２８，２８にネジ２９を通して前記固
定台３０を支持棒１９，２０上の前記基板１７の
各種サイズに応じた位置に固定し、かつ、前記固
定台３０を、前記載置面２７がいずれの前記位置
においても実質的に同一平面となるように保持す
ることを特徴としている。ここで、基板とは透光
性ガラス板に遮光性薄膜を被着したフオトマスク
基板や、Si等半導体基板にSiO2等半導体酸化物
を被着した基板であり、通常、それぞれフオトレ
ジストを塗布した後、所定のパターンでそのフオ
トレジストが露光されたものが含まれる。噴出液
とは、現像工程で使用する場合はフオトレジスト
専用液、エツチング工程で使用する場合は所定の
エツチング液（例えば、硝酸第２セリウムアンモ
ン165ｇ＋過塩素酸50mlを純水で合計１とした
混合液）、洗浄工程で使用する場合は所定の洗浄
液（例えば、純水）であり、また、フオトレジス
トの塗布工程で使用する場合はフオトレジスト液
である。
The spray device of the present invention is a spray device in which a substrate 17 is installed on a support 18 in a chamber 13, and a jet liquid 15 is jetted toward the substrate 17 from a jet hole 14 provided in the chamber 13. The tool 18 includes two support rods 19 and 20 that intersect with each other and whose centers coincide with the rotation axis 11, and contact surfaces of the support rods 19 and 20 that abut against the end surface portions of the substrate 17 in the intersecting direction. 26 and a mounting surface 27 placed on the bottom surface near the end surface, and four fixed stands 30 are attached to the support rods 19, 20, and the support rods 19, 20 A pair of holes 21, 21, 22, 22, 2 centered on the point
3, 23, 24, 24, 25, 25, 26, 2
A plurality of holes 6, 27, 27, 28, 28 are formed according to various sizes of the substrate 17, and the pair of holes 21, 21, 22, 22, 23,
23, 24, 24, 25, 25, 26, 26, 2
7, 27, 28, 28 through screws 29 to fix the fixing base 30 at positions corresponding to the various sizes of the substrates 17 on the support rods 19, 20, and fixing the fixing base 30 on the mounting surface 27. are held in substantially the same plane at any of the positions. Here, the substrate refers to a photomask substrate made of a light-transmitting glass plate coated with a light-shielding thin film, or a substrate made of a semiconductor substrate such as Si coated with a semiconductor oxide such as SiO2 , and each is usually coated with a photoresist. The photoresist is then exposed in a predetermined pattern. The ejected liquid is a dedicated photoresist solution when used in the developing process, and a specified etching solution when used in the etching process (for example, a mixture of 165 g of ceric ammonium nitrate + 50 ml of perchloric acid with pure water) When used in the cleaning process, it is a predetermined cleaning liquid (for example, pure water), and when used in the photoresist coating process, it is a photoresist liquid.
次に、フオトマスク基板の現像工程において使
用する場合の実施例を挙げて、本考案を説明す
る。
Next, the present invention will be described with reference to an example of use in a photomask substrate development process.
第２図は、本考案の特徴である基板１７とその
支持具１８及びその関連部分の構造を示し、同図
ａは支持具１８の組立斜視図、同図ｂは固定台３
０の拡大詳細図、同図ｃは基板１７を載置した状
態の平面図、同図ｄは同図ｃのＸ−Ｘ線箇所断面
図である。なお、スプレー装置の全体構造は、第
２図ｄに示す回転軸１１，連結具１２，基板１７
及び支持具１８を前述した第１図において互いに
対応する構成部分と置換することをもつて、その
説明に代える。 FIG. 2 shows the structure of the substrate 17, its support 18, and related parts, which are the features of the present invention. FIG. 2A is an assembled perspective view of the support 18, and FIG.
0 is an enlarged detailed view of FIG. 0, FIG. The overall structure of the spray device includes a rotating shaft 11, a connector 12, and a substrate 17 as shown in FIG. 2d.
The description thereof will be replaced by replacing the supporting device 18 with mutually corresponding components in FIG. 1 described above.
本例の基板１７は、石英ガラス板にクロム膜
（膜厚：800Å）を被着し、その上にフオトレジス
ト（米国Hoechst製AZ1350，膜厚：4000Å）を
塗布し、このレジストに対して所定パターンの露
光（露光量60mj／cm2，水銀ランプ）が行なわれ
ており、この基板１７に対してフオトレジスト専
用液を本例のスプレー装置で噴出させる。 The substrate 17 of this example is a quartz glass plate coated with a chromium film (film thickness: 800 Å), a photoresist (AZ1350 manufactured by Hoechst, USA, film thickness: 4000 Å) coated on top of the chromium film, and a predetermined amount of A pattern is exposed to light (exposure amount: 60 mj/cm 2 , using a mercury lamp), and a special liquid for photoresist is sprayed onto this substrate 17 using the spray device of this embodiment.
一方、支持具１８は、第２図ａに示すように互
いに直交させた２本の支持棒１９，２０（テフロ
ン製で、その中心軸を回転軸の中心と一致させた
直交箇所で凹凸部を形成して噛み合わせている）
と、この支持棒１９，２０に６インチ基板用に設
けられた一対の穴２１，２１と２５，２５にそれ
ぞれネジ２９（ステンレス製）を通して固定され
る４個の固定台３０（テフロン製）とからなり、
更に支持棒１９，２０には、５インチ，４インチ
及び３インチ基板用の１対の穴２２，２２と２
６，２６，２３，２３と２７，２７及び２４，２
４と２８，２８が設けられ各サイズの基板に応じ
てこれ等１対の穴を選定し、同様にネジ２９を通
して４個の固定台３０を固定する構造になつてお
り、４個の固定台３０は、基板１７の対角線上の
４隅の端面部分と当接する２つの当接面２６，２
６と、その底面部分を載置する載置面２７が形成
されている。 On the other hand, the support 18 consists of two support rods 19 and 20 (made of Teflon) that are orthogonal to each other as shown in FIG. formed and interlocked)
and four fixing stands 30 (made of Teflon) that are fixed to the support rods 19, 20 by passing screws 29 (made of stainless steel) into a pair of holes 21, 21 and 25, 25 provided for the 6-inch board, respectively. Consisting of
Further, the support rods 19, 20 have a pair of holes 22, 22 and 2 for 5 inch, 4 inch and 3 inch boards.
6, 26, 23, 23 and 27, 27 and 24, 2
4 and 28, 28 are provided, and one pair of these holes is selected according to each size of the board, and the four fixing bases 30 are similarly fixed through the screws 29. 30 are two contact surfaces 26, 2 that come into contact with the end surface portions of the four diagonal corners of the substrate 17.
6 and a mounting surface 27 on which the bottom portion thereof is placed.
支持具１８を上記した構造とすることにより、
各種サイズの基板を支持具１８に支持した場合、
回転軸１１をそれぞれその中心軸に一致させて回
転し、かつこれ等基板の平面を同一面上（同一の
程度は各種サイズの基板の厚さ寸法差以内であ
り、通常１mm以内である。）に設置することがで
きることから、噴出を均一にすることができる。 By making the support 18 have the above-described structure,
When substrates of various sizes are supported by the support 18,
The rotating shafts 11 are rotated so as to coincide with their central axes, and the planes of these substrates are on the same plane (the degree of sameness is within the difference in thickness of substrates of various sizes, usually within 1 mm). Since it can be installed in the same area, it is possible to make the ejection uniform.
基板の形状については、前例の正方形に限ら
ず、第３図に示す基板３１のように円形であつて
もよい。本例の基板３１は、互いに直交する方向
の端面部分が平坦面に研磨され、４個の固定台３
２には、基板３１の平坦面と当接する平面状の当
接面３３と、基板３１の底面部分を載置する載置
面３４とが形成されている。その他の構造につい
ては前例と同様である。 The shape of the substrate is not limited to the square as in the previous example, but may be circular like the substrate 31 shown in FIG. 3. The substrate 31 of this example has end faces in directions perpendicular to each other polished into flat surfaces, and four fixing stands 3
2 is formed with a planar contact surface 33 that comes into contact with the flat surface of the substrate 31, and a mounting surface 34 on which the bottom portion of the substrate 31 is placed. The rest of the structure is the same as the previous example.
以上の通り、本考案のスプレー装置によれば、
その支持具に基板サイズを変えて支持しても、何
れの基板に対しても噴出を均一にして、特に、レ
ジスト露光後の現像，エツチング，洗浄の一連の
各工程において使用した場合、均一な線幅のパタ
ーンを形成することができる。
As mentioned above, according to the spray device of the present invention,
Even if substrates of different sizes are supported on the support, the jetting will be uniform for all substrates, and especially when used in the series of steps of development, etching, and cleaning after resist exposure, A pattern of line width can be formed.
第１図は従来のスプレー装置を示し、同図ａは
全体構造図、同図ｂは支持具に基板を設置した状
態の平面図及び同図ｃは支持具の平面図である。
第２図は本考案の実施例によるスプレー装置内の
支持具とその関連部分を示し、同図ａは支持具の
組立図、同図ｂは固定台の拡大図、同図ｃは支持
具に基板を設置した状態の平面図及び同図ｄは同
図ｃのＸ−Ｘ線箇所の断面図、第３図は本考案の
他の実施例によるスプレー装置内の支持具に基板
を設置した状態の平面図、同図ｂは同図ａのＸ−
Ｘ線箇所の断面図、及び同図ｃは固定台の拡大図
である。
１３……チヤンバー、１４……噴出孔、１５…
…噴出液、１７，３１……基板、１８……支持
具、１９，２０……支持棒、２１〜２８……１対
の穴、２９……ネジ、３０，３２……固定台、２
６，３３……当接面、２７，３４……載置面。
FIG. 1 shows a conventional spray device, in which FIG. 1A is an overall structural view, FIG. 1B is a plan view of a substrate installed on a support, and FIG. 1C is a plan view of the support.
Figure 2 shows the support and its related parts in the spray device according to the embodiment of the present invention, Figure a is an assembled view of the support, Figure b is an enlarged view of the fixing base, and Figure c is the support. A plan view of the substrate installed, and d of the same figure is a sectional view taken along the line X-X of figure c, and FIG. 3 is a plan view of the substrate installed on a support in a spray device according to another embodiment of the present invention. The plan view of the same figure b is X- of the same figure a
A cross-sectional view of the X-ray location, and figure c is an enlarged view of the fixing table. 13...Chamber, 14...Blowout hole, 15...
...Ejected liquid, 17, 31...Substrate, 18...Support, 19, 20...Support rod, 21-28...Pair of holes, 29...Screw, 30, 32...Fixing base, 2
6, 33...Abutting surface, 27,34...Placement surface.
Claims (1)
設置し、前記チヤンバー１３に設けられた噴出
孔１４から前記基板１７に向けて噴出液１５を
噴出するスプレー装置において、 前記支持具１８は、 互いに交叉し、その中心が回転軸１１と一致
する２本の支持棒１９，２０と、 この支持棒１９，２０の前記交叉方向におけ
る前記基板１７の端面部分に当接する当接面２
６と該端面近傍の底面部分を載置する載置面２
７とを有して前記支持棒１９，２０に取付けら
れる４個の固定台３０と を備え、 前記支持棒１９，２０は、前記交叉する点を
中心にした一対の穴２１，２１，２２，２２，
２３，２３，２４，２４，２５，２５，２６，
２６，２７，２７，２８，２８が前記基板１７
の各種サイズに応じて複数個形成され、 前記一対の穴２１，２１，２２，２２，２
３，２３，２４，２４，２５，２５，２６，２
６，２７，２７，２８，２８にネジ２９を通し
て前記固定台３０を支持棒１９，２０上の前記
基板１７の各種サイズに応じた位置に固定し、
かつ、前記固定台３０を、前記載置面２７がい
ずれの前記位置においても実質的に同一平面と
なるように保持することを特徴とするスプレー
装置。 (2) 実用新案登録請求の範囲第１項において、前
記基板１７の形状が正方形であり、前記交叉方
向が前記基板１７の対角線方向であることを特
徴とするスプレー装置。 (3) 実用新案登録請求の範囲第１項において、前
記基板３１の形状が円形であり、前記交叉方向
が前記基板３１の互いに直交する方向であり、
かつ前記交叉方向の前記基板３１の端面部分が
平坦状に形成されていることを特徴とするスプ
レー装置。[Claims for Utility Model Registration] (1) A spray device in which a substrate 17 is installed on a support 18 in a chamber 13, and a spray liquid 15 is ejected from an ejection hole 14 provided in the chamber 13 toward the substrate 17. In this case, the support tool 18 includes two support rods 19 and 20 that intersect with each other and whose centers coincide with the rotation axis 11, and the support rods 19 and 20 touch the end surface portions of the substrate 17 in the intersecting direction. Contact surface 2
6 and a mounting surface 2 on which the bottom surface near the end surface is placed.
7 and are attached to the support rods 19, 20, and the support rods 19, 20 have a pair of holes 21, 21, 22, 22, 22,
23, 23, 24, 24, 25, 25, 26,
26, 27, 27, 28, 28 are the substrate 17
A plurality of holes are formed according to various sizes of the holes 21, 21, 22, 22, 2.
3, 23, 24, 24, 25, 25, 26, 2
6, 27, 27, 28, 28 through screws 29 to fix the fixing base 30 at a position corresponding to the various sizes of the substrate 17 on the support rods 19, 20,
Further, the spray device is characterized in that the fixing base 30 is held so that the mounting surface 27 becomes substantially the same plane in any of the positions. (2) Utility Model Registration The spray device according to claim 1, wherein the substrate 17 has a square shape, and the intersecting direction is a diagonal direction of the substrate 17. (3) Utility model registration Claim 1, wherein the substrate 31 has a circular shape, and the intersecting direction is a direction in which the substrates 31 are orthogonal to each other,
A spray device characterized in that an end face portion of the substrate 31 in the cross direction is formed into a flat shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8709184U JPS614772U (en) | 1984-06-12 | 1984-06-12 | spray equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8709184U JPS614772U (en) | 1984-06-12 | 1984-06-12 | spray equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS614772U JPS614772U (en) | 1986-01-13 |
| JPH049031Y2 true JPH049031Y2 (en) | 1992-03-06 |
Family
ID=30638992
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8709184U Granted JPS614772U (en) | 1984-06-12 | 1984-06-12 | spray equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS614772U (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0325400Y2 (en) * | 1986-06-30 | 1991-06-03 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5043564U (en) * | 1973-08-16 | 1975-05-01 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54167678U (en) * | 1978-05-16 | 1979-11-26 |
-
1984
- 1984-06-12 JP JP8709184U patent/JPS614772U/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5043564U (en) * | 1973-08-16 | 1975-05-01 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS614772U (en) | 1986-01-13 |
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