JPH0488037U - - Google Patents

Info

Publication number
JPH0488037U
JPH0488037U JP1990400851U JP40085190U JPH0488037U JP H0488037 U JPH0488037 U JP H0488037U JP 1990400851 U JP1990400851 U JP 1990400851U JP 40085190 U JP40085190 U JP 40085190U JP H0488037 U JPH0488037 U JP H0488037U
Authority
JP
Japan
Prior art keywords
lever
electromagnetic brake
release device
manual release
comes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP1990400851U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990400851U priority Critical patent/JPH0488037U/ja
Publication of JPH0488037U publication Critical patent/JPH0488037U/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図及び第２図は本考案の電磁ブレーキの手
動開放装置の一実施例を示す説明図で、第１図は
要部構成を示す斜視図、第２図は全体構成を示す
側面図、第３図及び第４図は従来の電磁ブレーキ
の手動開放装置の一例を示す説明図で、第３図は
手動開放装置の斜視図、第４図は手動開放装置が
装着された電磁ブレーキの斜視図である。 ２１……手動開放装置、２２……第１のレバー
、２３……第２のレバー、２４……連結体、２５
，２６……当接部、２７……取手部、２８……ス
トツパ。

Claims (1)

    【実用新案登録請求の範囲】
  1. 電磁ブレーキの一方のアームに当接する第１の
    レバーと、他方のアームに当接する第２のレバー
    と、これらの第１のレバー及び第２のレバーを回
    動可能に連結する連結体と、上記第１のレバー及
    び第２のレバーに押圧力を付与可能な取手部とを
    有し、この取手部を手動で操作して上記第１のレ
    バー及び第２のレバーを開脚することにより、上
    記アームの両方を制動ばねに抗して互いより離隔
    する方向に開いて電磁ブレーキの開放を行なう電
    磁ブレーキの手動開放装置において、上記の第１
    のレバー及び第２のレバーの開脚角度が１８０度
    以上となるように第１のレバー及び第２のレバー
    の回動を規制するストツパを、これらの第１のレ
    バー及び第２のレバーの少なくとも一方に備える
    とともに、上記取手部を上記第１のレバー及び第
    ２のレバーの少なくとも一方に着脱可能に設けた
    ことを特徴とする電磁ブレーキの手動開放装置。
JP1990400851U 1990-12-18 1990-12-18 Withdrawn JPH0488037U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990400851U JPH0488037U (ja) 1990-12-18 1990-12-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990400851U JPH0488037U (ja) 1990-12-18 1990-12-18

Publications (1)

Publication Number Publication Date
JPH0488037U true JPH0488037U (ja) 1992-07-30

Family

ID=31879033

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990400851U Withdrawn JPH0488037U (ja) 1990-12-18 1990-12-18

Country Status (1)

Country Link
JP (1) JPH0488037U (ja)

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Legal Events

Date Code Title Description
A300 Withdrawal of application because of no request for examination

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 19950518