JPH048433U - - Google Patents
Info
- Publication number
- JPH048433U JPH048433U JP1990049302U JP4930290U JPH048433U JP H048433 U JPH048433 U JP H048433U JP 1990049302 U JP1990049302 U JP 1990049302U JP 4930290 U JP4930290 U JP 4930290U JP H048433 U JPH048433 U JP H048433U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- package
- view
- plan
- die bond
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/5449—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990049302U JPH048433U (oth) | 1990-05-11 | 1990-05-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990049302U JPH048433U (oth) | 1990-05-11 | 1990-05-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH048433U true JPH048433U (oth) | 1992-01-27 |
Family
ID=31566870
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990049302U Pending JPH048433U (oth) | 1990-05-11 | 1990-05-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH048433U (oth) |
-
1990
- 1990-05-11 JP JP1990049302U patent/JPH048433U/ja active Pending