JPH048437U - - Google Patents
Info
- Publication number
- JPH048437U JPH048437U JP4865090U JP4865090U JPH048437U JP H048437 U JPH048437 U JP H048437U JP 4865090 U JP4865090 U JP 4865090U JP 4865090 U JP4865090 U JP 4865090U JP H048437 U JPH048437 U JP H048437U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- jig
- wafer bonding
- corner
- tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 3
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4865090U JPH048437U (me) | 1990-05-11 | 1990-05-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4865090U JPH048437U (me) | 1990-05-11 | 1990-05-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH048437U true JPH048437U (me) | 1992-01-27 |
Family
ID=31565652
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4865090U Pending JPH048437U (me) | 1990-05-11 | 1990-05-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH048437U (me) |
-
1990
- 1990-05-11 JP JP4865090U patent/JPH048437U/ja active Pending