JPH0487681U - - Google Patents

Info

Publication number

JPH0487681U

JPH0487681U JP13070390U JP13070390U JPH0487681U JP H0487681 U JPH0487681 U JP H0487681U JP 13070390 U JP13070390 U JP 13070390U JP 13070390 U JP13070390 U JP 13070390U JP H0487681 U JPH0487681 U JP H0487681U

Authority

JP

Japan

Prior art keywords

surface mount

solder portions

mount components

printed circuit

circuit board

Prior art date

1990-11-30

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
• 239000011889 copper foil Substances 0.000 claims description 2
• 229910000679 solder Inorganic materials 0.000 claims 2
• 238000010586 diagram Methods 0.000 description 2
• 238000005476 soldering Methods 0.000 description 1

Cited By (1)