JPH0489548U - - Google Patents
Info
- Publication number
- JPH0489548U JPH0489548U JP40365990U JP40365990U JPH0489548U JP H0489548 U JPH0489548 U JP H0489548U JP 40365990 U JP40365990 U JP 40365990U JP 40365990 U JP40365990 U JP 40365990U JP H0489548 U JPH0489548 U JP H0489548U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Physical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP40365990U JPH0489548U (zh) | 1990-12-17 | 1990-12-17 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP40365990U JPH0489548U (zh) | 1990-12-17 | 1990-12-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0489548U true JPH0489548U (zh) | 1992-08-05 |
Family
ID=31881405
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP40365990U Pending JPH0489548U (zh) | 1990-12-17 | 1990-12-17 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0489548U (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018536768A (ja) * | 2015-12-09 | 2018-12-13 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 基板上のスパッタ堆積用に構成されたシステム、スパッタ堆積チャンバ用のシールド装置、およびスパッタ堆積チャンバ内に電気シールドを設ける方法 |
-
1990
- 1990-12-17 JP JP40365990U patent/JPH0489548U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018536768A (ja) * | 2015-12-09 | 2018-12-13 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | 基板上のスパッタ堆積用に構成されたシステム、スパッタ堆積チャンバ用のシールド装置、およびスパッタ堆積チャンバ内に電気シールドを設ける方法 |