JPH0482878U - - Google Patents

Info

Publication number

JPH0482878U

JPH0482878U JP12750490U JP12750490U JPH0482878U JP H0482878 U JPH0482878 U JP H0482878U JP 12750490 U JP12750490 U JP 12750490U JP 12750490 U JP12750490 U JP 12750490U JP H0482878 U JPH0482878 U JP H0482878U

Authority

JP

Japan

Prior art keywords

copper foil

pattern

foil patterns

patterns

circuit board

Prior art date

1990-11-28

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
• 239000011889 copper foil Substances 0.000 claims description 7
• 238000010586 diagram Methods 0.000 description 3
• 229910000679 solder Inorganic materials 0.000 description 1