JPH0485733U - - Google Patents

Info

Publication number
JPH0485733U
JPH0485733U JP1990128569U JP12856990U JPH0485733U JP H0485733 U JPH0485733 U JP H0485733U JP 1990128569 U JP1990128569 U JP 1990128569U JP 12856990 U JP12856990 U JP 12856990U JP H0485733 U JPH0485733 U JP H0485733U
Authority
JP
Japan
Prior art keywords
mounting part
semiconductor element
sintered body
brazing material
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1990128569U
Other languages
English (en)
Japanese (ja)
Other versions
JP2514911Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990128569U priority Critical patent/JP2514911Y2/ja
Publication of JPH0485733U publication Critical patent/JPH0485733U/ja
Application granted granted Critical
Publication of JP2514911Y2 publication Critical patent/JP2514911Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP1990128569U 1990-11-29 1990-11-29 半導体素子収納用パッケージ Expired - Lifetime JP2514911Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990128569U JP2514911Y2 (ja) 1990-11-29 1990-11-29 半導体素子収納用パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990128569U JP2514911Y2 (ja) 1990-11-29 1990-11-29 半導体素子収納用パッケージ

Publications (2)

Publication Number Publication Date
JPH0485733U true JPH0485733U (cg-RX-API-DMAC10.html) 1992-07-24
JP2514911Y2 JP2514911Y2 (ja) 1996-10-23

Family

ID=31876024

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990128569U Expired - Lifetime JP2514911Y2 (ja) 1990-11-29 1990-11-29 半導体素子収納用パッケージ

Country Status (1)

Country Link
JP (1) JP2514911Y2 (cg-RX-API-DMAC10.html)

Also Published As

Publication number Publication date
JP2514911Y2 (ja) 1996-10-23

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term