JPH0482856U - - Google Patents
Info
- Publication number
- JPH0482856U JPH0482856U JP12436390U JP12436390U JPH0482856U JP H0482856 U JPH0482856 U JP H0482856U JP 12436390 U JP12436390 U JP 12436390U JP 12436390 U JP12436390 U JP 12436390U JP H0482856 U JPH0482856 U JP H0482856U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- detects
- temperature sensor
- tank
- heater
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 6
- 239000003507 refrigerant Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims 2
- 230000031070 response to heat Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Description
第１図は本考案の一実施例を示す半導体冷却装
置の斜視図、第２図は第１図の−矢視断面図
、第３図はヒータと送風機の動作時期を示すダイ
ヤグラムである。
１……タンク、２……半導体素子、３……冷媒
、５……凝縮器、８……低温温度センサ、９……
高温温度センサ、１０……ヒータブロツク、１１
……ヒータ、１２……送風機。
FIG. 1 is a perspective view of a semiconductor cooling device showing an embodiment of the present invention, FIG. 2 is a sectional view taken along the - arrow in FIG. 1, and FIG. 3 is a diagram showing operating timings of a heater and a blower. 1...Tank, 2...Semiconductor element, 3...Refrigerant, 5...Condenser, 8...Low temperature sensor, 9...
High temperature sensor, 10... Heater block, 11
...Heater, 12...Blower.
Claims (1)
ク中に浸漬し、前記半導体からの発熱を受けて沸
騰した冷媒を凝縮する凝縮器を設けた半導体冷却
装置において、 前記タンクを構成する一面にヒータを設けたこ
とを特徴とする半導体冷却装置。 ２ 請求項１において、前記凝縮器の前面に冷却
用送風機を設けた半導体冷却装置。 ３ 請求項２において、低温域を検出する低温温
度センサと高温域を検出する高温温度センサをタ
ンクに設置し、前記タンクの温度が−２０℃とな
つた時、低温温度センサが検出し、ヒータを加熱
させると同時に送風機を低速で作動させるように
し、その状態を継続させ、さらに、高温側の温度
センサが７０℃で検出した時にヒータの加熱をや
め、送風機を高速で作動させるようにした半導体
冷却装置。[Claims for Utility Model Registration] 1. A semiconductor cooling device in which a semiconductor to be cooled is immersed in a tank filled with a refrigerant, and a condenser is provided to condense the boiled refrigerant in response to heat generated from the semiconductor, A semiconductor cooling device characterized in that a heater is provided on one side of the tank. 2. The semiconductor cooling device according to claim 1, further comprising a cooling blower provided in front of the condenser. 3 In claim 2, a low temperature sensor that detects a low temperature range and a high temperature sensor that detects a high temperature range are installed in the tank, and when the temperature of the tank reaches -20°C, the low temperature sensor detects and the heater is activated. At the same time as heating the air, the blower operates at low speed and continues in this state.Furthermore, when the temperature sensor on the high temperature side detects 70 degrees Celsius, the heater stops heating and the blower operates at high speed. Cooling system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12436390U JPH0482856U (en) | 1990-11-28 | 1990-11-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12436390U JPH0482856U (en) | 1990-11-28 | 1990-11-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0482856U true JPH0482856U (en) | 1992-07-20 |
Family
ID=31872021
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12436390U Pending JPH0482856U (en) | 1990-11-28 | 1990-11-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0482856U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015019076A (en) * | 2008-11-18 | 2015-01-29 | 日本電気株式会社 | Boiling and cooling device |
-
1990
- 1990-11-28 JP JP12436390U patent/JPH0482856U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015019076A (en) * | 2008-11-18 | 2015-01-29 | 日本電気株式会社 | Boiling and cooling device |
| US9297589B2 (en) | 2008-11-18 | 2016-03-29 | Nec Corporation | Boiling heat transfer device |
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