JPH0488038U - - Google Patents
Info
- Publication number
- JPH0488038U JPH0488038U JP40102090U JP40102090U JPH0488038U JP H0488038 U JPH0488038 U JP H0488038U JP 40102090 U JP40102090 U JP 40102090U JP 40102090 U JP40102090 U JP 40102090U JP H0488038 U JPH0488038 U JP H0488038U
- Authority
- JP
- Japan
- Prior art keywords
- strut
- strut tube
- shock absorber
- bottom part
- fixing bracket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000006096 absorbing agent Substances 0.000 claims description 3
- 230000035939 shock Effects 0.000 claims description 3
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP40102090U JPH0488038U (de) | 1990-12-19 | 1990-12-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP40102090U JPH0488038U (de) | 1990-12-19 | 1990-12-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0488038U true JPH0488038U (de) | 1992-07-30 |
Family
ID=31879180
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP40102090U Pending JPH0488038U (de) | 1990-12-19 | 1990-12-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0488038U (de) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016178177A (ja) * | 2015-03-19 | 2016-10-06 | 新光電気工業株式会社 | 配線基板及び電子部品装置と電子部品装置の製造方法 |
| JP2016184654A (ja) * | 2015-03-26 | 2016-10-20 | シャープ株式会社 | 半導体素子フリップチップ接合構造体 |
-
1990
- 1990-12-19 JP JP40102090U patent/JPH0488038U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016178177A (ja) * | 2015-03-19 | 2016-10-06 | 新光電気工業株式会社 | 配線基板及び電子部品装置と電子部品装置の製造方法 |
| JP2016184654A (ja) * | 2015-03-26 | 2016-10-20 | シャープ株式会社 | 半導体素子フリップチップ接合構造体 |